JP7406175B2 - Manufacturing method of light emitting module, light emitting module and projector - Google Patents

Description

The present disclosure relates to a method of manufacturing a light emitting module, a light emitting module, and a projector.

BACKGROUND ART Conventionally, light emitting modules have been developed in which a light emitting device in which a plurality of light emitting elements are mounted in one package is mounted on one mounting board. Patent Document 1 discloses an optical unit in which a unit substrate includes a plurality of semiconductor devices in which four semiconductor elements are mounted in one package.

JP2007-227422A

The light output required for a light emitting module varies depending on the purpose and size of the product in which it is installed. Therefore, one possible method to flexibly respond to the required light output is to adjust the number of light emitting elements mounted on a product. However, there is room for improvement in efficiently meeting various required specifications regarding output light.

Therefore, an object of the embodiments of the present disclosure is to provide a method for manufacturing a light emitting module that can efficiently meet various specifications regarding the light to be output.

Alternatively, an object of the embodiments of the present disclosure is to provide a light-emitting module having a suitable form in which the number of light-emitting elements to be mounted is adjusted.

A light emitting module according to an embodiment of the present disclosure includes a first light emitting device including a plurality of first semiconductor laser elements, a first package in which the plurality of first semiconductor laser elements are arranged in one direction, and a plurality of first light emitting devices. a second light emitting device including a second semiconductor laser device, a second package in which the plurality of second semiconductor laser devices are arranged in one direction, and a first connection pattern in which the first light emitting device is mounted. and a second connection pattern on which the second light emitting device is mounted. The number is one more than the first semiconductor laser element mounted on the first light emitting device, and the first package and the second package have the same external shape.
A method for manufacturing a light-emitting module according to an embodiment of the present disclosure is a method for manufacturing a light-emitting module in which one or more light-emitting devices on which a plurality of light-emitting elements are mounted, the method for manufacturing a light-emitting module includes: a step of preparing a first light emitting device and a second light emitting device each having one different number of mounted light emitting elements; and a connection pattern corresponding to one of the light emitting devices, the connection pattern being the same. a step of preparing a first mounting board having a plurality of mounting surfaces; and a step of preparing a first mounting board having a plurality of mounting surfaces; and a step of mounting a plurality of the light emitting devices selected from among the light emitting devices, and it is possible to manufacture the light emitting module equipped with an arbitrary number of light emitting elements selected from at least three consecutive numbers. .

A light emitting module according to an embodiment of the present disclosure includes a first light emitting device that is a light emitting device in which a plurality of light emitting elements are mounted, and a light emitting device in which one more light emitting element than the first light emitting device is mounted. a second light emitting device; and a first mounting board having a mounting surface provided with a plurality of connection patterns corresponding to the one light emitting device, the first mounting board having a mounting surface provided with a plurality of the same connection patterns; One or more of the first light emitting devices and one or more of the second light emitting devices are connected to the plurality of connection patterns provided on the mounting surface.

A projector according to an embodiment of the present disclosure includes the light emitting module described above, a sealing member provided on a mounting board of the light emitting module, and a sealing member that is joined to the mounting board via the sealing member to form a sealed space. The device includes a sealing member formed, a light emitting device mounted on the mounting board within the formed sealed space, and an optical unit provided within the formed sealed space.

According to the method for manufacturing a light emitting module according to the embodiment of the present disclosure, various specifications can be efficiently met. Further, according to the light emitting module according to the embodiment of the present disclosure, it is possible to provide a suitable form in which the number of mounted light emitting elements is adjusted.

FIG. 1 is a perspective view schematically showing an example of the configuration of a light emitting module according to a first embodiment. FIG. 1 is a plan view schematically showing an example of the configuration of a light emitting module according to a first embodiment. FIG. 2 is a plan view schematically showing an example of the configuration of the mounting board according to the first embodiment. 1C is a plan view showing a state in which the mounting board of FIG. 1C is separated into two first mounting boards. FIG. FIG. 2 is an exploded perspective view schematically showing the configuration of a first light emitting device. FIG. 3 is a plan view schematically showing the configuration inside the package of the first light emitting device. FIG. 2 is an exploded perspective view schematically showing the configuration of a second light emitting device. FIG. 3 is a plan view schematically showing the configuration inside the package of the second light emitting device. FIG. 3B is a cross-sectional view taken along line IIIC-IIIC in FIG. 3B. FIG. 7 is a plan view schematically showing the configuration of the lower surface of the second light emitting device. It is a flowchart which shows the procedure of the manufacturing method of the light emitting module based on 1st Embodiment. It is a perspective view showing typically an example of composition of a light emitting module concerning a 2nd embodiment. FIG. 7 is a plan view schematically showing an example of the configuration of a light emitting module according to a second embodiment. FIG. 7 is a plan view schematically showing an example of the configuration of a mounting board according to a second embodiment. 5C is a plan view showing a state where the mounting board of FIG. 5C is separated into a first mounting board and a second mounting board. FIG. It is a flowchart which shows the procedure of the manufacturing method of the light emitting module based on 2nd Embodiment. FIG. 7 is a plan view schematically showing an example of the configuration of a light emitting module according to a third embodiment. FIG. 7 is a plan view schematically showing an example of the configuration of a light emitting module according to a third embodiment. FIG. 7 is a plan view schematically showing an example of the configuration of a light emitting module according to a third embodiment. FIG. 1 is a plan view schematically showing an example of the configuration of a light emitting module according to an embodiment. It is a perspective view showing typically an example of composition of a light emitting module concerning a 4th embodiment. It is a top view which shows typically an example of a structure of the light emitting module based on 4th Embodiment. FIG. 7 is a schematic plan view for explaining a first mounting board according to a fourth embodiment. FIG. 7 is a schematic plan view for explaining a light emitting device and a thermistor mounted on a second mounting board according to a fourth embodiment. FIG. 7 is a schematic plan view for explaining a second mounting board according to a fourth embodiment. FIG. 2 is a perspective view schematically showing an example of mounting when a light emitting module according to an embodiment is applied to a projector. It is a perspective sectional view for explaining the sealing structure of the light emitting module concerning one embodiment. FIG. 2 is a perspective view schematically showing an example of mounting when a light emitting module according to an embodiment is applied to a projector. FIG. 11A is a plan view schematically showing an example of the configuration of the projector according to the embodiment of FIG. 11A. 11A is a side view schematically showing an example of the configuration of the projector according to the embodiment of FIG. 11A. FIG. FIG. 2 is a perspective view schematically showing an example of mounting when a light emitting module according to an embodiment is applied to a projector. 12A is a side view schematically showing an example of the configuration of the projector according to the embodiment of FIG. 12A. FIG. It is a perspective sectional view for explaining other sealing structures of a light emitting module concerning one embodiment.

Embodiments will be described below with reference to the drawings. However, the embodiments shown below are illustrative of a light-emitting module and a method of manufacturing a light-emitting module for embodying the technical idea of this embodiment, and are not limited to the following. Further, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present invention, unless specifically stated, and are merely illustrative. It's nothing more than that. Note that the sizes, positional relationships, etc. of members shown in each drawing may be exaggerated for clarity of explanation. Further, in each embodiment, members using the same reference numerals as in other embodiments represent the same or corresponding members, and the explanation may be omitted.

<First embodiment>
FIG. 1A is a perspective view schematically showing an example of the configuration of the light emitting module according to the first embodiment. FIG. 1B is a plan view schematically showing an example of the configuration of the light emitting module according to the first embodiment. FIG. 1C is a plan view schematically showing an example of the configuration of the mounting board according to the first embodiment. FIG. 1D is a plan view showing a state in which the mounting board of FIG. 1C is separated into two first mounting boards. FIG. 2A is an exploded perspective view schematically showing the configuration of the first light emitting device. FIG. 2B is a plan view schematically showing the configuration inside the package of the first light emitting device. FIG. 3A is an exploded perspective view schematically showing the configuration of the second light emitting device. FIG. 3B is a plan view schematically showing the configuration inside the package of the second light emitting device. FIG. 3C is a cross-sectional view taken along line IIIC-IIIC in FIG. 3B. FIG. 3D is a plan view schematically showing the configuration of the lower surface of the second light emitting device.

