JP5224802B2 - Light emitting element storage package, light emitting device, light emitting element storage package, and light emitting device manufacturing method - Google Patents

Description

  The present invention relates to a light emitting element housing package and a light emitting device, and a light emitting element housing package and a light emitting device for housing light emitting elements such as a light emitting diode (LED) chip and a semiconductor laser (Laser Diode: LD). It relates to the manufacturing method.

  Conventionally, as a package for housing a light emitting element, for example, a light emitting element housing package made of ceramics is known. FIG. 12 shows a light emitting device 101 using a conventional light emitting element storage package 102. 12A is a plan view of the light emitting device 101, and FIG. 12B is a cross-sectional view taken along a dotted line DD in FIG. 12A and 12B, the light emitting element storage package 102 includes a base 103 made of ceramic, and the base 103 is provided with a hole 105 in which the light emitting element 104 is stored. The shape of the hole 105 is generally circular in plan view. A wiring conductor 110 that is electrically connected to the light emitting element 104 is formed at the bottom 109 of the hole 105. The light emitting device 101 is manufactured by housing a light emitting element 104 such as an LED in the hole 105 of the base 103 of the light emitting element housing package 102. In the light emitting device 101, a voltage is applied to the light emitting element 104 through the wiring conductor 110, whereby the light emitting element 104 emits light in a pn junction region of the LED or the like. A part of the light emitted from the light emitting element 104 is directly emitted to the outside of the hole portion 105, and the rest of the light emitted from the light emitting element 104 is reflected on the inner wall 111 or the bottom portion 109 and then the hole. Released to the outside of the unit 105. As described above, the light emitting device 101 emits light.

As a light emitting element storage package of such a light emitting device, for example, a light emitting element storage package described in Patent Document 1 has been proposed.
JP 2006-5091 A

  However, luminance unevenness may occur in the light emitted from the light emitting element depending on the shape and arrangement of the light emitting element and the position of the connection region between the light emitting element and the wiring conductor. In such a case, in the conventional light emitting device, since the shape of the hole is circular in plan view, the light emitted from the light emitting element is uniformly reflected on the inner wall of the hole, resulting in uneven brightness. The light was emitted as it was.

  Therefore, in view of the above problems, the present invention provides a light-emitting device that emits light with less luminance unevenness, a method for manufacturing the light-emitting device, a light-emitting element storage package used in the light-emitting device, and a manufacture of the light-emitting element storage package. It aims to provide a method.

The light emitting element storage package of the present invention includes a base body provided with a hole portion for storing the light emitting element, and when the base body is viewed in a plan view, recesses and protrusions alternately arranged along the opening of the hole portion. The bottom of the hole is flat, the recess and the protrusion are provided from the opening of the hole to the bottom, the recess is a curve, and the hole is the A light-emitting element mounting portion on which the light-emitting element is mounted; and the convex portion has a surface facing the light-emitting element mounting portion when seen in a plan view, and the surface extends from the opening of the hole. A reflective layer made of a metal is provided on only the inner surface of the recess among the inner surface of the hole .

  In the light emitting element storage package of the present invention, preferably, all the concave portions have the same shape.

  In the light emitting element storage package of the present invention, preferably, all the concave portions are provided at equal intervals along the opening.

  In the light emitting element storage package according to the present invention, preferably, the arbitrary concave portion is opposed to the other concave portion.

  In the light emitting element storage package of the present invention, preferably, the width of the recess is longer than the depth of the recess in plan view.

  In the light emitting element storage package of the present invention, preferably, a plurality of reflective layers are provided separately from each other on the inner wall of the hole.

  In the light emitting element storage package of the present invention, preferably, the base has a plurality of the hole portions.

  The light-emitting device of the present invention includes the light-emitting element storage package of the present invention and a light-emitting element stored in the hole of the light-emitting element storage package.

The method for manufacturing a light emitting element storage package according to the present invention includes a green sheet forming step of forming a first ceramic green sheet and a second ceramic green sheet as the base, and an inner wall of the hole in the second ceramic green sheet. A first through-hole forming step for forming a number of first through-holes constituting a region corresponding to the concave portion, and the first ceramic through holes are divided into the first through-holes, and the inner wall of the hole portion A second through-hole forming step for forming a second through-hole constituting a region corresponding to the convex portion, a laminating step for laminating the second ceramic green sheet on the first ceramic green sheet, and the laminating step a firing step of firing the first ceramic green sheet and the second ceramic green sheet, after the first through-hole forming step, Serial and having a coating step of respectively applying a conductive paste constituting the reflecting layer on the inner wall of a plurality of first through-hole.

  In the method for manufacturing a light emitting element storage package according to the present invention, preferably, the second ceramic green sheet is composed of a plurality of sheets, and the first through hole and the second hole formed in each second ceramic green sheet in the stacking step. A plurality of the second ceramic green sheets are laminated on the first ceramic green sheet so that the through holes correspond to the first through holes and the second through holes formed in the other second ceramic green sheets. .

  In the method for manufacturing a light emitting element storage package according to the present invention, preferably, in the first through hole forming step, the plurality of first through holes are formed along the periphery of the second through hole.

  The light emitting device manufacturing method of the present invention includes a light emitting element storing package preparation step of preparing a light emitting element storing package obtained by the method of manufacturing a light emitting element storing package of the present invention, and the hole of the light emitting element storing package. And a light emitting element housing step of housing the light emitting element.

  The base in the light emitting element storage package of the present invention has recesses and protrusions that are alternately arranged along the opening of the hole in plan view. As a result, the light-emitting element storage package of the present invention scatters light in the recess, so that the light-emitting device in which the light-emitting element is stored in the light-emitting element storage package of the present invention emits light with less luminance unevenness. Can do.

