JP2014229676A - Led light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve such a problem that it is difficult to connect LED elements, which have same characteristics, to one another in series by a low-cost single-layered substrate, in an LED light emitting device in which a plurality of LED elements having emission characteristics different from each other are arranged on a substrate.SOLUTION: In an LED light emitting device, a plurality of first LED elements and a plurality of second LED elements which have emission characteristics different from each other are flip-chip mounted on a substrate having a wiring electrode, respectively. The first LED elements and the second LED elements are connected in series by the wiring electrode, respectively. A part of the wiring electrode connecting the first LED elements to one another is wired to pass through between an anode electrode and a cathode electrode of the second LED elements mounted on the substrate.

Description

  The present invention relates to a wiring structure of an LED light emitting device in which a plurality of LED elements having different light emission characteristics are flip-chip mounted on a substrate having wiring electrodes.

In recent years, LED elements, which are semiconductor light emitting elements, have long life and excellent driving characteristics, and are also widely used in backlights and lighting of color display devices because they are compact, have high luminous efficiency, and have bright emission colors. It has come to be.

  Particularly, in recent years, LED light-emitting devices that perform bright illumination by mounting a plurality of LED elements on a substrate having wiring electrodes and connecting the LED elements in series by wiring electrodes on the substrate have been proposed. (For example, Patent Document 1 and Patent Document 2)

  Hereinafter, the LED light-emitting device which mounted the some LED element on the board | substrate which has the conventional wiring electrode is demonstrated. In addition, in the range which does not remove the meaning of the invention, the drawings are partially simplified, and the component names are partially aligned with the component names of the present invention in order to facilitate comparison. FIG. 10 is a plan view of a light emitting portion on a substrate in the LED light emitting device described in Patent Document 1, and circular element mounting areas are defined as a first mounting area 102a, a second mounting area 102b, a third mounting area 102c, The fourth mounting region 102d is divided into four parts and surrounded by two power supply electrodes 103a and 103b and three relay electrodes 104a, 104b and 104c.

  Then, in the two mounting regions 102b and 102c from the center, 20 LED elements 101 are arranged in two rows in a staggered arrangement of 10 pieces each, and each of the 10 LED elements 101 arranged in a staggered manner is connected by wires 108. Two LED element arrays connected in series are connected in series between the relay electrodes 104a, 104b, and 104c by a wire 108. That is, in the mounting area 102b, two LED element arrays connected in series in units of 10 are connected in parallel to the relay electrodes 104a and 104c, and in the mounting area 102c, two LED element arrays connected in series in units of 10 are connected to the relay electrode. 104b and 104c are connected in parallel.

  Similarly, in the two mounting regions 102a and 102d on both sides, 12 LED elements 101 are arranged in two rows in a staggered arrangement of 6 pieces each, and each of the 6 LED elements 101 arranged in a staggered manner is connected by wires 108. Two LED element arrays connected in series are connected by a wire 108 between the relay electrode 104a and the power supply electrode 103a, and between the relay electrode 104b and the power supply electrode 103b. That is, two LED element rows connected in series in the mounting area 102a are connected in parallel to the relay electrode 104a and the power supply electrode 103a, and two LED element arrays connected in series in the mounting area 102d are connected in two rows. The relay electrode 104b and the power supply electrode 103b are connected in parallel.

  In the above configuration, when the power supply electrode 103a is the positive electrode (+) and the power supply electrode 103b is the negative electrode (−), two rows are connected between the power supply electrodes 103a and 103b in series in the mounting region 102a and the mounting region 102d. The LED element rows are mounted, and two LED element rows are connected in series in the mounting region 102b and the mounting region 102c. The LED element arrays mounted in these mounting regions are all connected in series via the relay electrodes 104a, 104c, and 104b between the power supply electrodes 103a and 103b. Therefore, the total of the series LED elements 101 in the four mounting regions is 6 + 10 + 10 + 6 = 32, and when the driving voltage of one LED element is 3V, 3 × 32 = 96V. Therefore, all LED elements 101 are turned on by applying a voltage of 96 V between the power supply electrodes 103a and 103b.

  Next, the LED light-emitting device described in Patent Document 2 will be described with reference to FIGS. FIG. 11 is a plan view of the LED light emitting device 200 described in Patent Document 2. A color light source 211 in which a red LED 201R, a green LED 201G, and a blue LED 201B are arranged in series as an LED element 201 on the upper surface of a substrate 202, and a blue light source. The LED 201 </ b> B includes a lemon light source 212 that is covered with a yellow phosphor 215, and the color light source 211 and the lemon light source 212 are arranged in a staggered pattern on the substrate 202.

