TWI811636B - 附有保護膜之無機基板/工程塑膠薄膜積層體、積層體之堆疊、積層體的保管方法、及積層體的運輸方法 - Google Patents
附有保護膜之無機基板/工程塑膠薄膜積層體、積層體之堆疊、積層體的保管方法、及積層體的運輸方法 Download PDFInfo
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- TWI811636B TWI811636B TW110106237A TW110106237A TWI811636B TW I811636 B TWI811636 B TW I811636B TW 110106237 A TW110106237 A TW 110106237A TW 110106237 A TW110106237 A TW 110106237A TW I811636 B TWI811636 B TW I811636B
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- engineering plastic
- plastic film
- inorganic substrate
- protective film
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Classifications
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- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
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- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/04—4 layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
- B32B2379/08—Polyimides
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- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
- Packages (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
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| TW201425016A (zh) * | 2012-10-25 | 2014-07-01 | Corning Inc | 可撓性多層密封積層板 |
| TW201517220A (zh) * | 2013-07-16 | 2015-05-01 | Toyo Boseki | 可撓性電子元件之製造方法 |
| WO2020067488A1 (ja) * | 2018-09-28 | 2020-04-02 | リンテック株式会社 | ガスバリア性積層体 |
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| JP2004269624A (ja) * | 2003-03-06 | 2004-09-30 | Sekisui Film Kk | 光学部品保護シート |
| JP2005125659A (ja) * | 2003-10-24 | 2005-05-19 | Nitto Denko Corp | 表面保護フィルム |
| MY141348A (en) * | 2005-05-16 | 2010-04-16 | Nissha Printing | Mounting structure of re-peelable protective panel and mounting sheet using the same |
| JP2008074037A (ja) * | 2006-09-25 | 2008-04-03 | Toray Ind Inc | 耐熱性フレキシブル金属積層板の製造方法 |
| JP5152104B2 (ja) | 2009-06-08 | 2013-02-27 | 東洋紡株式会社 | 積層体およびその製造方法 |
| JP5699606B2 (ja) | 2011-01-06 | 2015-04-15 | 東洋紡株式会社 | フィルムデバイス製造用ポリイミド前駆体溶液 |
| KR101648280B1 (ko) * | 2011-12-02 | 2016-08-12 | 샤프 가부시키가이샤 | 적층체 |
| EP2839953B1 (en) * | 2012-03-29 | 2020-08-05 | Lintec Corporation | Gas barrier laminate, method for producing same, member for electronic devices, and electronic device |
| JP6353184B2 (ja) * | 2012-07-26 | 2018-07-04 | 味の素株式会社 | 保護フィルム付き接着シート、積層体の製造方法、及びプリント配線板の製造方法 |
| TWI735411B (zh) * | 2014-06-18 | 2021-08-11 | 日商味之素股份有限公司 | 附保護薄膜之接著片 |
| JP6427459B2 (ja) * | 2015-04-17 | 2018-11-21 | 富士フイルム株式会社 | 機能性フィルムおよび機能性フィルムの製造方法 |
| JP7042211B2 (ja) * | 2016-03-04 | 2022-03-25 | リンテック株式会社 | 半導体加工用シート |
| CN108966671B (zh) * | 2016-03-24 | 2023-09-26 | 琳得科株式会社 | 支撑片及保护膜形成用复合片 |
| JP6998734B2 (ja) * | 2016-11-29 | 2022-01-18 | 住友化学株式会社 | 積層体及びこれを含むデバイス |
| JP6885412B2 (ja) * | 2017-01-18 | 2021-06-16 | コニカミノルタ株式会社 | 機能性フィルム積層体、及び、電子デバイスの製造方法 |
| JP2018173542A (ja) * | 2017-03-31 | 2018-11-08 | 株式会社半導体エネルギー研究所 | 素子、半導体装置、発光装置、表示装置、剥離方法、半導体装置の作製方法、発光装置の作製方法及び表示装置の作製方法 |
| JP2019133049A (ja) * | 2018-02-01 | 2019-08-08 | 日東電工株式会社 | 表面保護フィルム付光学積層体 |
| JP2020033400A (ja) * | 2018-08-27 | 2020-03-05 | 日東電工株式会社 | 積層体 |
| JP7115510B2 (ja) * | 2019-06-06 | 2022-08-09 | Ａｇｃ株式会社 | 積層基板、および梱包体 |
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| TW201425016A (zh) * | 2012-10-25 | 2014-07-01 | Corning Inc | 可撓性多層密封積層板 |
| TW201517220A (zh) * | 2013-07-16 | 2015-05-01 | Toyo Boseki | 可撓性電子元件之製造方法 |
| WO2020067488A1 (ja) * | 2018-09-28 | 2020-04-02 | リンテック株式会社 | ガスバリア性積層体 |
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| KR20220154099A (ko) | 2022-11-21 |
| TW202204145A (zh) | 2022-02-01 |
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| CN115243881A (zh) | 2022-10-25 |
| KR102665141B1 (ko) | 2024-05-10 |
| JP6962506B1 (ja) | 2021-11-05 |
| WO2021199798A1 (ja) | 2021-10-07 |
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