  Embodiments of a light-emitting element storage package and a light-emitting device using the light-emitting element storage package of the present invention will be described in detail below.

(First embodiment)
FIG. 1 shows a light-emitting device using a light-emitting element storage package according to a first embodiment of the present invention. FIG. 1A is a plan view of the light-emitting device 1 of the present embodiment, and FIG. 1B is a cross-sectional view taken along the dotted line AA in FIG. FIG. 1 (c) is a partially enlarged view of region X in FIG. 1 (a). In FIG. 1, the light emitting element storage package 2 includes a base 3. The base 3 includes a hole 5 that houses the light emitting element 4. When viewed in plan, the opening 6 of the hole 5 is provided with a recess 7 and a protrusion 8. A wiring conductor 10 that is electrically connected to the electrode of the light emitting element 4 is formed at the bottom 9 of the hole 5. In the light emitting device 1, the light emitting element 4 is accommodated in the hole 5 of the light emitting element accommodation package 2.

  As shown in FIG. 1A, the base 3 is provided with recesses 7 and protrusions 8 that are alternately arranged along the openings 6 of the holes 5 when viewed in plan. The concave portion 7 and the convex portion 8 are provided in the depth direction of the hole portion 5 by a predetermined depth from the opening portion 6 of the hole portion 5 along the inner wall 11 of the hole portion 5. In the recess 7, the inner wall 11 of the hole 5 scatters light when reflecting the light emitted from the light emitting element 4. Therefore, for example, when the light emitted from the light emitting element 4 has a strong portion, if the concave portion 7 is arranged in the portion, the light having high luminance is scattered in the concave portion 7, so that the difference in luminance strength is eliminated. The light emitting device 1 can emit light with less luminance unevenness. Further, when the difference in intensity of light emitted from the light emitting element 4 is small, the concave portions 7 are arranged at equal intervals along the opening 6 so that the light is entirely transmitted by the concave portions 7 of the hole 5. It is possible to scatter and emit light with less luminance unevenness. In the present specification, the opening means a boundary between the base and the hole when the base is viewed in plan. Moreover, the surface of the base | substrate which contact | connects a hole part comprises the inner wall and bottom part of a hole part. The boundary between the concave portion and the convex portion is a portion closest to the midpoint of the straight line connecting the deepest portion of the concave portion and the tip portion of the convex portion.

  Here, the concave portion 7 refers to a portion of the opening 6 where the base body 3 is recessed outside the hole portion 5, and has a curved shape when viewed in plan. In addition, a region corresponding to one recess 7 in the inner wall 11 of the hole 5 (hereinafter, also referred to as a “notch”) has a curved surface shape and a curved shape in an arbitrary cross section in the planar direction. As described above, the concave portion 7 has a curved shape and the notched portion has a curved shape, so that the light emitted from the light emitting element 4 can be uniformly scattered as compared with the case having the corner portion. . Note that in this specification, a curved shape refers to a shape that does not have a corner portion, is formed of a single curve, and continuously changes the slope of a tangent at an arbitrary point on the line. Further, the curved surface shape refers to a shape that does not have a corner and is formed of a single curved surface.

  The convex portion 8 is a portion of the opening 6 where the base body 3 protrudes to the inside of the hole portion 5 and has a substantially rectangular shape. In this specification, as shown in FIG. 2, the substantially quadrangular shape includes each side consisting of a straight line 12 or a curve 13, two different straight lines 12 and 12, a straight line 12 and a curve 13, or two different ones. It refers to a part of the outer periphery of a substantially quadrilateral having two corner portions 14 formed by the intersection of the curve 13 and the curve 13, and the inner angle 15 of the corner portion 14 is 45 ° or more and less than 180 ° by design. Here, when the corner portion 14 is formed by crossing two different straight lines 12 and 12, the inner angle 15 of the corner portion 14 is an angle formed by the straight line 12 and the straight line 12. Further, when the corner portion 14 is formed by intersecting the straight line 12 and the curve 13, the inner angle 15 of the corner portion 14 is an angle formed by the tangent line 16 of the curve 13 and the straight line 12 when the corner portion 14 is a contact point. I mean. When the corner portion 14 is formed by crossing two different curves 13 and 13, the inner corner 15 of the corner portion 14 is tangent to the tangent line 16 of each curve 13 when the corner portion 14 is a contact point. This is the angle formed by 16. Preferably, in the above three cases, the inner angle 15 of the corner portion 14 is 90 ° or more and less than 180 °.

  In the first embodiment, as shown in FIG. 1C, the side 17 of the substantially square-shaped convex portion 8 having the corner portions 14 at both ends is curved. Since the side 17 is formed so as to be substantially circular when all the sides 17 are connected, the light emitted from the light emitting element 4 is emitted at a constant reflection angle in a region corresponding to the side 17 of the inner wall 11 of the hole 5. In this region, light scattering can be reduced. Therefore, the light emitting device 1 can scatter light more in the region corresponding to the concave portion 7 of the inner wall 11 and efficiently emit light with less luminance unevenness.

  It is preferable that the side 17 of the convex portion 8 and the straight line connecting the boundary portions 20 of the concave portion 7 adjacent to the convex portion 8 do not overlap. In these cases, non-uniform scattering of light at the corners 14 of the convex portion 8 is reduced, and the light emitting device 1 can emit light with less luminance unevenness. In addition, as shown in FIG.1 (c), when the convex part 8 is a substantially square shape, the corner | angular part 14 by the side of the recessed part 7 adjacent to the convex part 8 among the two corner | angular parts 14 of the convex part 8 is shown. The tip of the convex portion 8 is used. The portion closest to the midpoint 19 of the straight line connecting the corner portion 14 on the concave portion 7 side adjacent to the convex portion 8 and the deepest portion 18 of the concave portion 7 is defined as a boundary portion 20 between the concave portion 7 and the convex portion 8. .