  FIG. 12 is a plan view of an LED light emitting device 300 according to another embodiment described in Patent Document 2. The basic configuration of the LED light-emitting device 300 is the same as that of the LED light-emitting device 200 shown in FIG. 11, and the same reference numerals are given to the same members, and duplicate descriptions are omitted. The LED light emitting device 300 shown in FIG. 12 is different from the LED light emitting device 200 shown in FIG. 11 in that the LED light emitting device 200 has the color light source 211 and the lemon light source 212 arranged on the substrate 202 in a staggered manner. The LED light emitting device 300 is a red LED 301R, a green LED 201G, a blue LED 201B and a lemon color light source 212 which are single color LEDs arranged in a staggered manner.

  The LED light-emitting device 200 and the LED light-emitting device 300 described in Patent Document 2 are both aimed at an illuminating device that can improve color rendering properties and light emission efficiency and can change the color temperature or light color of illumination light. The color LED of the illumination light is arranged by staggering the red LED 201R, the green LED 201G, the blue LED 201B, and the lemon light source 212 which are color LEDs on the substrate, and independently connecting and driving each color LED. Alternatively, the color rendering property and the light emission efficiency are improved by changing the light color.

JP 2010-287657 A JP 2010-92993 A

  When a large number of LED elements are arranged in a staggered manner on a substrate as shown in Patent Document 1, connecting in series with wires to form each LED element group has a problem that the number of mounting steps increases. Further, as shown in Patent Document 2, LED elements having different light emission characteristics are arranged in a staggered manner on the substrate, and the LED elements having the respective light emission characteristics are connected independently and driven independently, whereby the color rendering property and light emission of illumination light are achieved. Efficiency can be improved. However, in order to arrange the LED elements having different light emission characteristics in a staggered manner and connect the LED elements having the same characteristics in series, a three-dimensional connection with a wire as in Patent Document 1 or a flip chip mounting type LED element It is necessary to wire three-dimensionally using a multilayer substrate. Although there is no specific description in detail in Patent Document 2 regarding the wiring method, when the red LED 201R, the green LED 201G, the blue LED 201B, and the lemon light source 212, which are color LEDs, are arranged in a staggered manner, wire connection with a large number of mounting steps is required. In addition, it is necessary to perform wiring using a high-priced multilayer substrate, and there is a problem that it is difficult to mount the wiring on a low-cost single-layer substrate.

  An object of the present invention is to solve the above-mentioned conventional problems, and in a configuration in which LED elements having different light emission characteristics are arranged in a staggered manner, LED elements having the same characteristics can be connected in series with a low-priced single layer substrate. It is to provide a light emitting device.

  In order to achieve the above object, the present invention provides a LED light emitting device in which a plurality of first LED elements and second LED elements each having different light emission characteristics are mounted on a substrate having wiring electrodes by flip chip mounting. The plurality of first LED elements and the second LED element are respectively connected in series by the wiring electrode, and a part of the wiring electrode that connects the first LED elements is an anode of the second LED element that is mounted on the substrate. It is characterized in that it is wired between the electrode and the cathode electrode.

  According to the said structure, since connection between 1st LED elements can be connected across 2nd LED element, an LED light-emitting device can be comprised by wiring mounting of a single layer board | substrate.

  A part of the wiring electrode that connects the second LED elements may be wired through between the anode electrode and the cathode electrode of the first LED element mounted on the substrate.

  The first LED elements and the second LED elements may be arranged in a staggered pattern on the substrate.

  The first LED elements and the second LED elements are alternately arranged to form a column light source, and the alternately arranged first LED elements and the second LED elements pass between the anode electrode and the cathode electrode and are connected in series. Good to have been.

  The column light sources may be configured in a plurality of columns, and each column light source may be driven independently.

  The LED element is preferably covered with a fluorescent resin to constitute an LED package.

  In the LED package, the side surface of the LED element may be covered with a reflective resin, and the upper surface may be covered with a fluorescent resin.

  According to the above configuration, by using the blue LED element and the white light emitting LED package made of yellow fluorescent resin (YAG) as the first LED element and the red light emitting LED package as the second LED element, the LED light emission for illumination having excellent color rendering properties is achieved. An apparatus can be provided.

