JP7810528B2 - 基板洗浄装置 - Google Patents

基板洗浄装置

Info

Publication number
JP7810528B2
JP7810528B2 JP2021117423A JP2021117423A JP7810528B2 JP 7810528 B2 JP7810528 B2 JP 7810528B2 JP 2021117423 A JP2021117423 A JP 2021117423A JP 2021117423 A JP2021117423 A JP 2021117423A JP 7810528 B2 JP7810528 B2 JP 7810528B2
Authority
JP
Japan
Prior art keywords
substrate
brush
cleaning
liquid
surface brush
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021117423A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023013332A (ja
JP2023013332A5 (https=
Inventor
拓馬 ▲高▼橋
智之 篠原
淳一 石井
一樹 中村
敬 篠原
展彬 沖田
吉文 岡田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2021117423A priority Critical patent/JP7810528B2/ja
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to US18/579,208 priority patent/US12463063B2/en
Priority to PCT/JP2022/026392 priority patent/WO2023286635A1/ja
Priority to KR1020247003898A priority patent/KR102825486B1/ko
Priority to CN202280049929.6A priority patent/CN117642846A/zh
Priority to TW113130596A priority patent/TW202447827A/zh
Priority to TW111124911A priority patent/TWI850692B/zh
Publication of JP2023013332A publication Critical patent/JP2023013332A/ja
Publication of JP2023013332A5 publication Critical patent/JP2023013332A5/ja
Application granted granted Critical
Publication of JP7810528B2 publication Critical patent/JP7810528B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/36—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • B08B1/52—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
JP2021117423A 2021-07-15 2021-07-15 基板洗浄装置 Active JP7810528B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2021117423A JP7810528B2 (ja) 2021-07-15 2021-07-15 基板洗浄装置
PCT/JP2022/026392 WO2023286635A1 (ja) 2021-07-15 2022-06-30 基板洗浄装置
KR1020247003898A KR102825486B1 (ko) 2021-07-15 2022-06-30 기판 세정 장치
CN202280049929.6A CN117642846A (zh) 2021-07-15 2022-06-30 基板清洗装置
US18/579,208 US12463063B2 (en) 2021-07-15 2022-06-30 Substrate cleaning device
TW113130596A TW202447827A (zh) 2021-07-15 2022-07-04 基板洗淨裝置
TW111124911A TWI850692B (zh) 2021-07-15 2022-07-04 基板洗淨裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021117423A JP7810528B2 (ja) 2021-07-15 2021-07-15 基板洗浄装置

Publications (3)

Publication Number Publication Date
JP2023013332A JP2023013332A (ja) 2023-01-26
JP2023013332A5 JP2023013332A5 (https=) 2024-12-27
JP7810528B2 true JP7810528B2 (ja) 2026-02-03

Family

ID=84920207

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021117423A Active JP7810528B2 (ja) 2021-07-15 2021-07-15 基板洗浄装置

Country Status (6)

Country Link
US (1) US12463063B2 (https=)
JP (1) JP7810528B2 (https=)
KR (1) KR102825486B1 (https=)
CN (1) CN117642846A (https=)
TW (2) TWI850692B (https=)
WO (1) WO2023286635A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7810528B2 (ja) 2021-07-15 2026-02-03 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置
CN118268297B (zh) * 2024-06-03 2024-08-30 沈阳和研科技股份有限公司 一种陶瓷吸盘清洁装置及划片机
CN118635188B (zh) * 2024-08-13 2024-11-05 河南新黄水电工程有限公司辉县百泉分公司 一种水利工程施工设备的刷洗机构
CN118831879B (zh) * 2024-09-24 2025-01-24 洛阳合兴工贸有限公司 一种汽车连杆加工用清洁装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003332287A (ja) 2002-05-17 2003-11-21 Dainippon Screen Mfg Co Ltd 基板洗浄方法及びその装置
JP2017034235A (ja) 2015-07-29 2017-02-09 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
JP2019145687A (ja) 2018-02-21 2019-08-29 東京エレクトロン株式会社 洗浄具、基板洗浄装置及び基板洗浄方法
JP2020017689A (ja) 2018-07-27 2020-01-30 芝浦メカトロニクス株式会社 基板洗浄装置及び基板洗浄方法
JP2021093427A (ja) 2019-12-09 2021-06-17 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2877216B2 (ja) * 1992-10-02 1999-03-31 東京エレクトロン株式会社 洗浄装置
JP5904169B2 (ja) 2013-07-23 2016-04-13 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び記憶媒体
KR102935928B1 (ko) 2019-09-17 2026-03-06 가부시키가이샤 스크린 홀딩스 기판 세정 장치
JP7810528B2 (ja) 2021-07-15 2026-02-03 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003332287A (ja) 2002-05-17 2003-11-21 Dainippon Screen Mfg Co Ltd 基板洗浄方法及びその装置
JP2017034235A (ja) 2015-07-29 2017-02-09 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
JP2019145687A (ja) 2018-02-21 2019-08-29 東京エレクトロン株式会社 洗浄具、基板洗浄装置及び基板洗浄方法
JP2020017689A (ja) 2018-07-27 2020-01-30 芝浦メカトロニクス株式会社 基板洗浄装置及び基板洗浄方法
JP2021093427A (ja) 2019-12-09 2021-06-17 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法

Also Published As

Publication number Publication date
US12463063B2 (en) 2025-11-04
US20240321598A1 (en) 2024-09-26
KR102825486B1 (ko) 2025-06-30
KR20240029067A (ko) 2024-03-05
TWI850692B (zh) 2024-08-01
JP2023013332A (ja) 2023-01-26
WO2023286635A1 (ja) 2023-01-19
CN117642846A (zh) 2024-03-01
TW202318479A (zh) 2023-05-01
TW202447827A (zh) 2024-12-01

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