<Light-emitting module>
The light emitting module 100 includes a first light emitting device 20a on which three light emitting elements 22 are mounted, or one more light emitting element 22 than the first light emitting device 20a, that is, four light emitting elements 22. is mounted on the second light emitting device 20b. Further, the first mounting board 10a is provided with two connection patterns 15 corresponding to both the first light emitting device 20a and the second light emitting device 20b on the mounting surface. Further, a desired light emitting device 20 selected from the first light emitting device 20a and the second light emitting device 20b is connected to the two connection patterns 15 provided on the mounting surface of the first mounting board 10a. Specifically, the two first light emitting devices 20a, two second light emitting devices 20b, or one first light emitting device 20a and one second light emitting device 20b are connected in any combination. Furthermore, a mounting board 10 using one first mounting board 10a or a mounting board 10 using two first mounting boards 10a arranged side by side is formed.

Note that when two mounting boards 10 are formed, one of the two first mounting boards 10a has only one light emitting device out of the first light emitting device 20a and the second light emitting device 20b. There are cases where two light emitting devices are selected and connected, and cases where two light emitting devices are selected and connected. Further, the mounting board 10 is formed by one first mounting board 10a, and only one light emitting device is selected from the first light emitting device 20a and the second light emitting device 20b on the one first mounting board 10a. It is also possible to realize connected light emitting modules 100.
In the example of FIG. 1, a mounting board 10 is formed in which two first mounting boards 10a are arranged, and two connection patterns 15 of each first mounting board 10a include one first light emitting device. 20a and one second light emitting device 20b are described.
Each configuration of the light emitting module 100 will be described below.

The light emitting module 100 includes a mounting board 10 and a light emitting device 20.
[Mounting board]
The mounting board 10 is composed of one first mounting board 10a or two first mounting boards 10a each having the same configuration. In the example of FIG. 1C, the mounting board 10 is configured by arranging two first mounting boards 10a.
The first mounting board 10a has a lower surface, an upper surface, and a side surface, and has a connection pattern 15 made of a metal part 11 and a first metal film 12, a second metal film 13, and an insulating film 14 on the upper surface. is formed.
The first mounting board 10a has a mounting surface on which two identical connection patterns 15 are provided on the upper surface. One light emitting device 20 is mounted on one connection pattern 15, so the first mounting board 10a is formed so that two light emitting devices 20 can be mounted thereon. The first mounting board 10a employs the same connection pattern 15 in providing the two connection patterns, thereby facilitating the formation of the connection patterns on the first mounting board 10a. Note that there may be more than two connection patterns 15, and for example, three connection patterns 15 may be provided in a row. A plurality of connection patterns 15 are provided on one first mounting board 10a. The connection pattern 15 includes a metal part 11 exposed from the insulating film 14 and a first metal film 12 formed on the insulating film 14, and the metal part 11 and the first metal film 12 form a light emitting device. This is the implementation aspect. Note that the metal portion 11 may have a configuration in which a metal film is formed on the upper surface. For example, similarly to the first metal film 12, a metal film may be formed on the insulating film 14 to provide the metal portion 11.

The metal part 11 is a part on which the light emitting device 20 is placed, and is formed into a rectangular shape in plan view, and two metal parts 11 are formed side by side in the horizontal direction. The metal part 11 is formed so that the insulating film 14 is not provided on the upper surface of the first mounting board 10a, and the board is exposed as it is. Note that the metal part 11 may be formed of a plurality of metal layers. For example, a metal layer is provided in the region of the metal part 11 of the substrate to make the height the same as the insulating film 14 or the first metal film 12 provided on the upper surface of the substrate, and a plurality of metal layers are formed. It may be .
The insulating film 14 is provided on the upper surface of the first mounting board 10a excluding the metal portion 11. The first metal film 12 and the second metal film 13 are provided on the insulating film 14.

The first metal films 12 are formed in pairs, three on the upper side of the metal part 11 and three on the lower side, in a plan view of one metal part 11. Further, the second metal film 13 is provided on the side of one of the first metal films 12 provided above and below. It is not provided on the other first metal film 12 side. The second metal film 13 and the first metal film 12 provided on the side of the second metal film 13 are connected together to form a single metal film on the insulating film 14, and the first metal film 12 is formed on the insulating film 14. An insulating film 14 is provided so as to be divided into a metal film 12 and a second metal film 13. That is, the first metal film 12 and the second metal film 13 are connected and electrically connected although not visible from the surface.
The three first metal films 12 on the side where the second metal film 13 is not provided are connected between the two connection patterns 15. That is, similarly, a single connected metal film is provided on the insulating film 14, and the insulating film 14 is provided from above so that this becomes three first metal films 12 in each connection pattern 15. . Therefore, the two connection patterns 15 are connected to each other at the first metal film 12 on the side where the second metal film 13 is not provided, and are electrically connected. The metal part 11 is not connected to the first metal film 12.
The first metal films 12 provided vertically in pairs with the metal part 11 in between are joined to the metal film 37 provided on the lower surface of the light emitting device 20, thereby electrically connecting one to the other. . Furthermore, by mounting the light emitting devices 20 on the two connection patterns 15, conduction can be established from one second metal film 13 through the two light emitting devices 20 to the other second metal film 13.

In this way, the first mounting board 10a and the light emitting device 20 can be electrically connected. Furthermore, since the first metal film 12 is provided in three regions on the first mounting board 10a, self-alignment can be effectively performed when the light emitting device 20 is mounted. Note that when only one light emitting device 20 is mounted, conduction can be established from the first metal film 12 on the side where the second metal film 13 is not provided of the connection pattern 15 to which the light emitting device is not bonded. . Further, by providing the second metal film 13 only on one side, the mounting direction can be determined from the position of the second metal film. The two first mounting boards 10a in the mounting board 10 are arranged side by side so that the side surfaces opposite to the side on which the second metal film 13 is formed face each other.
The first mounting board 10a is located outside the area where the two connection patterns 15 are arranged side by side, at the left and right positions when the direction in which the first metal film 12 is provided across the metal part 11 is defined as up and down. A through hole is formed that penetrates in the thickness direction of the substrate. These through holes are provided for fastening positioning pins and fixing screws.

[Light emitting device]
The light emitting device 20 includes a first light emitting device 20a and a second light emitting device 20b. The first light emitting device 20a and the second light emitting device 20b each include a package 21, a semiconductor laser element 22, a submount 23, a light reflecting member 24, a protection element 25, a wire 26, a lid member 27, It has an adhesive part 28 and a lens member 29.

The first light emitting device 20a and the second light emitting device 20b have the same outer shape, but differ in the number of semiconductor laser elements 22 placed inside the outer shape. That is, in this embodiment, a package 21 capable of mounting four semiconductor laser elements 22 is used for both the first light emitting device 20a and the second light emitting device 20b. Therefore, in the same package 21, there is a first light emitting device 20a with three semiconductor laser elements 22 mounted thereon as shown in FIGS. 2A and 2B, and a first light emitting device 20a with three semiconductor laser elements 22 mounted thereon as shown in FIGS. 3A and 3B. A second light emitting device 20b on which is mounted is manufactured. The first light emitting device 20a and the second light emitting device 20b have the same package and have the same external shape.When bonding to a mounting board, no matter which light emitting device is mounted, the mounting board side will emit light. There is no need to consider that the sizes of devices are different. Thereby, a plurality of connection patterns can be prepared in a unified layout like the first mounting board 10a. Although FIGS. 3C and 3D respectively show a cross section of the second light emitting device and a lower surface (back surface) of the second light emitting device, the same applies to the first light emitting device. Note that the number of semiconductor laser elements 22 mounted on the first light emitting device 20a is not limited to three. For example, there may be two, or four or more. Alternatively, it is also possible to use only one. The number of semiconductor laser elements 22 mounted on the second light emitting device 20b is one more than the number of semiconductor laser elements 22 mounted on the first light emitting device 20a. Note that it is also possible to increase the number by two.

