JP6648712B2 - Light emitting device manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing a light emitting device.

  A light source device having an excitation light source such as a laser light emitting element and a lens array as a collimator lens for condensing light from the excitation light source has been proposed (see Patent Document 1). In Patent Literature 1, a lens array holder including a lens array is screwed to a light source holder on which an excitation light source is fixed. The lens array has a plurality of lens units.

JP 2013-73079 A

  However, optical members such as lens arrays have some dimensional variations due to dimensional tolerances. Therefore, according to the above light source device, there is a possibility that the spread angle of the light emitted from each lens unit varies greatly within one light source device. In addition, when the light source devices described above are mass-produced, there is a possibility that the spread angle of the light as a whole of the light source devices greatly varies among the mass-produced light source devices.

  The above problem can be solved by, for example, the following means.

  A step of preparing a base having a base, a step of fixing a plurality of semiconductor laser elements on the upper surface of the base, a plurality of lens portions, and a non-lens portion provided around the plurality of lens portions when viewed from above. And fixing the optical member to the base, wherein the step of fixing the optical member includes disposing the optical member above the base, between the base and the non-lens portion. Adjusting the inclination and height of the optical member after interposing an adhesive, or interposing an adhesive between the base and the non-lens portion after adjusting the inclination and height of the optical member, Thereafter, the optical member is fixed to the base by curing the adhesive, thereby manufacturing a light emitting device.

  A base having a base and a wall surrounding an area on the upper surface of the base, a plurality of semiconductor laser elements fixed to the upper surface of the base inside the wall, and transmitting light emitted from the semiconductor laser element; A step of preparing a light source unit having a light-transmitting portion and a lid fixed to the upper surface of the wall portion; a plurality of lens portions; and a non-light-emitting device provided around the plurality of lens portions when viewed from above. Fixing the optical member with the lens unit to the light source unit, wherein in the step of fixing the optical member, the optical member is disposed above the base, and an upper surface of the wall portion is provided. After interposing an adhesive between the non-lens portion and the tilt and height of the optical member, or adjusting the tilt and height of the optical member, the upper surface of the wall portion and the non-lens Glue between parts Is interposed, then, by curing the adhesive to secure the optical members to the light source unit, the method of manufacturing the light emitting device.

  According to the above-described manufacturing method, it is possible to suppress variations in the spread angle of light emitted from each lens unit in one light emitting device. In addition, when mass-producing light-emitting devices, it is possible to suppress variations in the spread angle of light among mass-produced light-emitting devices.

FIG. 2 is a schematic plan view illustrating the light emitting device according to the first embodiment. It is AA sectional drawing in FIG. 1A. It is BB sectional drawing in FIG. 1A. It is CC sectional drawing in FIG. 1A. It is a schematic plan view explaining an example of the process of preparing a base. It is DD sectional drawing in FIG. 2A. It is II sectional drawing in FIG. 2A. FIG. 5 is a schematic plan view illustrating an example of a step of fixing a semiconductor laser element. It is EE sectional drawing in FIG. 3A. It is JJ sectional drawing in FIG. 3A. It is a schematic plan view explaining an example of the process of fixing a lid to a base. It is FF sectional drawing in FIG. 4A. It is KK sectional drawing in FIG. 4A. It is a schematic plan view explaining an example of the process of fixing an optical member to a base. It is a typical sectional view explaining an example of a process of fixing an optical member to a substrate. It is a typical sectional view explaining an example of a process of fixing an optical member to a substrate. It is a perspective view explaining an optical member and a suction jig. It is the figure which looked at the adsorption jig from the adsorption surface side. It is a typical sectional view explaining other examples of a process of fixing an optical member to a substrate. FIG. 3 is a schematic cross-sectional view illustrating an example of an optical member. FIG. 9 is a schematic plan view illustrating an optical member according to a second embodiment. It is GG sectional drawing in FIG. 9A. FIG. 13 is a schematic plan view illustrating an optical member according to a third embodiment. It is HH sectional drawing in FIG. 10A. FIG. 14 is a schematic plan view illustrating an optical member according to a fourth embodiment. 9 is a table showing Z stage positions when light emitted from lens numbers 1 and the like is collimated in an example. 9 is a table showing an adjustment amount of an inclination of an optical member required to collimate light emitted from a lens number 1 or the like in an example. 9 is a table showing a deviation angle of an optical axis of light emitted from a lens number 1 or the like in Examples. It is the figure which plotted the data of FIG.

[Method of Manufacturing Light-Emitting Device 1 According to First Embodiment]
The method for manufacturing the light emitting device 1 according to the first embodiment includes a step of preparing a base 10 having a base 12 (see FIGS. 2A to 2C) and a step of fixing a plurality of semiconductor laser elements 30 on the upper surface of the base 12 (FIG. 3A to FIG. 3C), and a step of fixing the optical member 20 including the plurality of lens portions 22 and the non-lens portion 24 provided around the plurality of lens portions 22 in a top view (FIG. 5A). , FIG. 5B and FIG. 5C). Then, in the step of fixing the optical member 20, the optical member 20 is disposed above the base 10, and after adjusting the inclination and the height of the optical member 20, the adhesive 100 is applied between the base 10 and the non-lens portion 24. The optical member 20 is fixed to the base 10 by interposing and then curing the adhesive 100. The light emitting device 1 thus obtained is shown in FIGS. 1A to 1D. According to the present embodiment, since the inclination and height of the optical member 20 are adjusted, it is possible to suppress variations in the spread angle of light emitted from each lens unit 22 in one light emitting device. In addition, when mass-producing the light-emitting devices 1, it is possible to suppress variations in the spread angle of light between mass-produced light-emitting devices. Hereinafter, this point will be described in detail.

  Generally, an optical member having a flat surface on which light is incident (lower surface side) is used as the optical member. When manufacturing such an optical member, the thickness of the optical member is adjusted by polishing the optical member from the lower surface side. However, the optical member may become thicker from one end to the other end due to dimensional tolerances. In this case, the light spread angle differs between the thick part and the thin part. However, in the present embodiment, the inclination and the height of the optical member 20 are adjusted so that the spread angle of the light emitted from the lens unit 22 falls within a predetermined range. Therefore, even if the optical member 20 has a dimensional variation within the allowable range of the dimensional tolerance, it is possible to suppress the variation in the spread angle of the light emitted from each lens unit 22 in one light emitting device 1. Further, since the inclination and the height of the optical member 20 are adjusted for each light emitting device 1, it is possible to suppress a variation in the spread angle of light as a whole of the light emitting device among mass-produced light emitting devices. Hereinafter, a method for manufacturing the light emitting device 1 will be described in detail.

