TWI819167B - Method of manufacturing light emitting module, light emitting module, and projector - Google Patents

Abstract

To provide a method of manufacturing a light emitting module efficiently meeting various product specifications in relation to light output. Or, To provide a light emitting module in a suitable configuration in which the number of mounted light emitting elements is adjusted. A method of manufacturing a light emitting module includes: providing, as a light emitting device 20 in which a plurality of light emitting elements is mounted, a first light emitting device 20a and a second light emitting device 20b differing from each other by one in number of the light emitting elements mounted therein; providing a first mounting substrate 10a having a mounting surface provided with a plurality of connection patterns having identical patterns to each other, the connection patterns each corresponding to one of the light emitting device 20 ; and mounting the light emitting devices 20 selected from the first light emitting device 20a and the second light emitting device 20b on the connection patterns provided on the mounting surface of the first mounting substrate 10a. A light emitting module 100 mounted the light emitting elements by any arbitrary number selected from at least three continuous numbers is manufactured.

Description

Manufacturing method of light-emitting module, light-emitting module and projector

The present disclosure relates to a manufacturing method of a light-emitting module, a light-emitting module and a projector.

Previously, light-emitting modules have been developed in which a light-emitting device equipped with a plurality of light-emitting elements in one package is mounted on a single mounting substrate. Patent Document 1 discloses an optical unit including a plurality of semiconductor devices in which four semiconductor elements are mounted in one package on a unit substrate. [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Laid-Open No. 2007-227422

[Problem to be solved by the invention]

The light output of the light-emitting module also changes depending on the use or size of the product it is mounted on. Therefore, as a method to flexibly respond to required light output, a method of adjusting the number of light-emitting elements mounted on the product may be considered. However, regarding the output light, there is still room for improvement in effectively meeting the various specifications required.

Therefore, the object of the embodiments of the present disclosure is to provide a manufacturing method for a light-emitting module that can effectively cope with various specifications regarding the light output.

Alternatively, an object of the embodiments of the present disclosure is to provide a light-emitting module with a better form of adjusting the number of mounted light-emitting elements. [Technical means to solve problems]

The manufacturing method of the light-emitting module according to the embodiment of the present disclosure is a manufacturing method of the above-mentioned light-emitting module that is equipped with one or a plurality of light-emitting devices mounted with a plurality of light-emitting elements, and includes the following steps: preparation The above-mentioned light-emitting device, that is, the first light-emitting device and the second light-emitting device whose numbers of light-emitting elements are different from each other by one are prepared; a first mounting substrate is prepared, which has a mounting surface, and the mounting surface is provided with a plurality of identical connection patterns, The connection pattern corresponds to one of the light-emitting devices; and a plurality of the connection patterns provided on the mounting surface of the first mounting substrate are mounted with a plurality of the light-emitting devices selected from the first light-emitting device and the second light-emitting device. ; And this manufacturing method can manufacture the above-mentioned light-emitting module equipped with at least any number of light-emitting elements selected from three consecutive quantities.

A light-emitting module according to an embodiment of the present disclosure includes: a first light-emitting device mounted with a plurality of light-emitting elements; and a second light-emitting device mounted with one more light-emitting element than the first light-emitting device. The light-emitting device; and the first mounting substrate, which has a mounting surface, the mounting surface is provided with a plurality of identical connection patterns, the above-mentioned connection pattern corresponds to one of the above-mentioned light-emitting devices; and the light-emitting module is provided for the above-mentioned first 1 A plurality of the above-mentioned connection patterns on the mounting surface of the mounting substrate connect one or more of the above-mentioned first light-emitting devices and one or more of the above-mentioned second light-emitting devices.

A projector according to an embodiment of the present disclosure includes: the light-emitting module described above; a sealing member provided on a mounting substrate of the light-emitting module; and a sealing member bonded to the mounting substrate via the sealing member to form a seal. Space; a light-emitting device, which is installed on the above-mentioned mounting substrate in the formed sealed space; and an optical unit, which is installed in the formed sealed space. [Effects of the invention]

The manufacturing method of the light-emitting module according to the embodiment of the present disclosure can effectively cope with various specifications. In addition, the light-emitting module according to the embodiment of the present disclosure can provide a better form of adjusting the number of mounted light-emitting elements.

The embodiment will be described below with reference to the drawings. However, the forms shown below are illustrative of the light-emitting module and the manufacturing method of the light-emitting module for embodying the technical idea of the present embodiment, and are not limited to the following. In addition, unless otherwise specified, the dimensions, materials, shapes, relative arrangements, etc. of the constituent parts described in the embodiments are not intended to limit the scope of the present invention, but are merely examples. In addition, the size and positional relationship of the members shown in each drawing may be exaggerated for clear explanation. In addition, in each embodiment, members using the same symbols as in other embodiments represent the same or corresponding members, and descriptions may be omitted.

<First Embodiment> FIG. 1A is a perspective view schematically showing an example of the structure of the light-emitting module according to the first embodiment. 1B is a top view schematically showing an example of the structure of the light-emitting module according to the first embodiment. FIG. 1C is a plan view schematically showing an example of the structure of the mounting substrate according to the first embodiment. FIG. 1D is a top view showing a state in which the mounting substrate of FIG. 1C is separated into two first mounting substrates. FIG. 2A is an exploded perspective view schematically showing the structure of the first light-emitting device. FIG. 2B is a top view schematically showing the structure within the package of the first light-emitting device. FIG. 3A is an exploded perspective view schematically showing the structure of the second light-emitting device. FIG. 3B is a top view schematically showing the structure within the package of the second light-emitting device. Fig. 3C is a cross-sectional view along line IIIC-IIIC in Fig. 3B. FIG. 3D is a top view schematically showing the structure of the lower surface of the second light-emitting device.

＜Light-emitting module＞ The first light-emitting device 20a with three light-emitting elements 22 is mounted on the light-emitting module 100, or the second light-emitting device 20 with one more light-emitting element 22 than the first light-emitting device 20a, that is, four light-emitting elements 22 is mounted on the light-emitting module 100. Any one of the light emitting devices 20b. Moreover, it has the 1st mounting board 10a provided with the 2 connection patterns 15 corresponding to any one of the 1st light-emitting device 20a and the 2nd light-emitting device 20b on a mounting surface. Furthermore, the desired light-emitting device 20 selected from the first light-emitting device 20a and the second light-emitting device 20b is connected to the two connection patterns 15 provided on the mounting surface of the first mounting substrate 10a. Specifically, any combination of two first light-emitting devices 20a, two second light-emitting devices 20b, or one first light-emitting device 20a and one second light-emitting device 20b is connected. Furthermore, the mounting substrate 10 using one first mounting substrate 10a or the mounting substrate 10 using two first mounting substrates 10a side by side is formed.

In addition, when two mounting boards 10 are arranged side by side, only one light-emitting device selected from the first light-emitting device 20a and the second light-emitting device 20b is connected to one of the two first mounting boards 10a. situation, and the situation of selecting two light-emitting devices to connect. In addition, it is possible to realize a light-emitting module in which the mounting substrate 10 is formed with one first mounting substrate 10a, and only one light-emitting device is selected from the first light-emitting device 20a and the second light-emitting device 20b and is connected to one first mounting substrate 10a. 100. In the example of FIG. 1 , it is described that two first mounting substrates 10 a are formed side by side on the mounting substrate 10 , and each first mounting substrate 10 a has two connection patterns 15 , and one first light-emitting device 20 a and one are bonded to each other. The light-emitting module 100 of the second light-emitting device 20b. Each structure of the light emitting module 100 will be described below.

The light-emitting module 100 includes a mounting substrate 10 and a light-emitting device 20 . [Installation base] The mounting substrate 10 is composed of one first mounting substrate 10a or two first mounting substrates 10a each having the same configuration. In the example of FIG. 1C , two first mounting substrates 10 a are arranged side by side to form the mounting substrate 10 . The first mounting substrate 10a has a lower surface, an upper surface, and side surfaces, and a connection pattern 15 including a metal portion 11 and a first metal film 12, a second metal film 13, and an insulating film 14 are formed on the upper surface. The first mounting substrate 10a has a mounting surface on which two identical connection patterns 15 are provided on the upper surface. Since one light-emitting device 20 is mounted on one connection pattern 15, the first mounting substrate 10a is formed so that two light-emitting devices 20 can be mounted. When the first mounting substrate 10a is provided with two connection patterns, the same connection pattern 15 is used, thereby making it easy to form the connection patterns in the first mounting substrate 10a. In addition, there may be more than two connection patterns 15 , for example, three connection patterns 15 may be arranged side by side in a row. A plurality of connection patterns 15 are provided in one first mounting substrate 10a. The connection pattern 15 is composed of a metal portion 11 exposed from the insulating film 14 and a first metal film 12 formed on the insulating film 14, and the metal portion 11 and the first metal film 12 are mounting surfaces for the light emitting device. In addition, the metal part 11 may be formed with a metal film on the upper surface. For example, similarly to the first metal film 12 , a metal film can be formed on the insulating film 14 and the metal portion 11 can be provided.