The three semiconductor laser elements 22 of the first light emitting device 20a are arranged at the same positions as the three semiconductor laser elements 22 of the four semiconductor laser elements 22 of the second light emitting device 20b. Thereby, the mounting position of the semiconductor laser element 22 in the package 21 can be made common to both the first light emitting device 20a and the second light emitting device 20b.
Which of the four semiconductor laser elements 22 should be removed can be arbitrarily determined. For example, the three semiconductor laser elements 22 of the first light emitting device 20a can be arranged side by side, biased toward one side of the package 21. That is, of the four semiconductor laser elements 22 arranged in the second light emitting device 20b, one semiconductor laser element 22 arranged at the end is removed. By doing so, the light from the first light emitting device 20a can be suppressed within a small range. Further, for example, the three semiconductor laser elements 22 of the first light emitting device 20a are such that one of the four semiconductor laser elements 22 arranged in the second light emitting device 20b is removed. The arrangement can be made as follows. By doing so, it is possible to reduce the difference in length of the light emitting region from end to end between the first light emitting device 20a and the second light emitting device 20b. Note that the arrangement is not limited to such an arrangement, and for example, three semiconductor laser elements 22 may be equally arranged in a region where four semiconductor laser elements 22 are arranged.

The package 21 is formed into a rectangular shape in a plan view, and has a recess 30 that is rectangular in a plan view. Note that the term "rectangular" here includes shapes that are approximately rectangular, such as a shape with a corner or a part of the side surface cut out like the package 21, a shape with curved corners like the recess 30, etc. It is something that Furthermore, the package 21 has a stepped portion 33 formed in a part of the inner surface 32 of the recessed portion 30 . Specifically, the step portion 33 is provided on two opposing inner surfaces 32 in the transverse direction among the four inner surfaces 32 of the recess 30 .
The package 21 can be formed using ceramic as a main material. Note that the package 21 is not limited to ceramic, and may be formed of metal. For example, among ceramics, aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide can be used as the main material of the package 21. As metals, copper, aluminum, iron, and composites such as copper molybdenum, copper-diamond composites, and copper tungsten can be used as the main material of the package 21.

A metal film is provided on the lower surface 34 of the package 21 and the upper surface of the stepped portion 33, respectively. Further, the metal film on the lower surface 34 of the package 21 includes a metal film 37 provided in pairs at both ends of the package 21, and a metal film provided at the center of the lower surface 34 of the package 21 between the metal films 37 at both ends. 38. Each of the metal films 37 is provided in three substantially rectangular positions spaced apart from each other along each of the two opposing sides. This metal film 37 is formed facing the first metal film 12 of the first mounting board 10a so as to be connectable thereto. Further, the area of the metal film 38 provided at the center of the lower surface 34 of the package 21 is larger than that of any of the metal films 37. This metal film 38 is formed facing the metal part 11 of the first mounting board 10a so as to be connectable thereto. In the package 21, the metal film on the top surface of the stepped portion 33 and the metal film 37 on the bottom surface 34 are electrically connected by metal wiring passing through the inside.

Note that the package 21 may be formed by having the frame portion 35 forming the frame of the recessed portion 30 and the bottom portion 36 made of different main materials, respectively, and joining the frame portion 35 and the bottom portion 36 together. For example, the package 21 may be formed by joining together a plate-shaped bottom portion 36 mainly made of metal and having a predetermined thickness, and a frame portion 35 mainly made of ceramic and having a frame of a predetermined height. In this case, instead of providing the metal film 38, the lower surface of the bottom part 36 can be connected to the metal part 11 of the first mounting board 10a.

The semiconductor laser element 22 and the protection element 25 are electrically connected to the connection wiring, which is a metal film provided on the upper surface of the stepped portion 33 . A wire 26 is connected for this continuity. FIGS. 2B and 3B show an example of bonding of the wires 26 when the semiconductor laser elements 22 are connected in series. Note that the connection method is not limited to this. Further, a plurality of semiconductor laser elements 22 may be connected in parallel. Thereby, the semiconductor laser element 22 and the protection element 25 are electrically connected via the metal film 37 provided on the lower surface 34 of the package 21.

No step portion 33 is provided on the two opposing inner surfaces 32 of the package 21 in the longitudinal direction. By not providing the stepped portion 33 all around the inner surface 32 of the package 21, the size of the package 21 can be reduced. Note that a stepped portion 33 may be provided on the inner surface 32 on the side far from the light reflecting member 24. By expanding the region in which the stepped portion 33 is provided, more wiring regions can be secured. On the other hand, it is not necessary to provide the stepped portion 33 on the inner surface 32 on the side closer to the light reflecting member 24. Even if the stepped portion 33 is provided in this portion, the wire 26 must be bonded to the semiconductor laser element 22 and the wiring area so as not to obstruct the optical path, making it difficult to provide a wiring area for the semiconductor laser element 22.
Moreover, by not providing the stepped portion 33 on the inner surface 32, the light reflecting member 24 can be placed close to the outer surface of the package 21. Although the details will be described later, when the two light emitting devices 20 are mounted on the mounting board 10, the distance between the lights emitted from the two light emitting devices 20 can be brought closer. Note that, as shown in FIGS. 2B and 3B, the inner surface 32 located on the side closer to the light reflecting member 24 can also be said to be the inner surface located ahead in the direction in which the laser light emitted from the semiconductor laser element travels.

In such a light emitting device 20, the pair of metal films 37 provided on the lower surface 34 are bonded to the first metal film 12 of the first mounting board 10a. Moreover, the metal film 38 provided between the pair of metal films 37 is bonded to the metal part 11 of the first mounting board 10a. The light emitting device 20 and the first mounting board 10a can be joined by soldering. In bonding the metal film 37 and metal film 38 on the lower surface 34 of the light emitting device 20 and the first metal film 12 and metal part 11 of the first mounting board 10a, when fixing the light emitting device 20 to the first mounting board 10a, self-alignment is working.

The semiconductor laser element 22 has a lower surface, an upper surface, and a side surface, and emits laser light from one side surface. The laser light emitted from the semiconductor laser element 22 has a spread, and forms an elliptical far field pattern (hereinafter referred to as "FFP") in a plane parallel to the light emission end face.

The semiconductor laser element 22 is placed on the bottom surface 31 (bottom top surface) of the recess 30 of the package 21 via the submount 23 . The submount 23 is provided separately for each semiconductor laser element 22. Note that in the light emitting device 20, a plurality of semiconductor laser elements 22 may be mounted on the upper surface of one submount 23. Further, in the light emitting device 20 , the semiconductor laser element 22 may be placed directly on the bottom surface 31 of the recess 30 of the package 21 without using the submount 23 .
As shown in FIGS. 2B, 3B, etc., the plurality of semiconductor laser elements 22 mounted on the light emitting device 20 are arranged side by side in one direction. Specifically, they are arranged in the longitudinal direction of the package 21. Further, the directions of the emission end faces are aligned so that the mounted semiconductor laser elements 22 emit laser light in the same direction. The positions of the emission end faces of the mounted semiconductor laser elements 22 are designed so that the emission end faces are arranged on the same plane. Note that they do not necessarily have to be aligned on the same plane.
A plurality of semiconductor laser elements 22 arranged in one direction are electrically connected in series using wires 26. Laser light traveling in a direction perpendicular to the direction in which the plurality of semiconductor laser elements 22 are lined up is emitted from the emission end face of the plurality of semiconductor laser elements 22 .

The semiconductor laser devices 22 mounted on the first light emitting device 20a and the second light emitting device 20b are all semiconductor laser devices that emit blue light. Note that a semiconductor laser element that emits light other than blue, such as red or green light, may be used. Furthermore, the color emitted by the semiconductor laser element 22 placed on the first light emitting device 20a may be different from the color emitted by the semiconductor laser element 22 placed on the second light emitting device 20b. For example, the first light emitting device 20a is mounted with a semiconductor laser element 22 that emits blue light, and the second light emitting device 20b is mounted with a semiconductor laser element 22 that emits red light. Furthermore, there is a possibility that two first light emitting devices 20a or two second light emitting devices 20b are mounted on the first mounting board 10a while being joined to two connection patterns 15, but in this case, Semiconductor laser elements 22 that emit light of different colors may be placed between the two light emitting devices 20 to be mounted.

Here, blue light refers to light whose emission peak wavelength is within the range of 420 nm to 494 nm. Red light refers to light whose emission peak wavelength is within the range of 605 nm to 750 nm. Green light refers to light whose emission peak wavelength is within the range of 495 nm to 570 nm.
Note that the semiconductor laser element 22 is an example of a light emitting element mounted on the light emitting module according to the present invention. The light emitting element is not limited to the semiconductor laser element 22.