(Step of Preparing Base 10)
First, as shown in FIGS. 2A to 2C, a base 10 having a base 12 is prepared. In the present embodiment, as the base 10, a base having a wall 14 surrounding an area on the upper surface of the base 12 is used. The wall 14 is provided with a hole penetrating the inside and outside of the wall 14. A lead is inserted into the hole as a wiring 90 for supplying a current to the semiconductor laser element 30. Inside the hole, an insulating portion is interposed between the wiring 90 and the wall portion 14 to insulate both. For the base 10, for example, a metal material such as iron, an iron alloy, copper, or a copper alloy, a ceramic material such as Al ₂ O ₃ , AlN, SiC, or SiN, or a material combining these materials can be used. it can. At this time, it is preferable to use copper or a copper alloy for the base 12 because of high heat dissipation, and it is preferable to use iron or an iron alloy for the wall 14 because it can be welded to a lid 80 described later.

(Step of fixing semiconductor laser element 30)
Next, as shown in FIGS. 3A to 3C, the plurality of semiconductor laser elements 30 are fixed on the upper surface of the base 12. In the present embodiment, the semiconductor laser element 30 is indirectly fixed to the upper surface of the base 12 by interposing the mounting body 40 between the base 12 and the semiconductor laser element 30. The plurality of semiconductor laser elements 30 are edge emitting lasers, and emit laser light in a lateral direction (a direction parallel to the upper surface of the base 12). As in the present embodiment, when the mounting body 40 is used, the emission surface of the semiconductor laser element 30 can be separated from the upper surface of the base 12, so that the laser beam can be prevented from hitting the upper surface of the base 12. However, the semiconductor laser element may be directly fixed to the upper surface of the base without interposing the mounting body.

  The laser light emitted from each semiconductor laser element 30 is reflected by the light reflecting member 50 and then enters the light incident surface LA of each lens unit 22. As in the present embodiment, the laser light emitted from one semiconductor laser element 30 may be incident on one lens unit 22, but for example, the laser light emitted from two or more semiconductor laser elements is condensed, The light may be incident on one lens unit.

  In the present embodiment, when the X direction is the row direction and the Y direction is the column direction in FIG. 3A, the plurality of semiconductor laser elements 30 are arranged in a matrix of 4 rows × 5 columns. In this embodiment, a matrix of 4 rows × 5 columns is used. However, when a plurality of semiconductor laser elements 30 are arranged in a matrix, the number of rows and the number of columns are arbitrarily set (m rows × n columns (m ≧ 2, m ≧ 2, n ≧ 2)).

As described above, in the present embodiment, the plurality of semiconductor laser elements 30 are provided in a matrix. Adjacent semiconductor laser elements 30 provided in the row direction can be connected in series using the wire 60 and the relay member 70 as in the present embodiment. If the relay member 70 is used, the length of one wire 60 can be shortened, so that an increase in electric resistivity can be suppressed. As the wire 60, gold, silver, copper, aluminum or the like can be used. As the relay member 70, a metal material such as iron, iron alloy, or copper, or an insulating material such as Al ₂ O ₃ , AlN, SiC, or SiN having an electric wiring formed on an upper surface can be used.

  The light reflecting member 50 may be further fixed to the upper surface of the base 12 as in the present embodiment (see FIGS. 3A to 3C). Here, the light reflecting member 50 is a member that reflects light emitted from one of the plurality of semiconductor laser elements 30 toward one of the plurality of lens parts 22. . When the light reflecting member 50 is provided, the optical path length (the light emitted from the semiconductor laser element 30 is shifted from the light emitting surface of the semiconductor laser element 30 to the lens) as compared with the case where the semiconductor laser element 30 directly irradiates the optical member 20 with light. The distance up to the light exit surface LB of the portion 22. The same applies hereinafter.). However, if the optical path length becomes longer, the direction of the optical axis of the light emitted from each lens unit 22 falls within a predetermined range even when the semiconductor laser element 30 is displaced from a predetermined position due to mounting accuracy. It is easy to fit in. Therefore, in the present embodiment, by adjusting the inclination and the height of the optical member 20, the light spread angle of the entire optical member 20 (that is, the light spread angle of the light emitting device 1) is kept within a predetermined range. By arranging the light reflecting member 50, the optical path length is lengthened, and the deviation of the optical axis of the light emitted from each lens unit 22 is suppressed to some extent.

  If a plurality of lens units are arranged in one row in a top view and only light is incident on the plurality of lens units, one light reflecting member extending in the row direction below the plurality of lens units arranged in one row is arranged. It is also possible. However, in the present embodiment, the plurality of light reflecting members 50 are arranged such that one light reflecting member 50 corresponds to each of the plurality of lens portions 22 arranged in one row. In this way, even if the position of one light reflecting member 50 among the plurality of light reflecting members 50 arranged in one row is shifted, the other light reflecting members 50 on the same row are not shifted. Accordingly, it is possible to suppress the optical axes of the light emitted from the plurality of lens units 22 arranged in one line from being entirely shifted.

  The plurality of light reflecting members 50 may be fixed to the base 10 after fixing the plurality of semiconductor laser elements 30 to the base 10 in the step of fixing the plurality of semiconductor laser elements as in the present embodiment. For example, the plurality of semiconductor laser elements 30 may be fixed to the base 10 before fixing to the base 10. Further, for example, in the step of fixing a plurality of semiconductor laser elements, one semiconductor laser element 30 and one light reflecting member 50 may be alternately fixed.

  The light reflecting member 50 has a reflecting surface that reflects light emitted from the semiconductor laser device 30. As the light reflecting member 50, for example, glass, sapphire, metal, ceramics having a light reflecting film formed thereon, or a metal having a mirror-finished reflecting surface can be used. As the light reflecting film, for example, a dielectric multilayer film or a metal film can be used.

  In the present embodiment, the light reflecting member 50 is provided as described above, but the light emitted from the semiconductor laser element may be emitted upward without providing the light reflecting member.

(Step of fixing lid 80)
Next, as shown in FIGS. 4A to 4C, the lid 80 is fixed to the base 10. The cover 80 includes a light transmitting portion 84 that transmits light emitted from the semiconductor laser device 30. By using the lid 80, the space in which the semiconductor laser element 30 is arranged can be sealed. Therefore, particularly when a nitride semiconductor is used as the semiconductor laser element 30, it is possible to suppress the collection of organic substances on the light emitting surface of the semiconductor laser element 30. If the light emitting device 1 does not have the lid 80, this step is omitted.