  Moreover, it is preferable that the concave portion 7 and the convex portion 8 are provided from the opening 6 of the hole portion 5 to the bottom portion 9. In this case, the recess 7 can scatter light on the surface extending from the opening 6 to the bottom 9. Further, as shown in FIG. 1B, the inner wall 11 in the recess 7 is perpendicular to the bottom 9 and is linear from the opening 6 of the hole 5 to the bottom 9. Since the inner wall 11 is linear, out of the light emitted from the light emitting element 4 toward the inner wall 11 of the hole 5, the light emitted from the light emitting surface of the light emitting element 4 to the upper surface side of the base 1 is changed to the bottom. Since the reflection toward the 9 side can be suppressed and the reflection toward the upper surface side of the base 3 can be performed, the reduction in the luminance of the light emitted from the light emitting device 1 can be suppressed. In addition, the inner wall 11 is linear, and the surface of the inner wall 11 may have minute unevenness. For example, when the surface of the inner wall 11 has minute irregularities, it is only necessary to suppress the light emitted from the light emitting element 4 from being reflected toward the bottom portion 9, and the irregularity step is preferably set to about 10 μm or less.

  Further, the bottom 9 of the hole 5 is flat. For example, when a plurality of light emitting elements 4 are accommodated, there is no gap between the light emitting elements 4. If the bottom 9 is flat, the light emitted from each light emitting element 4 is dispersed throughout the hole 5 and reflected by the inner wall 11 of the hole 5, so that the light is scattered well, and the light emitting device 1 Light with less luminance unevenness can be emitted. Note that in this specification, the flat bottom means that there is no threshold on the bottom to block light emitted from each light emitting element, and the bottom is curved, bent, or blocked. It may have a minute unevenness.

  In the light emitting device 1 according to the present embodiment, when the luminance of light emitted from the light emitting element 4 varies, the concave portion 7 is provided so as to coincide with a region where the luminance of light is strong. For example, when a large current flows in a connection region between the light emitting element 4 and the wiring conductor 10, the luminance of light in that region may be higher than the luminance of light in other regions. In addition, depending on the shape of the light emitting element 4, a difference in luminance may occur in the light emitted from the light emitting element 4. In these cases, when the concave portion 7 is arranged so as to coincide with a region where the luminance of light is high, light at a portion having high luminance is scattered in the concave portion 7. Therefore, the difference in intensity of light is reduced, and the light emitting device 1 can emit light with less luminance unevenness.

  As a case where uneven brightness of light occurs in the inner wall 11 of the hole 5, for example, uneven brightness of light may occur symmetrically. In this case, when the concave portion 7 faces the other concave portion 7, the concave portion 7 can be disposed in a region having high luminance, and thus the light emitting device 1 can emit light with less luminance unevenness.

  Further, in the inner wall 11 of the hole portion 5, the difference in intensity of light intensity may be about the same. In this case, if all the recesses 7 have the same shape in plan view, the difference in intensity of light in each region can be moderated to the same extent, so that the light emitting device 1 emits light with less unevenness. can do.

  In addition, in the inner wall 11 of the hole 5, uneven brightness of light may occur at equal intervals. In this case, when all the recesses 7 are provided at equal intervals along the opening 6 of the hole 5 in a plan view, the recesses 7 can be arranged in a region with high luminance. Can emit light with less luminance unevenness.

  In addition, in the inner wall 11 of the hole part 5, when there is little difference in the intensity of light, all the recessed parts 7 are good in the same shape in planar view. Since the difference in intensity of light in each region can be alleviated to the same extent, the light emitting device 1 can emit light with less luminance unevenness. Moreover, all the recessed parts 7 may be provided at equal intervals along the opening part 6 of the hole part 5 in planar view. Since light does not scatter in the concave portion 7 of the specific biased region of the inner wall 11 of the hole 5, the light emitting device 1 can emit light with less luminance unevenness.

  Further, as shown in FIG. 1 (c), the shape of the recess 7 in plan view is such that the width 21 of the recess 7 is longer than the depth 22 of the recess 7. By making the width 21 of the recess 7 longer than the depth 22 of the recess 7, the light emitting element storage package 2 can be downsized while emitting light with less luminance unevenness. In this specification, the width of the concave portion refers to the distance between the boundary portions at both ends of the concave portion, and the depth of the concave portion refers to the shortest distance between the straight line that is the width of the concave portion and the deepest portion of the concave portion. Say.

  The base 3 is made of an insulating material such as ceramics or resin. Note that since the light emitted from the light emitting element 4 can be efficiently reflected, the insulating material is preferably white. In the case of ceramics, the substrate 3 is formed by laminating a plurality of ceramic layers made of, for example, an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or glass ceramics. By laminating in this way, the wiring conductor 10 can be three-dimensionally wired inside the base 3, so that the wiring density can be increased and the light emitting element housing package 2 can be reduced in size.

  A wiring conductor 10 to which the electrode of the light emitting element 4 is electrically connected is formed on the bottom 9 of the hole 5 of the base 3. The electrode of the light emitting element 4 is electrically connected to the wiring conductor 10 by, for example, a wire bonding method or a flip chip method. The wiring conductor 10 is formed by metallization obtained by firing metal powder such as tungsten, molybdenum, copper, or silver. In addition, it is preferable to deposit a plating metal layer such as nickel, gold, silver, platinum, or palladium on the exposed surface of the wiring conductor 10 by an electrolytic plating method or an electroless plating method.

  The light emitting element 4 accommodated in the hole 5 may be one or plural. In particular, when a plurality of light emitting elements 4 that emit light of different wavelengths are used, light unevenness of light emitted from the light emitting device 1 can be reduced by scattering light in the recess 7. For example, when a red LED, a green LED, and a blue LED are used as the light-emitting element 4, the light-emitting device 1 of the present embodiment can emit white light with little color tone unevenness. In addition, the wiring conductor 10 is formed according to the some light emitting element 4, respectively.

