TWI816663B - 靶材的洗淨方法與靶材洗淨裝置、靶材的製造方法以及回收鑄塊的製造方法 - Google Patents
靶材的洗淨方法與靶材洗淨裝置、靶材的製造方法以及回收鑄塊的製造方法 Download PDFInfo
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- TWI816663B TWI816663B TW107110324A TW107110324A TWI816663B TW I816663 B TWI816663 B TW I816663B TW 107110324 A TW107110324 A TW 107110324A TW 107110324 A TW107110324 A TW 107110324A TW I816663 B TWI816663 B TW I816663B
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Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
Landscapes
- Physical Vapour Deposition (AREA)
- Processing Of Solid Wastes (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-068470 | 2017-03-30 | ||
| JP2017068470 | 2017-03-30 | ||
| JP2017-196245 | 2017-10-06 | ||
| JP2017196245A JP6533265B2 (ja) | 2017-03-30 | 2017-10-06 | ターゲット材の洗浄のための装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201837189A TW201837189A (zh) | 2018-10-16 |
| TWI816663B true TWI816663B (zh) | 2023-10-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107110324A TWI816663B (zh) | 2017-03-30 | 2018-03-26 | 靶材的洗淨方法與靶材洗淨裝置、靶材的製造方法以及回收鑄塊的製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (2) | JP6533265B2 (enrdf_load_stackoverflow) |
| TW (1) | TWI816663B (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109161862A (zh) * | 2018-11-01 | 2019-01-08 | 广西晶联光电材料有限责任公司 | 一种平面和旋转靶材解绑定的装置及方法 |
| JP6692486B1 (ja) * | 2019-02-15 | 2020-05-13 | 住友化学株式会社 | ターゲット材の洗浄方法、ターゲット材の製造方法及びリサイクル鋳塊の製造方法 |
| JP6755378B1 (ja) * | 2019-03-28 | 2020-09-16 | 住友化学株式会社 | ターゲット材の研磨方法、ターゲット材の製造方法及びリサイクル鋳塊の製造方法 |
| CN118685626B (zh) * | 2024-08-27 | 2024-12-31 | 有研亿金新材料有限公司 | 一种利用电磁感应加热技术高效回收扩散焊接靶材的方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002053953A (ja) * | 2000-08-04 | 2002-02-19 | Tosoh Corp | スパッタリングターゲットの製造方法 |
| JP2008149297A (ja) * | 2006-12-20 | 2008-07-03 | Kn Lab Analysis:Kk | 剥離洗浄装置 |
| CN106282938A (zh) * | 2015-05-13 | 2017-01-04 | 宁波创润新材料有限公司 | 回收靶材的方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1046327A (ja) * | 1996-07-31 | 1998-02-17 | Sumitomo Chem Co Ltd | スパッタリングターゲットおよびその製造方法 |
| JP4286076B2 (ja) * | 2003-06-30 | 2009-06-24 | 三井金属鉱業株式会社 | 再生ターゲット材およびターゲット材の再生方法 |
| JP4409216B2 (ja) * | 2003-06-30 | 2010-02-03 | 三井金属鉱業株式会社 | ターゲット材の再生方法 |
| JP4270971B2 (ja) * | 2003-07-24 | 2009-06-03 | 三井金属鉱業株式会社 | スパッタリングターゲットの製造方法 |
| JP2007126736A (ja) * | 2005-11-07 | 2007-05-24 | Mitsui Mining & Smelting Co Ltd | スパッタリングターゲットおよびその製造方法 |
| EP2784174B1 (en) | 2012-01-12 | 2017-11-01 | JX Nippon Mining & Metals Corporation | High-purity copper sputtering target |
| JP6716452B2 (ja) * | 2014-03-31 | 2020-07-01 | 株式会社東芝 | 再生スパッタリングターゲットの製造方法および再生スパッタリング |
| KR20160134199A (ko) * | 2015-05-15 | 2016-11-23 | 희성금속 주식회사 | 재활용 타겟의 제조방법 및 이로부터 제조된 재활용 타겟 |
-
2017
- 2017-10-06 JP JP2017196245A patent/JP6533265B2/ja active Active
-
2018
- 2018-03-26 TW TW107110324A patent/TWI816663B/zh active
- 2018-06-05 JP JP2018107478A patent/JP7102237B2/ja active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002053953A (ja) * | 2000-08-04 | 2002-02-19 | Tosoh Corp | スパッタリングターゲットの製造方法 |
| JP2008149297A (ja) * | 2006-12-20 | 2008-07-03 | Kn Lab Analysis:Kk | 剥離洗浄装置 |
| CN106282938A (zh) * | 2015-05-13 | 2017-01-04 | 宁波创润新材料有限公司 | 回收靶材的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018172796A (ja) | 2018-11-08 |
| JP6533265B2 (ja) | 2019-06-19 |
| TW201837189A (zh) | 2018-10-16 |
| JP7102237B2 (ja) | 2022-07-19 |
| JP2018168465A (ja) | 2018-11-01 |
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