JP7398191B2 - 部品を装着するボンディングヘッド及び該ボンディングヘッドを備えているダイボンダ - Google Patents

部品を装着するボンディングヘッド及び該ボンディングヘッドを備えているダイボンダ Download PDF

Info

Publication number
JP7398191B2
JP7398191B2 JP2018195498A JP2018195498A JP7398191B2 JP 7398191 B2 JP7398191 B2 JP 7398191B2 JP 2018195498 A JP2018195498 A JP 2018195498A JP 2018195498 A JP2018195498 A JP 2018195498A JP 7398191 B2 JP7398191 B2 JP 7398191B2
Authority
JP
Japan
Prior art keywords
axis
shaft
bonding head
length
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018195498A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019096867A (ja
JP2019096867A5 (cg-RX-API-DMAC7.html
Inventor
クローナート，レネ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Switzerland AG
Original Assignee
Besi Switzerland AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland AG filed Critical Besi Switzerland AG
Publication of JP2019096867A publication Critical patent/JP2019096867A/ja
Publication of JP2019096867A5 publication Critical patent/JP2019096867A5/ja
Application granted granted Critical
Publication of JP7398191B2 publication Critical patent/JP7398191B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K1/00—Details of the magnetic circuit
    • H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
    • H02K1/22—Rotating parts of the magnetic circuit
    • H02K1/27—Rotor cores with permanent magnets
    • H02K1/2706—Inner rotors
    • H02K1/272—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis
    • H02K1/274—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis the rotor consisting of two or more circumferentially positioned magnets
    • H02K1/2753—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis the rotor consisting of two or more circumferentially positioned magnets the rotor consisting of magnets or groups of magnets arranged with alternating polarity
    • H02K1/276—Magnets embedded in the magnetic core, e.g. interior permanent magnets [IPM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
    • H02K11/21—Devices for sensing speed or position, or actuated thereby
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
    • H02K11/25—Devices for sensing temperature, or actuated thereby
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
    • H02K7/10—Structural association with clutches, brakes, gears, pulleys or mechanical starters
    • H02K7/116—Structural association with clutches, brakes, gears, pulleys or mechanical starters with gears
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75824—Translational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75841—Means for moving parts of the bonding head
    • H01L2224/75842—Rotational mechanism

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Reciprocating, Oscillating Or Vibrating Motors (AREA)
JP2018195498A 2017-11-17 2018-10-17 部品を装着するボンディングヘッド及び該ボンディングヘッドを備えているダイボンダ Active JP7398191B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH01396/17A CH714351A1 (de) 2017-11-17 2017-11-17 Bondkopf für die Montage von Bauelementen.
CH01396/17 2017-11-17
CH00957/18A CH714384A2 (de) 2017-11-17 2018-08-06 Bondkopf für die Montage von Bauelementen und Die Bonder mit einem solchen Bondkopf.
CH00957/18 2018-08-06

Publications (3)

Publication Number Publication Date
JP2019096867A JP2019096867A (ja) 2019-06-20
JP2019096867A5 JP2019096867A5 (cg-RX-API-DMAC7.html) 2021-11-18
JP7398191B2 true JP7398191B2 (ja) 2023-12-14

Family

ID=66646772

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018195498A Active JP7398191B2 (ja) 2017-11-17 2018-10-17 部品を装着するボンディングヘッド及び該ボンディングヘッドを備えているダイボンダ

Country Status (6)