  As described above, according to the present invention, in the LED light emitting device in which a plurality of first LED elements and second LED elements having different light emission characteristics are mounted on a substrate having wiring electrodes, a plurality of first LED elements and second LED elements are flip-chip mounted. The two LED elements are connected in series by the wiring electrodes, and a part of the wiring electrodes connecting the first LED elements pass between the anode electrode and the cathode electrode of the second LED element mounted on the substrate. Since the first LED elements can be connected across the second LED elements, the LED light emitting device can be configured by wiring mounting on a single-layer substrate.

It is a top view which shows 1st Embodiment of the LED light-emitting device in this invention. It is the top view and sectional drawing which show the notional structure of the LED package shown in FIG. It is a wiring diagram which shows the connection of the LED light-emitting device shown in FIG. It is the fragmentary top view and sectional drawing which show the mounting part of the LED package shown in FIG. It is a top view which shows 2nd Embodiment of the LED light-emitting device in this invention. It is a wiring diagram which shows the connection of the LED light-emitting device shown in FIG. It is a top view which shows 3rd Embodiment of the LED light-emitting device in this invention. It is a wiring diagram which shows the connection of the LED light-emitting device shown in FIG. FIG. 3 is a detailed cross-sectional view of an LED package that is optimal for use in the present invention. It is a top view of the conventional LED light-emitting device shown in the cited reference 1. It is a top view of the conventional LED light-emitting device shown in the cited reference 2. It is a top view of the conventional LED light-emitting device shown in the cited reference 2.

(First embodiment)
The configuration of the LED light-emitting device according to the first embodiment of the present invention will be described below with reference to the drawings.
1 to 4 show the configuration of the LED light emitting device 10 according to the first embodiment, FIG. 1 is a plan view of the LED light emitting device 10, FIG. 2 shows the configuration of the LED package shown in FIG. ) Is a plan view (b) is an AA cross-sectional view. 3 is a wiring diagram showing the connection of the LED light emitting device 10 shown in FIG. 1, FIG. 4 is a wiring portion of the LED package indicated by the dotted line M in FIG. 3, (a) is a plan view, and (b) is a cross-sectional view along BB. FIG.

  In FIG. 1, the LED light emitting device 10 has a circular substrate 2 in which first LED packages A (indicated by white frames) and second LED packages B (indicated by hatching) having different emission characteristics are arranged in a staggered manner. Drive electrodes 3a and 3b for driving the first LED package A connected in series and drive electrodes 4a and 4b for driving the second LED package B connected in series are provided on the left and right sides of 2, respectively. In the present embodiment, a white light emitting LED package in which a blue LED element is covered with a yellow fluorescent resin (YAG) is used as the first LED package A, and a red light emitting LED package is used as the second LED package.

  FIG. 2 shows a conceptual configuration of the first LED package A shown in FIG. 1. In the plan view of FIG. 2A, the upper surface of the first LED package A is covered with the fluorescent resin 7, and the anode electrode 1c is indicated by a dotted line. A gap 1e between the cathode electrode 1d and the two electrodes is shown. 2B is a cross-sectional view taken along the line AA of FIG. 2A, and the first LED element 1 includes a semiconductor light emitting layer 1b, an anode electrode 1c, and a cathode electrode 1d, and a gap between the two electrodes. 1e is formed. The configuration of the second LED package B is basically the same as that of the first LED package A. Although not shown, the emission color of the second LED element and the fluorescence color of the fluorescent resin are different.

  FIG. 3 is a wiring diagram showing the connection of the LED light emitting device 10 shown in FIG. 1. All the first LED packages A are connected in series between the drive electrodes 3a and 3b, and all the second LED packages B are drive electrodes. 4a and 4b are connected in series. That is, the first LED packages A1 to A8 are connected in series between the negative (−) drive electrodes 3b by the wiring 5a from the positive (+) drive electrode 3a, but the first LED package A4 and the first LED package A5 are connected. The first LED package A5 and the first LED package A6 are connected to each other, and the first LED package A6 and the first LED package A7 are connected to the gap 1e between the anode electrode 1c and the cathode electrode 1d of the second LED packages B2, B3, and B4, respectively. This is done by the wiring 5b passing therethrough.