The submount 23 is bonded to the bottom surface 31 of the recess 30 of the package 21 at its lower surface, and to the semiconductor laser element 22 at its upper surface. The semiconductor laser element 22 is mounted on the submount 23 such that the emission end face of the semiconductor laser element 22 is aligned with the side surface of the submount 23 or protrudes from it. Thereby, the light emitted from the semiconductor laser element 22 can be prevented from being irradiated onto the upper surface of the submount 23. Submount 23 can be formed using silicon nitride, aluminum nitride, or silicon carbide, for example. Further, a metal film is provided on the upper surface of the submount 23.

The light reflecting member 24 is a member that reflects the light from the semiconductor laser element 22. The light reflecting member 24 is placed on the bottom surface of the recess 30 of the package 21 . The light reflecting member 24 is separately arranged corresponding to each semiconductor laser element 22. Further, in the three or four semiconductor laser elements 22, the distance between the emission end face of each semiconductor laser element 22 and the corresponding light reflecting member 24 is designed to be the same. Note that the distance may be determined depending on the semiconductor laser element 22, or may be a different distance between the plurality of semiconductor laser elements 22. Further, in the light emitting device 20, one light reflecting member 24 may be arranged corresponding to a plurality of semiconductor laser elements 22.

The light reflecting member 24 has a lower surface, an upper surface, a side surface, and an inclined surface, and the inclined surface serves as a light reflecting surface. The light reflecting surface is a flat surface and slopes from the top surface to the bottom surface. The light reflecting surface is designed to form an angle of 45 degrees with the lower surface. Note that this angle does not need to be limited to 45 degrees, and the light reflecting surface may be a curved surface instead of a flat surface.

The light-reflecting member 24 can be formed by forming its outer shape using a main material and forming a light-reflecting film on the surface of the formed outer shape on which a light-reflecting surface is desired to be provided. The main material is preferably a material that is resistant to heat, and for example, glass such as quartz or BK7 (borosilicate glass), metal such as aluminum, or Si, etc. can be used. The light reflecting film is preferably made of a material with high light reflectance, such as metals such as Ag or Al, or dielectric multilayer films such as Ta ₂ O ₅ /SiO ₂ , TiO ₂ /SiO ₂ , Nb ₂ O ₅ /SiO ₂ , etc. can do. Note that when the outer shape of the light reflecting member 24 is formed using a material with high light reflectance such as metal as the main material, the formation of the light reflecting film may be omitted.

The main part of the light emitted from the semiconductor laser element 22 is irradiated onto the light reflecting surface of the corresponding light reflecting member 24. By passing the light emitted from the semiconductor laser element 22 through the light reflecting member 24, the optical path length of the light until it enters the lens can be made longer than when the light reflecting member 24 is not interposed. The longer the optical path length, the smaller the influence of mounting misalignment between the light reflecting member 24 and the semiconductor laser element 22. Note that the light emitting device 20 may be provided without the light reflecting member 24 and in which the emission end face of the semiconductor laser element 22 is directed upward.

The protection element 25 is placed on the top surface of the submount 23. The protection element 25 is, for example, a Zener diode. The wire 26 is a metal wiring. Examples of the material of the wire 26 include metals such as Au, Ag, Cu, Pt, and Al, and alloys thereof. Note that the light emitting device 20 may not include the protection element 25.

The lid member 27 is a member that covers the semiconductor laser element 22 and the light reflecting member 24. Although the lid member 27 is translucent as a whole, it may have a partially non-transparent region. The lid member 27 can be formed using sapphire as a main material. Further, the lid member 27 is provided with a metal film in a part of the region. Note that, in addition to sapphire, for example, glass or the like can also be used as the main material.
The lid member 27 is joined to the upper surface (frame upper surface) of the package 21 at its lower surface. The lid member 27 and the package 21 are provided with a metal film in the region where they are to be joined, and are fixed via Au--Sn or the like. In the light emitting device 20, a closed space is formed by joining the package 21 and the lid member 27. This closed space becomes an airtightly sealed space. By airtightly sealing the light emitting device 20 in this manner, it is possible to suppress the accumulation of organic matter and the like on the light emitting end face of the semiconductor laser element 22.

The adhesive portion 28 is formed on the upper surface of the lid member 27 in a region where the lid member 27 and the lens member 29 are adhered. As the adhesive portion 28, for example, an ultraviolet curing resin can be used. Note that the adhesive portion 28 is formed so that the lid member 27 and the lens member 29 do not come into contact with each other. The adhesive part 28 is thickened to adjust the position and height, and then joins the lens member 29 to the lid member 27. Further, the adhesive portion 28 is formed, for example, at a position facing the outer edge of the lens member 29 so as not to be provided on the optical path of the light emitted from the semiconductor laser element 22. Note that although FIGS. 2A and 3A show an example of the shape of the adhesive portion 28 after hardening, the adhesive portion 28 may be soft when applied.

The lens member 29 is provided facing the upper surface of the lid member 27. The lens member 29 is integrally formed with a lens portion 51 having a lens shape and a rectangular support plate portion 52 that supports the lens portion 51. In the lens member 29, each of the lens portions 51 is provided at a position facing the optical axis of the semiconductor laser element 22. The arrangement and shape of each lens section 51 are designed such that the reflected light emitted from the corresponding semiconductor laser element 22 and reflected by the light reflecting member 24 passes through the lens section 51 and is collimated. As shown in FIGS. 2A and 3A, the same lens member 29 is used in both the first light emitting device 20a and the second light emitting device 20b in which the number of semiconductor laser elements 22 is different. In other words, the same lens member 29 of the second light emitting device 20b is also used for the lens member 29 of the first light emitting device 20a. By doing so, the lens member 29 can be unified even in the first light emitting device 20a configured in such a manner that any of the four semiconductor laser elements 22 in the second light emitting device 20b is excluded. Further, the lens member 29 of one design can be used for the first light emitting device 20a and the second light emitting device 20b.

Note that the lens member 29 used in the first light emitting device 20a may be one in which the number and arrangement of lens portions 51 correspond to the number and arrangement of semiconductor laser elements 22 mounted on the package 21. By matching the number of lens parts 51 with the number of semiconductor laser elements 22, the lens member 29 can be made lighter than the lens member 29, which is matched with the number of semiconductor laser elements 22 of the second light emitting device 20b.
For the lens member 29, for example, glass such as BK7 or B270 can be used.

In the light emitting module 100 shown in FIG. 1A, two first mounting boards 10a are arranged side by side to form a mounting board 10, and two light emitting devices 20 are mounted on each, so that four light emitting devices 20 are arranged in two rows and two columns. A light emitting module 100 is realized in which the following is mounted. Further, in the light emitting module 100 of FIG. 1A, two light emitting devices 20 arranged in a one-row, two-column arrangement are mounted in directions 180 degrees different from each other on the mounting surface.
Specifically, the light emitting module 100 has one first light emitting device 20a and one second light emitting device 20b mounted side by side on each of the first mounting boards 10a, and the light reflecting member 24 are implemented so that they are next to each other. That is, regarding the two light emitting devices 20 mounted on one first mounting board 10a, the distance to the light reflecting member 24 arranged on one light emitting device 20 is the same as the distance from the light reflecting member 24 arranged on the other light emitting device 20. Mounting is performed so that the condition that the light reflecting member 24 is shorter than the semiconductor laser element 22 holds true, and this condition also holds when one light emitting device 20 and the other light emitting device 20 are replaced. be done.
Further, in the light emitting module 100, the first light emitting device 20a and the second light emitting device 20b are mounted so that the first light emitting devices 20a and the second light emitting devices 20b are both located diagonally. In this way, the four light emitting devices are mounted on the mounting board 10 so that they are adjacent to each other in the row and column direction, and the light emitting devices 20 are mounted so that the light reflecting members 24 are adjacent to each other in the row direction.