The metal part 11 is a place where the light-emitting device 20 is mounted. It is formed into a rectangular shape when viewed from above, and two metal parts 11 are formed side by side in the transverse direction. The metal portion 11 is formed by directly exposing the substrate without providing the insulating film 14 on the upper surface of the first mounting substrate 10a. In addition, the metal part 11 may be formed of a plurality of metal layers. For example, in order to set the height of the insulating film 14 or the first metal film 12 provided on the upper surface of the substrate to be the same, a metal layer may be provided in the area of the metal portion 11 of the substrate to form a plurality of metal layers. The insulating film 14 is provided on the upper surface of the first mounting substrate 10a except for the metal portion 11. The first metal film 12 and the second metal film 13 are provided on the insulating film 14 .

For one metal part 11 , three first metal films 12 are formed in pairs on the upper side and the lower side of the metal part 11 in plan view. In addition, a second metal film 13 is provided on the side of the first metal film 12 provided up and down. It is not provided on the other first metal film 12 side. The second metal film 13 and the first metal film 12 provided on the second metal film 13 side are provided with a metal film connecting them on the insulating film 14, and are then divided into the first metal film 12 and the second metal film 12. The insulating film 14 is provided in the form of the metal film 13. That is, the first metal film 12 and the second metal film 13 are not visible from the surface, but are connected and electrically connected. The three first metal films 12 on the side where the second metal film 13 is not provided are connected between the two connection patterns 15 . That is, a connected metal film is similarly provided on the insulating film 14 , and the insulating film 14 is provided from above so that each of the connection patterns 15 becomes three first metal films 12 . Therefore, the first metal films 12 on the side of the two connection patterns 15 where the second metal film 13 is not provided are connected to each other and are electrically connected. The metal portion 11 is not connected to the first metal film 12 . The first metal films 12 arranged in pairs up and down sandwiching the metal part 11 are bonded to the metal films 37 provided on the lower surface of the light emitting device 20, thereby electrically connecting one to the other. In addition, by mounting the light-emitting device 20 on the two connection patterns 15, conduction can be achieved from one second metal film 13 to the other second metal film 13 through the two light-emitting devices 20.

In this way, the first mounting substrate 10a and the light emitting device 20 can be electrically connected. In addition, in the first mounting substrate 10a, the first metal film 12 is separately provided in three areas, whereby self-alignment can be effectively performed when the light-emitting device 20 is mounted. In addition, when one light-emitting device 20 is installed, conduction can be achieved from the first metal film 12 on the side of the connection pattern 15 where the light-emitting device is not connected and the second metal film 13 is not provided. Furthermore, by arranging the second metal film 13 on one side, the installation direction can be specified from the position of the second metal film. Two of the first mounting substrates 10 a among the mounting substrates 10 are arranged side by side so as to face the side opposite to the side on which the second metal film 13 is formed. The first mounting substrate 10a is located outside the area where the two connection patterns 15 are arranged side by side and the direction in which the first metal film 12 is sandwiched between the metal portion 11 is set to the left and right positions, and a penetration penetrating through the thickness direction of the substrate is formed. hole. These through holes are provided for retaining positioning pins or fixing threads.

[Lighting device] The light-emitting device 20 includes a first light-emitting device 20a and a second light-emitting device 20b. Each of the first light-emitting device 20a and the second light-emitting device 20b has a package 21, a semiconductor laser element 22, a submount 23, a light reflection member 24, a protective element 25, a wire 26, a cover member 27, a bonding portion 28, and a lens member 29 .

The first light-emitting device 20a and the second light-emitting device 20b have the same outer shape, and have different numbers of semiconductor laser elements 22 placed inside the outer shape. That is, in this embodiment, the package 21 capable of mounting four semiconductor laser elements 22 is used for both the first light-emitting device 20a and the second light-emitting device 20b. Therefore, for the same package 21, the first light-emitting device 20a mounted with three semiconductor laser elements 22 can be manufactured as shown in FIGS. 2A and 2B, and the first light-emitting device 20a mounted with 4 semiconductors as shown in FIGS. 3A and 3B can be manufactured. The second light-emitting device 20b of the laser element 22. Since the first light-emitting device 20a and the second light-emitting device 20b have the same package and the same outer shape, when they are joined to the mounting substrate, even if either light-emitting device is installed, there is no need to consider the size of the light-emitting device on the mounting substrate side. different. Thereby, as shown in the first mounting substrate 10a, a plurality of connection patterns can be prepared in a unified layout. 3C and 3D respectively show the cross section of the second light-emitting device and the lower surface (back surface) of the second light-emitting device, but the same applies to the first light-emitting device. In addition, the number of semiconductor laser elements 22 mounted on the first light emitting device 20a is not limited to three. For example, the number may be 2, or the number may be 4 or more. Or, it can also be 1. The number of semiconductor laser elements 22 mounted on the second light-emitting device 20b is one greater than the number of semiconductor laser elements 22 mounted on the first light-emitting device 20a. Alternatively, there can be 2 more.

The three semiconductor laser elements 22 of the first light-emitting device 20a are arranged at the same position as the three semiconductor laser elements 22 of the four semiconductor laser elements 22 of the second light-emitting device 20b. Thereby, both the first light-emitting device 20a and the second light-emitting device 20b can share the mounting position of the semiconductor laser element 22 in the package 21. It can be arbitrarily determined whether or not any one of the four semiconductor laser elements 22 is removed. For example, the three semiconductor laser elements 22 of the first light-emitting device 20a can be offset to one side of the package 21 and arranged side by side. That is, the arrangement is such that one of the four semiconductor laser elements 22 arranged at the second light emitting device 20b is removed from the semiconductor laser element 22 arranged at the end. By doing this, the light from the first light emitting device 20a can be suppressed to a smaller range. Furthermore, for example, the three semiconductor laser elements 22 of the first light-emitting device 20a may be arranged such that one of the four semiconductor laser elements 22 arranged in the second light-emitting device 20b is arranged outside both ends. twenty two. In this way, the length difference of the end-to-end light-emitting areas between the first light-emitting device 20a and the second light-emitting device 20b can be reduced. In addition, the arrangement is not limited to this. For example, three semiconductor laser elements 22 may be equally arranged in the area where four semiconductor laser elements 22 are arranged.

The package 21 is formed into a rectangular shape when viewed from above, and has a rectangular recess 30 when viewed from above. In addition, the rectangular shape here means a substantially rectangular shape including a shape in which a corner or a part of a side surface is cut off like the package 21 or a shape in which the corners are curved like the recessed portion 30 . In addition, the package 21 has a step portion 33 formed on a portion of the inner side surface 32 of the recessed portion 30 . Specifically, the step portion 33 is provided on the two opposite inner side surfaces 32 in the transverse direction among the four inner side surfaces 32 of the recessed portion 30 . The package 21 may be made of ceramic as the main material. In addition, the package 21 is not limited to ceramic and may be formed of metal. For example, in the case of ceramics, aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide can be used as the main material of the package 21 . For metals, copper, aluminum, iron, copper molybdenum as a composite, copper-diamond composite material, and copper tungsten can be used as the main material of the package 21.

Metal films are respectively provided on the lower surface 34 of the package 21 and the upper surface of the step portion 33 . In addition, the metal film in the lower surface 34 of the package 21 has metal films 37 arranged in pairs with both ends of the package 21, and a metal film 38 arranged in the center of the lower surface 34 of the package 21 between the metal films 37 at both ends. . Each of the metal films 37 is arranged in a substantially rectangular shape and spaced apart from each other at three locations along each of the two opposing sides. The metal film 37 is formed opposite to the first metal film 12 so as to be connected to the first mounting substrate 10a. In addition, the area of the metal film 38 provided in the center of the lower surface 34 of the package 21 is formed to be larger than any of the metal films 37 . The metal films 38 are formed to face each other so as to be connectable to the metal portion 11 of the first mounting substrate 10a. In the package 21, the metal film on the upper surface of the step portion 33 and the metal film 37 on the lower surface 34 are electrically connected by penetrating the internal metal wiring.

In addition, the package 21 may be formed by forming the frame part 35 and the bottom part 36 that form the frame of the recessed part 30 with different main materials, and joining the frame part 35 and the bottom part 36 together. For example, the package 21 may be formed by joining a plate-shaped bottom 36 made of metal as the main material and having a specific thickness, and a frame portion 35 of a specific height made of ceramic as the main material. In this case, instead of providing the metal film 38, the lower surface of the bottom 36 can be connected to the metal portion 11 of the first mounting substrate 10a.

The semiconductor laser element 22 and the protection element 25 are electrically connected to the metal film provided on the upper surface of the step portion 33, that is, the connection wiring. A conductive wire 26 is connected for electrical conduction. 2B and 3B show bonding examples of the wires 26 when the semiconductor laser elements 22 are connected in series. In addition, the connection method is not limited to this. In addition, a plurality of semiconductor laser elements 22 may be connected in parallel. Thereby, the semiconductor laser element 22 and the protection element 25 are electrically connected through the metal film 37 provided on the lower surface 34 of the package 21 .