Country Link
JP (1) JP7398191B2 (cg-RX-API-DMAC7.html)
KR (1) KR102661560B1 (cg-RX-API-DMAC7.html)
CN (1) CN110011439B (cg-RX-API-DMAC7.html)
CH (2) CH714351A1 (cg-RX-API-DMAC7.html)
MY (1) MY200011A (cg-RX-API-DMAC7.html)
TW (1) TWI848919B (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3975664B1 (en) 2019-05-23 2025-11-12 Nippon Steel Corporation Secondary coil module, traverse hardening apparatus, and traverse hardening method
GB2591132A (en) * 2020-01-17 2021-07-21 Asm Assembly Systems Singapore Pte Ltd Tooling pin placement system
JP2024080318A (ja) 2022-12-02 2024-06-13 三星電子株式会社 実装装置及び実装方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5952744A (en) 1996-03-28 1999-09-14 Anoiad Corporation Rotary-linear actuator
JP2003319633A (ja) 2002-04-23 2003-11-07 Matsushita Electric Ind Co Ltd ボイスコイル型モータおよび作業ヘッド
JP2008251727A (ja) 2007-03-29 2008-10-16 Shibaura Mechatronics Corp 電子部品の実装装置
JP2008288473A (ja) 2007-05-21 2008-11-27 Panasonic Corp ワイヤボンディング方法およびワイヤボンディング装置
JP2014123731A (ja) 2012-12-21 2014-07-03 Vesi Switzerland Ag 基板上に半導体チップを実装するための熱圧着ボンディング方法および装置
JP2015113868A (ja) 2013-12-09 2015-06-22 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 流体圧アクチュエータ
JP2017144516A (ja) 2016-02-17 2017-08-24 株式会社ディスコ 加工装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2979772B2 (ja) * 1991-09-13 1999-11-15 松下電器産業株式会社 ダイボンディング装置
JP2998467B2 (ja) * 1992-12-04 2000-01-11 松下電器産業株式会社 電子部品の実装用ヘッド
DE60320596T2 (de) * 2003-08-25 2009-06-10 Husky Injection Molding Systems Ltd., Bolton Spritzgiesseinheit mit einer antriebsanordnung zum drehen und translatorischen verschieben einer welle
US8651159B2 (en) * 2009-06-12 2014-02-18 Asm Assembly Automation Ltd Die bonder providing a large bonding force
KR20110137602A (ko) * 2010-06-17 2011-12-23 한미반도체 주식회사 다이 본딩 장치의 본드 헤드
CH707480B1 (de) * 2013-01-21 2016-08-31 Besi Switzerland Ag Bondkopf mit einem heiz- und kühlbaren Saugorgan.
CH707934B1 (de) * 2013-04-19 2017-04-28 Besi Switzerland Ag Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
US9726204B2 (en) * 2013-12-09 2017-08-08 Samsung Electronics Co., Ltd. Fluid pressure actuator
JP6573813B2 (ja) * 2015-09-30 2019-09-11 ファスフォードテクノロジ株式会社 ダイボンダおよび半導体装置の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5952744A (en) 1996-03-28 1999-09-14 Anoiad Corporation Rotary-linear actuator
JP2003319633A (ja) 2002-04-23 2003-11-07 Matsushita Electric Ind Co Ltd ボイスコイル型モータおよび作業ヘッド
JP2008251727A (ja) 2007-03-29 2008-10-16 Shibaura Mechatronics Corp 電子部品の実装装置
JP2008288473A (ja) 2007-05-21 2008-11-27 Panasonic Corp ワイヤボンディング方法およびワイヤボンディング装置
JP2014123731A (ja) 2012-12-21 2014-07-03 Vesi Switzerland Ag 基板上に半導体チップを実装するための熱圧着ボンディング方法および装置
JP2015113868A (ja) 2013-12-09 2015-06-22 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 流体圧アクチュエータ
JP2017144516A (ja) 2016-02-17 2017-08-24 株式会社ディスコ 加工装置

Also Published As

Publication number Publication date
KR102661560B1 (ko) 2024-04-26
CN110011439A (zh) 2019-07-12
JP2019096867A (ja) 2019-06-20
MY200011A (en) 2023-12-04
CH714351A1 (de) 2019-05-31
TWI848919B (zh) 2024-07-21
TW201923940A (zh) 2019-06-16
CH714384A2 (de) 2019-05-31
CN110011439B (zh) 2023-10-17
KR20190056985A (ko) 2019-05-27

Similar Documents

Publication Publication Date Title
JP7398191B2 (ja) 部品を装着するボンディングヘッド及び該ボンディングヘッドを備えているダイボンダ
US9494413B2 (en) Probe holder for measuring system
US20020039060A1 (en) Actuator
JP2004088024A (ja) 部品装着装置
CN104795346A (zh) 一种电磁型芯片操作装置
WO2010106079A1 (en) Electronic component placement machine with air bearing axis for its pick and/or place system
CN105762099B (zh) 一种芯片供送机构及粘片机
US12046490B2 (en) Bonding head for mounting components and die bonder with such a bonding head
CN103426345B (zh) 一种紧凑型磁悬浮工作台的实验装置
US7325298B2 (en) Pressure apparatus and chip mounter
WO2010036204A1 (en) Direct drive pick and place system with reduced moving mass
CN104966687B (zh) 一种键合头装置
CN100390034C (zh) 送料装置及采用该送料装置的元器件装配装置
JP2004103653A (ja) ダイボンダ
HK40007889A (en) Bonding head for mounting components and die bonder with such a bonding head
CN110828339A (zh) 一种取料单元及固晶机
HK40007889B (zh) 用於安装组件的结合头和具有这种结合头的贴片机
JP2019096867A5 (cg-RX-API-DMAC7.html)
TWI808231B (zh) 致動器
US20040231148A1 (en) Head for implanting electrical components on substrates
KR20210076100A (ko) 액추에이터
CN113465684B (zh) 非接触式运动体状态检测装置
TW202027592A (zh) 致動器
CN105789101A (zh) 一种芯片供送机构及粘片机
TW202020416A (zh) 致動器的荷重檢測器

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181218

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211007

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20211008

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20221110

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20221122

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230119

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20230516

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230831

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20230831

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20230922

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20231121

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20231204

R150 Certificate of patent or registration of utility model

Ref document number: 7398191

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150