  As the lid 80, a lid having a frame portion 82 provided with a plurality of through holes 82a and a plurality of light transmitting portions 84 closing the respective through holes 82a is used. Laser light emitted from one semiconductor laser element 30 passes through one through hole 82a. A peripheral portion of the frame portion 82 is fixed to the upper surface of the wall portion 14. In the present embodiment, as shown in FIG. 4B and the like, the frame portion 82 has a concave portion 82b that is recessed on the base 12 side. By doing so, the stress generated in the lid 80 (the stress generated due to the difference in the thermal expansion coefficient between the lid 80 and the base 10) is reduced by the vertically extending portion of the lid 80 (corresponding to the inner wall of the concave portion 82 b). (Part), it is possible to reduce the damage of the lid 80, particularly the damage of the light transmitting portion 84.

  As the lid 80, unlike the present embodiment, a lid having a frame portion provided with a plurality of through holes and one translucent portion closing the plurality of through holes can be used. A lid having a frame portion provided with one relatively large through-hole so that a plurality of laser beams emitted from a plurality of semiconductor laser elements can pass therethrough, and one translucent portion closing the through-hole. Can also be used.

  The lid 80 may be fixed to the base 10 by seam welding as in the present embodiment, or may be fixed to the base 10 by an adhesive made of resin. According to the seam welding, the space in which the semiconductor laser element 30 is disposed (the space formed by the base 10 and the lid 80) is hermetically sealed to suppress dust collection.

  In the present embodiment, the step of preparing the base 10, the step of fixing the plurality of semiconductor laser elements 30 to the upper surface of the base 12, and the step of fixing the lid 80 to the upper surface of the wall 14 are sequentially performed. However, the same thing as the one manufactured through each step may be prepared. That is, before the step of fixing the optical member 20 to be described later, the base 10 having the base 12 and the wall 14 surrounding one area on the upper surface of the base 12 and the upper surface of the base 12 inside the wall 14 are fixed. A light source unit including a plurality of semiconductor laser elements 30 and a lid 80 having a light-transmitting portion 84 that transmits light emitted from the semiconductor laser element 30 and fixed to the upper surface of the wall 14 may be prepared.

(Step of fixing optical member 20)
Next, as shown in FIGS. 5A to 5C, the optical member 20 is fixed to the base 10. The optical member 20 includes a plurality of lens portions 22 and a non-lens portion 24 provided around the plurality of lens portions 22 when viewed from above. In this embodiment, the optical member 20 is fixed to the base 10 via the lid 80 by fixing the optical member 20 to the lid 80 fixed to the base 10. Specifically, after the optical member 20 is disposed above the base 10 and the inclination and height of the optical member 20 are adjusted as shown in FIGS. 5A and 5B, the base 10 and the non-lens are adjusted as shown in FIG. 5C. The optical member 20 is fixed to the base 10 via the lid 80 by interposing the adhesive 100 between the portion 24 and the adhesive 24 and then curing the adhesive 100. By adjusting the tilt and height of the optical member 20 in a state where the adhesive 100 is not interposed, it is possible to suppress an adverse effect on the optical characteristics due to the adhesive 100 protruding inward during the adjustment.

  As described above, the lid 80 can be fixed to the base 10 by seam welding or an adhesive made of resin. However, in any case, simply fixing the optical member to the base via the lid can keep the spread angle of light emitted from each lens portion of one light emitting device within a predetermined range. It may not be possible. Further, in each of the mass-produced light emitting devices, there is a possibility that the light spread angle as the light emitting device cannot be kept within a predetermined range. For example, when the lid is fixed to the base by seam welding, the lid is welded to the base while pressing the lid with a roller. May not be flat. Further, when the lid is fixed to the base with an adhesive made of a resin, not only is there a risk of dust collection because organic substances are generated from the adhesive, but also the thickness of the adhesive becomes uneven or the adhesive protrudes. Then, there is a possibility that the lid is inclined and fixed. However, if the inclination and height of the optical member 20 are adjusted for each light emitting device 1 as in the present embodiment, the case where the upper surface of the lid 80 is not flat or the case where the lid 80 is inclined and fixed is obtained. Also, the spread angle of light emitted from each lens unit of one light emitting device can be kept within a predetermined range. Further, in each of the mass-produced light emitting devices 1, the spread angle of light as the light emitting device 1 can be kept within a predetermined range.

  Generally, not only the optical member 20 but also other members such as the light reflecting member 50 have dimensional variations. Further, when mounting the light reflecting member 50 and the like, the actual mounting position may vary due to mounting accuracy. That is, it is difficult to completely match the direction of the optical axis of the light emitted from each lens unit between the mass-produced light emitting devices. Therefore, in the present embodiment, as shown in FIG. 5B, in addition to the adjustment of the inclination and the height of the optical member 20, the planar position of the optical member 20 is also adjusted. With this configuration, when the light emitted from each lens unit is viewed together, not only the spread angle of the light as the light emitting device but also the direction of the optical axis as the light emitting device can be kept within a predetermined range. . Therefore, according to the present embodiment, in addition to the dispersion of the light spread angle within one light emitting device and the dispersion of the light spread between mass-produced light emitting devices, the dispersion of the direction of the optical axis between the mass produced light emitting devices. Can also be suppressed. Here, the adjustment of the planar position of the optical member 20 means the adjustment of the position of the optical member 20 on a plane parallel to the upper surface of the base 12 (the vertical direction, the horizontal direction, and the rotation direction in FIG. 5B). In the following, the tilt, height, and plane position of the optical member 20 may be simply referred to as “tilt or the like”.

  Hereinafter, the adjustment of the inclination of the optical member 20 and the like in the present embodiment will be described in detail.

  First, the optical member 20 is held by a suction jig described later, and the optical member 20 is arranged above the base 10 so that laser light emitted from each semiconductor laser element 30 passes through each lens unit 22.

  Next, as shown in FIG. 5A, the inclination and height of the optical member 20 are adjusted (first adjustment). Specifically, the tilt and height of the optical member 20 are adjusted so that the four lens portions 22 located at the four corners in top view have an appropriate height. More specifically, first, for each of the four lens portions 22 located at the four corners when viewed from above, the height at which light transmitted through the lens portions becomes parallel light is measured. That is, for each of the four lens portions 22, the height at which the light emitted from the lens portions becomes parallel light while actually oscillating the semiconductor laser element 30 is measured. Then, the inclination and the height of the optical member 20 are adjusted so that each of the four lens units 22 is disposed at or near the measured height. The main factor in which the spread angle of light differs for each lens portion 22 in one optical member 20 is that the optical member 20 gradually increases in thickness from one end to the other end due to the dimensional tolerance of the optical member 20. It is considered that. Therefore, if each of the four lens portions 22 located at the four corners in the top view has an appropriate height, an appropriate height can be obtained also in the lens portion 22 located therebetween. The adjustment of the inclination and the height of the optical member may be performed, for example, such that all the lens units are arranged at an appropriate height, or a plurality of the lens units may be arranged at positions other than the four corners. You may perform so that a lens part may be arrange | positioned at an appropriate height. Further, in the present embodiment, the first adjustment is performed so that the laser light in a state close to or parallel to the parallel light is emitted from the lens unit 22, but the laser light having an arbitrary spread angle other than the parallel light is emitted. One adjustment can also be made.

  In the present embodiment, the first adjustment is performed using the spread angle in the Y direction in FIG. 5B. Generally, the FFP (Far Field Pattern) of the laser light emitted from the semiconductor laser element 30 is elliptical. Also in the present embodiment, as shown in FIG. 5B, the FFP on the light incident surface LA of the lens unit 22 is an ellipse that spreads more in the Y direction than in the X direction, and the spread angle of light in the Y direction is smaller than that of light in the X direction. It becomes larger than the spread angle. Therefore, if the first adjustment is performed using the light spread angle in the Y direction in FIG. 5B, the effect of adjusting the light spread angle can be more easily obtained. Further, the first adjustment can be easily performed by adjusting the Y direction in which the light spread angle is large. As another embodiment, the adjustment can be performed using not only the spread angle of light in the Y direction but also the spread angle of light in the X direction, or the adjustment can be performed using only the spread angle of light in the X direction. it can.

  Next, the planar position of the optical member 20 is adjusted (second adjustment). In the second adjustment, first, an angle (hereinafter, also referred to as a “deviation angle”) between the optical axis of light emitted from the lens units 22 and a reference axis is measured for each of all the lens units 22. Then, based on the measurement result, the average value of the deviation angles of the laser beams emitted from all the lens units 22 is obtained, and the plane position of the optical member 20 is adjusted so that the average value approaches zero. That is, the plane position of the optical member 20 is adjusted such that the optical axes of the light emitted from all the lens units 22 approach the reference axis as a whole. Typically, a straight line perpendicular to the lower surface of the base 10 can be assumed as the reference axis, but a straight line extending in an arbitrary direction can also be assumed.

  In the present embodiment, the first adjustment and the second adjustment are performed all at once, but the first adjustment and the second adjustment may be repeatedly performed in order to perform more strict adjustment. Further, instead of performing the second adjustment after the first adjustment, the first adjustment may be performed after the second adjustment.

  In the present embodiment, as described above, the tilt, height, and plane position of the optical member 20 are adjusted, and information about the adjusted tilt, height, and plane position after adjustment is stored in a memory or the like. Next, the optical member 20 is once separated from the base 10, and then the adhesive 100 is applied to the upper surface of the lid 80. Next, based on the stored information, the lower surface of the optical member 20 is brought into contact with the adhesive 100 applied to the upper surface of the lid 80 while returning the optical member 20 to a predetermined inclination, height, and plane position. If the optical member 20 is once separated from the base 10 and then the adhesive 100 is applied to the upper surface of the lid 80, the adhesive 100 can be easily arranged on the upper surface of the lid 80. In addition, while keeping the state in which the inclination, the height, and the plane position of the optical member 20 have been adjusted without releasing the adhesive, the adhesive between the base 10 and the non-lens portion 24 from the outside of the optical member 20 in a top view. 100 can also be injected.

  Adjustment of the inclination, height, and plane position of the optical member 20 can be performed using a suction jig 110 as shown in FIGS. 6A and 6B. FIG. 6A is a diagram illustrating a state in which the suction jig 110 holds the optical member 20, and FIG. 6B is a view illustrating the suction jig 110 as viewed from a suction surface (a surface that holds the optical member 20). The suction jig 110 is provided with a recess 112 along the outer periphery of the optical member 20 so that the optical member 20 is always held at a fixed position when the optical member 20 is sucked. Further, a through hole 112a for suction is provided in a part of the recess 112. In this embodiment, the optical member is held by one suction jig. However, for example, two stick-shaped suction jigs may be prepared, and the optical member 20 may be held by two suction jigs.

  The optical member 20 (the lens portion 22 and the non-lens portion 24) can be formed using a light-transmitting material such as glass or synthetic quartz. As shown in FIG. 5A and the like, each lens unit 22 has a light incident surface LA and a light exit surface LB, and each laser beam incident on the light incident surface LA of each lens unit 22 The light is emitted from each of the light emission surfaces LB.

  As the optical member 20, one in which a plurality of lens units 22 are two-dimensionally arranged in a top view can be used, and typically, one in which a plurality of lens units 22 are arranged in a matrix in a top view is used. As illustrated in FIG. 5B and the like, in the present embodiment, one lens unit 22 and a lens unit 22 adjacent thereto in the column direction are connected by a connection unit. When the plurality of lens units 22 are two-dimensionally arranged, the spread angle of light emitted from each lens unit 22 is more likely to vary than when the plurality of lens units 22 are arranged in a line, and mass production is also possible. The light spread angle tends to vary among the light emitting devices. However, according to the present embodiment, in order to adjust the inclination and the height of the optical member 20, even when a plurality of lens units 22 are two-dimensionally arranged, each lens unit 22 can be included in one light emitting device. The spread angle of the light emitted from the light source 22 can be kept within a predetermined range. Further, when mass-producing the light-emitting devices, the light-spreading angle of the light-emitting device 1 in each of the mass-produced light-emitting devices can be kept within a predetermined range.

  As the adhesive 100, a photocurable adhesive such as an ultraviolet curable resin is preferably used. The photocurable adhesive is different from a normal adhesive that cures with the passage of time, and the timing of curing can be arbitrarily determined at the timing of applying light. Also, the time until curing is short. Therefore, if a photocurable adhesive is used as the adhesive 100, the optical member 20 can be fixed with a predetermined inclination or the like with high accuracy.

  In the present embodiment, as shown in FIG. 1A, an adhesive 100 is interposed between the lid 80 and the optical member 20 in a region excluding a part of the outer peripheral portion of the optical member 20 when viewed from above. In FIG. 1A, the hatched area is the area where the adhesive 100 is interposed. If the adhesive 100 is partially provided in this manner, a gap is generated between the adhesives 100, and the gap is used to spatially connect the outside of the light emitting device 1 and the concave portion 82b. be able to. When the adhesive contains an organic substance, the organic substance may collect on the incident surface LA of the lens unit due to the laser beam. However, if the outside of the light emitting device 1 and the concave portion 82b are spatially connected as described above, even if the adhesive 100 contains an organic substance, it is difficult for the organic gas to stay inside the concave portion 82b. Therefore, the accumulation (dust collection) of the organic matter in the lens portion 22 and the light transmitting portion 84 can be suppressed. In addition, the occurrence of dew condensation can be suppressed.

  In the step of fixing the optical member 20 to the base 10, as shown in FIG. 7, the inclination and the height of the optical member 20 are adjusted while the adhesive 100 is present between the lid 80 and the optical member 20. Then, the adhesive 100 may be cured. In this case, the adhesive 100 is applied to the upper surface of the base 10 or the upper surface of the lid 80 as compared with the case where the adhesive is applied without separating the optical member from the base after adjusting the inclination and height of the optical member. Is easier to place.

  As the optical member 20, an optical member having an inclined surface approaching the upper surface as the lower surface of the non-lens portion 24 goes outward as shown in FIG. 8 is used, and the adhesive 100 is interposed between the lid 80 and the inclined surface. You can also. By doing so, it is possible to make it difficult for the adhesive 100 to enter the inside of the wall portion 14 (in this embodiment, the concave portion 82b of the lid 80) when fixing the optical member 20 to the base 10. In adjusting the height of the optical member, if the optical member is moved closer to the base in a state where the adhesive is present between the optical member and the lid, the adhesive is pressed and easily enters the inside of the wall. However, even in the case of adjusting the inclination or the like of the optical member after interposing the adhesive in this way, if the optical member 20 having the inclined surface is used, the adhesive 100 can be easily pushed to the outside. 100 can be reduced from entering the interior of the wall 14.

  The optical member 20 may be indirectly fixed to the base 10 via a member such as the cover 80 as in the present embodiment, or may be directly fixed to the base 10 without the use of a member such as the cover 80. May be. Further, the adhesive 100 may be interposed between the base 10 and the optical member 20 via a member such as the lid 80 as in the present embodiment, or may be provided without the member such as the lid 80. It may be interposed between 10 and the optical member 20.

[Method of Manufacturing Light Emitting Device 2 According to Second Embodiment]
The method for manufacturing the light emitting device 2 is the same as the method for manufacturing the light emitting device 1 except for the items described below.

  In the present embodiment, as shown in FIGS. 9A and 9B, the optical member 20 in which a plurality of injection holes 24a for injecting the adhesive 100 are provided in the non-lens portion 24 is used as the optical member 20. . By injecting the adhesive 100 from the injection hole 24a, the adhesive 100 can be easily interposed between the base 10 and the non-lens portion 24. Moreover, the adhesive strength can be improved by making the adhesive 100 contact not only the lower surface of the optical member 20 but also the inner surface of the injection hole 24a.

  In the present embodiment, after the adjustment of the inclination and the height of the optical member 20 and before the interposition of the adhesive 100 between the base 10 and the optical member 20, in the hatched region in FIG. The optical member 20 is temporarily fixed to the base 10. The temporary fixing can be performed by, for example, a photo-curable adhesive. By performing the temporary fixing, it is not necessary to hold the optical member 20 with the suction jig 110 when the adhesive is interposed, so that the adhesive 100 can be easily injected from the injection hole 24a. Temporary fixing is not an essential step, and by using the suction jig 110 that does not block the injection hole 24a, the base member 10 and the optical member 20 are not temporarily fixed while the optical member 20 is held by the suction jig 110. The adhesive 100 may be interposed between them.

[Method of Manufacturing Light-Emitting Device 3 According to Third Embodiment]
The method for manufacturing the light emitting device 3 is the same as the method for manufacturing the light emitting device 1 except for the items described below.

  In the light emitting device 3, as shown in FIGS. 10A and 10B, the optical member 20 in which the non-lens portion 24 is provided with the through hole F is used as the optical member 20. In this case, the adhesive 100 is interposed between the base 10 and a region of the non-lens portion 24 farther from the plurality of lens portions 22 than the through hole F in a top view. In FIG. 10A, the hatched area is the area where the adhesive 100 is interposed. The adhesive 100 is interposed between the base 10 and the optical member 20 in a region extending over the entire outer peripheral portion of the optical member 20 when viewed from above. By using the optical member 20 provided with the through hole F, the organic gas generated from the adhesive 100 can be released from the through hole F to the outside even when the adhesive 100 contains an organic substance. Therefore, in the space formed between the optical member 20 and the lid 80, not only the dew condensation can be suppressed, but also the accumulation (dust collection) of organic substances can be suppressed. In addition, in a region extending over the entire outer periphery of the optical member 20 when viewed from above, the adhesive strength between the optical member 20 and the substrate 10 can be improved by interposing the adhesive 100 between the substrate 10 and the optical member 20. it can. In the present embodiment, the optical member provided with the injection hole 24a described in the second embodiment can also be used.

[Method of Manufacturing Light-Emitting Device 4 According to Embodiment 4]
The method for manufacturing the light emitting device 4 is the same as the method for manufacturing the light emitting device 1 except for the items described below.

  In the present embodiment, as shown in FIG. 11, in the step of fixing the optical member 20, the lid 80 is interposed so that a part of the outer peripheral portion of the optical member 20 is located inside the concave portion 82b when viewed from above. The optical member 20 is fixed to the base 10. That is, the optical member 20 used in the present embodiment has a shape in which four corners are cut in a top view, and the opening G is formed in the four cut portions. In FIG. 11, the hatched area is the area where the adhesive 100 is interposed. When such an optical member 20 is used, the optical member 20 and the base 10 or the lid 80 are compared with the first embodiment in which the adhesive 100 is partially disposed on the upper surface of the wall portion 14 in a top view. Thus, a portion that is not joined can be formed more reliably. In the present embodiment, the optical member provided with the injection hole 24a described in the second embodiment can also be used.

[Example]
In this example, a light emitting device was manufactured by a manufacturing method corresponding to the fourth embodiment. Hereinafter, a method for manufacturing the light emitting device according to the present embodiment will be described with reference to FIGS. 2A to 5C and FIG.

  First, a base 10 having a base 12 made of copper and a wall 14 surrounding an area on the upper surface of the base 12 and made of an iron alloy was prepared (see FIGS. 2A to 2C).

  Next, a semiconductor laser device 30 made of a nitride semiconductor and having an oscillation wavelength of 455 nm is disposed on the upper surface of the base 12 inside the wall portion 14. Thereafter, a light reflecting film made of a dielectric multilayer film is formed on the upper surface of the base 12. The light reflecting member 50 made of the formed glass was disposed. This operation was repeated 20 times, and the semiconductor laser elements 30 and the light reflecting members 50 were arranged so that there were a total of 20 pieces in 4 rows × 5 columns (see FIGS. 3A to 3C).

  Next, a lid 80 including a frame portion 82 made of an iron alloy provided with 20 through holes 82a and 20 light transmitting portions 84 closing each through hole 82a is placed on the upper surface of the wall portion 14. It was fixed by seam welding (see FIGS. 4A to 4C). The lid 80 has a concave portion 82 b that is recessed toward the base 12 inside the wall 14 while being fixed to the wall 14.

  Next, the optical member 20 was arranged above the base 10, and the inclination, height, and plane position of the optical member 20 were adjusted using an autocollimator and various stages. At the time of adjustment, a portion other than the lens portion to be measured is covered with a light-shielding plate, so that light is emitted only from the lens portion to be measured, and the parallel light is emitted from the lens portion and the height of the lens portion. The optical axis deviation angle of the light was measured.

  Although described below with reference to FIGS. 5A to 5C, the optical member 20 shown in FIG. In FIG. 11, the lens unit 22 located in the first row and the first column is located at the lens number 1, the lens unit 22 located at the first row and the second column at the right is located at the lens number 2 and the first row and the third column at the right. The lens section 22 to be positioned is designated by lens number 3, the lens section 22 located on the first row and fourth column to the right thereof is designated by lens number 4, and the lens section 22 located on the first row and fifth column to the right is designated by lens number 5 and the like. The description will be made (that is, lens numbers 1 to 5 are set from the left end to the right end of the top row). Similarly, in the second row (the second row from the top), lens numbers 6 to 10 are set from the first column to the fifth column, and in the third row (the third row from the top), the lens numbers are set from the first column. Lens numbers 11 to 15 are set for the fifth column, and lens numbers 16 to 20 are set for the fourth row (fourth row from the top) from the first column to the fifth column. The stage position in the X direction (horizontal direction in FIG. 11) is the X stage position, the stage position in the Y direction (vertical direction in FIG. 11) is the Y stage position, and the Z direction (the direction perpendicular to the plane of FIG. 11). , Height direction.) Will be described as a Z stage position.

  First, in each of the lens portions 22 located at the four corners of the optical member 20, the Z-stage position when the light emitted from the lens portion 22 becomes parallel light in the Y direction or a state close thereto is measured. By measuring the Z stage position, the relative height of the lens unit when the light emitted from the lens unit 22 becomes parallel light can be grasped. As a result of the measurement, the Z-stage position at which the parallel light was formed at each lens portion was 174 μm for lens number 1, 185 μm for lens number 5, 165 μm for lens number 16, and 162 μm for lens number 20.

  Next, the difference between the Z stage position of the lens number 1 and the Z stage position of the lens number 5 and the X stage position when measuring the height at which the parallel light can be obtained at the lens number 1 and the parallel light at the lens number 5 Based on the difference from the X stage position when measuring the obtained height, the tilt to be adjusted in the X direction, which is necessary to obtain parallel light with both the lens number 1 and the lens number 5, based on the angle A Was calculated to be -0.045 °. Similarly, the difference between the Z stage position of the lens number 16 and the Z stage position of the lens number 20 and the parallel light at the X stage position and the lens number 20 when measuring the height at which the parallel light is obtained at the lens number 16 Based on the obtained height and the difference from the X stage position, the tilt to be adjusted in the X direction, which is necessary to obtain parallel light at both lens numbers 16 and 20, is determined by the angle B. Was calculated to be 0.012 °. Similarly, the difference between the Z stage position of lens number 1 and the Z stage position of lens number 16 and the parallel light at Y stage position and lens number 16 when measuring the height at which parallel light is obtained at lens number 1 Based on the difference from the Y stage position when measuring the obtained height, the inclination to be adjusted in the Y direction required to obtain parallel light with both the lens number 1 and the lens number 16 is determined by the angle C. Was -0.029 [deg.]. Similarly, the difference between the Z stage position of lens number 5 and the Z stage position of lens number 20 and the parallel light at Y stage position and lens number 20 when measuring the height at which parallel light is obtained at lens number 5 Based on the obtained height and the difference from the Y-stage position, the inclination to be adjusted in the Y direction, which is necessary to obtain parallel light with both lens numbers 5 and 20, is determined by the angle D. Was -0.073 [deg.]. Then, a value (−0.039 °) obtained by averaging two values (angle A and angle B) obtained in the X direction and a value obtained by averaging two values (angle C and angle D) in the Y direction are obtained. Based on the value (−0.066 °), the inclination of the optical member 20 was adjusted such that each of the lens portions 22 at the four corners had an appropriate height. Here, the minus means that the left side in FIG. 11 needs to be adjusted so as to approach the upper surface of the base 12 in the X direction, or the lower side in FIG. 11 needs to be adjusted so as to approach the upper surface of the base 12 in the Y direction. Means that. In addition, the plus means that the right side of FIG. 11 needs to be adjusted so as to approach the upper surface of the base 12 in the X direction, or the plus direction needs to be adjusted so that the upper side of FIG. Means you need to.

  In order to confirm the effect of the adjustment, after the adjustment, the position of the Z stage at which parallel light is formed was measured for each of lens numbers 1, 5, 16, and 20. As a result, it was 225 μm for lens number 1, 228 μm for lens number 5, 227 μm for lens number 16, and 222 μm for lens number 20. Further, after the adjustment, when the angles A to D were calculated in the same manner as described above, the angle A was −0.012 °, the angle B was 0.020 °, the angle C was 0.006 °, and the angle D was -0.019 °. The value obtained by averaging two values (angle A and angle B) obtained in the X direction is −0.002 °, and the value obtained by averaging two values obtained in the Y direction (angle C and angle D) Was -0.004 [deg.].

