KR20230018314A - 가열 처리 장치 - Google Patents

가열 처리 장치 Download PDF

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Publication number
KR20230018314A
KR20230018314A KR1020220073397A KR20220073397A KR20230018314A KR 20230018314 A KR20230018314 A KR 20230018314A KR 1020220073397 A KR1020220073397 A KR 1020220073397A KR 20220073397 A KR20220073397 A KR 20220073397A KR 20230018314 A KR20230018314 A KR 20230018314A
Authority
KR
South Korea
Prior art keywords
temperature
plate
temperature control
workpiece
unit
Prior art date
Application number
KR1020220073397A
Other languages
English (en)
Korean (ko)
Inventor
아키노리 이소
다카시 다카하시
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바우라 메카트로닉스 가부시끼가이샤 filed Critical 시바우라 메카트로닉스 가부시끼가이샤
Publication of KR20230018314A publication Critical patent/KR20230018314A/ko

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D99/00—Subject matter not provided for in other groups of this subclass
    • F27D99/0001—Heating elements or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D21/00—Arrangements of monitoring devices; Arrangements of safety devices
    • F27D21/0014—Devices for monitoring temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D99/00—Subject matter not provided for in other groups of this subclass
    • F27D99/0001—Heating elements or systems
    • F27D2099/0061—Indirect heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Control Of Resistance Heating (AREA)
  • Drying Of Solid Materials (AREA)
  • Furnace Details (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
KR1020220073397A 2021-07-29 2022-06-16 가열 처리 장치 KR20230018314A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2021-123920 2021-07-29
JP2021123920A JP7366086B2 (ja) 2021-07-29 2021-07-29 加熱処理装置

Publications (1)

Publication Number Publication Date
KR20230018314A true KR20230018314A (ko) 2023-02-07

Family

ID=85060178

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220073397A KR20230018314A (ko) 2021-07-29 2022-06-16 가열 처리 장치

Country Status (4)

Country Link
JP (1) JP7366086B2 (ja)
KR (1) KR20230018314A (ja)
CN (1) CN115672686B (ja)
TW (1) TWI823437B (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019117250A (ja) 2017-12-27 2019-07-18 京セラドキュメントソリューションズ株式会社 画像形成装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10112437A (ja) * 1996-10-04 1998-04-28 Hitachi Ltd 半導体基板処理装置
JP2002195755A (ja) * 2000-10-16 2002-07-10 Matsushita Electric Ind Co Ltd 熱処理装置
JP2006170534A (ja) * 2004-12-16 2006-06-29 Seiko Epson Corp 被加熱体の加熱方法、加熱炉、及びデバイスの製造方法
CN102633442B (zh) * 2012-04-19 2015-12-09 深圳市华星光电技术有限公司 温控针支撑基板进行配向膜预干燥的装置及方法
JP6240440B2 (ja) * 2013-08-30 2017-11-29 東京応化工業株式会社 チャンバー装置及び加熱方法
CN111566428B (zh) * 2017-12-15 2022-03-29 芝浦机械电子株式会社 有机膜形成装置
CN110323161B (zh) * 2018-03-30 2023-06-06 芝浦机械电子株式会社 有机膜形成装置以及有机膜制造方法
JP6940541B2 (ja) * 2018-04-16 2021-09-29 芝浦メカトロニクス株式会社 有機膜形成装置
CN110391132B (zh) * 2018-04-16 2023-05-16 芝浦机械电子株式会社 有机膜形成装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019117250A (ja) 2017-12-27 2019-07-18 京セラドキュメントソリューションズ株式会社 画像形成装置

Also Published As

Publication number Publication date
JP7366086B2 (ja) 2023-10-20
CN115672686B (zh) 2024-06-11
CN115672686A (zh) 2023-02-03
TW202305992A (zh) 2023-02-01
JP2023019295A (ja) 2023-02-09
TWI823437B (zh) 2023-11-21

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