The step portion 33 is not provided on the two inner side surfaces 32 of the package 21 facing each other in the longitudinal direction. The size of the package 21 can be reduced by not providing the step portion 33 across the entire circumference of the inner surface 32 . In addition, a step portion 33 may be provided on the inner side surface 32 located on the side away from the light reflecting member 24 . By enlarging the area where the step portion 33 is provided, more wiring area can be secured. On the other hand, the step portion 33 may not be provided on the inner side surface 32 located close to the light reflecting member 24 . Even if the step portion 33 is provided in this portion, the semiconductor laser element 22 must be connected to the wiring area so that the conductive wire 26 does not block the optical path, and it is difficult to provide a wiring area for the semiconductor laser element 22 . In addition, by not providing the step portion 33 on the inner side surface 32, the light reflecting member 24 can be disposed close to the outer side surface of the package 21. Details will be described later. When two light-emitting devices 20 are installed on the mounting substrate 10 , the distance between the lights emitted from the two light-emitting devices 20 can be made close. In addition, as shown in FIGS. 2B and 3B , the inner side surface 32 located on the side close to the light reflecting member 24 can also be called the inner side surface located at the end of the traveling direction of the laser light emitted from the semiconductor laser element.

In this light-emitting device 20, a pair of metal films 37 provided on the lower surface 34 are bonded to the first metal film 12 of the first mounting substrate 10a. Furthermore, the metal film 38 provided between the paired metal films 37 is bonded to the metal portion 11 of the first mounting substrate 10a. The light emitting device 20 and the first mounting substrate 10a can be joined by soldering. During the bonding between the metal film 37 and the metal film 38 on the lower surface 34 of the light-emitting device 20 and the first metal film 12 and the metal part 11 of the first mounting substrate 10a, the light-emitting device 20 is automatically fixed to the first mounting substrate 10a. Alignment comes into play.

The semiconductor laser element 22 has a lower surface, an upper surface, and side surfaces, and emits laser light from one side surface. The laser light emitted from the semiconductor laser element 22 has a width and forms an elliptical far field pattern (hereinafter referred to as "FFP: Far Field Pattern") on a plane parallel to the light emission end surface.

The semiconductor laser element 22 is placed on the bottom surface 31 (bottom upper surface) of the recess 30 of the package 21 with the sub-substrate 23 interposed therebetween. The sub-board 23 is provided individually for each semiconductor laser element 22 . In addition, the light-emitting device 20 can mount a plurality of semiconductor laser elements 22 on the upper surface of a sub-substrate 23 . In addition, the light-emitting device 20 can directly place the semiconductor laser element 22 on the bottom surface 31 of the recess 30 of the package 21 without interposing the sub-substrate 23 . As shown in FIG. 2B and FIG. 3B , a plurality of semiconductor laser elements 22 mounted on the light-emitting device 20 are arranged in one direction. Specifically, they are arranged in the longitudinal direction of the package 21 . In addition, the directions of the emission end surfaces of each of the mounted semiconductor laser elements 22 are aligned so that the laser light is emitted in the same direction. The position of the emission end surface of each semiconductor laser element 22 is designed to be arranged on the same plane. Alternatively, they may not be aligned on the same plane. A plurality of semiconductor laser elements 22 arranged in one direction are electrically connected in series using wires 26 . Laser light traveling in a direction orthogonal to the direction in which the plurality of semiconductor laser elements 22 are arranged is emitted from the emission end surfaces of the plurality of semiconductor laser elements 22 .

The semiconductor laser elements 22 placed on the first light-emitting device 20a and the second light-emitting device 20b are all semiconductor laser elements that emit blue light. In addition, it may also be a semiconductor laser element that emits light other than blue, such as red or green light. In addition, the color emitted by the semiconductor laser element 22 mounted on the first light-emitting device 20a can be different from the color emitted by the semiconductor laser element 22 mounted on the second light-emitting device 20b. For example, the semiconductor laser element 22 in which the first light-emitting device 20a emits blue light and the second light-emitting device 20b emits red light is mounted. In addition, the two first light-emitting devices 20a or the two second light-emitting devices 20b can be mounted on the first mounting substrate 10a by joining the two connection patterns 15. However, in this case, it can also be mounted on the first mounting substrate 10a. The two light-emitting devices 20 emit semiconductor laser elements 22 of different colors.

Here, blue light is light whose luminescence peak wavelength is in the range of 420 nm to 494 nm. Red light has a luminescence peak wavelength in the range of 605 nm to 750 nm. Green light has a luminescence peak wavelength in the range of 495 nm to 570 nm. In addition, the semiconductor laser element 22 is an example of the light-emitting element mounted in the light-emitting module of the present invention. As the light-emitting element, it is not limited to the semiconductor laser element 22.

The submount 23 is bonded to the bottom surface 31 of the recess 30 of the package 21 on its lower surface, and is bonded to the semiconductor laser element 22 on its upper surface. The semiconductor laser element 22 is placed on the sub-substrate 23 in such a manner that the emission end surface of the semiconductor laser element 22 is aligned with or protrudes from the side surface of the sub-substrate 23 . Thereby, the light emitted from the semiconductor laser element 22 can be prevented from irradiating the upper surface of the sub-substrate 23 . The submount 23 may be formed using, for example, silicon nitride, aluminum nitride, or silicon carbide. In addition, a metal film is provided on the upper surface of the sub-substrate 23 .

The light reflecting member 24 is a member that reflects the light from the semiconductor laser element 22 . The light reflecting member 24 is placed on the bottom surface of the recess 30 of the package 21 . The light reflecting members 24 are individually arranged corresponding to the respective semiconductor laser elements 22 . In addition, among the three or four semiconductor laser elements 22, the distance between the exit end surface of each semiconductor laser element 22 and the corresponding light reflecting member 24 is designed to be the same. In addition, the distance may be determined according to the semiconductor laser elements 22 , or the distances between the plurality of semiconductor laser elements 22 may be different. In addition, the light-emitting device 20 may be provided with one light reflecting member 24 corresponding to a plurality of semiconductor laser elements 22 .

The light reflecting member 24 has a lower surface, an upper surface, side surfaces, and an inclined surface, and the inclined surface is a light reflecting surface. The light reflecting surface is flat and inclined from the upper surface to the lower surface. The light reflective surface is designed to form an angle of 45 degrees relative to the lower surface. In addition, the angle is not limited to 45 degrees, and the light reflecting surface can also be a curved surface instead of a flat surface.

The light reflective member 24 can be formed by using a main material to form its outer shape, and forming a light reflective film on the surface where the light reflective surface is to be provided in the outer shape. The main material is preferably a material with strong heat resistance. For example, glass such as quartz stone or BK7 (borosilicate glass), metals such as aluminum, or Si can be used. The light reflective film is preferably made of materials with high light reflectivity. Metals such as Ag and Al or dielectric multilayer films such as Ta ₂ O ₅ /SiO ₂ , TiO ₂ /SiO ₂ , Nb ₂ O ₅ /SiO ₂ etc. can be used. . In addition, if the light reflective member 24 uses a material with a high light reflectivity such as metal as the main material to form its outer shape, the formation of the light reflective film may be omitted.

The main part of the light emitted from the semiconductor laser element 22 is irradiated to the corresponding light reflecting surface of the light reflecting member 24 . When the light emitted from the semiconductor laser element 22 passes through the light reflecting member 24, the optical path length of the light incident on the lens can be lengthened compared to the case where the light reflecting member 24 is not interposed. The longer optical path length can reduce the influence caused by the installation deviation of the light reflecting member 24 and the semiconductor laser element 22 . Alternatively, the light-emitting device 20 may be configured without the light reflecting member 24 and with the emission end surface of the semiconductor laser element 22 facing upward.

The protection element 25 is placed on the upper surface of the sub-substrate 23 . The protection element 25 is, for example, a Zener diode. The conductor 26 is a metal wiring. Examples of the material of the conductor 26 include metals such as Au, Ag, Cu, Pt, and Al, and alloys thereof. In addition, the light-emitting device 20 without the protective element 25 may also be used.

The cover member 27 is a member that covers the semiconductor laser element 22 and the light reflecting member 24 . The cover member 27 is entirely light-transmitting, but may have a non-light-transmitting area in a part. The cover member 27 can be formed using sapphire as a main material. Moreover, the cover member 27 may be provided with a metal film in a part of the area. In addition, as the main material, in addition to sapphire, glass, for example, can also be used. The cover member 27 is joined to the upper surface (frame portion upper surface) of the package 21 at its lower surface. A metal film is provided in the area where the cover member 27 and the package 21 are bonded, and is fixed via Au-Sn or the like. The light emitting device 20 forms a closed space by joining the package 21 and the cover member 27 . The closed space becomes an airtight sealed space. By air-tightly sealing the light-emitting device 20 in this manner, organic matter and the like can be prevented from collecting dust on the light exit end surface of the semiconductor laser element 22 .