  Similarly, the second LED packages B1 to B8 are connected in series between the negative (−) drive electrodes 4b by the wiring 5a from the positive (+) drive electrode 4a, but the second LED package B6 and the second LED package B7 are connected to each other. The connection is made by the wiring 5b passing through the gap 1e between the anode electrode 1c and the cathode electrode 1d of the first LED package A3.

4 is a partial plan view and a cross-sectional view showing a mounting portion of the first LED package A3 shown in FIG. 3, and an M portion indicated by a dotted line is enlarged. 4A is a plan view, and FIG. 4B is a cross-sectional view taken along the line BB. The anode electrode 1c and the cathode electrode 1d of the first LED package A3 are flip-chip mounted on the wiring 5a provided on the substrate 2. The second LED package B6 and the second LED package B7 shown in FIG. 3 are connected by a wiring 5b that passes through a gap 1e formed between the anode electrode 1c and the cathode electrode 1d. That is, the second LED package B6 and the second LED package B7 are connected in series on the surface of the substrate 2 by being connected across the first LED package A3.
In the LED package using a small LED element, the width of the gap 1e between the anode electrode 1c and the cathode electrode 1d is 0.3 mm, and the width of the wiring 5b passing between them is about 0.1 mm. is there.

(Second Embodiment)
Next, the structure of the LED light-emitting device in 2nd Embodiment of this invention is demonstrated with FIG. 5, FIG. FIG. 5 is a plan view of the LED light emitting device 20, and FIG. 6 is a wiring diagram showing connections of the LED light emitting device 20 shown in FIG. 5, showing the left half from the center N of the LED light emitting device 20 of FIG. In the LED light emitting device 20 in FIG. 5, the same or corresponding elements as those of the LED light emitting device 10 of the first embodiment are denoted by the same reference numerals, and redundant description is omitted.

  In the LED light emitting device 20, the circular substrate 2, the first LED package A, and the second LED package B are the same as or equivalent to the LED light emitting device 10. The LED light emitting device 20 is different from the LED light emitting device 10 in that the LED light emitting device 10 has arranged the first LED package A and the second LED package B having different light emission characteristics on the circular substrate 2 in a staggered manner, In the LED light-emitting device 20, six LED rows L1 to L6 are provided by alternately arranging the first LED package A and the second LED package B having different light emission characteristics, and four drive electrodes are provided for each LED row. Is provided. Since the configuration of each LED row is the same except that the number of LED packages arranged in a straight line is different, the LED row L1 will be described as an example.

  The LED array L1 includes three first LED packages A and second LED packages B alternately arranged in a straight line to form a linear light source, and drive electrodes L1A and L1B are provided above and below the LED array L1, respectively. The first LED package A group connected in series by L1A is driven, and the second LED package B group connected in series by L1B is driven. That is, as will be described later, the first LED package A group and the second LED package B group having different light emission characteristics are driven independently. In addition, the LED array L1 has a linear light source by alternately arranging three first LED packages A and second LED packages B alternately, whereas the LED array L2 has four first LED packages A, The second LED packages B are alternately arranged in a straight line to form a linear light source, and the LED array L3 has five first LED packages A and second LED packages B alternately arranged in a straight line to form a linear light source. Further, the LED array L4 has the same configuration as the LED array L3, the LED array L5 has the same configuration as the LED array L2, and the LED array L6 has the same configuration as the LED array L1. That is, the arrangement of the LED rows is symmetrical with respect to the center N of the substrate 2.

  Next, the wiring of the LED light emitting device 20 will be described with reference to FIG. FIG. 6 is a wiring diagram showing the arrangement and wiring of the LED packages in the LED rows on the left half from the center N of the substrate 2 in the LED light emitting device 20 shown in FIG. 5, that is, the LED rows L1 to L3. As described with reference to FIG. 5, the arrangement and wiring of the LED array L1 constitute a linear light source by alternately arranging three first LED packages A1, A2, A3 and three second LED packages B1, B2, B3. Drive electrodes L1A + and LA1- for driving the LED package A are provided above and below the LED row L1, and drive electrodes L1B + and LB1- for driving the LED package B are provided. .

  Next, the wiring of the LED row L1 will be described. FIG. 6 is a wiring diagram showing the connection of the LED light emitting device 20 shown in FIG. 5. All the first LED packages A are connected in series between the drive electrodes L1A + and LA1-, and all the second LED packages B are connected. The drive electrodes L1B + and LB1- are connected in series. That is, the first LED packages A1 to A3 are connected in series between the drive electrodes L1A− by the wiring 5a from the drive electrode L1A +, but between the first LED packages A1 and A2, between the first LED packages A2 and A3, The connection between the drive electrodes L1A- is made by the wiring 5b passing through the gap 1e between the anode electrode 1c and the cathode electrode 1d of the second LED packages B1, B2, and B3, respectively.

