TWI832989B - 感光性樹脂組成物、感光性樹脂薄片、硬化膜、硬化膜之製造方法、有機el顯示裝置、及電子零件 - Google Patents

感光性樹脂組成物、感光性樹脂薄片、硬化膜、硬化膜之製造方法、有機el顯示裝置、及電子零件 Download PDF

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Publication number
TWI832989B
TWI832989B TW109107947A TW109107947A TWI832989B TW I832989 B TWI832989 B TW I832989B TW 109107947 A TW109107947 A TW 109107947A TW 109107947 A TW109107947 A TW 109107947A TW I832989 B TWI832989 B TW I832989B
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TW
Taiwan
Prior art keywords
photosensitive resin
compound
film
resin composition
polyimide precursor
Prior art date
Application number
TW109107947A
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English (en)
Chinese (zh)
Other versions
TW202106760A (zh
Inventor
小森悠佑
鷲見岳
三好一登
Original Assignee
日商東麗股份有限公司
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Application filed by 日商東麗股份有限公司 filed Critical 日商東麗股份有限公司
Publication of TW202106760A publication Critical patent/TW202106760A/zh
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Publication of TWI832989B publication Critical patent/TWI832989B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/48—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW109107947A 2019-03-14 2020-03-11 感光性樹脂組成物、感光性樹脂薄片、硬化膜、硬化膜之製造方法、有機el顯示裝置、及電子零件 TWI832989B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019046742 2019-03-14
JP2019-046742 2019-03-14

Publications (2)

Publication Number Publication Date
TW202106760A TW202106760A (zh) 2021-02-16
TWI832989B true TWI832989B (zh) 2024-02-21

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Family Applications (1)

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TW109107947A TWI832989B (zh) 2019-03-14 2020-03-11 感光性樹脂組成物、感光性樹脂薄片、硬化膜、硬化膜之製造方法、有機el顯示裝置、及電子零件

Country Status (6)

Country Link
US (1) US11953830B2 (https=)
JP (1) JP7517149B2 (https=)
KR (1) KR102813261B1 (https=)
CN (1) CN113544585B (https=)
TW (1) TWI832989B (https=)
WO (1) WO2020184326A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240044383A (ko) * 2021-08-06 2024-04-04 도레이 카부시키가이샤 크산텐 화합물, 수지 조성물, 경화물, 경화물의 제조 방법, 유기 el 표시 장치 및 표시 장치
KR20230057969A (ko) 2021-10-22 2023-05-02 주식회사 엘지화학 수지 중합 반응 장치 및 수지 토출 방법
CN114890873B (zh) * 2022-03-18 2024-03-19 上海邃铸科技有限公司 一种组合物以及提高酰亚胺化率的方法
JP2024048223A (ja) * 2022-09-27 2024-04-08 Jsr株式会社 感光性樹脂組成物、レジストパターン膜の製造方法、およびメッキ造形物の製造方法
CN119895367A (zh) * 2022-12-20 2025-04-25 东丽株式会社 布线基板、遮光层形成用正型感光性树脂组合物、遮光层转印膜及布线基板的制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011197362A (ja) * 2010-03-19 2011-10-06 Toray Ind Inc ポジ型感光性樹脂組成物
TW201829539A (zh) * 2016-11-02 2018-08-16 日商東麗股份有限公司 樹脂組成物、樹脂薄片、硬化膜、有機ｅｌ顯示裝置、半導體電子零件、半導體裝置及有機ｅｌ顯示裝置之製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6212979B2 (ja) * 2013-06-21 2017-10-18 東レ株式会社 樹脂組成物
CN113820920B (zh) 2016-03-31 2023-07-04 旭化成株式会社 感光性树脂组合物、固化浮雕图案的制造方法和半导体装置
WO2017217292A1 (ja) * 2016-06-16 2017-12-21 東レ株式会社 感光性樹脂組成物、感光性シート、硬化膜、素子、有機ｅｌ表示装置、半導体電子部品、半導体装置および有機ｅｌ表示装置の製造方法
US11163234B2 (en) 2016-08-22 2021-11-02 Asahi Kasei Kabushiki Kaisha Photosensitive resin composition and method for producing cured relief pattern

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011197362A (ja) * 2010-03-19 2011-10-06 Toray Ind Inc ポジ型感光性樹脂組成物
TW201829539A (zh) * 2016-11-02 2018-08-16 日商東麗股份有限公司 樹脂組成物、樹脂薄片、硬化膜、有機ｅｌ顯示裝置、半導體電子零件、半導體裝置及有機ｅｌ顯示裝置之製造方法

Also Published As

Publication number Publication date
JP7517149B2 (ja) 2024-07-17
CN113544585A (zh) 2021-10-22
US20220155680A1 (en) 2022-05-19
US11953830B2 (en) 2024-04-09
TW202106760A (zh) 2021-02-16
WO2020184326A1 (ja) 2020-09-17
CN113544585B (zh) 2024-10-22
KR20210141469A (ko) 2021-11-23
JPWO2020184326A1 (https=) 2020-09-17
KR102813261B1 (ko) 2025-05-28

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