The joining portion 28 is formed in a region on the upper surface of the cover member 27 where the cover member 27 and the lens member 29 are joined. As the bonding portion 28, for example, ultraviolet curable resin can be used. Moreover, the bonding part 28 is formed so that the cover member 27 and the lens member 29 may not come into contact. After the position or height of the connecting portion 28 is adjusted by having a thickness, the lens member 29 is joined to the cover member 27 . In addition, the bonding portion 28 is formed, for example, at a position facing the outer edge of the lens member 29 so as not to be provided on the optical path of the light emitted from the semiconductor laser element 22 . In addition, FIGS. 2A and 3A show an example of the shape of the bonding portion 28 after hardening, but the bonding portion 28 can be one that is soft during coating.

The lens member 29 is provided to face the upper surface of the cover member 27 . The lens member 29 is formed integrally with a lens portion 51 having a lens shape and a rectangular support plate portion 52 that supports the lens portion 51 . In the lens member 29 , each of the lens portions 51 is provided at a position opposite to the optical axis of the semiconductor laser element 22 . The arrangement and shape of each lens portion 51 are designed in such a manner that the reflected light emitted from the corresponding semiconductor laser element 22 and reflected by the light reflecting member 24 is collimated by the lens portion 51 . As shown in FIGS. 2A and 3A , the same lens member 29 is used in both the first light-emitting device 20 a and the second light-emitting device 20 b that have different numbers of semiconductor laser elements 22 mounted thereon. That is, the lens member 29 of the first light-emitting device 20a is also the same as the lens member 29 of the second light-emitting device 20b. In this way, even if the first light-emitting device 20a is configured with an arrangement in which any one of the four semiconductor laser elements 22 in the second light-emitting device 20b is removed, the lens member 29 can be unified. In addition, the lens member 29 of one design can be used in the first light-emitting device 20a and the second light-emitting device 20b.

In addition, the lens member 29 used in the first light emitting device 20 a may be used such that the number and arrangement of the lens portions 51 correspond to the number and arrangement of the semiconductor laser elements 22 mounted on the package 21 . By making the number of lens portions 51 equal to the number of semiconductor laser elements 22, the lens member 29 can be made lighter than the lens member 29 having the same number as the semiconductor laser elements 22 of the second light emitting device 20b. For the lens member 29, glass such as BK7 and B270 can be used.

In the light-emitting module 100 shown in FIG. 1A , two first mounting substrates 10 a are arranged side by side to form the mounting substrate 10 , and two light-emitting devices 20 are mounted on each of them, thereby achieving the installation of four light-emitting devices 20 arranged in two columns and two rows. The light-emitting module 100 of the light-emitting device 20. In addition, the light-emitting module 100 of FIG. 1A is mounted with two light-emitting devices 20 having an arrangement structure of 1 row and 2 rows on the mounting surface in directions that are 180 degrees different from each other. Specifically, the light-emitting module 100 has one first light-emitting device 20a and one second light-emitting device 20b arranged and mounted adjacently on each of the first mounting substrates 10a, and the light emitting device 20b is mounted adjacently. Reflective member 24. That is, regarding the two light-emitting devices 20 mounted on one first mounting substrate 10a, the distance to the light-reflecting member 24 provided on one light-emitting device 20 is longer than the distance to the light-reflecting member 24 provided on the other light-emitting device 20. The condition that the light-reflecting member 24 is shorter in the semiconductor laser element 22 is satisfied, and when one light-emitting device 20 is replaced with another light-emitting device 20, the same condition is installed in such a way that this condition is satisfied. Furthermore, the light-emitting module 100 is equipped with the first light-emitting device 20a and the second light-emitting device 20b such that the first light-emitting devices 20a and the second light-emitting devices 20b are located at opposite corners to each other. In this way, the four light-emitting devices are mounted on the mounting substrate 10 so as to be adjacent to each other in the column direction, and the light-emitting devices 20 are mounted so that the light reflecting members 24 are adjacent to each other in the column direction.

By arranging two light-emitting devices 20 on one first mounting substrate 10a in this way, the light emitted from the two light-emitting devices 20 can be brought close to each other. In addition, since the distance between the semiconductor laser elements 22 is separated between the two light-emitting devices 20, the heat dissipation performance is improved. Furthermore, by arranging the two first mounting substrates 10 a in this manner, light can be focused on the center side of the mounting substrate 10 . In the optical unit disclosed in Patent Document 1, which includes a plurality of semiconductor devices mounted with four semiconductor elements in a package, since the light emitted from the semiconductor elements is directly emitted through the semiconductor device, there is no need for the light emitting module 100 according to the invention. The arrangement relationship between the semiconductor laser element and the light reflective component placed in the package is discussed as to how best to install the two light-emitting devices 20 . On the other hand, the light-emitting device 20 of the light-emitting module 100 carries a plurality of semiconductor laser elements 22 and light reflective components 24 in the package. In this case, by mounting the two light-emitting devices 20 on the mounting substrate 10 in a preferred form, the light-emitting module 100 that can achieve the above-mentioned effects can be realized. Furthermore, when manufacturing and mounting the light-emitting module 100 in which two first light-emitting devices 20a and two second light-emitting devices 20b are provided with three semiconductor laser elements 22 in the same arrangement, the first light-emitting device 20a is Arranged at opposite corners to each other, the semiconductor laser elements 22 in the two first light-emitting devices 20 a can be arranged symmetrically from the center of the mounting substrate 10 . In addition, here, the light-emitting device 20 is installed such that the light-reflecting members 24 are adjacent to each other in the column direction on the paper. The light-emitting device 20 may also be installed so that the light-reflecting members 24 are adjacent to each other in the row direction. Furthermore, the light-emitting devices 20 may be arranged so that the first light-emitting devices 20a and the second light-emitting devices 20b are adjacent to each other in the column direction, or the first light-emitting devices 20a and the second light-emitting devices 20b may be adjacent to each other in the row direction. The light-emitting device 20 is configured in this way.

＜Manufacturing method of light-emitting module＞ Next, an example of a method of manufacturing the light-emitting module 100 of the first embodiment will be described. FIG. 4 is a flow chart showing the procedure of the manufacturing method of the light-emitting module according to the first embodiment. The method of manufacturing a light-emitting module according to the first embodiment manufactures a light-emitting module 100 equipped with one or a plurality of light-emitting devices on which a plurality of light-emitting elements are mounted. Moreover, the manufacturing method of the light-emitting module 100 includes steps S101 of preparing the light-emitting device, step S102 of preparing the first mounting substrate, and step S103 of mounting the light-emitting device, and is performed in sequence. Furthermore, as the light-emitting module 100 manufactured by this manufacturing method, the light-emitting module 100 equipped with any number of the light-emitting elements 22 selected from at least three consecutive numbers can be manufactured.

Each step of the manufacturing method of the light emitting module 100 will be described below. In addition, since the material and arrangement of each component are as described in the above description of the light-emitting module 100, the description is appropriately omitted here.

[Steps to prepare lighting device] The step S101 of preparing the light-emitting device is a step of preparing a first light-emitting device and a second light-emitting device that are mounted with a number of semiconductor laser elements that differ by one from each other as the light-emitting device. In this step S101, a plurality of first light-emitting devices 20a having three semiconductor laser elements 22 and a plurality of second light-emitting devices 20b having four semiconductor laser elements 22 are respectively prepared.

[Steps to prepare the first mounting substrate] Step S102 of preparing the first mounting substrate is a step of preparing the first mounting substrate having a mounting surface provided with a plurality of connection patterns 15 corresponding to one light-emitting device, that is, the same connection pattern. In this step S102, prepare one or two or more pieces with connection patterns corresponding to one light-emitting device 20 provided with any one of the first light-emitting device 20a and the second light-emitting device 20b that can be used as the light-emitting device. The first mounting substrate 10a on the mounting surface 15.

[Steps to install lighting device] Step S103 of mounting the light-emitting device is a step of mounting a plurality of light-emitting devices selected from the first light-emitting device and the second light-emitting device on a plurality of connection patterns provided on the mounting surface of the first mounting substrate. In this step S103, two desired light-emitting devices selected from the first light-emitting device 20a and the second light-emitting device 20b are mounted on the two connection patterns 15 provided on the mounting surface of the first mounting substrate 10a. Furthermore, as the light-emitting module 100 equipped with the selected two light-emitting devices 20, a light-emitting module 100 equipped with at least two first light-emitting devices 20a, one first light-emitting device 20a and one second light-emitting device 20a each is manufactured. The light-emitting module 100 of the device 20b, and the light-emitting module 100 in which two second light-emitting devices 20b are installed. The number of light-emitting elements mounted on these three types of light-emitting modules 100 increases one by one. In this way, by manufacturing three types of light-emitting modules 100 equipped with two light-emitting devices 20 in different combinations, the light-emitting module 100 equipped with any number of light-emitting elements 22 selected from three consecutive quantities can be manufactured.

