KR102825486B1 - 기판 세정 장치 - Google Patents
기판 세정 장치 Download PDFInfo
- Publication number
- KR102825486B1 KR102825486B1 KR1020247003898A KR20247003898A KR102825486B1 KR 102825486 B1 KR102825486 B1 KR 102825486B1 KR 1020247003898 A KR1020247003898 A KR 1020247003898A KR 20247003898 A KR20247003898 A KR 20247003898A KR 102825486 B1 KR102825486 B1 KR 102825486B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- brush
- cleaning
- liquid
- lower brush
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
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- H01L21/67046—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
- B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
- B08B1/36—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
- B08B1/52—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2021-117423 | 2021-07-15 | ||
| JP2021117423A JP7810528B2 (ja) | 2021-07-15 | 2021-07-15 | 基板洗浄装置 |
| PCT/JP2022/026392 WO2023286635A1 (ja) | 2021-07-15 | 2022-06-30 | 基板洗浄装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20240029067A KR20240029067A (ko) | 2024-03-05 |
| KR102825486B1 true KR102825486B1 (ko) | 2025-06-30 |
Family
ID=84920207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247003898A Active KR102825486B1 (ko) | 2021-07-15 | 2022-06-30 | 기판 세정 장치 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12463063B2 (https=) |
| JP (1) | JP7810528B2 (https=) |
| KR (1) | KR102825486B1 (https=) |
| CN (1) | CN117642846A (https=) |
| TW (2) | TWI850692B (https=) |
| WO (1) | WO2023286635A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7810528B2 (ja) | 2021-07-15 | 2026-02-03 | 株式会社Screenホールディングス | 基板洗浄装置 |
| CN118268297B (zh) * | 2024-06-03 | 2024-08-30 | 沈阳和研科技股份有限公司 | 一种陶瓷吸盘清洁装置及划片机 |
| CN118635188B (zh) * | 2024-08-13 | 2024-11-05 | 河南新黄水电工程有限公司辉县百泉分公司 | 一种水利工程施工设备的刷洗机构 |
| CN118831879B (zh) * | 2024-09-24 | 2025-01-24 | 洛阳合兴工贸有限公司 | 一种汽车连杆加工用清洁装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003332287A (ja) * | 2002-05-17 | 2003-11-21 | Dainippon Screen Mfg Co Ltd | 基板洗浄方法及びその装置 |
| JP2020017689A (ja) * | 2018-07-27 | 2020-01-30 | 芝浦メカトロニクス株式会社 | 基板洗浄装置及び基板洗浄方法 |
| JP2021093427A (ja) * | 2019-12-09 | 2021-06-17 | 株式会社Screenホールディングス | 基板洗浄装置および基板洗浄方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2877216B2 (ja) * | 1992-10-02 | 1999-03-31 | 東京エレクトロン株式会社 | 洗浄装置 |
| JP5904169B2 (ja) | 2013-07-23 | 2016-04-13 | 東京エレクトロン株式会社 | 基板洗浄装置、基板洗浄方法及び記憶媒体 |
| JP6740028B2 (ja) | 2015-07-29 | 2020-08-12 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および記憶媒体 |
| JP6969434B2 (ja) | 2018-02-21 | 2021-11-24 | 東京エレクトロン株式会社 | 洗浄具、基板洗浄装置及び基板洗浄方法 |
| KR102935928B1 (ko) | 2019-09-17 | 2026-03-06 | 가부시키가이샤 스크린 홀딩스 | 기판 세정 장치 |
| JP7810528B2 (ja) | 2021-07-15 | 2026-02-03 | 株式会社Screenホールディングス | 基板洗浄装置 |
-
2021
- 2021-07-15 JP JP2021117423A patent/JP7810528B2/ja active Active
-
2022
- 2022-06-30 US US18/579,208 patent/US12463063B2/en active Active
- 2022-06-30 KR KR1020247003898A patent/KR102825486B1/ko active Active
- 2022-06-30 CN CN202280049929.6A patent/CN117642846A/zh active Pending
- 2022-06-30 WO PCT/JP2022/026392 patent/WO2023286635A1/ja not_active Ceased
- 2022-07-04 TW TW111124911A patent/TWI850692B/zh active
- 2022-07-04 TW TW113130596A patent/TW202447827A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003332287A (ja) * | 2002-05-17 | 2003-11-21 | Dainippon Screen Mfg Co Ltd | 基板洗浄方法及びその装置 |
| JP2020017689A (ja) * | 2018-07-27 | 2020-01-30 | 芝浦メカトロニクス株式会社 | 基板洗浄装置及び基板洗浄方法 |
| JP2021093427A (ja) * | 2019-12-09 | 2021-06-17 | 株式会社Screenホールディングス | 基板洗浄装置および基板洗浄方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US12463063B2 (en) | 2025-11-04 |
| US20240321598A1 (en) | 2024-09-26 |
| KR20240029067A (ko) | 2024-03-05 |
| TWI850692B (zh) | 2024-08-01 |
| JP2023013332A (ja) | 2023-01-26 |
| JP7810528B2 (ja) | 2026-02-03 |
| WO2023286635A1 (ja) | 2023-01-19 |
| CN117642846A (zh) | 2024-03-01 |
| TW202318479A (zh) | 2023-05-01 |
| TW202447827A (zh) | 2024-12-01 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
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| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
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| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
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| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
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| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
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| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |