CN217719595U - Light emitting module and display device - Google Patents

Abstract

The disclosure belongs to the technical field of display, and particularly relates to a light-emitting component and a display device, wherein the light-emitting component comprises a first substrate and a second substrate which are arranged in a stacked manner, a plurality of first packaging areas which are arranged in an array manner are arranged on the first substrate, and at least two colors of light-emitting chips are packaged in the first packaging areas; a plurality of second packaging areas arranged in an array are arranged on the second substrate, and the second packaging areas package at least one color of light-emitting chips; the orthographic projection of the second packaging area on the first substrate is positioned between the adjacent first packaging areas. According to the scheme, the distance between the light-emitting chips is shortened through the two superposed substrates, the arrangement quantity of the LEDs is increased, and the contrast and the brightness of the display device are improved.

Description

Light emitting module and display device

Technical Field

The disclosure belongs to the technical field of display, and particularly relates to a light-emitting assembly and a display device.

Background

With the increasing development of LED (Light Emitting Diode) lighting technology, in life, mini LEDs can realize partitioning on a backlight module, and control brightness of an area with small partitioned LED lamps, and have the advantages of low power consumption, high contrast and the like. However, the Mini LED is limited by the size of the LED chip, resulting in limited contrast and brightness of the Mini LED.

SUMMERY OF THE UTILITY MODEL

The present disclosure is directed to a light emitting assembly and a display device, which can shorten the distance between LED light emitting chips, increase the number of LEDs arranged, and further improve the contrast and brightness of the display device.

The first aspect of the present disclosure provides a light emitting assembly, including a first substrate and a second substrate, which are stacked, wherein the first substrate is provided with a plurality of first package regions arranged in an array, and the first package regions package light emitting chips of at least two colors; a plurality of second packaging areas arranged in an array are arranged on the second substrate, and the second packaging areas package at least one color of light-emitting chips; the orthographic projection of the second packaging area on the first substrate is positioned between the adjacent first packaging areas.

In an exemplary embodiment of the present disclosure, an orthogonal projection of the second package region on the first substrate is located in a different row from the first package region.

In an exemplary embodiment of the present disclosure, the first package region packages first and second light emitting chips arranged at intervals in a row direction and having different colors, and the second package region packages a third light emitting chip having a color different from that of the first and second light emitting chips; the orthographic projection of the second packaging area on the first substrate is positioned between two adjacent rows of the first packaging areas.

In an exemplary embodiment of the present disclosure, an orthographic projection of the third light emitting chip on the first substrate is located in a different row and a different column from the first light emitting chip and the second light emitting chip.

In an exemplary embodiment of the present disclosure, a distance between an orthographic projection of the third light emitting chip on the first substrate and an oblique direction of the first light emitting chip and the second light emitting chip is the same as a distance between the first light emitting chip and the second light emitting chip in a horizontal direction.

In an exemplary embodiment of the present disclosure, in a column direction, the first light emitting chip or the second light emitting chip in each column of the first package region is opposite in the column direction.

In an exemplary embodiment of the present disclosure, the first and second package regions are each packaged with first, second, and third light emitting chips arranged in a row direction.

In an exemplary embodiment of the present disclosure, an orthogonal projection of the second package region on the first substrate is located between two adjacent columns of the first package regions, and orthogonal projections of the first, second, and third light emitting chips in the second package region on the first substrate are located in different rows and different columns from those of the first, second, and third light emitting chips in the first package region.

In an exemplary embodiment of the present disclosure, orthographic projections of the first, second and third light emitting chips in the second package region on the first substrate are located on a same row or a same column as the first, second and third light emitting chips in the first package region.

The second aspect of the present disclosure provides a display device, which includes a display panel and the light emitting module of any one of the above embodiments, wherein the display panel is disposed on the light emitting side of the light emitting module.

The scheme disclosed by the invention has the following beneficial effects:

the scheme of the disclosure includes a light emitting assembly and a display device. The method comprises the steps that light-emitting chips with different or same quantity and color are packaged in a first packaging area and a second packaging area of two substrates, then the two substrates are stacked, and after stacking, the orthographic projection of the second packaging area on the first substrate is located between adjacent first packaging areas, so that a light-emitting assembly is formed; by packaging the light-emitting chips on the two substrates, the distance between the orthographic projection of the second packaging area on the first substrate and the first packaging area can be shortened, and then more light-emitting chips can be arranged on the same row and/or the same column, so that the arrangement number of the LEDs can be increased on the basis of ensuring that the sizes of the LED light-emitting chips are not changed, and the contrast and the brightness of the display device can be improved; in addition, the same or different light-emitting chips are packaged on the two substrates respectively, so that the manufacturing difficulty of the light-emitting chips can be reduced, the same or different light-emitting chips can be manufactured on the two substrates more easily, and the production cost is reduced.

Additional features and advantages of the disclosure will be set forth in the detailed description which follows, or in part will be obvious from the description, or may be learned by practice of the disclosure.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure. It should be apparent that the drawings in the following description are merely examples of the disclosure and that other drawings may be derived by those of ordinary skill in the art without inventive effort.

Fig. 1 illustrates a schematic structural diagram of a first substrate provided in a first embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a second substrate according to a first embodiment of the disclosure;

FIG. 3 is a schematic diagram of the structure of FIG. 2 and FIG. 1 superimposed to form a light emitting assembly;

fig. 4 is a schematic structural diagram of a second substrate provided in the first embodiment of the disclosure;

FIG. 5 is a schematic diagram showing the structure of FIG. 4 superimposed on FIG. 1 to form a light emitting assembly;

fig. 6 shows a schematic structural diagram of a first substrate provided in a second embodiment of the disclosure;

fig. 7 shows a schematic structural diagram of a second substrate provided in the second embodiment of the disclosure;

FIG. 8 is a schematic view of the superposition of FIGS. 7 and 6 to form a light-emitting assembly;

fig. 9 shows a schematic structural diagram of a first substrate provided in a third embodiment of the present disclosure;

fig. 10 shows a schematic structural diagram of a second substrate provided in the third embodiment of the present disclosure;

fig. 11 shows a schematic structure of the light emitting assembly formed by overlapping fig. 10 and fig. 9.

Description of reference numerals:

10. a first substrate; 101. a first package region; 20. a second substrate; 201. a second package region; 301. a red light emitting chip; 302. a green light emitting chip; 303. and a blue light emitting chip.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art.

In the present disclosure, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present disclosure, "a plurality" means two or more unless specifically limited otherwise.

In the present disclosure, unless expressly stated or limited otherwise, the terms "mounted," "connected," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present disclosure can be understood as a specific case by a person of ordinary skill in the art.

Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the embodiments of the disclosure can be practiced without one or more of the specific details, or with other methods, components, devices, steps, and the like. In other instances, well-known methods, devices, implementations, or operations have not been shown or described in detail to avoid obscuring aspects of the disclosure.

Example one

The first embodiment of the present disclosure provides a light emitting assembly, which includes a first substrate 10 and a second substrate 20 stacked in a stacked manner.

As shown in fig. 1, a plurality of first package regions 101 arranged in a row direction X and a column direction Y in an array are disposed on the first substrate 10, and the first package regions 101 package at least two colors of light emitting chips; for example, the first package region 101 packages a red light emitting chip 301 and a blue light emitting chip 303; or, the first package region 101 packages the red light emitting chip 301, the green light emitting chip 302, and the blue light emitting chip 303, etc.

Referring to fig. 2, the second substrate 20 is also provided with a plurality of second package regions 201 arranged in a row direction X and a column direction Y, and the second package regions 201 also package at least one color of light emitting chips.

It should be noted that the number of the light emitting chips packaged in the second packaging region 201 may be the same as or different from the number of the light emitting chips in the first packaging region 101. For example: the first packaging area 101 packages 2 light emitting chips, and the second packaging area 201 packages 1 light emitting chip; the first package region 101 packages 3 light emitting chips, and the second package region 201 packages 3 light emitting chips.

In addition, the color of the light emitting chip packaged in the second package region 201 may be the same as or different from the color of the light emitting chip in the first package region 101. For example: the first packaging area 101 packages red and blue light emitting chips 303, and the second packaging area 201 packages green light emitting chips 302; the first package region 101 packages the red, green and blue light emitting chips 303 and the second package region 201 packages the red, green and blue light emitting chips 303.

Further, the first substrate 10 may be located above or below the second substrate 20, and may be stacked according to different structures, which is not limited in detail herein.

Illustratively, referring to fig. 3, the first substrate 10 is located below the second substrate 20, and the second substrate 20 is disposed above the light emitting chips packaged in the first package region 101.

In order to increase transmittance and ensure brightness display of the LED, glass substrates are used for the first substrate 10 and the second substrate 20.

Furthermore, the orthographic projection of the second packaging region 201 on the first substrate 10 is located between the adjacent first packaging regions 101. Like this, can encapsulate the same or different quantity respectively on two base plates, the luminous chip of colour, reduce the quantity of encapsulating luminous chip on a base plate, so that it is simpler to encapsulate luminous chip on the base plate, reduce the orthographic projection of luminous chip in second encapsulated area 201 on first base plate 10 apart from the interval of luminous chip in first encapsulated area 101, and then can increase the range quantity of luminous chip on same line and/or same row on a base plate, and then increase LED's range quantity, possess more careful subregion of adjusting luminance, obtain better contrast and display effect.

The orthographic projection of the second package region 201 on the first substrate 10 may be located in a different row from the first package region 101. Therefore, the distance between the orthographic projection of the light-emitting chips in the second packaging area 201 on the first substrate 10 and the light-emitting chips in the first packaging area 101 can be shortened, the gap between two adjacent rows of first packaging areas 101 can be utilized, the arrangement quantity of the LEDs can be increased, and the better contrast and display effect can be improved.

In an alternative embodiment, two first light emitting chips and two second light emitting chips which are arranged at intervals in the row direction X and have different colors are packaged in the first package region 101; the second package region 201 packages a third light emitting chip having a different color from the first and second light emitting chips; referring to fig. 3, an orthographic projection of the third light emitting chip in the second package region 201 on the first substrate 10 is located between the first light emitting chip and the second light emitting chip, that is, an orthographic projection of the second package region 201 on the first substrate 10 is located between two adjacent rows of the first package regions 101.

Illustratively, referring to fig. 1, a red light emitting chip 301 and a blue light emitting chip 303 are packaged in a first package region 101; referring to fig. 2, green light emitting chips 302 are packaged in the second package region 201, and an orthogonal projection of the green light emitting chips 302 on the first substrate 10 is positioned in different rows and different columns from the red light emitting chips 301 and the blue light emitting chips 303, and forms a V-shaped structure with the red light emitting chips 301 and the blue light emitting chips 303, as shown in fig. 3. In this way, the second substrate 20 and the first substrate 10 are stacked to form an RGB Mini LED three-color light emitting backlight.

With this structure, it is not necessary to package the green light emitting chip 302 on the first substrate 10, but only the red light emitting chip 301 and the blue light emitting chip 303 are packaged on the first substrate 10. Therefore, more red light-emitting chips 301 and more blue light-emitting chips 303 can be arranged on the same row and/or the same column, and the gap between two adjacent rows of the first packaging regions 101 is utilized to further arrange more LEDs, so that the RGB three-primary-color light mixing distance is shortened, the LED three-primary-color light mixing device has more delicate light adjusting partitions, and better contrast and display effect are obtained. Moreover, the orthographic projection of the green light emitting chip 302 on the first substrate 10 forms a V shape with the red light emitting chip 301 and the blue light emitting chip 303, that is, the orthographic projection of the second package region 201 on the first substrate 10 is sandwiched between two adjacent rows of the first package regions 101, and the second package region 201 and the first package regions 101 are located in the same column.

Further, the pitch of the orthographic projection of the green light-emitting chip 302 on the first substrate 10 from the red light-emitting chip 301 and the blue light-emitting chip 303 in the oblique direction is the same as the pitch of the red light-emitting chip 301 from the blue light-emitting chip 303 in the horizontal direction; that is, the orthographic projection of the green light emitting chip 302 on the first substrate 10 forms an equilateral triangle with the connection of the red light emitting chip 301 and the blue light emitting chip 303. Therefore, the light emitting colors and the positions have certain complementary effects, and the uniformity of mixed light can be improved.

It should be noted that, the distance between the adjacent first package regions 101 may be equal to the distance between the red light emitting chip 301 and the blue light emitting chip 303, so as to improve the uniformity of light mixing; and the distance between the first package regions 101 of two adjacent columns is greater than the package width of the second package region 201, so as to ensure that the green light emitting chips 302 are located in the first package regions 101 between two adjacent rows. Or the distance between two adjacent rows of the first package regions 101 may be smaller than the distance between the red light emitting chip 301 and the blue light emitting chip 303, so as to ensure that more LED light emitting chips can be arranged, and further have more detailed dimming partitions, and obtain better contrast and display effect.

For example, the distance between the red light emitting chip 301 and the blue light emitting chip 303 may be 7mm, 8mm or 9mm, and the distance between two adjacent rows of the red light emitting chips 301 may also be 7mm, 8mm or 9mm.

In addition, the green light emitting chips 302 are spaced from the red light emitting chips 301 and the blue light emitting chips 303 between two adjacent rows by the same distance, so as to improve the uniformity of light mixing.

In another alternative embodiment, the second package region 201 further includes a third light emitting chip, which is located in a different row and a different column from the first package region 101 in an orthographic projection on the first substrate 10, that is, the second package region 201 may further form a "Z" shaped structure in the orthographic projection on the first substrate 10. Therefore, the light mixing distance of the three primary colors of RGB can be further reduced, more LED light emitting chips are further arranged, more detailed dimming partitions are obtained, and better contrast and display effects are obtained.

For example, referring to fig. 4 and 5, the orthogonal projection of the second package region 201 on the first substrate 10 includes both green light emitting chips 302 between two adjacent rows; also included are green light-emitting chips 302 on different rows and different columns, that is, the orthographic projection of the green light-emitting chips 302 on the first substrate 10 is located at the lower right corner of the blue light-emitting chips 303 in the first package region 101 and at the lower left corner of the red light-emitting chips 301 in the adjacent two columns of the first package region 101.

It is worth mentioning that, referring to fig. 1, 3 and 5, in the column direction Y, the first light emitting chip or the second light emitting chip in the first package region 101 is opposite in the column direction; that is, the first package regions 101 package light emitting chips of the same color in the column direction. For example, in the same column direction Y, the first package regions 101 package the red light emitting chips 301 and the blue light emitting chips 303, the first package regions 101 of two adjacent rows also package the red light emitting chips 301 and the blue light emitting chips 303, and the red light emitting chips 301 in the two adjacent first package regions 101 are located in the same column.

It should be noted that the first package region 101 may also be disposed in a staggered manner; for example, in the same column direction Y, the first package regions 101 package the red light emitting chips 301 and the blue light emitting chips 303, and the first package regions 101 in two adjacent rows also package the red light emitting chips 301 and the blue light emitting chips 303, but at this time, the red light emitting chips 301 in the first package regions 101 and the blue light emitting chips 303 in the first package regions 101 in the adjacent rows are located in the same column, that is, in the same column direction Y, the red light emitting chips 301 and the blue light emitting chips 303 are alternately arranged.

Example two

The second embodiment of the present disclosure is different from the first embodiment in that the first package region 101 and the second package region 201 are respectively packaged with a first light emitting chip, a second light emitting chip, and a third light emitting chip which are arranged at intervals in the row direction X.

Alternatively, referring to fig. 6, the first package region 101 packages the red light emitting chips 301, the green light emitting chips 302, and the blue light emitting chips 303, and the red light emitting chips 301, the green light emitting chips 302, and the blue light emitting chips 303 in the first package region 101 are arranged at intervals in the row direction X; referring to fig. 7, the second package region 201 packages the red, green and blue light emitting chips 301, 302 and 303, and the red, green and blue light emitting chips 301, 302 and 303 in the first package region 101 are spaced apart in the row direction X. The red light-emitting chip 301, the green light-emitting chip 302 and the blue light-emitting chip 303 are arranged in sequence, and the longer the corresponding wavelength is, the better the penetration capability is, and the loss of light energy in the penetration process can be reduced. In addition, the orthographic projection of the second package region 201 on the first substrate 10 is located in different rows and different columns from the first package region 101, and forms a zigzag shape with the adjacent first package region 101. Therefore, the distance between the adjacent LED light-emitting chips can be reduced, so that the LED light-emitting chips have more delicate dimming partitions, and better contrast and display effect are obtained.

Illustratively, referring to fig. 6, the red light-emitting chips 301, the green light-emitting chips 302, and the blue light-emitting chips 303 in the first package region 101 are arranged at 7mm pitch intervals in the row direction X, and the red light-emitting chips 301, the green light-emitting chips 302, and the blue light-emitting chips 303 in the second package region 201 are also arranged at 7mm pitch intervals in the row direction X; in addition, the pitch between the first package regions 101 of two adjacent columns is spaced at a pitch greater than 7mm, for example, the pitch between the first package regions 101 of two adjacent columns is arranged at a pitch of 15mm, 17mm or 20mm, so that the orthographic projection of the light emitting chips of the second package region 201 on the first substrate 10 can be located between the first package regions 101 of two adjacent columns and form a "Z" shaped structure with the adjacent first package regions 101, as shown in fig. 8.

That is, the red light emitting chip 301, the green light emitting chip 302, and the blue light emitting chip 303 packaged in the first package region 101 are defined as a first pixel unit, and the red light emitting chip 301, the green light emitting chip 302, and the blue light emitting chip 303 packaged in the second package region 201 are defined as a second pixel unit. A plurality of first pixel units arranged in an array are correspondingly disposed on the first substrate 10, a plurality of second pixel units arranged in an array are correspondingly disposed on the second substrate 20, and a distance between adjacent first pixel units may be equal to a distance between adjacent second pixel units, so as to improve uniformity of light mixing. Moreover, the orthographic projection of the second pixel unit on the first substrate 10 is located at the lower right of the first pixel unit and located at the lower left of the first pixel units in two adjacent columns, that is, the second pixel unit and two adjacent first pixel units form a V-shaped structure, and the first pixel unit and the second pixel unit are located in different rows and different columns, as shown in fig. 8.

It is understood that the orthographic projection of the red light emitting chip 301 on the first substrate 10 in the second pixel unit is adjacent to the blue light emitting chip 303 in the first pixel unit, and the orthographic projection of the blue light emitting chip 303 on the first substrate 10 in the second pixel unit is adjacent to the red light emitting chip 301 in the first pixel unit; that is to say, the design can reduce the distance between the orthographic projections of the blue light-emitting chip 303 in the first pixel unit and the red light-emitting chip 301 in the second pixel unit and the distance between the orthographic projections of the red light-emitting chip 301 in the first pixel unit and the blue light-emitting chip 303 in the second pixel unit, and after the first substrate 10 and the second substrate 20 are overlapped, the packaging number of the LED light-emitting chips is increased by using the gap between two adjacent rows, so as to improve the display brightness and the contrast.

In addition, the color of the light emitting chips in the first package region 101 and the second package region 201 on the same column is the same, so that the process difficulty is reduced.

It should be noted that, referring to fig. 8, the distance between the first package regions 101 in two adjacent rows may be equal to the distance between the adjacent light emitting chips, and the distance should be greater than the length of the light emitting chips in the second package region 201, so that the orthographic projection of the light emitting chips in the second package region 201 on the first substrate 10 is accommodated between the adjacent first package regions 101.

In addition, a larger distance is adopted between the first pixel units in two adjacent columns, so that the packaging process difficulty can be reduced, and the production progress can be improved.

EXAMPLE III

The third embodiment is different from the second embodiment in that, referring to fig. 9 to 11, orthogonal projections of the first light emitting chip, the second light emitting chip, and the third light emitting chip in the second package region 201 on the first substrate 10 are located in the same row or the same column as the first light emitting chip, the second light emitting chip, and the third light emitting chip in the adjacent first package region 101. Therefore, the distance between two adjacent rows of the first packaging areas 101 can be set in a larger range, and the process difficulty of packaging the light-emitting chips is reduced.

In an alternative embodiment, referring to fig. 9, the red light-emitting chips 301, the green light-emitting chips 302, and the blue light-emitting chips 303 are packaged in the first package region 101 and arranged at intervals of 7mm in the row direction X; referring to fig. 10, the red light emitting chips 301, the green light emitting chips 302, and the blue light emitting chips 303 in the second package region 201 are also arranged at intervals of 7mm in the row direction X; in addition, the pitch between the first package regions 101 of two adjacent columns is set at a pitch interval greater than 7mm, for example, the pitch between the first package regions 101 of two adjacent columns is arranged at a pitch of 15mm, 17mm, or 20mm, so that the orthographic projection of the light emitting chips of the second package region 201 on the first substrate 10 may be located between the first package regions 101 of two adjacent columns.

In addition, the orthographic projection of the light emitting chips of the second package region 201 on the first substrate 10 is located in the same row with the first package region 101, and is arranged side by side, as shown in fig. 11. In this way, after the first substrate 10 and the second substrate 20 are stacked, the orthogonal projection of the light emitting chips on the first substrate 10 in the second package region 201 and the distance between the light emitting chips in the first package region 101 are reduced, and thus the number of the LED light emitting chips arranged in the same row or the same column can be increased, and the display brightness and the contrast can be increased.

It should be noted that, the distance between the first package regions 101 in the two adjacent rows is set to be greater than the distance between the light emitting chips, which not only enables the orthographic projection of the light emitting chips on the second substrate 20 on the first substrate 10 to be located between the first package regions 101, but also reduces the difficulty in packaging the light emitting chips by the first substrate 10, and improves the production efficiency.

In addition, the distance between the two adjacent rows of the first package regions 101 may be equal to or smaller than the distance between the adjacent light emitting chips, so as to shorten the distance between the two adjacent rows of the first package regions 101, increase the arrangement number of the light emitting chips, further improve the arrangement number of the LEDs, and improve the display brightness and the contrast.

It is worth mentioning that, compared with the second embodiment in which a "Z" arrangement is adopted, the parallel tiling manner can arrange more LED light emitting chips, thereby obtaining wider brightness and color gamut.

In another alternative embodiment, when the orthographic projection of the second package region 201 on the first substrate 10 is located in the same column as the first package region 101, the design structure and the basic principle are the same as those in the same row, and are not repeated herein.

Example four

The fourth embodiment provides a display device, which includes a display panel and the light emitting device in the first embodiment, the second embodiment or the third embodiment, wherein the display panel is disposed on the light emitting side of the light emitting device, so as to provide display brightness. In addition, the arrangement number of the LED light-emitting chips can be increased by adopting a mode of superposing the two substrates, so that the backlight module has more delicate dimming partitions, and the backlight device can obtain better contrast and display effect.

In the description herein, references to the description of the terms "some embodiments," "exemplary," etc. mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or exemplary is included in at least one embodiment or exemplary of the present disclosure. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present disclosure have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present disclosure, and that changes, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present disclosure, and therefore all changes and modifications that are intended to be covered by the claims and the specification of this disclosure are within the scope of the patent disclosure.

Claims (10)

1. A light-emitting assembly is characterized by comprising a first substrate and a second substrate which are arranged in a stacked mode, wherein a plurality of first packaging areas which are arranged in an array mode are arranged on the first substrate, and the first packaging areas package light-emitting chips of at least two colors; a plurality of second packaging areas arranged in an array are arranged on the second substrate, and the second packaging areas package at least one color of light-emitting chips; the orthographic projection of the second packaging area on the first substrate is positioned between the adjacent first packaging areas.

2. The light-emitting assembly according to claim 1, wherein an orthogonal projection of the second package region on the first substrate is located in a different row from the first package region.

3. The light emitting assembly of claim 2, wherein the first package region encapsulates a first light emitting chip and a second light emitting chip which are arranged at an interval in the row direction and have different colors, and the second package region encapsulates a third light emitting chip which has a different color from the first light emitting chip and the second light emitting chip; the orthographic projection of the second packaging area on the first substrate is positioned between two adjacent rows of the first packaging areas.

4. The light emitting assembly of claim 3, wherein an orthographic projection of the third light emitting chip on the first substrate is in a different row and a different column than the first light emitting chip and the second light emitting chip.

5. The light assembly of claim 4, wherein an orthogonal projection of the third light emitting chip on the first substrate is spaced apart from the first and second light emitting chips in an oblique direction by a distance equal to a horizontal distance between the first light emitting chip and the second light emitting chip.

6. The light emitting assembly according to any one of claims 3 to 5, wherein the first light emitting chip or the second light emitting chip in each column of the first package region is opposite in a column direction.

7. The light emitting assembly of claim 1, wherein the first and second package regions each package a first, second, and third light emitting chips arranged in a row direction.

8. The light emitting assembly of claim 7, wherein an orthographic projection of the second package region on the first substrate is located between two adjacent columns of the first package regions, and wherein orthographic projections of the first, second and third light emitting chips in the second package region on the first substrate are located in different rows and different columns than the first, second and third light emitting chips in the first package region.

9. The lighting assembly according to claim 7,

orthographic projections of the first light-emitting chip, the second light-emitting chip and the third light-emitting chip in the second packaging area on the first substrate are positioned in the same row or the same column as the first light-emitting chip, the second light-emitting chip and the third light-emitting chip in the first packaging area.

10. A display device, comprising a display panel and the light-emitting assembly of any one of claims 1 to 9, wherein the display panel is disposed on a light-emitting side of the light-emitting assembly.

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