By arranging the two light-emitting devices 20 on one first mounting board 10a in this way, the light emitted from the two light-emitting devices 20 can be brought closer to each other. Further, since the distance between the semiconductor laser elements 22 can be increased between the two light emitting devices 20, heat dissipation is improved. Furthermore, by arranging the two first mounting boards 10a in this manner, light can be focused on the center side of the mounting board 10.
In the optical unit disclosed in Patent Document 1, which includes a plurality of semiconductor devices in which four semiconductor elements are mounted in a package, the light emitted from the semiconductor element passes through the semiconductor device as it is and exits. Thus, there was no need to consider how best to mount the two light emitting devices 20 based on the arrangement relationship between the semiconductor laser element and the light reflecting member mounted on the package.
On the other hand, in the light emitting device 20 of the light emitting module 100, a plurality of semiconductor laser elements 22 and a light reflecting member 24 are placed in a package. In this case, by mounting the two light emitting devices 20 in a suitable form on the mounting board 10, the light emitting module 100 that obtains the above-mentioned effects is realized.
Further, when manufacturing the light emitting module 100 in which the two first light emitting devices 20a and the two second light emitting devices 20b in which the three semiconductor laser elements 22 are provided in the same arrangement are mounted, the first light emitting device By arranging the semiconductor laser elements 20a diagonally, the semiconductor laser elements 22 in the two first light emitting devices 20a can be arranged symmetrically from the center of the mounting board 10.
Note that here, it is assumed that the light-emitting devices 20 are mounted so that the light-reflecting members 24 are adjacent to each other in the row direction on the page, but the light-emitting devices 20 are mounted so that the light-reflecting members 24 are adjacent to each other in the column direction on the page. 20 may be implemented. Further, the light emitting devices 20 may be arranged such that the first light emitting devices 20a and the second light emitting devices 20b are adjacent to each other in the row direction, and the first light emitting devices 20a and the second light emitting devices 20b are arranged adjacent to each other in the column direction. The light emitting devices 20 may be arranged adjacent to each other.

<Production method of light emitting module>
Next, an example of a method for manufacturing the light emitting module 100 according to the first embodiment will be described.
FIG. 4 is a flowchart showing the steps of the method for manufacturing the light emitting module according to the first embodiment.
The method for manufacturing a light emitting module according to the first embodiment is manufacturing a light emitting module 100 in which one or more light emitting devices on which a plurality of light emitting elements are mounted are mounted. The method for manufacturing the light emitting module 100 includes a step S101 of preparing a light emitting device, a step S102 of preparing a first mounting board, and a step S103 of mounting the light emitting device, which are performed in this order. Moreover, as the light emitting module 100 manufactured by this manufacturing method, it is possible to manufacture the light emitting module 100 in which an arbitrary number of light emitting elements 22 selected from at least three consecutive numbers are mounted.

Each step of the method for manufacturing the light emitting module 100 will be described below. Note that the materials, arrangement, etc. of each member are as described in the description of the light emitting module 100, so the description will be omitted here as appropriate.

[Step of preparing light emitting device]
The step S101 of preparing a light emitting device is a step of preparing a first light emitting device and a second light emitting device each having one different number of mounted semiconductor laser elements as light emitting devices.
In this step S101, a plurality of first light emitting devices 20a each having three semiconductor laser elements 22 and a plurality of second light emitting devices 20b each having four semiconductor laser elements 22 are prepared.

[Step of preparing the first mounting board]
The step S102 of preparing a first mounting board is a step of preparing a first mounting board having a mounting surface on which a plurality of connection patterns 15 corresponding to one light emitting device and the same connection pattern are provided.
In this step S102, a first light-emitting device 20a and a second light-emitting device 20b as light-emitting devices have a mounting surface provided with two connection patterns 15 corresponding to one light-emitting device 20. One or more mounting boards 10a are prepared.

[Process of mounting light emitting device]
The step S103 of mounting light emitting devices is a step of mounting a plurality of light emitting devices selected from the first light emitting device and the second light emitting device on the plurality of connection patterns provided on the mounting surface of the first mounting board. It is.
In this step S103, two desired light emitting devices selected from the first light emitting device 20a and the second light emitting device 20b are connected to the two connection patterns 15 provided on the mounting surface of the first mounting board 10a. Implement.
Further, as the light emitting module 100 in which the two selected light emitting devices 20 are mounted, at least the light emitting module 100 in which two first light emitting devices 20a are mounted, and one in which the first light emitting device 20a and the second light emitting device 20b are mounted. A light emitting module 100 in which two light emitting devices 20b are mounted, and a light emitting module 100 in which two second light emitting devices 20b are mounted are manufactured. In these three light emitting modules 100, the number of mounted light emitting elements increases by one in order.
In this way, by manufacturing three light emitting modules 100 in which two light emitting devices 20 of different combinations are mounted, a light emitting module 100 in which an arbitrary number of light emitting elements 22 selected from three consecutive numbers is mounted is produced. Module 100 can be manufactured.

Note that the light emitting module 100 manufactured by the manufacturing method according to the first embodiment, in which one or more light emitting devices on which a plurality of light emitting elements are mounted, is mounted is not limited to these three light emitting modules 100. A light emitting module 100 in which one light emitting device 20 is mounted on one first mounting board 10a, a light emitting module 100 in which a total of three light emitting devices 20 are mounted on two first mounting boards 10a, and a light emitting module 100 in which a total of three light emitting devices 20 are mounted on two first mounting boards 10a; It is possible to manufacture a light emitting module 100 in which a total of four light emitting devices 20 are mounted on the mounting board 10a.
In manufacturing the light emitting module 100 shown in FIG. 1A, in step S103, two light emitting devices 20 (a first light emitting device 20a and a second light emitting device 20b) arranged in one row and two columns are placed on a mounting surface. Mount them in directions 180 degrees different from each other. In addition, in this step S103, by arranging the two first mounting boards 10a on which two light emitting devices 20 (the first light emitting device 20a and the second light emitting device 20b) are respectively mounted, four A light emitting module 100 in which a light emitting device 20 is mounted is manufactured. Thereby, when viewed as the light emitting module 100, the four light emitting devices 20 can be arranged in the center. Further, on the outer periphery of the four light emitting devices 20, through holes for screwing or the like are provided at one end so as to sandwich the four light emitting devices 20, and a second metal film 13 is provided at the other end. When the second metal film 13 is provided at both ends, it is easier to connect to a power source than when the second metal film 13 is provided between two light emitting devices 20.

In this way, the light emitting module 100 in which one to four light emitting devices are mounted can be manufactured using the first mounting board 10a, the first light emitting device 20a, and the second light emitting device 20b. Furthermore, with such a light emitting module 100, the number of mounted semiconductor laser elements 22 can be adjusted to any number from 3 to 16 (excluding 5), and various specifications can be efficiently met. A light emitting module 100 can be provided.
Note that when the number of semiconductor laser elements 22 mounted on the first light emitting device 20a is 2 and the number of semiconductor laser elements 22 mounted on the second light emitting device 20b is 3, any number from 2 to 12 may be used. A light emitting module 100 that can be adjusted can be provided. If the number of semiconductor laser elements 22 mounted on the first light emitting device 20a is 4, and the number of semiconductor laser elements 22 mounted on the second light emitting device 20b is 5, then 4 to 20 (however, 6, It is possible to provide light emitting modules 100 that can be adjusted to any number (excluding 7 and 11).

<Second embodiment>
Next, a second embodiment will be described.
FIG. 5A is a perspective view schematically showing an example of the configuration of a light emitting module according to the second embodiment. FIG. 5B is a plan view schematically showing an example of the configuration of the light emitting module according to the second embodiment. FIG. 5C is a plan view schematically showing an example of the configuration of the mounting board according to the second embodiment. FIG. 5D is a plan view showing the mounting board of FIG. 5C separated into a first mounting board and a second mounting board. The light emitting module according to the second embodiment differs in that a second mounting board is employed in addition to the first mounting board employed in the light emitting module according to the first embodiment.

<Light-emitting module>
The light emitting module 100A shown in FIG. 5A includes a mounting board 10A and a light emitting device 20. Moreover, this light emitting module 100A is a light emitting module in which three light emitting devices 20 are mounted.
The mounting board 10A of the light emitting module 100A in this case includes a first mounting board 10a and a second mounting board 10b.
The second mounting board 10b has the same external shape as the first mounting board 10a. The second mounting board 10b has a lower surface, an upper surface, and a side surface, and has a mounting surface provided with one connection pattern 15, which is the same as the connection pattern 15 provided on the first mounting board 10a, on the upper surface. . By making the outer shape the same while using only one connection pattern 15, the outer shape can be made the same as when mounting with two first mounting boards 10a.

