CN117642846A - 基板清洗装置 - Google Patents
基板清洗装置 Download PDFInfo
- Publication number
- CN117642846A CN117642846A CN202280049929.6A CN202280049929A CN117642846A CN 117642846 A CN117642846 A CN 117642846A CN 202280049929 A CN202280049929 A CN 202280049929A CN 117642846 A CN117642846 A CN 117642846A
- Authority
- CN
- China
- Prior art keywords
- substrate
- cleaning
- brush
- surface brush
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
- B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
- B08B1/36—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
- B08B1/52—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021117423A JP7810528B2 (ja) | 2021-07-15 | 2021-07-15 | 基板洗浄装置 |
| JP2021-117423 | 2021-07-15 | ||
| PCT/JP2022/026392 WO2023286635A1 (ja) | 2021-07-15 | 2022-06-30 | 基板洗浄装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117642846A true CN117642846A (zh) | 2024-03-01 |
Family
ID=84920207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280049929.6A Pending CN117642846A (zh) | 2021-07-15 | 2022-06-30 | 基板清洗装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12463063B2 (https=) |
| JP (1) | JP7810528B2 (https=) |
| KR (1) | KR102825486B1 (https=) |
| CN (1) | CN117642846A (https=) |
| TW (2) | TWI850692B (https=) |
| WO (1) | WO2023286635A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7810528B2 (ja) | 2021-07-15 | 2026-02-03 | 株式会社Screenホールディングス | 基板洗浄装置 |
| CN118268297B (zh) * | 2024-06-03 | 2024-08-30 | 沈阳和研科技股份有限公司 | 一种陶瓷吸盘清洁装置及划片机 |
| CN118635188B (zh) * | 2024-08-13 | 2024-11-05 | 河南新黄水电工程有限公司辉县百泉分公司 | 一种水利工程施工设备的刷洗机构 |
| CN118831879B (zh) * | 2024-09-24 | 2025-01-24 | 洛阳合兴工贸有限公司 | 一种汽车连杆加工用清洁装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2877216B2 (ja) * | 1992-10-02 | 1999-03-31 | 東京エレクトロン株式会社 | 洗浄装置 |
| JP4033709B2 (ja) | 2002-05-17 | 2008-01-16 | 大日本スクリーン製造株式会社 | 基板洗浄方法及びその装置 |
| JP5904169B2 (ja) | 2013-07-23 | 2016-04-13 | 東京エレクトロン株式会社 | 基板洗浄装置、基板洗浄方法及び記憶媒体 |
| JP6740028B2 (ja) | 2015-07-29 | 2020-08-12 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および記憶媒体 |
| JP6969434B2 (ja) | 2018-02-21 | 2021-11-24 | 東京エレクトロン株式会社 | 洗浄具、基板洗浄装置及び基板洗浄方法 |
| JP7104580B2 (ja) | 2018-07-27 | 2022-07-21 | 芝浦メカトロニクス株式会社 | 基板洗浄装置及び基板洗浄方法 |
| KR102935928B1 (ko) | 2019-09-17 | 2026-03-06 | 가부시키가이샤 스크린 홀딩스 | 기판 세정 장치 |
| JP7291068B2 (ja) | 2019-12-09 | 2023-06-14 | 株式会社Screenホールディングス | 基板洗浄装置および基板洗浄方法 |
| JP7810528B2 (ja) | 2021-07-15 | 2026-02-03 | 株式会社Screenホールディングス | 基板洗浄装置 |
-
2021
- 2021-07-15 JP JP2021117423A patent/JP7810528B2/ja active Active
-
2022
- 2022-06-30 US US18/579,208 patent/US12463063B2/en active Active
- 2022-06-30 KR KR1020247003898A patent/KR102825486B1/ko active Active
- 2022-06-30 CN CN202280049929.6A patent/CN117642846A/zh active Pending
- 2022-06-30 WO PCT/JP2022/026392 patent/WO2023286635A1/ja not_active Ceased
- 2022-07-04 TW TW111124911A patent/TWI850692B/zh active
- 2022-07-04 TW TW113130596A patent/TW202447827A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US12463063B2 (en) | 2025-11-04 |
| US20240321598A1 (en) | 2024-09-26 |
| KR102825486B1 (ko) | 2025-06-30 |
| KR20240029067A (ko) | 2024-03-05 |
| TWI850692B (zh) | 2024-08-01 |
| JP2023013332A (ja) | 2023-01-26 |
| JP7810528B2 (ja) | 2026-02-03 |
| WO2023286635A1 (ja) | 2023-01-19 |
| TW202318479A (zh) | 2023-05-01 |
| TW202447827A (zh) | 2024-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |