TWI869591B - 厚膜電阻糊、厚膜電阻體、及電子元件 - Google Patents

厚膜電阻糊、厚膜電阻體、及電子元件 Download PDF

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Publication number
TWI869591B
TWI869591B TW110115861A TW110115861A TWI869591B TW I869591 B TWI869591 B TW I869591B TW 110115861 A TW110115861 A TW 110115861A TW 110115861 A TW110115861 A TW 110115861A TW I869591 B TWI869591 B TW I869591B
Authority
TW
Taiwan
Prior art keywords
mass
thick film
film resistor
glass
lead
Prior art date
Application number
TW110115861A
Other languages
English (en)
Chinese (zh)
Other versions
TW202147354A (zh
Inventor
安藤真規
Original Assignee
日商住友金屬鑛山股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友金屬鑛山股份有限公司 filed Critical 日商住友金屬鑛山股份有限公司
Publication of TW202147354A publication Critical patent/TW202147354A/zh
Application granted granted Critical
Publication of TWI869591B publication Critical patent/TWI869591B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of oxides
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of oxides
    • H01C17/0654—Oxides of the platinum group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Non-Adjustable Resistors (AREA)
TW110115861A 2020-05-01 2021-05-03 厚膜電阻糊、厚膜電阻體、及電子元件 TWI869591B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-081114 2020-05-01
JP2020081114 2020-05-01

Publications (2)

Publication Number Publication Date
TW202147354A TW202147354A (zh) 2021-12-16
TWI869591B true TWI869591B (zh) 2025-01-11

Family

ID=78332085

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110115861A TWI869591B (zh) 2020-05-01 2021-05-03 厚膜電阻糊、厚膜電阻體、及電子元件

Country Status (6)

Country Link
US (1) US12283408B2 (https=)
JP (1) JP7622737B2 (https=)
KR (1) KR102820136B1 (https=)
CN (1) CN115461825A (https=)
TW (1) TWI869591B (https=)
WO (1) WO2021221173A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7444573B2 (ja) * 2019-09-25 2024-03-06 Koa株式会社 抵抗体材料、抵抗体材料の製造方法及び電流検出用抵抗器
CN114613529B (zh) * 2022-05-07 2022-08-16 西安宏星电子浆料科技股份有限公司 一种无铅厚膜电阻浆料

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254195A (en) * 1975-10-29 1977-05-02 Hitachi Ltd Resistor
JPS6324601A (ja) * 1986-07-17 1988-02-02 松下電器産業株式会社 描画用抵抗体組成物
JPH06140214A (ja) * 1992-10-23 1994-05-20 Sumitomo Metal Mining Co Ltd 厚膜抵抗体ペーストの製造方法および厚膜抵抗体の形成方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53100496A (en) * 1977-02-15 1978-09-01 Sumitomo Metal Mining Co Method of manufacturing paste for resistance body
JPH04320003A (ja) 1991-04-18 1992-11-10 Tdk Corp 厚膜抵抗体
JPH06163202A (ja) 1992-11-19 1994-06-10 Tdk Corp 厚膜抵抗体用ペーストならびに厚膜抵抗体およびその製造方法
US5379016A (en) * 1993-06-03 1995-01-03 E. I. Du Pont De Nemours And Company Chip resistor
JP2004320003A (ja) 2003-03-31 2004-11-11 Seiko Epson Corp 液滴吐出装置によるパターン形成方法および液滴吐出装置
JP2006163202A (ja) 2004-12-09 2006-06-22 Agilent Technol Inc アレイ基板の検査方法及び検査装置
US8815125B2 (en) * 2012-06-20 2014-08-26 E. I. Du Pont De Nemours And Company Method of manufacturing a resistor paste
US10115505B2 (en) * 2017-02-23 2018-10-30 E I Du Pont De Nemours And Company Chip resistor
CN115443513B (zh) * 2020-05-01 2026-02-10 住友金属矿山株式会社 厚膜电阻糊、厚膜电阻体和电子部件
JP2023100496A (ja) * 2022-01-06 2023-07-19 株式会社三洋物産 遊技機
JP2023054195A (ja) * 2022-07-05 2023-04-13 パイオニア株式会社 走行軌跡取得方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254195A (en) * 1975-10-29 1977-05-02 Hitachi Ltd Resistor
JPS6324601A (ja) * 1986-07-17 1988-02-02 松下電器産業株式会社 描画用抵抗体組成物
JPH06140214A (ja) * 1992-10-23 1994-05-20 Sumitomo Metal Mining Co Ltd 厚膜抵抗体ペーストの製造方法および厚膜抵抗体の形成方法

Also Published As

Publication number Publication date
KR20230004485A (ko) 2023-01-06
JP7622737B2 (ja) 2025-01-28
WO2021221173A1 (ja) 2021-11-04
JPWO2021221173A1 (https=) 2021-11-04
US20230170114A1 (en) 2023-06-01
CN115461825A (zh) 2022-12-09
KR102820136B1 (ko) 2025-06-12
US12283408B2 (en) 2025-04-22
TW202147354A (zh) 2021-12-16

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