  These results are shown in FIGS. As can be understood from FIGS. 12 and 13, by adjusting the height and the inclination of the optical member 20, it was possible to obtain light close to parallel light at all of the lens portions 22 located at the four corners in a top view. . In FIG. 12, the Z stage position at which the lens numbers 1, 5, 16, and 20 become parallel light before the adjustment, and the Z stage at which the lens numbers 1, 5, 16, and 20 become parallel light after the adjustment. The stage position differs greatly. This is because the reference axis for adjusting the inclination of the optical member 20 is located not on the center of the optical member 20 but on the stage for adjusting the inclination of the optical member 20 located at a position away from the optical member 20. It is. In other words, although the Z-stage position at which the parallel light is formed for each of the lens numbers 1, 5, 16, and 20 changes before and after the adjustment, the position of each lens unit which becomes the parallel light at each of the lens numbers 1, 5, 16, and 20 is changed. The actual height is almost the same before and after the adjustment.

  Next, the deviation angle of the optical axis of the laser light emitted from the lens unit 22 from the reference axis was measured for all of the 20 lens units 22 (here, a straight line perpendicular to the lower surface of the base 12 was measured). Reference axis). Then, the plane position of the optical member 20 was adjusted so that the average value of the measurement results approached the reference axis.

  FIG. 14 shows the deviation angle of the optical axis of the laser beam emitted from the lens unit 22 before and after the adjustment of the plane position, and FIG. 15 shows the data of FIG. 14 plotted on XY coordinates. In FIG. 14, θx is a deviation angle in the X direction in FIG. 11, θy is a deviation angle in the Y direction in FIG. 11, and D is a deviation angle obtained by combining θx and θy. is there. As is clear from FIGS. 14 and 15, by adjusting the planar position of the optical member 20, the shift amount of the optical axis when the light emitting device is regarded as one light source can be reduced.

  The embodiments and examples have been described above, but the present invention is not limited to the embodiments and examples.

1, 2, 3, 4 Light Emitting Device 10 Base 12 Base 14 Wall 20 Optical Member 22 Lens 24 Non-Lens 24a Injection Hole 30 Semiconductor Laser Element 40 Mounting Body 50 Light Reflecting Member 60 Wire 70 Relay Member 80 Cover 82 Frame portion 82a Through hole 82b Concave portion 84 Light transmitting portion 90 Wiring 100 Adhesive 110 Suction jig 112 Depressed portion 112a Through hole LA Light incident surface LB Light emitting surface F Through hole G Opening X Row direction Y Column direction

Claims (19)