Further, in this embodiment, the connection pattern 15 of the second mounting board 10b is provided near the center, and the area where the connection pattern 15 of the second mounting board 10b is provided on the top surface is two parts of the first mounting board 10a. It partially overlaps with each of the areas where two connection patterns 15 are provided. On the other hand, the positions of the second metal film 13 and the through holes are the same as those of the first mounting board 10a. By placing the second metal film 13 in the same position, it is possible to use a common connection method between the first mounting board 10a and the second mounting board 10b when electrically connecting to an external power source. For example, the connection to the second metal film 13 can be made through a connector, a flexible board, a glass epoxy board, a leaf spring terminal, or the like. When using such a connecting member, the same connecting member can be used to connect the first mounting board 10a and the second mounting board 10b. By arranging the through-holes at the same position, screwing or the like can be done at the same position as when mounting two first mounting boards 10a. In addition, in the second mounting board 10b, among the three first metal films 12 paired with the metal part 11 in between, the three first metal films provided on the side closer to the second metal film 13 12 is connected to one of the two second metal films 13 and is electrically connected. Moreover, the three first metal films 12 provided on the far side of the second metal film 13 are connected to the other second metal film 13 and are electrically connected.
One light emitting device 20 is mounted on the second mounting board 10b, and in the example of FIG. 5A, one second light emitting device 20b is mounted. The first mounting board 10a and the second mounting board 10b are arranged so that the side surfaces opposite to the side on which the second metal film 13 is formed face each other. Other matters are the same as the light emitting module 100 according to the first embodiment shown in FIG. 1A.

<Production method of light emitting module>
Next, an example of a method for manufacturing the light emitting module 100A according to the second embodiment will be described.
FIG. 6 is a flowchart showing the steps of a method for manufacturing a light emitting module according to the second embodiment.
The manufacturing method of the light emitting module 100A includes a step S201 of preparing a light emitting device, a step S202 of preparing a first mounting board, a step S203 of preparing a second mounting board, and a step S204 of determining the number of mounting boards etc. , a step S205 of mounting a light emitting device, and a step S206 of forming a light emitting module, which are performed in this order. Note that the materials, arrangement, etc. of each member are as described in the description of the light emitting module 100, so the description will be omitted here as appropriate. Further, the step S201 of preparing a light emitting device and the step S202 of preparing a first mounting board are the step S101 of preparing a light emitting device and the step S202 of preparing a first mounting board in the manufacturing method of the light emitting module 100 according to the first embodiment. Since it is the same as S102, the explanation will be omitted here.

[Process of preparing the second mounting board]
Step S203 of preparing a second mounting board is a step of preparing a second mounting board having a mounting surface provided with one connection pattern that is the same as the connection pattern provided on the first mounting board.
In this step S203, the second mounting board 10b is prepared, which has a mounting surface provided with one connection pattern 15 that is the same as the connection pattern 15 provided on the first mounting board 10a.

[Process of determining the number of mounting boards, etc.]
Step S204 of determining the number of mounting boards, etc. determines the number, or the number and combination, of mounting boards used for manufacturing the light emitting module from among a plurality of mounting boards including at least the first mounting board and the second mounting board. This is the process of
In this step S204, it is determined whether to form the mounting board 10A of the light emitting module 100A using one mounting board or to form the mounting board 10A of the light emitting module 100A using two mounting boards. In addition, if there is only one mounting board, it is determined whether to use the first mounting board 10a or the second mounting board 10b, and if there are two boards, the first mounting board 10a and the second mounting board 10a are combined, or the first mounting board 10a and the second mounting board 10a are combined. It is determined whether to combine the two mounting boards 10b one by one. Although it is possible to form the mounting board 10A by combining two second mounting boards 10b, if you want to mount two light emitting devices 20, it is better to use one first mounting board 10a because the light emitting module 100A can be realized in a smaller size.
In manufacturing the light emitting module 100A shown in FIG. 5A, two mounting boards are used in combination of one first mounting board 10a and one second mounting board 10b, and the mounting board 10A is I have decided to configure it.

[Process of mounting light emitting device]
In the step S205 of mounting a light emitting device, when a second mounting board is used for the light emitting module, one light emitting device selected from the first light emitting device and the second light emitting device is mounted on the connection pattern of the second mounting board. This is the process of implementation. In addition, in this step S205, when the first mounting board is used for the light emitting module, selection is made from among the first light emitting device and the second light emitting device with respect to the plurality of connection patterns provided on the mounting surface of the first mounting board. This is a step of mounting a plurality of light emitting devices.
In manufacturing the light emitting module 100A shown in FIG. 5A, one second light emitting device 20b is mounted on the second mounting board 10b. Furthermore, one first light emitting device 20a and one second light emitting device 20b are mounted side by side on the first mounting board 10a, and the two light emitting devices 20 arranged in one row and two columns are mutually mounted on the mounting surface. Mount in 180 degree different orientation.

[Process of forming a light emitting module]
The step S206 of forming a light emitting module is a step of forming a light emitting module using one or more of the first mounting board and the second mounting board on which the determined number or number and combination of light emitting devices are mounted. It is.
In manufacturing the light emitting module 100A shown in FIG. 5A, one first mounting board 10a on which one first light emitting device 20a and one second light emitting device 20b are mounted, and one second light emitting device A light emitting module 100A is formed by arranging one second mounting board 10b on which the light emitting module 20b is mounted side by side. By using the second mounting board 10b when mounting one light emitting device 20, it is possible to prevent unused connection patterns 15 from occurring compared to the case where the first mounting board 10a is used. Further, in the first mounting board 10a, in order to electrically connect to an external power source, the second metal film 13 on the connection pattern 15 side to which the light emitting device 20 is bonded and the connection pattern 15 to which the light emitting device 20 is not bonded. However, in the second mounting board 10b, conduction can be achieved between the two second metal films 13. By using the first mounting board 10a when mounting two light emitting devices 20 on one mounting board, and using the second mounting board 10b when mounting one light emitting device 20, the two light emitting devices 20 can be mounted on one mounting board. 2. Using the metal film 13, it is possible to easily establish electrical continuity with an external power source.
Note that, as explained in the method for manufacturing the light emitting module 100 according to the first embodiment, the light emitting module 100A manufactured by the manufacturing method according to the second embodiment also includes any number of light emitting devices 20 from 1 to 4. It is clear that it is possible to provide a light emitting module in which the

<Third embodiment>
Next, a third embodiment will be described.
FIG. 7A is a plan view schematically showing an example of the configuration of a light emitting module according to the third embodiment. FIG. 7B is a plan view schematically showing an example of the configuration of the light emitting module according to the third embodiment. FIG. 7C is a plan view schematically showing an example of the configuration of the light emitting module according to the third embodiment.

In the light emitting module 100B according to the third embodiment shown in FIG. 7A, the mounting board 10B of the light emitting module 100B is mounted on one first mounting surface having four identical connection patterns 15 arranged in two rows and two columns. It is composed of a mounting board 10c. In the light emitting module 100B, an arbitrary number of light emitting devices 20 from 1 to 4 are mounted for these four connection patterns 15. 7A to 7C, a light emitting module 100B in which four light emitting devices 20 are mounted, a light emitting module 100C in which three light emitting devices 20 are mounted, and a light emitting module 100D in which two light emitting devices 20 are mounted are shown. There is. Since four light emitting devices 20 can be mounted on one mounting board, the manufacturing process can be simplified.

The configuration example and manufacturing method of the light emitting module according to the present invention have been described through the first embodiment, the second embodiment, and the third embodiment. In addition, in these descriptions, the light emitting module includes a first light emitting device that is a light emitting device in which a plurality of light emitting elements are mounted, and a light emitting device in which one more light emitting element than the first light emitting device is mounted. a second light emitting device, and a first mounting board having a mounting surface provided with a plurality of connection patterns corresponding to one light emitting device, the mounting surface of the first mounting board. It has been described that a light emitting module is realized in which one or more first light emitting devices and one or more second light emitting devices are connected to a plurality of connection patterns provided in the first light emitting device. A light emitting module 100E shown in FIG. 8 is a specific example of such a light emitting module having a suitable form in which the number of mounted light emitting elements is adjusted. By realizing such a light emitting module, it is possible to provide a light emitting module that can efficiently meet various specifications regarding the light it outputs.