In addition, the light-emitting module 100 manufactured by the manufacturing method of the first embodiment and equipped with one or a plurality of light-emitting devices on which a plurality of light-emitting elements are mounted is not limited to these three types of light-emitting modules 100. It is also possible to manufacture a light-emitting module 100 in which one light-emitting device 20 is mounted on one first mounting substrate 10a, a light-emitting module 100 in which a total of three light-emitting devices 20 are mounted on two first mounting substrates 10a, and two first mounting substrates 10a. A total of four light-emitting modules 100 of light-emitting devices 20 are mounted on the first mounting substrate 10a. In the manufacturing of the light-emitting module 100 shown in FIG. 1A, in step S103, two light-emitting devices 20 (the first light-emitting device 20a and the second light-emitting device 20b) having an arrangement structure of 1 column and 2 rows are arranged 180 degrees apart from each other. The direction of installation is on the mounting surface. Furthermore, in this step S103, an arrangement of 2 rows and 2 rows is produced by arranging the two first mounting substrates 10a on which the two light-emitting devices 20 (the first light-emitting device 20a and the second light-emitting device 20b) are respectively mounted. A light-emitting module 100 equipped with four light-emitting devices 20 is installed. Therefore, when viewed as the light-emitting module 100, the four light-emitting devices 20 can be arranged in the center. In addition, on the outer periphery of the four light-emitting devices 20, through holes for screwing etc. are provided at both ends of one side so as to sandwich the four light-emitting devices 20, and a second metal film is provided at both ends of the other side. 13. The second metal film 13 provided at both ends is easier to connect to the power supply than the one sandwiched by two light-emitting devices 20 .

In this way, the first mounting substrate 10a, the first light-emitting device 20a and the second light-emitting device 20b can be used to manufacture the light-emitting module 100 equipped with 1 to 4 light-emitting devices. In addition, with this light-emitting module 100, it is possible to provide a light-emitting module that can adjust the number of mounted semiconductor laser elements 22 to any number from 3 to 16 (excluding the case of 5), and effectively corresponds to various specifications. Lighting module 100. In addition, when the number of semiconductor laser elements 22 mounted on the first light-emitting device 20a is set to 2, and the number of semiconductor laser elements 22 mounted on the second light-emitting device 20b is set to 3, an adjustment method can be provided. It is any number of light-emitting modules 100 ranging from 2 to 12. When the number of semiconductor laser elements 22 mounted on the first light-emitting device 20a is set to 4, and the number of semiconductor laser elements 22 mounted on the second light-emitting device 20b is set to 5, a method that can be adjusted to 4 can be provided. ~20 (excluding the cases of 6, 7 and 11) any number of light-emitting modules 100.

<Second Embodiment> Next, the second embodiment will be described. FIG. 5A is a perspective view schematically showing an example of the structure of the light-emitting module according to the second embodiment. 5B is a top view schematically showing an example of the structure of the light-emitting module according to the second embodiment. FIG. 5C is a plan view schematically showing an example of the structure of the mounting substrate according to the second embodiment. FIG. 5D is a top view showing a state in which the mounting substrate of FIG. 5C is separated into a first mounting substrate and a second mounting substrate. The difference between the light-emitting module of the second embodiment is that in addition to the first mounting substrate used in the light-emitting module of the first embodiment, a second mounting substrate is also used.

＜Light-emitting module＞ The light-emitting module 100A shown in FIG. 5A includes a mounting substrate 10A and a light-emitting device 20. In addition, this light-emitting module 100A is a light-emitting module in which three light-emitting devices 20 are installed. At this time, the mounting substrate 10A of the light-emitting module 100A includes a first mounting substrate 10a and a second mounting substrate 10b. The outer shape of the second mounting substrate 10b is the same as that of the first mounting substrate 10a. The second mounting substrate 10b has a lower surface, an upper surface, and a side surface, and has a mounting surface provided with a connection pattern 15 identical to the connection pattern 15 provided on the first mounting substrate 10a on the upper surface. By using one connection pattern 15 and making the outer shape the same, the outer shape can be made the same as when mounting with two first mounting substrates 10a.

Furthermore, in this embodiment, the connection pattern 15 of the second mounting substrate 10b is provided near the center. On the upper surface, the area where the connection pattern 15 is provided on the second mounting substrate 10b and the first mounting substrate 10a are provided with two Each of the areas connecting the patterns 15 partially overlaps. On the other hand, the position of the second metal film 13 or the through hole does not change from that of the first mounting substrate 10a. By setting the position of the second metal film 13 to be the same, when electrically connecting to an external power source, the first mounting substrate 10a and the second mounting substrate 10b can be connected in a common way. For example, the connection with the second metal film 13 can be through a connector, a flexible substrate, an epoxy glass substrate, a leaf spring terminal, or the like. When such a connecting member is used, the first mounting substrate 10a and the second mounting substrate 10b can be connected using the same connecting member. By setting the positions of the through holes to be the same, screwing and the like can be performed at the same positions as when two first mounting substrates 10 a are mounted. In addition, in the second mounting substrate 10b, among the three first metal films 12 in a pair each sandwiching the metal portion 11, the three first metal films 12 provided on the side close to the second metal film 13, and the two second metal films 12 are One of the metal films 13 is connected and electrically connected. In addition, the three first metal films 12 provided on the side away from the second metal film 13 are connected to the other second metal film 13 and are electrically connected. One light-emitting device 20 is mounted on the second mounting substrate 10b. In the example of FIG. 5A, one second light-emitting device 20b is mounted. Furthermore, the first mounting substrate 10 a and the second mounting substrate 10 b are arranged so that the side surfaces opposite to the side on which the second metal film 13 is formed face each other. Other matters are the same as the light-emitting module 100 of the first embodiment shown in FIG. 1A .

＜Manufacturing method of light-emitting module＞ Next, an example of a method of manufacturing the light-emitting module 100A of the second embodiment will be described. FIG. 6 is a flow chart showing the procedure of the manufacturing method of the light-emitting module according to the second embodiment. The manufacturing method of the light-emitting module 100A includes steps S201 of preparing the light-emitting device, step S202 of preparing the first mounting substrate, step S203 of preparing the second mounting substrate, step S204 of determining the number of mounting substrates, etc., and step S205 of mounting the light-emitting device. and step S206 of forming a light-emitting module, and are performed in sequence. In addition, since the materials and arrangements of each component are as described in the above description of the light-emitting module 100, the description is appropriately omitted here. In addition, since the step S201 of preparing the light-emitting device and the step S202 of preparing the first mounting substrate are the same as the step S101 of preparing the light-emitting device and the step S102 of preparing the first mounting substrate in the manufacturing method of the light-emitting module 100 of the first embodiment, Therefore, description is omitted here.

[Steps to prepare the second mounting substrate] Step S203 of preparing the second mounting substrate is a step of preparing a second mounting substrate having a mounting surface provided with a connection pattern that is the same as that provided on the first mounting substrate. In this step S203, the second mounting substrate 10b is prepared, having a mounting surface provided with a connection pattern 15 identical to the connection pattern 15 provided on the first mounting substrate 10a.

[Steps to determine the number of substrates to install, etc.] Step S204 of determining the number of mounting substrates, etc. is a step of determining the number or quantity and combination of mounting substrates used to manufacture the light emitting module from a plurality of mounting substrates including at least a first mounting substrate and a second mounting substrate. In this step S204, it is decided to use one mounting substrate to form the mounting substrate 10A of the light emitting module 100A or to use two mounting substrates to form the mounting substrate 10A of the light emitting module 100A. In addition, if there is one piece, it is decided which one of the first mounting substrate 10a and the second mounting substrate 10b is used. If it is two pieces, it is decided whether the combination of the two first mounting substrates 10a or the first mounting substrate 10a and the second mounting substrate 10a is used. 2. A combination of one piece of each mounting base plate 10b. In addition, it is also possible to combine two second mounting substrates 10b to form the mounting substrate 10A. However, if two light-emitting devices 20 are to be mounted, the light-emitting module 100A can be realized in a smaller size by using one first mounting substrate 10a. In the manufacturing of the light-emitting module 100A shown in FIG. 5A , it is decided to use a combination of one first mounting substrate 10 a and one second mounting substrate 10 b for two mounting substrates to form the mounting substrate 10A.

[Steps to install lighting device] Step S205 of mounting the light-emitting device is a step of mounting a light-emitting device selected from the first light-emitting device and the second light-emitting device to the connection pattern of the second mounting substrate when the second mounting substrate is used for the light-emitting module. Furthermore, when the first mounting substrate is used for a light-emitting module in step S205, a plurality of connection patterns provided on the mounting surface of the first mounting substrate are mounted with a plurality of selected ones from the first light-emitting device and the second light-emitting device. Light fixture steps. In the manufacturing of the light-emitting module 100A shown in FIG. 5A, a second light-emitting device 20b is mounted on the second mounting substrate 10b. Furthermore, one first light-emitting device 20a and one second light-emitting device 20b are mounted side by side on the first mounting substrate 10a, and two light-emitting devices 20 having an arrangement structure of one row and two rows are mounted in directions 180 degrees apart from each other. on the mounting surface.