  Similarly, the second LED packages B1 to B3 are connected in series between the drive electrodes L1B− by the wiring 5a from the drive electrode L1B +, but the connections between the second LED packages B1 and B2 and between the second LED packages B2 and B3 are The wiring 5b passes through the gap 1e between the anode electrode 1c and the cathode electrode 1d of the 1LED package A2, A3. The LED rows L2 and L3 are also basically connected in the same manner as the LED row L1, and redundant description is omitted. Further, the arrangement and wiring of the LED packages in the right half of the LED row from the center N of the substrate 2, that is, the LED rows L4 to L6, are the same as the LED row of the left half from the center N of the substrate 2. Corresponding to the row L1, the LED row L5 corresponds to the LED row L2, and the LED row L4 corresponds to the LED row L3.

  In the LED light emitting device 20, since the first LED package A group and the second LED package B group of the LED array L1 to LED array L6 can be driven independently by the drive electrodes LA and LB, the number of LED arrays to be lit Further, by arbitrarily selecting the combination, it is possible to adjust the brightness and color tone of the illumination in a wide range and perform illumination with good color rendering.

(Third embodiment)
Next, the configuration of the LED light-emitting device according to the third embodiment of the present invention will be described with reference to FIGS. FIG. 7 is a plan view of the LED light emitting device 30, and FIG. 8 is a wiring diagram showing connections of the LED light emitting device 30 shown in FIG. 7, and representative columns of the left half and the left half from the center N of the LED light emitting device 30 of FIG. LED row L1 and LED row L6 are shown. In the LED light emitting device 30 in FIG. 7, the same or corresponding elements as those of the LED light emitting device 20 of the second embodiment are denoted by the same reference numerals, and redundant description is omitted.

  The LED light-emitting device 30 is different from the LED light-emitting device 20 in that the LED light-emitting device 20 has LED rows L1 to L3 on the left half from the center N of the circular substrate 2, and LED rows L4 to L6 on the right half from the center N. The LED row L6 corresponds to the LED row L1, the LED row L5 corresponds to the LED row L2, and the LED row L4 corresponds to the LED row L3. On the other hand, in the LED light emitting device 30, the left half LED rows L1 to L3 from the center N of the circular substrate 2, the right half LED rows L4 to L6 from the center N, and the LED row L6 to the LED row L1, respectively. Correspondingly, the LED array L5 corresponds to the LED array L2, and the LED array L4 corresponds to the LED array L3, and the arrangement of the first LED package A and the second LED package B in each corresponding LED array is reversed. It is that you are.

  Next, the wiring of the LED light emitting device 30 will be described with reference to FIG. 8. As described above, the LED rows from the center N to the left half and from the center N to the right half correspond to each other. The left half LED row L1 from the center N and the right half LED row L6 from the center N will be described as a representative. In FIG. 8, the arrangement of the LED packages in the LED array L1 is as follows. The first LED package A1 is the first, the second LED package B1, and then the first LED package A and the second LED package B are in the order of A2, B2, A3, B3. Are alternately arranged.

  In addition, the LED packages of the LED array L6 are arranged in the order of the second LED package B1, the second LED package B1, the second LED package B and the first LED package A in the order of B2, A2, B3, and A3. Interleaved. And the wiring of LED row L1 is the same wiring as LED row L1 in FIG. The electrode arrangement of the LED array L6 is such that LA1 and LB1 are arranged opposite to the LED array L1, and the wiring of the LED package group A of the LED array L1 and the wiring of the LED package group B of the LED array L6 are the same. Thus, the wiring of the LED package group B of the LED array L1 and the wiring of the LED package group A of the LED array L6 are the same.

  Further, with respect to the center N of the substrate 2, the LED array L2 and the LED array L5, and the LED array L3 and the LED array L4 are basically the same LED package as the LED array L1 and the LED array L6 except for the number of LED packages. This is the arrangement and wiring. That is, since the LED light emitting device 30 is also driven independently of the first LED package group A and the second LED package group B having different light emission characteristics, similarly to the LED light emitting device 20, the number of LED rows to be lit and It is the same that the brightness and color tone can be adjusted in a wide range by arbitrarily selecting the combination. However, in the case of the LED light emitting device 30, as shown in FIG. When viewed as a surface light source, all of the first LED packages A and the second LED packages B are arranged in a staggered manner, and the light source is further balanced in color tone.

