TWI819043B - 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體元件及熱鹼產生劑 - Google Patents

感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體元件及熱鹼產生劑 Download PDF

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TWI819043B
TWI819043B TW108126691A TW108126691A TWI819043B TW I819043 B TWI819043 B TW I819043B TW 108126691 A TW108126691 A TW 108126691A TW 108126691 A TW108126691 A TW 108126691A TW I819043 B TWI819043 B TW I819043B
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Taiwan
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group
resin composition
photosensitive resin
formula
patent application
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TW108126691A
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English (en)
Chinese (zh)
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TW202024786A (zh
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野崎敦靖
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日商富士軟片股份有限公司
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/065—Polyamides; Polyesteramides; Polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Formation Of Insulating Films (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
TW108126691A 2018-09-26 2019-07-29 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體元件及熱鹼產生劑 TWI819043B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018181016 2018-09-26
JP2018-181016 2018-09-26

Publications (2)

Publication Number Publication Date
TW202024786A TW202024786A (zh) 2020-07-01
TWI819043B true TWI819043B (zh) 2023-10-21

Family

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TW108126691A TWI819043B (zh) 2018-09-26 2019-07-29 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體元件及熱鹼產生劑

Country Status (5)

Country Link
JP (1) JP7038223B2 (ko)
KR (1) KR102533836B1 (ko)
CN (1) CN112639615A (ko)
TW (1) TWI819043B (ko)
WO (1) WO2020066244A1 (ko)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010139860A (ja) * 2008-12-12 2010-06-24 Nissan Chem Ind Ltd ポリヒドロキシウレア樹脂含有ポジ型感光性樹脂組成物
TW201708957A (zh) * 2015-06-30 2017-03-01 Fujifilm Corp 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法及半導體元件
TW201817773A (zh) * 2016-06-29 2018-05-16 富士軟片股份有限公司 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法、半導體元件、積層體的製造方法、半導體元件的製造方法及聚醯亞胺前驅物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101775570B1 (ko) * 2010-12-20 2017-09-07 삼성전자주식회사 폴리이미드 전구체 조성물, 폴리이미드의 제조 방법, 상기 제조 방법에 따라 제조한 폴리이미드 및 상기 폴리이미드를 포함하는 필름
JP5782951B2 (ja) * 2011-09-20 2015-09-24 Jsr株式会社 硬化性組成物及び硬化膜
TWI486335B (zh) 2011-12-29 2015-06-01 Eternal Materials Co Ltd 鹼產生劑
JP2013241548A (ja) * 2012-05-22 2013-12-05 Jsr Corp 塩基発生剤、硬化膜形成用樹脂組成物、硬化膜及び硬化膜の形成方法
JP2016050259A (ja) * 2014-08-29 2016-04-11 Jsr株式会社 硬化性組成物、硬化膜、半導体素子及び表示素子
CN107709407B (zh) * 2015-05-29 2020-11-17 富士胶片株式会社 聚酰亚胺前体组合物、感光性树脂组合物、固化膜、固化膜的制造方法、半导体器件及聚酰亚胺前体组合物的制造方法
TWI634135B (zh) * 2015-12-25 2018-09-01 日商富士軟片股份有限公司 樹脂、組成物、硬化膜、硬化膜的製造方法及半導體元件

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010139860A (ja) * 2008-12-12 2010-06-24 Nissan Chem Ind Ltd ポリヒドロキシウレア樹脂含有ポジ型感光性樹脂組成物
TW201708957A (zh) * 2015-06-30 2017-03-01 Fujifilm Corp 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法及半導體元件
TW201817773A (zh) * 2016-06-29 2018-05-16 富士軟片股份有限公司 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法、半導體元件、積層體的製造方法、半導體元件的製造方法及聚醯亞胺前驅物

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Publication number Publication date
WO2020066244A1 (ja) 2020-04-02
JP7038223B2 (ja) 2022-03-17
CN112639615A (zh) 2021-04-09
TW202024786A (zh) 2020-07-01
KR102533836B1 (ko) 2023-05-18
JPWO2020066244A1 (ja) 2021-08-30
KR20210035258A (ko) 2021-03-31

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