[Steps to form a light emitting module] The step S206 of forming a light-emitting module is a step of forming a light-emitting module by using one or more of the first mounting substrate and the second mounting substrate on which the light-emitting device is mounted in a determined quantity, or a quantity and combination. In the manufacturing of the light-emitting module 100A shown in FIG. 5A, a first mounting substrate 10a on which a first light-emitting device 20a and a second light-emitting device 20b are mounted, and a second light-emitting device 20b are mounted. One second mounting substrate 10b is arranged side by side to form a light emitting module 100A. When one light-emitting device 20 is mounted, by using the second mounting substrate 10b, compared with the case of using the first mounting substrate 10a, unused connection patterns 15 are not generated. In addition, in the first mounting substrate 10a, in order to be electrically connected to an external power supply, the second metal film 13 on the side of the connection pattern 15 of the light-emitting device 20 must be bonded with the first metal that is not bonded to the connection pattern 15 of the light-emitting device 20. The film 12 achieves electrical conduction, but in the second mounting substrate 10 b, two second metal films 13 can achieve electrical conduction. When two light-emitting devices 20 are mounted on one mounting board, the first mounting board 10a is used, and when one light-emitting device 20 is mounted, the second mounting board 10b is used. By this, two second mounting boards can be used in any case. The metal film 13 is easily connected to the external power supply. In addition, as explained in the manufacturing method of the light-emitting module 100 of the first embodiment, it is clear that the light-emitting module 100A manufactured by the manufacturing method of the second embodiment can provide a light-emitting module equipped with any number of 1 to 4. The light-emitting module of the device 20.

<Third Embodiment> Next, the third embodiment will be described. 7A is a top view schematically showing an example of the structure of the light-emitting module according to the third embodiment. 7B is a top view schematically showing an example of the structure of the light-emitting module according to the third embodiment. 7C is a top view schematically showing an example of the structure of the light-emitting module according to the third embodiment.

In the light-emitting module 100B of the third embodiment shown in FIG. 7A , the light-emitting module 100B is composed of a first mounting substrate 10c having a mounting surface provided with four identical connection patterns 15 arranged in two columns and two rows. Install the base plate 10B. Furthermore, in the light-emitting module 100B, any number of light-emitting devices 20 from 1 to 4 are mounted on the four connection patterns 15 . In FIGS. 7A to 7C , a light-emitting module 100B equipped with four light-emitting devices 20 , a light-emitting module 100C equipped with three light-emitting devices 20 , and a light-emitting module 100D equipped with two light-emitting devices 20 are respectively shown. Since four light-emitting devices 20 can be mounted on one mounting substrate, the manufacturing steps can be simplified.

A structural example and a manufacturing method of the light-emitting module of the present invention will be described through the first embodiment, the second embodiment, and the third embodiment. In addition, in these descriptions, as a light-emitting module, it is described that a light-emitting module is realized, which has: a first light-emitting device, which is a light-emitting device on which a plurality of light-emitting elements are mounted; and a second light-emitting device, which is mounted with a plurality of light-emitting elements. A light-emitting device having one more light-emitting element than the first light-emitting device; and a first mounting substrate having a mounting surface provided with a plurality of connection patterns corresponding to one light-emitting device, that is, the same connection pattern; and A plurality of connection patterns on the mounting surface of the first mounting substrate connect one or more first light-emitting devices and one or more second light-emitting devices. The light-emitting module 100E shown in FIG. 8 shows a specific example of a light-emitting module in which the number of mounted light-emitting elements is adjusted. By implementing such a light-emitting module, a light-emitting module that can effectively correspond to various specifications regarding output light can be provided.

<Fourth Embodiment> Next, the fourth embodiment will be described. 9A is a perspective view schematically showing an example of the structure of a light-emitting module according to the fourth embodiment. 9B is a top view schematically showing an example of the structure of the light-emitting module according to the fourth embodiment. 9C is a plan view illustrating a schematic display of the first mounting substrate according to the fourth embodiment. 9D is a plan view illustrating a schematic display of the light-emitting device and the thermistor mounted on the second mounting substrate of the fourth embodiment. 9E is a top view illustrating a schematic display of the second mounting substrate according to the fourth embodiment.

The light-emitting module of the fourth embodiment is different from the mounting substrate described in the first to third embodiments in that the mounting surface of the mounting substrate is further provided with a point for mounting the metal film of the thermistor. As shown in FIG. 9C , in the first mounting substrate 10d of the fourth embodiment, in addition to the metal portion 11, the first metal film 12, the second metal film 13, and the insulating film 14, the third metal film 16, the fourth The metal film 17 is provided on the mounting surface. The connection pattern 15 composed of the metal portion 11 and the first metal film 12 is the same as that described in the embodiment thus far.

Since the third metal film 16 is provided in the first mounting substrate 10d, the distance between the first metal film 12 and the second metal film 13 is correspondingly larger than that of the first mounting substrate 10a. The two third metal films 16 are disposed between the first metal film 12 and the second metal film 13 and are disposed at the same distance from the light emitted from the two light emitting devices 20 . Therefore, the first mounting substrate 10d is provided at the same distance from the two connection patterns 15. That is, two third metal films 16 are provided such that the distance from one connection pattern 15 to one third metal film 16 is the same as the distance from another connection pattern 15 to another third metal film 16 . In addition, since the fourth metal film 17 is provided between the two second metal films 13, the distance between the two third metal films 13 is larger than the first mounting substrate 10a. The two fourth metal films 17 are both provided at positions sandwiched by the two second metal films 13 . The third metal film 16 and the fourth metal film 17 are provided on the insulating film 14 to form a metal film that connects them, and the insulating film 14 is divided into the third metal film 16 and the fourth metal film 17 . And formed. That is, the third metal film 16 and the fourth metal film 17 are connected and electrically connected, but cannot be observed from the surface. A third metal film 16 is connected to a fourth metal film 17 , and another third metal film 16 is connected to another fourth metal film 17 .

In the light-emitting module 100F of the fourth embodiment shown in FIGS. 9A and 9B , the thermistor 90 is mounted on the third metal film 16 . The thermistor 90 is an example of a temperature detection element used to measure the temperature when the light emitting module 100F is activated. The thermistor 90 is mounted in a state of being connected to both of the two third metal films 16 , whereby one fourth metal film 17 can be electrically connected to the other fourth metal film 17 through the thermistor 90 . In the light-emitting module 100F, the semiconductor laser elements 22 of the two light-emitting devices 20 installed on the first mounting substrate 10d are the main heat sources. Therefore, the thermistor 90 is preferably disposed close to any one of the two light-emitting devices 20. , and is also at the same distance from the light emitted from any light-emitting device 20 . That is, it is designed such that the center of the light emitted from the plurality of semiconductor laser elements 22 mounted on the two light-emitting devices 20 passes through the vertex of the lens portion 51. When viewed from above, the thermistor 90 is located at a distance from the light-emitting device. The straight line from the vertex of each lens part 51 of the other light-emitting device 20 intersects with the middle line at an equal distance from the straight line connecting the vertex of each lens part 51 of the other light-emitting device 20 .

The second mounting substrate 10e of the fourth embodiment shown in FIGS. 9D and 9E is provided with the third metal film 16 and the fourth metal film 17 similarly to the first mounting substrate 10d. And the thermistor 90 is mounted on the third metal film 16 . In addition, the same point as the first mounting substrate 10d is that the third metal film 16 is provided between the first metal film 12 and the second metal film 13, and the fourth metal film 17 is provided between the two second metal films 13. The location of the point. On the other hand, the thermistor 90 is provided at a position close to the light emitted from the light-emitting device 20. Therefore, in the second mounting substrate 10e, the thermistor 90 is provided close to the lens portion of the lens member 29 of the light-emitting device 20. The position of the vertex of 51. That is, when it is designed that the center of the light emitted from the plurality of semiconductor laser elements 22 mounted on the light-emitting device 20 passes through the vertex of the lens portion 51, in a plan view, the thermistor 90 and the vertex connecting each lens portion 51 The straight lines intersect. In this way, in the light-emitting module 100F of the fourth embodiment, the metal film for mounting the thermistor 90 is provided on the mounting substrate 10, whereby the temperature when the light-emitting module 100F is operated can be measured. Therefore, the operation of the semiconductor laser element 22 can be controlled based on the measured temperature.

The light-emitting module manufactured in this way can be used in various projectors with different specifications, for example. Specifically, a light-emitting module formed by using one or more of the first mounting substrate and the second mounting substrate on which the light-emitting device is mounted is mounted on the heat sink plate in a determined quantity, or quantity and combination, to form a projector. its constituent elements.

