JPWO2023017696A1 - - Google Patents
Info
- Publication number
- JPWO2023017696A1 JPWO2023017696A1 JP2023541240A JP2023541240A JPWO2023017696A1 JP WO2023017696 A1 JPWO2023017696 A1 JP WO2023017696A1 JP 2023541240 A JP2023541240 A JP 2023541240A JP 2023541240 A JP2023541240 A JP 2023541240A JP WO2023017696 A1 JPWO2023017696 A1 JP WO2023017696A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021130524 | 2021-08-10 | ||
| PCT/JP2022/026719 WO2023017696A1 (ja) | 2021-08-10 | 2022-07-05 | エッチング方法及び半導体素子の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023017696A1 true JPWO2023017696A1 (https=) | 2023-02-16 |
| JPWO2023017696A5 JPWO2023017696A5 (https=) | 2024-05-08 |
Family
ID=85199933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023541240A Pending JPWO2023017696A1 (https=) | 2021-08-10 | 2022-07-05 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240363356A1 (https=) |
| JP (1) | JPWO2023017696A1 (https=) |
| KR (1) | KR20240038985A (https=) |
| TW (1) | TWI819706B (https=) |
| WO (1) | WO2023017696A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100236055B1 (ko) | 1997-04-28 | 1999-12-15 | 김영환 | 전계 방출 소자 및 제조방법 |
| JP6139986B2 (ja) * | 2013-05-31 | 2017-05-31 | 東京エレクトロン株式会社 | エッチング方法 |
| US9425041B2 (en) * | 2015-01-06 | 2016-08-23 | Lam Research Corporation | Isotropic atomic layer etch for silicon oxides using no activation |
| JP6426489B2 (ja) * | 2015-02-03 | 2018-11-21 | 東京エレクトロン株式会社 | エッチング方法 |
| US10283319B2 (en) * | 2016-12-22 | 2019-05-07 | Asm Ip Holding B.V. | Atomic layer etching processes |
| EP3605587A4 (en) * | 2017-03-27 | 2020-12-30 | Kanto Denka Kogyo Co., Ltd. | DRY ENGRAVING OR DRY CLEANING PROCESS |
| JP7145740B2 (ja) * | 2018-01-22 | 2022-10-03 | 東京エレクトロン株式会社 | エッチング方法 |
-
2022
- 2022-07-05 US US18/682,767 patent/US20240363356A1/en active Pending
- 2022-07-05 KR KR1020247004737A patent/KR20240038985A/ko active Pending
- 2022-07-05 JP JP2023541240A patent/JPWO2023017696A1/ja active Pending
- 2022-07-05 WO PCT/JP2022/026719 patent/WO2023017696A1/ja not_active Ceased
- 2022-07-15 TW TW111126597A patent/TWI819706B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW202310028A (zh) | 2023-03-01 |
| TWI819706B (zh) | 2023-10-21 |
| WO2023017696A1 (ja) | 2023-02-16 |
| KR20240038985A (ko) | 2024-03-26 |
| US20240363356A1 (en) | 2024-10-31 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240208 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250529 |