TWI850692B - 基板洗淨裝置 - Google Patents

基板洗淨裝置 Download PDF

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Publication number
TWI850692B
TWI850692B TW111124911A TW111124911A TWI850692B TW I850692 B TWI850692 B TW I850692B TW 111124911 A TW111124911 A TW 111124911A TW 111124911 A TW111124911 A TW 111124911A TW I850692 B TWI850692 B TW I850692B
Authority
TW
Taiwan
Prior art keywords
substrate
cleaning
brush
surface brush
liquid
Prior art date
Application number
TW111124911A
Other languages
English (en)
Chinese (zh)
Other versions
TW202318479A (zh
Inventor
髙橋拓馬
篠原智之
石井淳一
中村一樹
篠原敬
沖田展彬
岡田吉文
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202318479A publication Critical patent/TW202318479A/zh
Application granted granted Critical
Publication of TWI850692B publication Critical patent/TWI850692B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/36—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • B08B1/52—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
TW111124911A 2021-07-15 2022-07-04 基板洗淨裝置 TWI850692B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021117423A JP7810528B2 (ja) 2021-07-15 2021-07-15 基板洗浄装置
JP2021-117423 2021-07-15

Publications (2)

Publication Number Publication Date
TW202318479A TW202318479A (zh) 2023-05-01
TWI850692B true TWI850692B (zh) 2024-08-01

Family

ID=84920207

Family Applications (2)

Application Number Title Priority Date Filing Date
TW111124911A TWI850692B (zh) 2021-07-15 2022-07-04 基板洗淨裝置
TW113130596A TW202447827A (zh) 2021-07-15 2022-07-04 基板洗淨裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW113130596A TW202447827A (zh) 2021-07-15 2022-07-04 基板洗淨裝置

Country Status (6)

Country Link
US (1) US12463063B2 (https=)
JP (1) JP7810528B2 (https=)
KR (1) KR102825486B1 (https=)
CN (1) CN117642846A (https=)
TW (2) TWI850692B (https=)
WO (1) WO2023286635A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12463063B2 (en) 2021-07-15 2025-11-04 SCREEN Holdings Co., Ltd. Substrate cleaning device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118268297B (zh) * 2024-06-03 2024-08-30 沈阳和研科技股份有限公司 一种陶瓷吸盘清洁装置及划片机
CN118635188B (zh) * 2024-08-13 2024-11-05 河南新黄水电工程有限公司辉县百泉分公司 一种水利工程施工设备的刷洗机构
CN118831879B (zh) * 2024-09-24 2025-01-24 洛阳合兴工贸有限公司 一种汽车连杆加工用清洁装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020017689A (ja) * 2018-07-27 2020-01-30 芝浦メカトロニクス株式会社 基板洗浄装置及び基板洗浄方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2877216B2 (ja) * 1992-10-02 1999-03-31 東京エレクトロン株式会社 洗浄装置
JP4033709B2 (ja) 2002-05-17 2008-01-16 大日本スクリーン製造株式会社 基板洗浄方法及びその装置
JP5904169B2 (ja) 2013-07-23 2016-04-13 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び記憶媒体
JP6740028B2 (ja) 2015-07-29 2020-08-12 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
JP6969434B2 (ja) 2018-02-21 2021-11-24 東京エレクトロン株式会社 洗浄具、基板洗浄装置及び基板洗浄方法
KR102935928B1 (ko) 2019-09-17 2026-03-06 가부시키가이샤 스크린 홀딩스 기판 세정 장치
JP7291068B2 (ja) 2019-12-09 2023-06-14 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
JP7810528B2 (ja) 2021-07-15 2026-02-03 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020017689A (ja) * 2018-07-27 2020-01-30 芝浦メカトロニクス株式会社 基板洗浄装置及び基板洗浄方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12463063B2 (en) 2021-07-15 2025-11-04 SCREEN Holdings Co., Ltd. Substrate cleaning device

Also Published As

Publication number Publication date
US12463063B2 (en) 2025-11-04
US20240321598A1 (en) 2024-09-26
KR102825486B1 (ko) 2025-06-30
KR20240029067A (ko) 2024-03-05
JP2023013332A (ja) 2023-01-26
JP7810528B2 (ja) 2026-02-03
WO2023286635A1 (ja) 2023-01-19
CN117642846A (zh) 2024-03-01
TW202318479A (zh) 2023-05-01
TW202447827A (zh) 2024-12-01

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