Next, an example of installation when the light-emitting module of this embodiment is applied to a projector will be described. In addition, here, a mounting substrate composed of one or a plurality of first mounting substrates 10 a is used as an example for description, but the invention is not limited to this. The mounting substrate can be configured using a desired first mounting substrate or second mounting substrate described in the first to fourth embodiments. FIG. 10A is a perspective view schematically showing an example of installation when a light-emitting module according to an embodiment is applied to a projector. FIG. 10B is a perspective cross-sectional view illustrating the sealing structure of the light-emitting module according to one embodiment. FIG. 11A is a perspective view schematically showing an example of installation when a light-emitting module according to an embodiment is applied to a projector. FIG. 11B is a top view schematically showing an example of the structure of the projector according to the embodiment of FIG. 11A. FIG. 11C is a side view schematically showing an example of the structure of the projector according to the embodiment of FIG. 11A. 12A is a perspective view schematically showing an example of installation when the light-emitting module according to an embodiment is applied to a projector. FIG. 12B is a side view schematically showing an example of the structure of the projector according to the embodiment of FIG. 12A. FIG. 13 is a perspective cross-sectional view illustrating another sealing structure of the light-emitting module according to one embodiment. In addition, these drawings are shown with part of the inside of the projector transparent for convenience.

As shown in FIGS. 10A and 10B , the projector 200 includes a sealing member 60 . The sealing member 60 is a member for forming a sealed space surrounding the light-emitting device 20 mounted on the mounting substrate 10 in the light-emitting module. Furthermore, the optical system of the projector is installed inside the closed space. That is, an optical unit for generating a projected image projected by the projector is installed. The optical unit includes, for example, a lens, a mirror, a DMD (Digital Mirror Device), a lens, etc. Moreover, it is also possible to construct an optical unit including a liquid crystal panel, a phosphor wheel, a rod integrator, etc., or to use an optical unit using appropriate components from each of these components, and to design an appropriate optical system. The projected image generated by the optical unit is emitted from the sealing member 60 to the outside and projected onto the screen of the projector. In order to further reduce the probability of the output of the projector being reduced due to light dust collection, it is preferable to store all the parts constituting the optical unit in a sealed space formed by the sealing member 60 and the mounting substrate 10 . When the sealing member 60 is miniaturized, only some of the components constituting the optical unit can be housed in the sealed space.

In the projector 200, a light-emitting module in which two light-emitting devices 20 are mounted on one first mounting substrate 10a is manufactured and covered with a sealing member 60. In addition, the sealing member 60 is formed in a rectangular parallelepiped shape here, but the shape of the sealing member 60 is not particularly limited. That is, it may have a shape corresponding to the form of the designed optical unit. On the first mounting substrate 10 a, a sealing member 70 is provided around the light-emitting devices 20 and surrounds the two light-emitting devices 20 . Moreover, the sealing member 70 is provided between the first metal film 12 and the second metal film 13 so that the second metal film 13 is placed outside the sealed space. Thereby, the light-emitting device 20 can be easily connected to an external power source. Moreover, the sealing member 70 is provided inward of the through holes on both sides so that the through hole of the first mounting substrate 10a is provided outside the sealed space. Thereby, there is no need to consider the influence of through holes when forming a closed space. The sealing member 60 is joined to the first mounting substrate 10a via the sealing member 70 to form a sealed space. This prevents dust, resin degassing, organic components of grease, and other objects that may cause light dust from entering the sealing member 60 .

Examples of the material of the sealing member 60 include metal, glass, sapphire, and the like. The sealing member 60 may be formed of a light-transmitting member such as glass or sapphire to emit light to the outside. Examples of the material of the sealing member 70 include metal, resin, rubber, and the like. In addition, as the material of the sealing member 70, a member that is easily deformed when pressed can be used, such as sponge or clay. In addition, when metal is used for the sealing member 70 , in order to avoid contact between the sealing member 70 and the first metal film 12 provided on the side away from the second metal film 13 , it is preferable to provide sufficient space. Thereby, a short circuit can be prevented by the sealing member 70 . If an insulating material is used, the sealing member 70 will not conduct electrically even if it comes into contact with the first metal film 12 or the second metal film 13 .

The projector 200A shown in FIGS. 11A, 11B, and 11C includes a sealing member 60A. In the projector 200A, a light-emitting module in which four light-emitting devices 20 are mounted on two first mounting substrates 10 a is manufactured and covered with a sealing member 60A. Furthermore, the sealing member 70 is formed to surround the two light emitting devices 20 on each of the first mounting substrates 10a. The sealing member 60A has a convex first pressing portion 63 that spans the boundary between the first mounting substrate 10 a and the first mounting substrate 10 a. The first pressing part 63 presses the sealing member 70 provided along the boundary of each first mounting substrate 10a, and seals the boundary between the two first mounting substrates 10a. In addition, when two first mounting substrates 10a are joined at the boundary, the first pressing part 63 may be omitted. For example, since each mounting substrate has a component tolerance, rather than joining two first mounting substrates 10 a to form the mounting substrate 10 , it is possible to arrange the first mounting substrates 10 a in an array with a width that does not contact each other. In addition, if the first mounting substrates 10a are too far apart from each other, the size of the light-emitting module or the projector will increase. Therefore, when miniaturization is desired, it is better to reduce the width. For example, the width between two mounting substrates can be set in the range of 0.1 mm or more and 1.0 mm or less. Alternatively, it can also be said that the distance from one mounting substrate to another mounting substrate can be set to 0.1 mm or more and 1.0 mm or less. In the case of installation with such a free width, by providing the first pressing part 63, the intrusion of external air from the boundary can be prevented, and the sealing performance can be ensured. In addition, the light-emitting module shown in FIG. 10A and FIG. 11A is an example, and any light-emitting module manufactured by the above-mentioned manufacturing method can also be applied. That is, a light emitting module in which the mounting substrate 10 is formed by arbitrarily selecting one or two mounting substrates from the first mounting substrate 10 a and the second mounting substrate 10 b can be applied. In addition, it can be applied to any number of light-emitting modules mounted on the mounting substrate 10 from the first light-emitting device 20a and the second light-emitting device 20b respectively.

Furthermore, it is not limited to one light-emitting module, and a plurality of light-emitting modules can also be applied. The projector 200B shown in FIGS. 12A and 12B is provided with a sealing member 60B. In the projector 200B, two light-emitting modules in which two light-emitting devices 20 are respectively mounted on two first mounting substrates 10 a are manufactured, and the two light-emitting modules are arranged. Therefore, a total of eight light-emitting devices 20 are covered with the sealing member 60B. Furthermore, the sealing member 70 is formed on each of the first mounting substrates 10a. In the projector 200B, two mounting substrates 10 are arranged so that the through holes are adjacent to each other. The sealing member 60B has a convex second pressing portion 64 extending across the through holes of the two mounting substrates 10 in addition to the first pressing portion 63 . The second pressing part 64 presses the sealing members 70 provided on the two mounting substrates 10 to form a sealed space. Each mounting substrate 10 is fixed using a fixing thread 80 for fixing the mounting substrate 10 to the heat dissipation plate, passing through the through hole. By providing the second pressing portion 64, it is possible to prevent the intrusion of external air from the through hole and ensure sealing properties.

In addition, FIG. 13 shows another example of the sealing structure of the sealing member and the sealing member. In this way, the sealing member 60C may have the protrusion 65 that is joined to the sealing member 70 at its side surface and lower surface. The protruding portion 65 covers the side surface of the sealing member 70 on the light emitting device 20 side. By providing the sealing member 60C with the protrusion 65, the joint portion with the sealing member 70 has a hook structure. According to this structure, the tightness of the sealing member 60C and the sealing member 70 is further improved, and the sealing property of the sealing member 60C is improved.

10:Install the base plate 10A: Installation base board 10a: 1st mounting base plate 10B: Install base plate 10b: 2nd mounting base plate 10C: Install base plate 10c: 1st mounting base plate 10d: 1st mounting base plate 10e: 2nd mounting base plate 11:Metal Department 12: 1st metal film 13: 2nd metal film 14:Insulating film 15:Connection pattern 16: 3rd metal film 17: 4th metal film 20:Lighting device 20a: First light-emitting device 20b: Second light-emitting device 21:Package 22: Light-emitting components (semiconductor laser components) 23: Sub-base 24:Light reflective components 25:Protective components 26:Wire 27: Cover member 28:The next part 29: Lens components 30: concave part 31: Bottom of the concave part 32: Inner side of the concave part 33: Step difference surface 34: Lower surface 35: Frame 36: Bottom 37:Metal film 38:Metal film 51: Lens Department 52:Support board department 60: Sealing components 60A: Sealing components 60B: Sealing components 60C: Sealing components 63: 1st compression part 64: 2nd compression part 65:Protrusion 70:Sealing components 80:Fixed thread 90:Thermistor 100:Light-emitting module 100A～100F: Light emitting module 200:Projector 200A:Projector 200B:Projector IIIC-IIIC: line S101～S103: steps S201～S206: steps