  In the first embodiment, the shape of the hole 5 in plan view is a circular shape having the recesses 7 and the protrusions 8 that are alternately arranged along the opening 6. It suffices to have the concave portions 7 and the convex portions 8 that are alternately arranged along, and may have an elliptical shape, an elliptical shape, a substantially polygonal shape, or the like.

  In addition, the concave portion 7 has a curved shape, but is not limited to a curved shape, and may be a substantially rectangular shape or a substantially polygonal shape other than a substantially rectangular shape. For example, when downsizing of the light emitting element storage package is required, if the concave portion is formed in a substantially square shape with sides having corners at both ends, the depth of the concave portion can be reduced. Package can be downsized. In this specification, a substantially polygonal shape other than a substantially quadrangular shape means that each side is composed of straight lines or curves, and two different straight lines and straight lines, straight lines and curves, or two different curved lines and curves intersect. It refers to a part of the outer periphery of a substantially polygon having three or more corners, and the internal angle of the corners is 45 ° or more and less than 180 ° by design. In addition, the internal angle of the substantially polygonal corner other than the substantially quadrangular shape refers to the angle of the same part as the internal angle of the substantially quadrangular corner.

  FIG. 3 is a partially enlarged view showing a modification of the light emitting device 1 using the light emitting element storage package 2 according to the first embodiment of the present invention. In FIG. 1, the convex portion 8 has a substantially quadrangular shape having a curved side 17. However, as shown in FIG. 3, the convex portion 8 may have a curved shape. Further, the convex portion 8 may have a substantially polygonal shape other than a substantially rectangular shape. As described above, since the convex portion 8 has a substantially polygonal shape or curved shape other than the substantially rectangular shape, the light is uniformly scattered at the convex portion 8, and the luminance unevenness of the light emitted from the light emitting device 1 can be reduced.

  Note that the recess 7 and the protrusion 8 are not necessarily provided from the opening 6 to the bottom 9 of the hole 5 but are provided on a part of the inner wall 11 of the hole 5 in a cross-sectional view. Also good.

  Further, in FIG. 1B, the inner wall 11 of the hole 5 in a sectional view is perpendicular to the bottom 9, but may be inclined. FIG. 4 is a sectional view showing a modification of the light emitting device 1 using the light emitting element storage package 2 according to the first embodiment of the present invention. The hole 5 of the base body 3 of the light emitting element storage package 2 extends from the bottom 9 side toward the top surface side of the base body 3. Thereby, the light emitted from the light emitting element 4 can be emitted to the outside uniformly and efficiently, and the light emission efficiency of the light emitting device 1 can be increased. In the present modification, the entire hole 5 may be expanded from the bottom 9 side toward the upper surface side of the base 3, or only the region corresponding to the recess in the hole 5 may be expanded or convex. Only the region corresponding to the part may be expanded.

  Further, the hole 5 of the base 3 of the light-emitting element storage package 2 may be narrowed from the bottom 9 side toward the top surface of the base 3 depending on the use of the light-emitting device 1. It is possible to improve the directivity to the front and the visibility from the front. Further, when a plurality of light emitting elements 4 are used to emit light of different wavelengths, the number of reflections of light in the hole 5 increases, so that uneven color tone of light emitted from the light emitting device 1 can be reduced.

  In FIG. 1B, the wiring conductor 10 is formed on the bottom 9 of the hole 5, but the wiring conductor 10 may be formed on the upper surface of the base 3. Alternatively, one wiring conductor 10 may be formed on the bottom 9 of the hole 5 and the other wiring conductor 10 may be formed on the upper surface of the base 3. In these cases, for example, the electrode of the light emitting element housed in the hole and the wiring conductor formed on the upper surface of the substrate are electrically connected by a wire bonding method or the like. As described above, when the wiring conductor is formed on the upper surface of the substrate, the wiring conductor is not formed on the bottom portion, so that the diameter of the hole portion can be reduced in plan view. Thereby, since the distance between the inner wall of the hole and the light emitting element can be shortened, it is possible to suppress a reduction in the luminance of light emitted from the light emitting element in the hole, and to improve the luminance of light emitted from the light emitting device. be able to.

  Further, when the frame body is arranged on the upper surface of the base body, the sealing member can be filled in the opening of the frame body. Therefore, the wiring conductor formed on the upper surface of the base body is sealed in the opening of the frame body. It is protected by the stop member, and the reliability of the light emitting device can be further improved. Here, FIG. 5 shows a light-emitting device using a light-emitting element storage package in which a frame is arranged on the upper surface of a base. 5A is a plan view of the light emitting device 1, and FIG. 5B is a cross-sectional view taken along a dotted line BB in FIG. 5A. In the light emitting device 1 shown in FIG. 5, a frame body 24 having an opening 23 is disposed on the upper surface of the base 3. The wiring conductor 10 is formed on the upper surface of the base 3, and the electrode of the light emitting element 4 accommodated in the hole 5 and the wiring conductor 10 are electrically connected by a wire line 25. In addition, the frame body 24 may incline the inner wall of the frame body 24 so as to spread from the lower side of the frame body 24 toward the upper side. Thereby, the light emitted from the light emitting element 4 can be efficiently emitted to the outside, and the light emission efficiency of the light emitting device 1 can be increased.

