TWI848919B - 用於安裝組件的接合頭及具有此種接合頭的晶粒接合機 - Google Patents

用於安裝組件的接合頭及具有此種接合頭的晶粒接合機 Download PDF

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Publication number
TWI848919B
TWI848919B TW107139446A TW107139446A TWI848919B TW I848919 B TWI848919 B TW I848919B TW 107139446 A TW107139446 A TW 107139446A TW 107139446 A TW107139446 A TW 107139446A TW I848919 B TWI848919 B TW I848919B
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TW
Taiwan
Prior art keywords
shaft
axis
longitudinal direction
air
bonding head
Prior art date
Application number
TW107139446A
Other languages
English (en)
Chinese (zh)
Other versions
TW201923940A (zh
Inventor
雷尼 克羅內特
Original Assignee
瑞士商貝西瑞士股份有限公司
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Application filed by 瑞士商貝西瑞士股份有限公司 filed Critical 瑞士商貝西瑞士股份有限公司
Publication of TW201923940A publication Critical patent/TW201923940A/zh
Application granted granted Critical
Publication of TWI848919B publication Critical patent/TWI848919B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K1/00—Details of the magnetic circuit
    • H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
    • H02K1/22—Rotating parts of the magnetic circuit
    • H02K1/27—Rotor cores with permanent magnets
    • H02K1/2706—Inner rotors
    • H02K1/272—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis
    • H02K1/274—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis the rotor consisting of two or more circumferentially positioned magnets
    • H02K1/2753—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis the rotor consisting of two or more circumferentially positioned magnets the rotor consisting of magnets or groups of magnets arranged with alternating polarity
    • H02K1/276—Magnets embedded in the magnetic core, e.g. interior permanent magnets [IPM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
    • H02K11/21—Devices for sensing speed or position, or actuated thereby
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
    • H02K11/25—Devices for sensing temperature, or actuated thereby
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
    • H02K7/10—Structural association with clutches, brakes, gears, pulleys or mechanical starters
    • H02K7/116—Structural association with clutches, brakes, gears, pulleys or mechanical starters with gears
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75824—Translational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75841—Means for moving parts of the bonding head
    • H01L2224/75842—Rotational mechanism

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Reciprocating, Oscillating Or Vibrating Motors (AREA)
TW107139446A 2017-11-17 2018-11-07 用於安裝組件的接合頭及具有此種接合頭的晶粒接合機 TWI848919B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH01396/17A CH714351A1 (de) 2017-11-17 2017-11-17 Bondkopf für die Montage von Bauelementen.
CH01396/17 2017-11-17
CH00957/18A CH714384A2 (de) 2017-11-17 2018-08-06 Bondkopf für die Montage von Bauelementen und Die Bonder mit einem solchen Bondkopf.
CH00957/18 2018-08-06

Publications (2)

Publication Number Publication Date
TW201923940A TW201923940A (zh) 2019-06-16
TWI848919B true TWI848919B (zh) 2024-07-21

Family

ID=66646772

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107139446A TWI848919B (zh) 2017-11-17 2018-11-07 用於安裝組件的接合頭及具有此種接合頭的晶粒接合機

Country Status (6)

Country Link
JP (1) JP7398191B2 (cg-RX-API-DMAC7.html)
KR (1) KR102661560B1 (cg-RX-API-DMAC7.html)
CN (1) CN110011439B (cg-RX-API-DMAC7.html)
CH (2) CH714351A1 (cg-RX-API-DMAC7.html)
MY (1) MY200011A (cg-RX-API-DMAC7.html)
TW (1) TWI848919B (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3975664B1 (en) 2019-05-23 2025-11-12 Nippon Steel Corporation Secondary coil module, traverse hardening apparatus, and traverse hardening method
GB2591132A (en) * 2020-01-17 2021-07-21 Asm Assembly Systems Singapore Pte Ltd Tooling pin placement system
JP2024080318A (ja) 2022-12-02 2024-06-13 三星電子株式会社 実装装置及び実装方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100314050A1 (en) * 2009-06-12 2010-12-16 Sun Kuen Wong Die bonder providing a large bonding force
TW201203429A (en) * 2010-06-17 2012-01-16 Hanmi Semiconductor Co Ltd Bond head for die bonding machine
JP2017069418A (ja) * 2015-09-30 2017-04-06 ファスフォードテクノロジ株式会社 ダイボンダおよび半導体装置の製造方法

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
JP2979772B2 (ja) * 1991-09-13 1999-11-15 松下電器産業株式会社 ダイボンディング装置
JP2998467B2 (ja) * 1992-12-04 2000-01-11 松下電器産業株式会社 電子部品の実装用ヘッド
US5952744A (en) * 1996-03-28 1999-09-14 Anoiad Corporation Rotary-linear actuator
JP3800126B2 (ja) 2002-04-23 2006-07-26 松下電器産業株式会社 作業ヘッド
DE60320596T2 (de) * 2003-08-25 2009-06-10 Husky Injection Molding Systems Ltd., Bolton Spritzgiesseinheit mit einer antriebsanordnung zum drehen und translatorischen verschieben einer welle
JP5068571B2 (ja) 2007-03-29 2012-11-07 芝浦メカトロニクス株式会社 電子部品の実装装置
JP2008288473A (ja) 2007-05-21 2008-11-27 Panasonic Corp ワイヤボンディング方法およびワイヤボンディング装置
CH707378A1 (de) * 2012-12-21 2014-06-30 Besi Switzerland Ag Thermokompressionsverfahren und Vorrichtung für die Montage von Halbleiterchips auf einem Substrat.
CH707480B1 (de) * 2013-01-21 2016-08-31 Besi Switzerland Ag Bondkopf mit einem heiz- und kühlbaren Saugorgan.
CH707934B1 (de) * 2013-04-19 2017-04-28 Besi Switzerland Ag Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
US9726204B2 (en) * 2013-12-09 2017-08-08 Samsung Electronics Co., Ltd. Fluid pressure actuator
JP6372031B2 (ja) * 2013-12-09 2018-08-15 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 流体圧アクチュエータ
JP6664986B2 (ja) * 2016-02-17 2020-03-13 株式会社ディスコ 加工装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100314050A1 (en) * 2009-06-12 2010-12-16 Sun Kuen Wong Die bonder providing a large bonding force
TW201203429A (en) * 2010-06-17 2012-01-16 Hanmi Semiconductor Co Ltd Bond head for die bonding machine
JP2017069418A (ja) * 2015-09-30 2017-04-06 ファスフォードテクノロジ株式会社 ダイボンダおよび半導体装置の製造方法

Also Published As

Publication number Publication date
JP7398191B2 (ja) 2023-12-14
KR102661560B1 (ko) 2024-04-26
CN110011439A (zh) 2019-07-12
JP2019096867A (ja) 2019-06-20
MY200011A (en) 2023-12-04
CH714351A1 (de) 2019-05-31
TW201923940A (zh) 2019-06-16
CH714384A2 (de) 2019-05-31
CN110011439B (zh) 2023-10-17
KR20190056985A (ko) 2019-05-27

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