FIG. 1A is a perspective view schematically showing an example of the structure of the light-emitting module according to the first embodiment. 1B is a top view schematically showing an example of the structure of the light-emitting module according to the first embodiment. FIG. 1C is a plan view schematically showing an example of the structure of the mounting substrate according to the first embodiment. FIG. 1D is a top view showing a state in which the mounting substrate of FIG. 1C is separated into two first mounting substrates. FIG. 2A is an exploded perspective view schematically showing the structure of the first light-emitting device. FIG. 2B is a top view schematically showing the structure within the package of the first light-emitting device. FIG. 3A is an exploded perspective view schematically showing the structure of the second light-emitting device. FIG. 3B is a top view schematically showing the structure within the package of the second light-emitting device. Fig. 3C is a cross-sectional view along line IIIC-IIIC in Fig. 3B. FIG. 3D is a top view schematically showing the structure of the lower surface of the second light-emitting device. FIG. 4 is a flow chart showing the procedure of the manufacturing method of the light-emitting module according to the first embodiment. FIG. 5A is a perspective view schematically showing an example of the structure of the light-emitting module according to the second embodiment. 5B is a top view schematically showing an example of the structure of the light-emitting module according to the second embodiment. FIG. 5C is a plan view schematically showing an example of the structure of the mounting substrate according to the second embodiment. FIG. 5D is a top view showing a state in which the mounting substrate of FIG. 5C is separated into a first mounting substrate and a second mounting substrate. FIG. 6 is a flow chart showing the procedure of the manufacturing method of the light-emitting module according to the second embodiment. 7A is a top view schematically showing an example of the structure of the light-emitting module according to the third embodiment. 7B is a top view schematically showing an example of the structure of the light-emitting module according to the third embodiment. 7C is a top view schematically showing an example of the structure of the light-emitting module according to the third embodiment. 8 is a top view schematically showing an example of the structure of the light-emitting module according to the embodiment. 9A is a perspective view schematically showing an example of the structure of a light-emitting module according to the fourth embodiment. 9B is a top view schematically showing an example of the structure of the light-emitting module according to the fourth embodiment. 9C is a plan view illustrating a schematic display of the first mounting substrate according to the fourth embodiment. 9D is a plan view illustrating a schematic display of the light-emitting device and the thermistor mounted on the second mounting substrate of the fourth embodiment. 9E is a top view illustrating a schematic display of the second mounting substrate according to the fourth embodiment. FIG. 10A is a perspective view schematically showing an example of installation when a light-emitting module according to an embodiment is applied to a projector. FIG. 10B is a perspective cross-sectional view illustrating the sealing structure of the light-emitting module according to one embodiment. FIG. 11A is a perspective view schematically showing an example of installation when a light-emitting module according to an embodiment is applied to a projector. FIG. 11B is a top view schematically showing an example of the structure of the projector according to the embodiment of FIG. 11A. FIG. 11C is a side view schematically showing an example of the structure of the projector according to the embodiment of FIG. 11A. 12A is a perspective view schematically showing an example of installation when the light-emitting module according to an embodiment is applied to a projector. FIG. 12B is a side view schematically showing an example of the structure of the projector according to the embodiment of FIG. 12A. FIG. 13 is a perspective cross-sectional view illustrating another sealing structure of the light-emitting module according to one embodiment.

10:Install the base plate

10a: 1st mounting base plate

20:Lighting device

20a: First light-emitting device

20b: Second light-emitting device

100:Light-emitting module

Claims (17)

A method of manufacturing a light-emitting module, which is a method of manufacturing the above-mentioned light-emitting module equipped with one or a plurality of light-emitting devices mounted with a plurality of light-emitting elements, and includes the following steps: preparing the above-mentioned light-emitting device , that is, the first light-emitting device and the second light-emitting device whose numbers of light-emitting elements are different from each other by one; prepare a first mounting substrate, the above-mentioned first mounting substrate has a mounting surface, and the above-mentioned mounting surface is provided with a plurality of identical connection patterns , the above-mentioned connection pattern corresponds to one of the above-mentioned light-emitting devices; and for a plurality of the above-mentioned connection patterns provided on the mounting surface of the above-mentioned first mounting substrate, a plurality of the above-mentioned light-emitting devices selected from the above-mentioned first light-emitting device and the above-mentioned second light-emitting device are mounted A light-emitting device; and the above-mentioned light-emitting module equipped with at least any number of light-emitting elements selected from three consecutive quantities can be manufactured. The manufacturing method of the light-emitting module of claim 1, wherein the first mounting substrate has the mounting surface provided with two identical connection patterns. The manufacturing method of the light-emitting module of Claim 2, which includes the following steps: preparing a second mounting substrate having a mounting surface provided with a connection pattern that is the same as the connection pattern provided on the first mounting substrate; from at least Among the plurality of mounting substrates including the above-mentioned first mounting substrate and the above-mentioned second mounting substrate, determine the number, or quantity and combination of mounting substrates used to manufacture the above-mentioned light-emitting module; use the above-mentioned second mounting substrate for the above-mentioned light-emitting module In this case, for the above second installation base The above-mentioned connection pattern of the board is installed with one of the above-mentioned light-emitting devices selected from the above-mentioned first light-emitting device and the above-mentioned second light-emitting device; using a determined number, or number and combination, of the above-mentioned third light-emitting device installed with the above-mentioned light-emitting device. Either one of the 1 mounting substrate and the above-mentioned second mounting substrate forms the above-mentioned light-emitting module. The manufacturing method of the light-emitting module of claim 3, wherein as the number and combination pattern of the mounting substrates used to manufacture the light-emitting module, at least one of the above-mentioned second mounting substrates is used, and one of the above-mentioned first mounting substrates is used. The case of mounting the substrate, the case of using one piece each of the above-mentioned first mounting substrate and the above-mentioned second mounting substrate, and the case of using two pieces of the above-mentioned first mounting substrate. The manufacturing method of the light-emitting module of Claim 3 or 4, wherein the above-mentioned first mounting substrate and the above-mentioned second mounting substrate having the same appearance are used. The method of manufacturing a light-emitting module according to claim 1, wherein the first mounting substrate has the mounting surface provided with four identical connection patterns. The method for manufacturing a light-emitting module according to any one of claims 1 to 4, wherein when manufacturing the light-emitting module equipped with four of the light-emitting devices, four of the light-emitting devices are installed in an arrangement of 2 columns and 2 rows. The manufacturing method of a light-emitting module as claimed in any one of claims 1 to 4, wherein in the above-mentioned light-emitting module, two of the above-mentioned light-emitting devices having an arrangement structure of 1 column and 2 rows are installed on the above-mentioned light-emitting device in directions 180 degrees apart from each other. on the mounting surface. The manufacturing method of a light-emitting module according to any one of claims 1 to 4, wherein the first light-emitting device is equipped with three light-emitting elements; and the second light-emitting device is equipped with four light-emitting elements. The manufacturing method of a light-emitting module according to any one of claims 1 to 4, wherein the first light-emitting device and the second light-emitting device having the same appearance and different numbers of the light-emitting elements mounted inside the outer shape are used. A light-emitting module, which has: a first light-emitting device, which is a light-emitting device mounted with a plurality of semiconductor laser elements; a second light-emitting device, which is mounted with one more semiconductor laser than the above-mentioned first light-emitting device. A light-emitting device of the component; and a first mounting substrate having a mounting surface, the mounting surface being provided with a plurality of identical connection patterns, the connection patterns corresponding to one of the above-mentioned light-emitting devices; and the mounting surface provided on the first mounting substrate A plurality of the above-mentioned connection patterns connect more than one above-mentioned first light-emitting device and one or more above-mentioned second light-emitting devices; on the surface of the above-mentioned mounting surface, a plurality of the above-mentioned connection patterns are arranged separately. The light-emitting module of claim 11, wherein the first mounting substrate has the mounting surface with four identical connection patterns arranged in two columns and two rows. The light-emitting module of claim 11, wherein the first mounting substrate is provided with two identical The above-mentioned mounting surface of the above-mentioned connection pattern; and having one or two above-mentioned first mounting substrates. The light-emitting module of claim 11 further includes: a second mounting substrate having the mounting surface provided with a connection pattern that is the same as the connection pattern provided on the first mounting substrate. As in the light-emitting module of any one of claims 11 to 14, the plurality of above-mentioned connection patterns include: connection patterns connected to the metal film provided on the lower surface of the above-mentioned first light-emitting device, and connection patterns provided on the above-mentioned second light-emitting device. The connection pattern of the metal film connection on the lower surface. As in the light-emitting module of any one of claims 11 to 14, each of the above-mentioned connection patterns includes: a metal part and a plurality of metal films arranged outside the above-mentioned metal part, and the above-mentioned metal part and the above-mentioned metal film are not connected. A projector having: the light-emitting module according to any one of claims 11 to 16; a sealing member provided on the mounting substrate of the light-emitting module; and a sealing member passing through the sealing member and the mounting substrate. Joining to form a sealed space; a light-emitting device, which is installed on the above-mentioned mounting substrate in the formed sealed space; and an optical unit, which is installed in the formed sealed space.