<Fourth embodiment>
Next, a fourth embodiment will be described.
FIG. 9A is a perspective view schematically showing an example of the configuration of a light emitting module according to the fourth embodiment. FIG. 9B is a plan view schematically showing an example of the configuration of the light emitting module according to the fourth embodiment. FIG. 9C is a schematic plan view for explaining the first mounting board according to the fourth embodiment. FIG. 9D is a schematic plan view for explaining the light emitting device and thermistor mounted on the second mounting board according to the fourth embodiment. FIG. 9E is a schematic plan view for explaining the second mounting board according to the fourth embodiment.

The light emitting module according to the fourth embodiment can be mounted as described in the first to third embodiments in that a metal film for mounting a thermistor is further provided on the mounting surface of the mounting board. Different from the board.
As shown in FIG. 9C, in addition to the metal part 11, the first metal film 12, the second metal film 13, and the insulating film 14, the first mounting board 10d according to the fourth embodiment further includes a third metal film. 16. A fourth metal film 17 is provided on the mounting surface. The connection pattern 15 composed of the metal portion 11 and the first metal film 12 is the same as that described in the previous embodiments.

In the first mounting board 10d, since the third metal film 16 is provided, the distance between the first metal film 12 and the second metal film 13 is correspondingly larger than that in the first mounting board 10a. The two third metal films 16 are provided between the first metal film 12 and the second metal film 13, and are provided at the same distance from the light emitted from the two light emitting devices 20. Therefore, in the first mounting board 10d, the two connection patterns 15 are provided at the same distance from each other. That is, the two third metal films 16 are connected so that the distance from one connection pattern 15 to one third metal film 16 is the same as the distance from the other connection pattern 15 to the other third metal film 16. is provided.
Further, since the fourth metal film 17 is provided between the two second metal films 13, the distance between the two second metal films 13 is larger than that of the first mounting substrate 10a. Both of the two fourth metal films 17 are provided at positions sandwiched between the two second metal films 13.
The third metal film 16 and the fourth metal film 17 are formed so that a single metal film in which these are connected is provided on the insulating film 14, and then separated into the third metal film 16 and the fourth metal film 17. It is formed by providing an insulating film 14. That is, the third metal film 16 and the fourth metal film 17 are connected and electrically connected although not visible from the surface. One third metal film 16 and one fourth metal film 17 are connected, and the other third metal film 16 and the other fourth metal film 17 are connected.

In a light emitting module 100F according to the fourth embodiment shown in FIGS. 9A and 9B, a thermistor 90 is mounted on the third metal film 16. The thermistor 90 is an example of a temperature sensing element used to measure the temperature when the light emitting module 100F is operating. The thermistor 90 is mounted in a state where it is connected to both of the two third metal films 16, thereby allowing electrical conduction from one of the fourth metal films 17 to the other fourth metal film 17 through the thermistor 90. .
In the light emitting module 100F, the semiconductor laser elements 22 of the two light emitting devices 20 mounted on the first mounting board 10d mainly serve as a heat source, so the thermistor 90 is located close to both of the two light emitting devices 20, and It is preferable to arrange it at a position that is the same distance from the emitted light of both light emitting devices 20. In other words, when the center of light emitted from the plurality of semiconductor laser elements 22 mounted on the two light emitting devices 20 is designed to pass through the vertex of the lens section 51, the thermistor 90 is The straight line connecting the vertices of each lens part 51 of one light emitting device 20 intersects with the intermediate line that is at the same distance from the straight line connecting the vertices of each lens part 51 of the other light emitting device 20 .

The second mounting board 10e according to the fourth embodiment shown in FIGS. 9D and 9E is provided with a third metal film 16 and a fourth metal film 17, similarly to the first mounting board 10d. A thermistor 90 is mounted. Further, regarding the point that the third metal film 16 is provided between the first metal film 12 and the second metal film 13, and the fourth metal film 17 is provided at a position sandwiched between the two second metal films 13, , is similar to the first mounting board 10d.
On the other hand, since the thermistor 90 is provided at a position close to the emitted light emitted from the light emitting device 20, the thermistor 90 is provided at a position close to the apex of the lens portion 51 of the lens member 29 of the light emitting device 20 on the second mounting board 10e. provided at the location. In other words, if the design is such that the center of light emitted from the plurality of semiconductor laser elements 22 mounted on the light emitting device 20 passes through the apex of the lens section 51, the thermistor 90 is connected to each lens section when viewed from above. It intersects with the straight line connecting the 51 vertices.
As described above, in the light emitting module 100F according to the fourth embodiment, a metal film for mounting the thermistor 90 is provided on the mounting board 10, and thereby the temperature can be measured when the light emitting module 100F is operated. be able to. Therefore, the operation of the semiconductor laser element 22 can be controlled according to the measured temperature.

The light emitting module manufactured in this way can be used, for example, in various projectors with different specifications. Specifically, a light emitting module formed using one or more of a first mounting board and a second mounting board on which a determined number or number and combination of light emitting devices are mounted is mounted on a heat sink. It becomes a component of the projector.

Next, an example of implementation when applying the light emitting module according to this embodiment to a projector will be described. Note that, although a mounting board configured of one or more first mounting boards 10a will be described here as an example, it goes without saying that the present invention is not limited to this. The mounting board can be configured using the desired first mounting board or second mounting board described in the first embodiment to the fourth embodiment.
FIG. 10A is a perspective view schematically showing an example of mounting when a light emitting module according to an embodiment is applied to a projector. FIG. 10B is a perspective sectional view for explaining the sealing structure of the light emitting module according to one embodiment. FIG. 11A is a perspective view schematically showing an example of mounting when a light emitting module according to an embodiment is applied to a projector. FIG. 11B is a plan view schematically showing an example of the configuration of the projector according to the embodiment of FIG. 11A. FIG. 11C is a side view schematically showing an example of the configuration of the projector according to the embodiment of FIG. 11A. FIG. 12A is a perspective view schematically showing an example of mounting when a light emitting module according to an embodiment is applied to a projector. FIG. 12B is a side view schematically showing an example of the configuration of the projector according to the embodiment of FIG. 12A. FIG. 13 is a perspective sectional view for explaining another sealing structure of the light emitting module according to one embodiment.
Note that in these drawings, for convenience, a part of the interior of the projector is shown transparently as appropriate.

As shown in FIGS. 10A and 10B, the projector 200 includes a sealing member 60.
The sealing member 60 is a member for forming a sealed space surrounding the light emitting device 20 mounted on the mounting board 10 in the light emitting module. Furthermore, the optical system of the projector is mounted inside this sealed space. That is, an optical unit for generating a projection image projected by the projector is mounted. The optical unit includes, for example, a lens, a mirror, a DMD (Digital Mirror Device), a prism, and the like. In addition, an optical unit including a liquid crystal panel, a phosphor wheel, a rod integrator, etc., or an optical unit using appropriate components from each of these components may be constructed, and an appropriate optical system may be constructed. is designed. The projected image generated by the optical unit is emitted from the sealing member 60 to the outside and projected onto the screen of the projector. In order to further reduce the probability of a decrease in the output of the projector due to optical dust collection, it is preferable that all the components constituting the optical unit be housed in the sealed space formed by the sealing member 60 and the mounting board 10. . In the case of downsizing the sealing member 60, only some of the components constituting the optical unit may be housed in the sealed space.

In the projector 200, a light emitting module is manufactured in which two light emitting devices 20 are mounted on a single first mounting board 10a, and the light emitting module is covered with a sealing member 60. Although the sealing member 60 is formed in a rectangular parallelepiped shape here, the shape of the sealing member 60 is not particularly limited. In other words, it can have a shape that corresponds to the shape of the designed optical unit.
A sealing member 70 that is provided around the light emitting devices 20 and surrounds the two light emitting devices 20 is provided on the first mounting board 10a. Moreover, the sealing member 70 is provided between the first metal film 12 and the second metal film 13 so that the second metal film 13 is provided outside the sealed space. Thereby, the light emitting device 20 can be easily connected to an external power source. Moreover, the sealing member 70 is provided inside the through holes on both sides so that the through holes of the first mounting board 10a are provided outside the sealed space. This eliminates the need to consider the influence of the through hole in forming a sealed space. The sealing member 60 is joined to the first mounting board 10a via the sealing member 70 to form a sealed space. This prevents objects that cause optical dust collection, such as dust, resin outgas, and organic components of grease, from entering the sealing member 60.

