TWI823437B - 加熱處理裝置 - Google Patents
加熱處理裝置 Download PDFInfo
- Publication number
- TWI823437B TWI823437B TW111123325A TW111123325A TWI823437B TW I823437 B TWI823437 B TW I823437B TW 111123325 A TW111123325 A TW 111123325A TW 111123325 A TW111123325 A TW 111123325A TW I823437 B TWI823437 B TW I823437B
- Authority
- TW
- Taiwan
- Prior art keywords
- temperature control
- workpiece
- vapor chamber
- chamber
- heating
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 129
- 238000012545 processing Methods 0.000 claims abstract description 129
- 230000005855 radiation Effects 0.000 claims abstract description 59
- 238000002791 soaking Methods 0.000 claims 1
- 238000009826 distribution Methods 0.000 abstract description 30
- 238000000034 method Methods 0.000 abstract description 5
- 239000007789 gas Substances 0.000 description 20
- 239000000758 substrate Substances 0.000 description 20
- 238000001816 cooling Methods 0.000 description 16
- 239000000463 material Substances 0.000 description 12
- 239000000112 cooling gas Substances 0.000 description 11
- 230000002093 peripheral effect Effects 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 8
- 230000007423 decrease Effects 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 241000219122 Cucurbita Species 0.000 description 1
- 235000009852 Cucurbita pepo Nutrition 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D99/00—Subject matter not provided for in other groups of this subclass
- F27D99/0001—Heating elements or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D21/00—Arrangements of monitoring devices; Arrangements of safety devices
- F27D21/0014—Devices for monitoring temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D99/00—Subject matter not provided for in other groups of this subclass
- F27D99/0001—Heating elements or systems
- F27D2099/0061—Indirect heating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Control Of Resistance Heating (AREA)
- Drying Of Solid Materials (AREA)
- Furnace Details (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-123920 | 2021-07-29 | ||
| JP2021123920A JP7366086B2 (ja) | 2021-07-29 | 2021-07-29 | 加熱処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202305992A TW202305992A (zh) | 2023-02-01 |
| TWI823437B true TWI823437B (zh) | 2023-11-21 |
Family
ID=85060178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111123325A TWI823437B (zh) | 2021-07-29 | 2022-06-23 | 加熱處理裝置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7366086B2 (ja) |
| KR (1) | KR20230018314A (ja) |
| CN (1) | CN115672686B (ja) |
| TW (1) | TWI823437B (ja) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10112437A (ja) * | 1996-10-04 | 1998-04-28 | Hitachi Ltd | 半導体基板処理装置 |
| WO2019117250A1 (ja) * | 2017-12-15 | 2019-06-20 | 芝浦メカトロニクス株式会社 | 有機膜形成装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002195755A (ja) * | 2000-10-16 | 2002-07-10 | Matsushita Electric Ind Co Ltd | 熱処理装置 |
| JP2006170534A (ja) * | 2004-12-16 | 2006-06-29 | Seiko Epson Corp | 被加熱体の加熱方法、加熱炉、及びデバイスの製造方法 |
| CN102633442B (zh) * | 2012-04-19 | 2015-12-09 | 深圳市华星光电技术有限公司 | 温控针支撑基板进行配向膜预干燥的装置及方法 |
| JP6240440B2 (ja) * | 2013-08-30 | 2017-11-29 | 東京応化工業株式会社 | チャンバー装置及び加熱方法 |
| JP6773019B2 (ja) | 2017-12-27 | 2020-10-21 | 京セラドキュメントソリューションズ株式会社 | 画像形成装置 |
| KR102226624B1 (ko) * | 2018-03-30 | 2021-03-12 | 시바우라 메카트로닉스 가부시끼가이샤 | 유기막 형성 장치, 및 유기막의 제조 방법 |
| CN110391132B (zh) * | 2018-04-16 | 2023-05-16 | 芝浦机械电子株式会社 | 有机膜形成装置 |
| JP6940541B2 (ja) * | 2018-04-16 | 2021-09-29 | 芝浦メカトロニクス株式会社 | 有機膜形成装置 |
-
2021
- 2021-07-29 JP JP2021123920A patent/JP7366086B2/ja active Active
-
2022
- 2022-06-16 KR KR1020220073397A patent/KR20230018314A/ko not_active Application Discontinuation
- 2022-06-21 CN CN202210703413.0A patent/CN115672686B/zh active Active
- 2022-06-23 TW TW111123325A patent/TWI823437B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10112437A (ja) * | 1996-10-04 | 1998-04-28 | Hitachi Ltd | 半導体基板処理装置 |
| WO2019117250A1 (ja) * | 2017-12-15 | 2019-06-20 | 芝浦メカトロニクス株式会社 | 有機膜形成装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115672686A (zh) | 2023-02-03 |
| TW202305992A (zh) | 2023-02-01 |
| KR20230018314A (ko) | 2023-02-07 |
| JP2023019295A (ja) | 2023-02-09 |
| CN115672686B (zh) | 2024-06-11 |
| JP7366086B2 (ja) | 2023-10-20 |
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