  The frame body 24 is made of, for example, ceramics, resin, or metal material. When the frame body 24 is made of an insulating material, it may be white for the same reason as in the case of the base 3. When the frame 24 is made of a metal material, the frame 24 is made of a metal material such as nickel, gold, silver, platinum, or palladium, or a plating layer such as nickel, gold, silver, platinum, or palladium on the surface. A metal material such as Cu, Cu—W, Fe—Ni, or Fe—Ni—Co to which is deposited can be preferably used. Thereby, the light emitted from the light emitting element 4 can be favorably reflected also in the frame body 24. In addition, when the frame body 24 consists of ceramics, it can manufacture by using the method similar to the manufacturing method of the base | substrate 3 mentioned later. The base body 3 and the frame body 24 are joined by a joining material. For example, when the substrate 3 is made of a ceramic material and the frame body 24 is made of a metal material, a bonding metal layer is formed on the upper surface of the substrate 3, and the bonding metal layer and the frame body 24 are connected to Ag−. What is necessary is just to join using brazing materials, such as Cu brazing material. Moreover, when both the base 3 and the frame 24 are made of a ceramic material, the base 3 and the frame 24 may be integrated by sintering. Similarly to the base 3, when viewed in a plan view, recesses and projections that are alternately arranged on the inner wall of the frame body 24 may be formed.

  Further, in FIGS. 1B, 4 and 5B described so far, the wiring conductor 10 is drawn to the lower surface of the base 3 and connected to the wiring of the external electric circuit board. 3 may be drawn out to the side surface or the upper surface of 3 and connected to the wiring of the external electric circuit board. The arrangement of the wiring conductor 10 is determined in consideration of the connection with the electrode of the light emitting element 4 and the connection with the wiring of the external electric circuit board.

  In FIG. 1, the light emitting element storage package 2 is provided with one hole 5, but a plurality of holes 5 may be provided. FIG. 6 is a plan view showing a modification of the light emitting device 1 using the light emitting element storage package according to the first embodiment of the present invention. When light with high luminance is required, a plurality of light emitting devices 1 shown in FIG. 1 may be used. However, since the light emitting device 1 shown in FIG. 6 has a plurality of holes 5 in one substrate 3, A single light emitting device can emit light having the same luminance as when a plurality of the light emitting devices 1 of FIG. 1 are used.

  The light emitting element 4 is preferably sealed with a sealing member. The sealing member seals the light emitting element 4 by, for example, surrounding the light emitting element 4, covering the top of the light emitting element 4, or filling the hole 5. When the electrode of the light emitting element 4 is connected to the wiring conductor 10 by the wire bonding method, the wire line is similarly sealed by the sealing member. When the hole 5 is filled with the sealing member, the base 3 of the light emitting element storage package 2 has the recesses 7 and the protrusions alternately arranged along the openings 6 of the hole 5 when viewed in plan. Since the portion 8 is provided, the contact area between the sealing member and the inner wall 11 of the hole portion 5 is increased, and the bonding strength is increased. Therefore, peeling of the sealing member due to heat generation of the light emitting element 4 can be suppressed. The sealing member is made of, for example, a light transmissive transparent resin such as silicone resin or epoxy resin, or a light transmissive inorganic material such as glass.

  Next, the manufacturing method of the light emitting element accommodation package by 1st embodiment of this invention is demonstrated based on FIG. FIG. 7 shows a manufacturing process for manufacturing the light emitting element storage package 2 shown in FIG.

  First, a first ceramic green sheet and a second ceramic green sheet to be a base are formed. The first ceramic green sheet and the second ceramic green sheet may be one sheet or a plurality of sheets. Such a ceramic green sheet is, for example, when the ceramic is made of an aluminum oxide sintered body, an organic binder, a solvent, a plasticizer, and a suitable ceramic raw material powder such as aluminum oxide, silicon oxide, calcium oxide, or magnesium oxide, and It is produced by adding a dispersing agent or the like to make a slurry, which is formed into a sheet having a predetermined thickness by a sheet forming technique such as a known doctor blade method.

  Next, as shown in FIG. 7A, a plurality of first through holes 27 constituting a region corresponding to the concave portion of the inner wall of the hole portion are punched into the second ceramic green sheet 26 using a punching die. . By thus punching with a punching die, the recess can be easily formed.

  In addition, if each 1st through-hole 27 is formed so that it may align along the circumference | surroundings of the 2nd through-hole 28 formed later, for example in a circle shape, a desired recessed part can be accurately formed in a base | substrate. .

  Next, as shown in FIG. 7 (b), the second ceramic green sheet 26 is divided into the second through holes 28 constituting the region corresponding to the concave portion of the inner wall of the hole, and all the first through holes 27 are divided. Punch using a punching die.

  Next, as shown in FIG. 7C, the second ceramic green sheet 26 is laminated on the first ceramic green sheet 29. Here, the first through hole 27 and the second through hole 28 formed in the second ceramic green sheet 26 communicate with the first through hole 27 and the second through hole 28 of the other second ceramic green sheet 26. In addition, the second ceramic green sheet 26 may be laminated. Thereby, a recessed part can be formed ranging from the opening part of a hole part to a bottom part.

  In addition, when the concave portion is not provided from the opening portion of the hole portion to the bottom portion but is provided in a part of the inner wall of the hole portion in a sectional view, the first through hole 27 and the second through hole are provided. The second ceramic green sheet 26 in which the holes 28 are formed and the second ceramic green sheet 26 in which only the second through holes 28 are formed are appropriately arranged so that the first through holes 27 are arranged at the positions of the recesses. What is necessary is just to laminate.

  Finally, the laminated body of the laminated ceramic green sheets is fired to obtain a substrate made of a ceramic sintered body. Thus, the light emitting element storage package 2 shown in FIG. 1 is completed.