Examples of the material of the sealing member 60 include metal, glass, and sapphire. The sealing member 60 may have a portion where light is emitted to the outside made of a transparent member such as glass or sapphire.
Examples of the material of the sealing member 70 include metal, resin, rubber, and the like. Furthermore, as the material of the sealing member 70, a member that easily deforms when pressed, such as sponge or clay, may be used. Note that when metal is used for the sealing member 70, a sufficient distance must be provided to avoid contact between the sealing member 70 and the first metal film 12 provided on the side far from the second metal film 13. is preferred. Thereby, it is possible to prevent a short circuit caused by the sealing member 70. If an insulating material is used, the sealing member 70 will not be electrically conductive even if it comes into contact with the first metal film 12 or the second metal film 13.

The projector 200A shown in FIGS. 11A, 11B, and 11C includes a sealing member 60A.
In the projector 200A, a light emitting module is manufactured in which four light emitting devices 20 are mounted on two first mounting boards 10a, and is covered with a sealing member 60A. Further, the sealing member 70 is formed to surround the two light emitting devices 20 for each first mounting board 10a.
The sealing member 60A has a convex first pressing portion 63 spanning the boundary between the first mounting substrates 10a. The first pressing portion 63 presses the sealing member 70 provided along the boundary of each first mounting board 10a, and closes the boundary between the two first mounting boards 10a. In addition, when the two first mounting boards 10a are joined at the boundary, the first holding part 63 may not be provided. For example, since each mounting board has component tolerances, rather than joining two first mounting boards 10a to form the mounting board 10, the first mounting boards 10a may be arranged side by side with a width apart from each other so that they do not come into contact with each other. Possible forms are possible. Note that if the first mounting boards 10a are too far apart from each other, the size of the light emitting module or projector will increase, so if it is desired to downsize, it is better to reduce the width. For example, it is preferable to provide a width between the two mounting boards in a range of 0.1 mm or more and 1.0 mm or less. Alternatively, it can be said that the distance from one mounting board to the other mounting board is preferably 0.1 mm or more and 1.0 mm or less. When mounting with a width in this way, by providing the first pressing portion 63, it is possible to prevent outside air from entering from the boundary and ensure airtightness.
Note that the light emitting modules shown in FIGS. 10A and 11A are just examples, and any of the light emitting modules manufactured by the manufacturing method described above can be applied. That is, it is possible to apply a light emitting module in which the mounting board 10 is formed by arbitrarily selecting one or two mounting boards from the first mounting board 10a and the second mounting board 10b. Moreover, light emitting modules in which any number of the first light emitting devices 20a and the second light emitting devices 20b are mounted on the mounting board 10 can be applied.

Furthermore, the present invention is not limited to one light emitting module, and a plurality of light emitting modules can also be applied.
The projector 200B shown in FIGS. 12A and 12B includes a sealing member 60B.
In the projector 200B, two light-emitting modules each having two light-emitting devices 20 mounted on two first mounting substrates 10a are manufactured, and two light-emitting modules are arranged side by side. Therefore, a total of eight light emitting devices 20 are covered with the sealing member 60B. Moreover, the sealing member 70 is formed for each first mounting board 10a.
In the projector 200B, two mounting boards 10 are arranged side by side so that their through holes are adjacent to each other.
In addition to the first holding part 63, the sealing member 60B has a convex second holding part 64 that straddles the through holes of the two mounting boards 10. The second pressing portion 64 presses the sealing member 70 provided on the two mounting substrates 10 to form a sealed space. Each mounting board 10 is fixed by passing fixing screws 80 through the through holes for fixing the mounting board 10 to the heat sink. By providing the second pressing portion 64, it is possible to prevent outside air from entering through the through hole and ensure airtightness.

Moreover, FIG. 13 shows another example of a sealing structure using a sealing member and a sealing member. In this way, the sealing member 60C may have a protrusion 65 that joins the sealing member 70 on the side surface and the bottom surface. The protrusion 65 covers the side surface of the sealing member 70 on the light emitting device 20 side. Since the sealing member 60C has the protrusion 65, the joint portion with the sealing member 70 has a claw structure. With such a structure, the adhesion between the sealing member 60C and the sealing member 70 is further improved, and the sealing performance of the sealing member 60C is improved.

10, 10A, 10B, 10C Mounting substrates 10a, 10c, 10d First mounting substrates 10b, 10e Second mounting substrate 11 Metal part 12 First metal film 13 Second metal film 14 Insulating film 15 Connection pattern 16 Third metal film 17 Fourth metal film 20 Light emitting device 21 Package 22 Light emitting element (semiconductor laser element)
23 Submount 24 Light reflecting member 25 Protective element 26 Wire 27 Lid member 28 Adhesive part 29 Lens member 30 Recessed part 31 Bottom surface of recessed part 32 Inner surface of recessed part 33 Step part 34 Lower surface 35 Frame part 36 Bottom part 37 Metal film 38 Metal film 51 Lens Part 52 Support plate part 60, 60A, 60B, 60C Sealing member 63 First holding part 64 Second holding part 65 Projection part 70 Sealing member 80 Fixing screw 90 Thermistor 100, 100A, 100B, 100C, 100D, 100E, 100F Light emitting module 200, 200A, 200B Projector

Claims (9)

A first light emitting module and a second light emitting module, each of which is equipped with a plurality of light emitting devices including a first light emitting device or a second light emitting device,
The first light emitting module is
the first light emitting device;
the second light emitting device;
A mounting board having two connection patterns on which the light emitting devices are mounted, respectively, and a mounting board on which the first light emitting device and the second light emitting device are mounted on the two connection patterns,
The second light emitting module is
two of the first light emitting devices;
a mounting board having two connection patterns on which the light emitting devices are respectively mounted, and a mounting board on which the two first light emitting devices are mounted on the two connection patterns;
The second light emitting module does not include the second light emitting device,
The first light emitting device and the second light emitting device are light emitting devices in which one or more semiconductor laser elements are arranged in a package having the same external shape,
A first light emitting module and a second light emitting module, wherein the number of semiconductor laser elements included in the first light emitting device is different from the number of semiconductor laser elements included in the second light emitting device by at least one. The packages included in the first light emitting device and the second light emitting device each include a metal provided on the lower surface of the package, electrically connected to the semiconductor laser element disposed in the package, and bonded to the connection pattern. The first light emitting module and the second light emitting module according to claim 1, each having a film. The one or more semiconductor laser elements included in the first light emitting device emit light of a color different from the color of light emitted from any of the one or more semiconductor laser elements included in the first light emitting device. The first light emitting module and the second light emitting module according to claim 1 or 2, wherein the first light emitting module and the second light emitting module include a semiconductor laser element. The first light emitting device includes the semiconductor laser element that emits blue light,
The first light emitting module and the second light emitting module according to any one of claims 1 to 3, wherein the second light emitting device includes the semiconductor laser element that emits red light. The first light emitting module according to any one of claims 1 to 4, wherein the mounting board included in the first light emitting module and the mounting board included in the second light emitting module have the same external shape. Second light emitting module. The connection pattern of the mounting board included in the first light emitting module and the connection pattern of the mounting board included in the second light emitting module are the same connection pattern, according to any one of claims 1 to 4. A first light emitting module and a second light emitting module. The first light emitting device includes a first lens member having one or more lens portions through which light emitted from each of the one or more semiconductor laser elements included in the first light emitting device passes,
The second light emitting device includes a second lens member having one or more lens portions through which light emitted from each of the one or more semiconductor laser elements included in the second light emitting device passes,
The first light emitting module and the second light emitting module according to any one of claims 1 to 6, wherein the first lens member and the second lens member are the same lens member. The first light emitting device includes a first lens member having one or more lens portions through which light emitted from each of the one or more semiconductor laser elements included in the first light emitting device passes,
The second light emitting device includes a second lens member having one or more lens portions through which light emitted from each of the one or more semiconductor laser elements included in the second light emitting device passes,
The first light emitting module and the second light emitting module according to any one of claims 1 to 6, wherein the first lens member and the second lens member are lens members having different numbers and arrangements of lens parts. The first light emitting module and the second light emitting module according to any one of claims 1 to 8, wherein each of the semiconductor laser elements included in the second light emitting module emits blue light.

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