  Next, an LED package that is optimal for use in the present invention will be described. FIG. 9 is an example of an LED package that is optimal for use in the present invention, and FIG. 2 is a detailed sectional view of the LED package A conceptually shown in FIG. 2 that are the same as or equivalent to those of the LED package A in FIG. The LED package A is packaged in a size approximately similar to that of the LED element 1. The side surface of the LED element 1 is covered with a reflective white resin 8, and a fluorescent resin sheet as a fluorescent resin 7 is attached to the upper surface. Yes. According to this packaging method, by reducing the thickness of the white resin 8 and the fluorescent resin 7, the LED package A can be packaged with a size substantially approximate to the LED element 1, and the side surface is a reflective white resin. By covering with 8, it is possible to produce an LED package with good radiation efficiency upward and suitable for arrangement on the substrate.

  Next, the combination of the first light emitting element and the second light emitting element having different light emission characteristics in the present invention will be described. The first light-emitting element and the second light-emitting element are configured by a single LED element or an LED package including the LED element. A combination thereof will be described below.

  Considering these combinations as white light emission and dimming as a lighting device, a blue LED element and a yellow phosphor are used for the first LED package A shown in each embodiment, and a blue LED element is used for the second LED package B. And red phosphors, blue LED elements and yellow phosphors for the first LED package A, green LED elements and red phosphors for the second LED package B, cold white light emission and warm color There is dimming in combination with white light emission.

  Moreover, in the combination of LED package and LED element, there are a combination of LED package and red LED element by blue LED element and yellow phosphor, and a combination of LED package and blue LED element by red LED element and green phosphor. Also, when considering the first light emitting element, the second light emitting element and the third light emitting element, a red LED element and a green LED element. A combination of blue LED elements is conceivable.

  As described above, in the present invention, as a light emitting element, a plurality of LED elements having different light emitting characteristics or an LED package including LED elements are flip-chip mounted on a single layer substrate, and the connection between the same LED elements is connected to another LED element. Since wiring is performed through a gap formed between the anode electrode and the cathode electrode, cross wiring on a single layer substrate is possible. Further, in each embodiment, the disclosure is focused on white light emission and its dimming as an illuminating device, but the present invention is not limited to this, and it is also effective in a combination of color light emission and the like.

1, 101, 201 LED element 1c Anode electrode 1d Cathode electrode 1e Gap 2, 202 Substrate 3a, 3b, 4a, 4b, Drive electrode L1A to L6A, L1B to L6B Drive electrode 5a, 5b Wiring 7 Fluorescent resin 8 White resin 10, 20, 30, 100, 200, 300 LED light emitting device A, A1 to A5 First LED package B, B1 to B5 Second LED package

Claims (8)

  In the LED light emitting device in which a plurality of first LED elements and second LED elements each having different light emission characteristics are flip-chip mounted on a substrate having wiring electrodes, the plurality of first LED elements and second LED elements are: Each of the wiring electrodes is connected in series by the wiring electrodes, and a part of the wiring electrodes connecting the first LED elements is wired between the anode electrode and the cathode electrode of the second LED element mounted on the substrate. An LED light emitting device characterized by that.   2. A part of the wiring electrode for connecting the second LED elements is wired through between the anode electrode and the cathode electrode of the first LED element mounted on the substrate. LED light emitting device.   The LED light-emitting device according to claim 1, wherein the first LED elements and the second LED elements are arranged in a staggered pattern on the substrate.   The first LED elements and the second LED elements are alternately arranged to form a column light source, and the alternately arranged first LED elements and the second LED elements pass between the anode electrode and the cathode electrode and are connected in series. The LED light-emitting device according to claim 1, wherein the LED light-emitting device is provided.   The LED light-emitting device according to claim 4, wherein the column light sources are configured in a plurality of columns.   6. The LED light emitting device according to claim 5, wherein each of the plurality of column light sources is driven independently.   The LED light-emitting device according to any one of claims 1 to 6, wherein the LED element is covered with a fluorescent resin to constitute an LED package.   8. The LED light emitting device according to claim 7, wherein the LED package has a side surface of the LED element coated with a reflective resin and a top surface coated with a fluorescent resin.

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