TWI819706B - 蝕刻方法及半導體元件之製造方法 - Google Patents

蝕刻方法及半導體元件之製造方法 Download PDF

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Publication number
TWI819706B
TWI819706B TW111126597A TW111126597A TWI819706B TW I819706 B TWI819706 B TW I819706B TW 111126597 A TW111126597 A TW 111126597A TW 111126597 A TW111126597 A TW 111126597A TW I819706 B TWI819706 B TW I819706B
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TW
Taiwan
Prior art keywords
etching
gas
etched
less
silicon
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TW111126597A
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English (en)
Chinese (zh)
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TW202310028A (zh
Inventor
Kazuma Matsui
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日商力森諾科股份有限公司
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Publication of TW202310028A publication Critical patent/TW202310028A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Weting (AREA)
TW111126597A 2021-08-10 2022-07-15 蝕刻方法及半導體元件之製造方法 TWI819706B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021130524 2021-08-10
JP2021-130524 2021-08-10

Publications (2)

Publication Number Publication Date
TW202310028A TW202310028A (zh) 2023-03-01
TWI819706B true TWI819706B (zh) 2023-10-21

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ID=85199933

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TW111126597A TWI819706B (zh) 2021-08-10 2022-07-15 蝕刻方法及半導體元件之製造方法

Country Status (5)

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US (1) US20240363356A1 (https=)
JP (1) JPWO2023017696A1 (https=)
KR (1) KR20240038985A (https=)
TW (1) TWI819706B (https=)
WO (1) WO2023017696A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014236055A (ja) * 2013-05-31 2014-12-15 東京エレクトロン株式会社 エッチング方法
TW201635383A (zh) * 2015-01-06 2016-10-01 蘭姆研究公司 使用一氧化氮活化之矽氧化物的同向性原子層蝕刻
WO2018181104A1 (ja) * 2017-03-27 2018-10-04 関東電化工業株式会社 ドライエッチング方法またはドライクリーニング方法
JP2019129313A (ja) * 2018-01-22 2019-08-01 東京エレクトロン株式会社 エッチング方法
US20200312620A1 (en) * 2016-12-22 2020-10-01 Asm Ip Holding B.V. Atomic layer etching processes

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100236055B1 (ko) 1997-04-28 1999-12-15 김영환 전계 방출 소자 및 제조방법
JP6426489B2 (ja) * 2015-02-03 2018-11-21 東京エレクトロン株式会社 エッチング方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014236055A (ja) * 2013-05-31 2014-12-15 東京エレクトロン株式会社 エッチング方法
TW201635383A (zh) * 2015-01-06 2016-10-01 蘭姆研究公司 使用一氧化氮活化之矽氧化物的同向性原子層蝕刻
US20200312620A1 (en) * 2016-12-22 2020-10-01 Asm Ip Holding B.V. Atomic layer etching processes
WO2018181104A1 (ja) * 2017-03-27 2018-10-04 関東電化工業株式会社 ドライエッチング方法またはドライクリーニング方法
JP2019129313A (ja) * 2018-01-22 2019-08-01 東京エレクトロン株式会社 エッチング方法

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Publication number Publication date
JPWO2023017696A1 (https=) 2023-02-16
TW202310028A (zh) 2023-03-01
WO2023017696A1 (ja) 2023-02-16
KR20240038985A (ko) 2024-03-26
US20240363356A1 (en) 2024-10-31

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