Preparing a substrate having a base;
Fixing a plurality of semiconductor laser elements on the upper surface of the base,
A step of fixing an optical member including a plurality of lens units and a non-lens unit provided around the plurality of lens units in a top view to the base,
In the step of fixing the optical member,
Disposing the optical member above the base;
After the adhesive is interposed between the substrate and the non-lens portion, at least the height of the optical member, as variations in spread angle of the light due to the dimensional variations of the optical member is suppressed each spread angle of the light emitted from the lens unit is adjusted to a position within a predetermined range, or at least the height of the optical member, variations in spread angle of the light due to the dimensional variations of the optical member is suppressed after the divergence angle of light emitted from the lens unit to be is adjusted to a position within a predetermined range, the adhesive is interposed between the substrate and the non-lens portion,
Then, by curing the adhesive interposed to supplement the height from the adhesive area of the base below the adjusted height to the adhesive area of the optical member at the adjusted height Fixing the optical member to the base,
A method for manufacturing a light emitting device. Preparing a substrate having a base;
Fixing a plurality of semiconductor laser elements on the upper surface of the base,
A step of fixing an optical member including a plurality of lens units and a non-lens unit provided around the plurality of lens units in a top view to the base,
In the step of fixing the optical member,
Disposing the optical member above the base;
After the adhesive is interposed between the substrate and the non-lens portion, at least the height of the optical member, as variations in spread angle of the light due to the dimensional variations of the optical member is suppressed each spread angle of the light emitted from the lens unit is adjusted to a position within a predetermined range, or at least the height of the optical member, variations in spread angle of the light due to the dimensional variations of the optical member is suppressed after the divergence angle of light emitted from the lens unit to be is adjusted to a position within a predetermined range, the adhesive is interposed between the substrate and the non-lens portion,
Then, the height of the adhesive interposed between the base and the optical member, the difference between the adjusted height from the base to the optical member and the height from the base to the bonding area of the base, By curing the adhesive in a state where it has become, fixing the optical member to the base,
A method for manufacturing a light emitting device. Providing a base having a base and a wall surrounding an area on the top surface of the base,
Fixing a plurality of semiconductor laser elements on the upper surface of the base inside the wall,
Fixing a lid having a light-transmitting portion that transmits light emitted from the semiconductor laser element to an upper surface of the wall portion;
A step of fixing an optical member having a plurality of lens portions and a non-lens portion provided around the plurality of lens portions in a top view to the lid,
In the step of fixing the optical member,
Disposing the optical member above the lid;
After the adhesive is interposed between the lid and the non-lens portion, wherein at least the height of the optical element, as variation in the spread angle of the light due to the dimensional variations of the optical member is suppressed spread angle of light emitted from the lens unit is adjusted to a position within a predetermined range, or at least the height of the optical member, variations in spread angle of the light due to the dimensional variations of the optical member after the divergence angle of light emitted from the lens unit to be suppressed is adjusted to a position within a predetermined range, the adhesive is interposed between the lid and the non-lens portion,
Then, curing the adhesive interposed to compensate for the height from the adhesive area of the lid body below the adjusted height to the adhesive area of the optical member at the adjusted height. By fixing the optical member to the lid,
A method for manufacturing a light emitting device. Providing a base having a base and a wall surrounding an area on the top surface of the base,
Fixing a plurality of semiconductor laser elements on the upper surface of the base inside the wall,
Fixing a lid having a light-transmitting portion that transmits light emitted from the semiconductor laser element to an upper surface of the wall portion;
A step of fixing an optical member having a plurality of lens portions and a non-lens portion provided around the plurality of lens portions in a top view to the lid,
In the step of fixing the optical member,
Disposing the optical member above the lid;
After the adhesive is interposed between the lid and the non-lens portion, wherein at least the height of the optical element, as variation in the spread angle of the light due to the dimensional variations of the optical member is suppressed spread angle of light emitted from the lens unit is adjusted to a position within a predetermined range, or at least the height of the optical member, variations in spread angle of the light due to the dimensional variations of the optical member after the divergence angle of light emitted from the lens unit to be suppressed is adjusted to a position within a predetermined range, the adhesive is interposed between the lid and the non-lens portion,
Thereafter, the height of the adhesive interposed between the lid and the optical member is the height of the adjusted base to the optical member and the height of the adjusted base to the bonding area of the lid. By curing the adhesive in the state of the difference, fixing the optical member to the lid,
A method for manufacturing a light emitting device. A base having a base and a wall surrounding an area on the upper surface of the base, a plurality of semiconductor laser elements fixed to the upper surface of the base inside the wall, and transmitting light emitted from the semiconductor laser element; A step of preparing a light source unit including a light-transmitting portion and a lid fixed to the upper surface of the wall portion;
Fixing a plurality of lens portions and a non-lens portion provided around the plurality of lens portions in a top view to the light source unit,
In the step of fixing the optical member,
Disposing the optical member above the lid;
An adhesive after being interposed, at least the height of the optical member, variations in spread angle of the light due to the dimensional variations of the optical member is suppressed between the upper surface and the non-lens portion of the lid spread angle of light emitted from the lens unit so that by adjusting the position within a predetermined range, or, said at least height of the optical element, the spread angle of the light due to the dimensional variations of the optical member after the divergence angle of light emitted from the lens unit as the variation is suppressed is adjusted to a position within a predetermined range, the adhesive is interposed between the upper surface and the non-lens portion of the lid,
Then, curing the adhesive interposed to compensate for the height from the adhesive area of the lid body below the adjusted height to the adhesive area of the optical member at the adjusted height. By fixing the optical member to the light source unit,
A method for manufacturing a light emitting device. A base having a base and a wall surrounding an area on the upper surface of the base, a plurality of semiconductor laser elements fixed to the upper surface of the base inside the wall, and transmitting light emitted from the semiconductor laser element; A step of preparing a light source unit including a light-transmitting portion and a lid fixed to the upper surface of the wall portion;
Fixing a plurality of lens portions and a non-lens portion provided around the plurality of lens portions in a top view to the light source unit,
In the step of fixing the optical member,
Disposing the optical member above the lid;
An adhesive after being interposed, at least the height of the optical member, variations in spread angle of the light due to the dimensional variations of the optical member is suppressed between the upper surface and the non-lens portion of the lid spread angle of light emitted from the lens unit so that by adjusting the position within a predetermined range, or, said at least height of the optical element, the spread angle of the light due to the dimensional variations of the optical member after the divergence angle of light emitted from the lens unit as the variation is suppressed is adjusted to a position within a predetermined range, the adhesive is interposed between the upper surface and the non-lens portion of the lid,
Thereafter, the height of the adhesive interposed between the lid and the optical member is the height of the adjusted base to the optical member and the height of the adjusted base to the bonding area of the lid. By curing the adhesive in the state of the difference, fixing the optical member to the light source unit,
A method for manufacturing a light emitting device. The method for manufacturing a light emitting device according to claim 1, wherein, in the step of fixing the optical member, a planar position is adjusted in addition to adjusting at least a height of the optical member.   The method for manufacturing a light emitting device according to claim 1, wherein in the step of fixing the optical member, an optical member in which the plurality of lens units are two-dimensionally arranged in a top view is used as the optical member. . The plurality of lens units are arranged in a matrix of N × M (N, M ≧ 1, and at least one of N or M is 3 or more),
In the step of fixing the optical member according to any one of claims 1 to 7 to adjust the height based on 2 Tsunore lens unit in the corner of the same row or column of said plurality of lens portions A method for manufacturing a light emitting device.   The method for manufacturing a light emitting device according to claim 9, wherein in the step of fixing the optical member, the planar position is adjusted based on all of the plurality of lens portions.   The method for manufacturing a light emitting device according to claim 1, wherein in the step of fixing the optical member, a photocurable adhesive is used as the adhesive. The method for manufacturing a light emitting device according to claim 1, wherein in the step of fixing the optical member, the adhesive is interposed after adjusting at least a height of the optical member.   In the step of fixing the optical member, an optical member having a plurality of injection holes for injecting an adhesive provided in the non-lens portion is used as the optical member, and the adhesive is injected from the injection hole. The method for manufacturing a light emitting device according to claim 12, wherein the adhesive is interposed.   In the step of fixing the plurality of semiconductor laser elements, further, a plurality of light reflecting members each of which reflects light emitted from one of the semiconductor laser elements toward one of the lens parts are fixed on the upper surface of the base. The method for manufacturing a light emitting device according to claim 1.   In the step of fixing the optical member, an optical member provided with a through-hole in the non-lens portion is used as the optical member, and an adhesive containing an organic substance is used as the adhesive. 15. The device according to claim 1, wherein the adhesive is interposed between a region farther from the plurality of lens portions than the through hole and the base. The method for manufacturing a light emitting device according to any one of claims 7 to 14, wherein claim 1 or claim 2 is cited.   In the step of fixing the optical member, an optical member provided with a through-hole in the non-lens portion is used as the optical member, and an adhesive containing an organic substance is used as the adhesive. Claims 3, 4, 5, 6, and 3 in which the adhesive is interposed between a region farther from the plurality of lens portions than the through hole and the lid. Any one of claims 7 to 14, any one of claims 7 to 14 citing claim 4, any one of claims 7 to 14 citing claim 5, or claim 6. The method for manufacturing a light-emitting device according to any one of claims 7 to 14, wherein   17. The method for manufacturing a light emitting device according to claim 15, wherein, in the step of fixing the optical member, the adhesive is interposed in a region over the entire outer peripheral portion of the optical member when viewed from above.   17. The method according to claim 1, wherein in the step of fixing the optical member, an adhesive containing an organic substance is used as the adhesive, and the adhesive is interposed in a region excluding a part of an outer peripheral portion of the optical member when viewed from above. 9. The method for manufacturing a light emitting device according to claim 1. Using a lid provided with a concave portion that is recessed on the side of the base inside the wall as the lid,
The method according to claim 3, wherein, in the step of fixing the optical member, the optical member is fixed to the lid such that a part of an outer peripheral portion of the optical member is located inside the recess when viewed from above. The method for manufacturing a light emitting device according to claim 18, claim 18 referring to claim 4, claim 18 referencing claim 5, or claim 18 referencing claim 6.