  Although not shown, in order to form a wiring conductor, a wiring conductor through hole is punched into the first ceramic green sheet 29 using a die, separately from the first through hole or the second through hole. And when forming a wiring conductor in the bottom part of a hole and the lower surface of a base | substrate, the metal paste for wiring conductors is apply | coated to the main surface of the 1st ceramic green sheet 29 by thick film forming methods, such as a screen printing method. Further, when forming the wiring conductor inside the substrate, the wiring conductor through-hole is filled with the wiring conductor metal paste. In the firing step, the wiring conductor 10 is formed by firing the metal paste for the wiring conductor simultaneously with the first ceramic green sheet 29 and the second ceramic green sheet 26. The wiring conductor metal paste may be applied or filled in accordance with the position of the wiring conductor formed in the light emitting element storage package. For example, when the wiring conductor is formed on the upper surface of the substrate, or when the wiring conductor is formed so that a part of the wiring conductor is exposed on the inner wall of the hole, the wiring conductor metal is formed on the main surface of the second ceramic green sheet 26. What is necessary is just to apply | coat a paste.

  And a light emitting element is accommodated in the hole of said light emitting element accommodation package, and the electrode and wiring conductor of a light emitting element are electrically connected. Preferably, the light emitting element is sealed with a sealing member. Thus, the light emitting device 1 shown in FIG. 1 is completed.

  According to the above method for manufacturing a light emitting element storage package, it is possible to easily manufacture a light emitting element storage package that emits light with less luminance unevenness. In the manufacturing method of the present embodiment, the first through hole 27 and the second through hole 28 are formed by separate punching dies when forming the hole. By combining multiple punching dies with a simple shape in this way, it is possible to form a hole with a complex shape, so it is possible to easily produce a punching die and easily form a hole with a complicated shape. can do.

  Although each through hole is formed by a punching die, it may be formed by using a through hole forming means such as laser processing.

  Further, although the wiring conductor through hole is punched into the first ceramic green sheet 29, it may be punched into the second ceramic green sheet 26. Thereby, for example, the wiring conductor can be drawn out on the upper surface of the base.

(Second embodiment)
FIG. 8 shows a light emitting device using the light emitting element storage package according to the second embodiment of the present invention. FIG. 8A is a plan view of the light-emitting device of this embodiment, and FIG. 8B is a cross-sectional view taken along the dotted line CC in FIG. On the surface of the substrate 3 of the light emitting element storage package, a reflective layer 30 is provided in a region corresponding to the concave portion 7 and a partial region corresponding to the convex portion 8.

  Since other configurations are the same as those in the first embodiment, the same reference numerals are given and description thereof is omitted.

  The reflective layer 30 is formed by coating a metallized metal layer 31 with a plated metal layer 32. The metallized metal layer 31 is made of metallization obtained by firing metal powder such as tungsten, molybdenum, copper, or silver. The plated metal layer 32 is made of nickel, gold, silver, platinum, palladium, or the like. The plated metal layer 32 can increase the light reflection efficiency on the inner wall 11 of the light emitting element storage package, and can also prevent the metallized metal layer 31 from being oxidized and reducing the reflection efficiency. Therefore, the luminance of light emitted from the light emitting device can be improved.

  When forming the reflective layer 30, the plurality of reflective layers 30 may be formed separately on the inner wall 11 of the hole 5. With such a configuration, even if the plurality of wiring conductors 10 are in contact with different reflective layers 30, the respective reflective layers 30 are not electrically connected, so that a short circuit between the wiring conductors 10 can be suppressed. Therefore, the reliability is improved, and the wiring conductor 10 can be installed close to the reflective layer 30, so that the light emitting element storage package can be downsized. Furthermore, since the wiring conductor 10 reflects light efficiently, if the wiring conductor 10 is placed close to the reflective layer 30, the proportion of the wiring conductor 10 in the bottom portion 9 increases, and the light reflection efficiency is improved.

  Further, as shown in FIG. 8A, when the reflective layer 30 is formed in the region corresponding to the concave portion 7 of the inner wall 11 of the hole portion 5, the reflective layer 30 does not protrude inside the hole portion 5, so that the light emission The element storage package can be miniaturized. Furthermore, since it becomes difficult for the reflective layer 30 and the wiring conductor 10 to contact, the reliability of a light-emitting device can be improved. Note that the reflective layer 30 may be provided beyond the boundary between the concave portion 7 and the convex portion 8 so that the reflective layer 30 does not protrude from the corner or tip of the convex portion 8 to the inside of the hole portion 5. What is necessary is just to be provided. In this case, the light emitting element storage package can be reduced in size.

  In the second embodiment, the reflective layer 30 is formed by depositing the plated metal layer 32 on the metallized metal layer 31. However, the reflective layer 30 may be formed of only the metallized metal layer 31.

  Next, the manufacturing method of the light emitting element storage package by 2nd embodiment of this invention is demonstrated based on FIG. FIG. 9 shows a manufacturing process for manufacturing the light emitting element storage package shown in FIG.

  First, as shown in FIG. 9A, the green sheet forming step and the first through hole forming step in the second ceramic green sheet 26 are performed in the same manner as the manufacturing process of the light emitting element storage package shown in FIG. Do.

  Next, as shown in FIG. 9B, a conductive paste 33 for forming the metallized metal layer 31 is applied to the inner wall of each first through hole 27 by a thick film method such as a screen printing method. At the time of printing application, printing is performed while sucking the conductor paste 33 from the opposite side of the printing surface. According to this manufacturing method, when the conductor paste 33 is applied to the inner wall of each first through hole 27 by the thick film method, the metal paste can be uniformly applied in the penetration direction. A light emitting element storage package that is uniformly formed from the bottom of the hole to the opening can be manufactured.

  And although not shown, like the method for manufacturing the light emitting element storage package shown in FIG. 7, after the second through-hole forming step shown in FIG. A substrate made of a ceramic sintered body on which the metallized metal layer 31 is formed is obtained.

  Although not shown, in order to form a wiring conductor, a through hole for the wiring conductor is formed in the same manner as in the manufacturing process of the light emitting element storage package according to the first embodiment of the present invention. A wiring conductor metal paste is applied to the main surface of the sheet 29 and the wiring conductor through-holes are filled with the wiring conductor metal paste. In the firing step, the wiring conductor metal paste is fired simultaneously with the first ceramic green sheet 29 and the second ceramic green sheet 26.

  When the plated metal layer 32 is formed, as shown in FIG. 9 (d), the exposed surface of the metallized metal layer 31 of the substrate 3 is subjected to nickel plating, gold plating, silver plating, electroless plating, or electroless plating. A plated metal layer 32 such as platinum or palladium is deposited.

  By the above manufacturing method, the reflective layer 30 can be easily formed in the region corresponding to the concave portion 7 of the inner wall of the hole portion 5 of the light emitting element storage package.

  In the method for manufacturing the light emitting element storage package of the present embodiment, the reflective layer 30 is formed in the region corresponding to the concave portion and the partial region corresponding to the convex portion, but in the inner wall 11 of the hole portion 5, The reflective layer 30 may be formed on the entire surface. That is, the reflective layer 30 may be formed in the region corresponding to the convex portion 8 together with the region corresponding to the concave portion 7. In this case, the reflective layer 30 is formed on the inner wall of the first through-hole 27, the second through-hole 28 is formed, and then the same method as that for forming the reflective layer 30 on the inner wall of the first through-hole 27 is used. The reflective layer 30 may be formed on the inner wall of the second through hole 28.

  In the method for manufacturing the light emitting element storage package according to the second embodiment of the present invention, the reflective layer 30 is formed by the thick film method and the plating method, but may be formed by the thin film method. In the case of forming by a thin film method, for example, the green sheet forming step, the first through hole forming step, the second through hole forming step, the laminating step, and the firing, as in the method for manufacturing the light emitting element storage package shown in FIG. After performing the process, a thin metal layer is formed by a thin film method such as vapor deposition or sputtering. In the case of forming a plated metal layer, after forming a metal layer made of a thin film, it is formed in the same manner as the method for manufacturing the light emitting element storage package shown in FIG.

  FIG. 10 is a plan view showing a modification of the light emitting device using the light emitting element storage package according to the second embodiment of the present invention. In the light emitting device shown in FIG. 8, the reflective layer 30 is formed in a region corresponding to the concave portion 7 and a partial region corresponding to the convex portion 8. In the light emitting device shown in FIG. 30 is provided only in a region corresponding to the concave portion 7 of the inner wall of the hole portion 5.

  Next, the manufacturing method of the light emitting element storage package by the modification of 2nd Embodiment of this invention is demonstrated based on FIG. FIG. 11 shows a manufacturing process for manufacturing the light emitting element storage package shown in FIG.

  First, as shown in FIG. 11A, after the green sheet forming process is performed in the same manner as the manufacturing process of the light emitting element storage package described in the first embodiment, the second ceramic green sheet 26 is punched. A plurality of third through holes 34 constituting the reflective layer are punched out using a mold.

  Next, as shown in FIG. 11B, each third through hole 34 is filled with a conductive paste 33 for forming a metallized metal layer by a thick film method such as a screen printing method. Since the metallized metal layer is formed by filling the conductive paste 33, the third through hole 34 can be formed small.

  Next, as shown in FIG. 11C, each first through hole 27 is punched into the second ceramic green sheet 26 so as to divide the third through hole 34 by using a punching die.

  Next, as shown in FIG. 11 (d), the second through hole forming step is performed so as to divide all the first through holes 27 in the same manner as the manufacturing process of the light emitting element storage package shown in FIG.

  And although not shown in figure, like the manufacturing method of the light emitting element accommodation package shown in Drawing 7, after the 2nd penetration hole formation process shown in Drawing 11 (d), a lamination process and a baking process are performed in order, A substrate made of a ceramic sintered body on which a metallized metal layer is formed is obtained.

  Although not shown, in order to form the wiring conductor, the first through-hole forming step or the second through-hole forming step is performed in the same manner as the manufacturing process of the light emitting element storage package according to the first embodiment of the present invention. The wiring conductor through-hole is formed, the wiring conductor metal paste is applied to the main surface of the first ceramic green sheet 29, and the wiring conductor through-hole is filled with the wiring conductor metal paste. In the firing step, the wiring conductor metal paste is fired simultaneously with the first ceramic green sheet 29 and the second ceramic green sheet 26.

  When the plated metal layer is formed, the plated metal layer is deposited on the exposed surface of the metallized metal layer of the substrate in the same manner as in the method for manufacturing the light emitting element storage package shown in FIG.

  With the above manufacturing method, the reflective layer can be easily formed in the region corresponding to the concave portion of the inner wall of the light emitting element storage package. In addition, since the third through hole 34 is filled with the conductive paste 33, it is easy to form a reflective layer in a small recess. Therefore, this manufacturing method is particularly effective when a light emitting device capable of emitting light with reduced luminance unevenness is formed by forming a large number of small concave portions provided with a reflective layer.

  In addition, this invention is not limited to said embodiment, You may make a various change within the range which does not deviate from the summary of this invention. For example, a metal member may be used for a part of the base 3. For example, a member on the upper surface side of the bottom portion 9 of the base 3, that is, a member forming the regions of the convex portion 7 and the concave portion 8 of the hole portion 5 may be formed from a metal material. In this case, a metal material such as nickel, gold, silver, platinum, or palladium, or Cu, Cu—W, Fe—Ni having a surface coated with a plating layer such as nickel, gold, silver, platinum, or palladium. Alternatively, a metal material such as Fe—Ni—Co can be preferably used. In addition, what is necessary is just to join the member by the side of the bottom part 9 of the base | substrate 3, and the member by the side of an upper surface using a joining material. For example, when the member on the bottom 9 side of the substrate 3 is made of ceramics, a bonding metal layer is formed on the member on the bottom 9 side of the substrate 3, and the bonding metal layer and the member on the upper surface side are combined with Ag− What is necessary is just to join using brazing materials, such as Cu brazing material. Further, a metal member may be used for a part of the base 3 on the bottom 9 side. In the drawings of the present invention, the scale of the drawings is changed for convenience.

1A is a plan view of a light emitting device using a light emitting element storage package according to the first embodiment of the present invention, FIG. It is a schematic diagram explaining a substantially square shape and its inside angle. In the light-emitting device of FIG. 1, it is the elements on larger scale when a convex part is curvilinear. In the light-emitting device of FIG. 1, it is sectional drawing in case a hole part has spread toward the opening part from the bottom part. In the light emitting device of FIG. 1, (a) a plan view and (b) a cross-sectional view when a frame is formed on the upper surface of a base. FIG. 2 is a plan view when a plurality of hole portions are provided in the light emitting device of FIG. 1. It is a figure which shows the manufacturing process of the light emitting element storage package of FIG. It is (a) top view and (b) sectional view of a light emitting device using a light emitting element storage package according to a second embodiment of the present invention. It is a figure which shows the manufacturing process of the light emitting element storage package of FIG. FIG. 9 is a plan view when the shape of the reflective layer is different in the light emitting device of FIG. 8. It is a figure which shows the manufacturing process of the light emitting element storage package of FIG. It is (a) top view of the light-emitting device using the conventional light emitting element accommodation package, (b) It is sectional drawing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light-emitting device 2 Light-emitting-element accommodation package 3 Base | substrate 4 Light-emitting element 5 Hole 6 Opening 7 Recess 8 Protrusion 9 Bottom 10 Wiring conductor 11 Inner wall 26 Second ceramic green sheet 27 First through-hole 28 Second through-hole 29 First One ceramic green sheet 30 Reflective layer 31 Metallized metal layer 32 Plating metal layer 33 Conductive paste

Claims (12)

A substrate provided with a hole for accommodating the light emitting element;
The base body has concave and convex portions that are alternately arranged along the opening of the hole when viewed in plan,
The bottom of the hole is flat, the recess and the protrusion are provided from the opening of the hole to the bottom, the recess is a curve,
The hole has a light emitting element mounting portion for mounting the light emitting element;
The convex portion has a surface facing the light emitting element mounting portion when seen in a plan view, and the surface is provided from the opening of the hole to the bottom ,
A light emitting element storage package, wherein a reflective layer made of a metal is provided only on the inner surface of the concave portion of the inner surface of the hole .   The light emitting element storage package according to claim 1, wherein all the recesses have the same shape.   The light emitting element storage package according to claim 1, wherein all the concave portions are provided at equal intervals along the opening.   The package for light emitting element accommodation according to any one of claims 1 to 3 in which said arbitrary crevice opposes said other crevice.   The package for light emitting element accommodation according to any one of claims 1 to 4 whose width of said crevice is longer than the depth of said crevice in plane view.   The light emitting element storage package according to any one of claims 1 to 5, wherein a plurality of reflective layers are separately provided on an inner wall of the hole. The light emitting element storage package according to any one of claims 1 to 6 , wherein the base body has a plurality of the hole portions. The light emitting element storage package according to any one of claims 1 to 7 ,
A light emitting device comprising: a light emitting element housed in the hole of the light emitting element housing package. A base provided with a hole for accommodating the light emitting element, and the base has a concave portion and a convex portion alternately arranged along the opening of the hole when viewed in plan, and the hole A bottom portion of the light emitting element mounting portion on which the concave portion and the convex portion are provided from the opening portion of the hole portion to the bottom portion, the concave portion is formed of a curve, and the hole portion mounts the light emitting element. The convex portion has a surface facing the light emitting element mounting portion when seen in a plan view, and the surface is provided from the opening to the bottom of the hole, and the hole A method for manufacturing a light emitting element storage package in which a reflective layer made of metal is provided only on the inner surface of the recess among the inner surfaces of
A green sheet forming step of forming a first ceramic green sheet and a second ceramic green sheet as the base;
In the second ceramic green sheet, a first through-hole forming step for forming a plurality of first through-holes each constituting a region corresponding to the concave portion of the inner wall of the hole portion;
A second through-hole forming step of dividing the first through-holes into the second ceramic green sheet and forming second through-holes constituting regions corresponding to the convex portions of the inner walls of the hole portions;
A laminating step of laminating the second ceramic green sheet on the first ceramic green sheet;
A firing step of firing the first ceramic green sheet and the second ceramic green sheet laminated ;
The manufacturing method of the package for light emitting element accommodation which has an application | coating process which apply | coats the conductor paste which comprises a reflection layer on the inner wall of these 1st through-holes after said 1st through-hole formation process, respectively . The second ceramic green sheet comprises a plurality of sheets, and in the laminating step, a first through hole and a second through hole formed in each second ceramic green sheet are formed in the other second ceramic green sheets. The method for manufacturing a light emitting element storage package according to claim 9 , wherein the plurality of second ceramic green sheets are stacked on the first ceramic green sheet so as to correspond to the one through hole and the second through hole. The method for manufacturing a light emitting element storage package according to claim 9 or 10, wherein, in the first through hole forming step, the plurality of first through holes are formed along the periphery of the second through hole. A light emitting element storage package preparation step of preparing a light emitting element storage package obtained by the method for manufacturing a light emitting element storage package according to any one of claims 9 to 11 .
A light emitting device manufacturing method comprising: a light emitting element storing step of storing the light emitting element in the hole of the light emitting element storing package.

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