TWI811589B - Apparatus for removing dust, laser marking system including the same, and air flow induction unit - Google Patents

Abstract

Disclosed is a dust removal device, a laser marking system including the same, and an air Air flow guidance unit. The disclosed dust removal device is a device that performs a marking operation to remove generated dust by irradiating a laser beam to a semiconductor chip on a wafer, and includes: an air flow guide unit arranged at the lower part of the wafer, by The air blow generates a downward airflow that guides the surrounding air flow in a downward direction, so that the dust moves in a downward direction; and a suction unit sucks in the dust that moves in the downward direction by the air flow guiding unit. .

Description

Dust removal devices, laser marking systems including the same, and air Air flow guidance unit

The present invention relates to a dust removal device and a laser marking system including the same, and in particular to a method for effectively removing dust generated when using a laser marker to perform marking operations on chips formed on a wafer. A dust removal device for dust and a laser marking system including the dust removal device.

For the purpose of distinguishing wafers formed on a wafer by a semiconductor manufacturing process, a laser marking operation of marking each of the semiconductor wafers with letters or numbers using a laser marker may be performed. In this case, during the marking operation by irradiating the wafer with a laser beam, a large amount of dust may be generated in the marking work space, and if such dust remains in the marking work space, it may hinder the laser beam. The travel of the beam may degrade the mark quality, so the dust needs to be effectively removed.

An embodiment of the present invention provides a dust removal device and a laser marking system including the same.

In one aspect of the present invention, a dust removal device is provided. The dust removal device is a device that performs a marking operation by irradiating a laser beam on a semiconductor chip on a wafer to remove generated dust, including: An air flow guide unit is arranged at the lower part of the wafer, and uses air blowing to generate a downward airflow that guides the air flow around the wafer in a downward direction, so that the dust moves in a downward direction; and a suction unit ( suction unit), sucking in the dust moved downward by the air flow guide unit.

The air flow guide unit may include a ring-shaped structure including an outer wall through which at least one air flow inlet is formed and an inner wall through which a plurality of nozzles are formed.

External air is supplied at the at least one air inlet, and the plurality of nozzles can spray the air supplied by the at least one air inlet through the inner wall.

The nozzle may be arranged such that an outlet of the nozzle is inclined downward. Here, the angle at which the nozzle is tilted downward may be 10 degrees to 20 degrees.

At least one manifold may be arranged between the at least one air flow inlet and the plurality of nozzles, the at least one manifold being used to transfer air from the at least one Air supplied from one air inlet is evenly distributed to the plurality of nozzles.

The suction unit may be arranged at a window plate including a window for the laser beam to pass. The suction unit may be arranged on the outer contour of the window.

The suction surface of the suction unit may include a first surface that is arranged obliquely with respect to a direction of a downflow generated by the air flow guide unit and in which a plurality of first suction holes are formed.

The suction surface of the suction unit may further include a second surface arranged at a lower part of the first surface and formed with a plurality of second suction holes.

The dust removal device may further include a wiper, which is arranged to move back and forth on the window panel to clean dust accumulated at the window. A dust removal component may be arranged on the window panel between the wiper and the window, the dust removal component removing dust covering the wiper.

In another aspect of the present invention, a laser marking system is provided. The laser marking system includes: a frame supporting an outer outline of a wafer on which a semiconductor wafer is formed; and an air flow guide unit arranged at a lower part of the frame. , the air blowing generates a downward airflow that guides the air flow around it in the downward direction, so that the dust moves in the downward direction; the suction unit sucks in all the dust that moves in the downward direction by the air flow guiding unit. The dust; and a laser marker, arranged at the lower part of the suction unit, irradiates the semiconductor wafer with a laser beam to perform marking operations.

The air flow guide unit may include an annular structure including an outer wall through which at least one air inlet is formed and an inner wall through which a plurality of nozzles are formed.

The nozzle may be arranged such that an outlet of the nozzle is inclined downward.

The suction unit may be arranged at a window panel including a window for the laser beam to pass.

The suction unit may be arranged on the outer contour of the window.

The suction surface of the suction unit may include a first surface that is arranged obliquely with respect to a direction of a downflow generated by the air flow guide unit and in which a plurality of first suction holes are formed.

The suction surface of the suction unit may further include a second surface arranged at a lower part of the first surface and formed with a plurality of second suction holes.

A wiper may be further arranged on the window panel, and the wiper may clean dust accumulated at the window while moving back and forth.

In yet another aspect of the present invention, there is provided an air flow guide unit that guides the flow of surrounding air in a specific direction and generates a downward airflow that guides the flow of surrounding air in a downward direction by air blowing. , so that the dust moves downward.

According to embodiments of the present invention, dust generated when a laser marker irradiates a laser beam to a chip formed on a wafer to perform a marking operation is caused by air flow. The guide unit uses air blowing to generate a downward airflow that guides the air flow around it downward, so that it can move smoothly downward, and the dust moved in this way can be sucked into the suction unit and discharged to the outside. . Therefore, since dust generated by the marking operation in the marking operation space can be prevented from interfering with the progress of the laser beam, marking quality can be improved. In addition, the dust accumulated on the window is cleaned and removed by a wiper arranged on the window panel, thereby further improving the marking quality.

50:wafer

100:Laser marking system

110: Wafer frame

120:Air flow guidance unit

121:Outer wall

121a:Air flow inlet

122:Inner wall

122a:Nozzle

130:Suction unit

131: First surface

131a: First suction hole

132: Second surface

132a: Second suction hole

135:Dust collector

140:Window panel

145:Window

150:Laser marker

160: Manifold block

161:Supply pipe

162: Distribution pipe

171:Wiper

172:Dust removal parts

L: laser beam

W:wafer

x, y, z: direction

θ: angle

Figure 1 schematically illustrates a laser marking system according to an exemplary embodiment of the present invention.

FIG. 2 is an internal plan view showing the air flow guide unit shown in FIG. 1 .

3 is a cross-sectional view showing a nozzle formed on the inner wall of the air flow guide unit shown in FIG. 2 .

FIG. 4 shows a pattern in which air flows from the upper part to the lower part in the air flow guide unit shown in FIG. 1 .

FIG. 5 is a perspective view showing the suction unit shown in FIG. 1 .

Figures 6 and 7 show the suction unit and the wiper being arranged on the window panel.

Hereinafter, exemplary embodiments will be described in detail with reference to the accompanying drawings. In the following drawings, the same reference symbols refer to the same structural elements, and the size of each structural element in the drawings may be exaggerated for clarity and convenience of explanation. the other party In this regard, the embodiments described below are only illustrative, and various modifications can be made according to such embodiments.

Hereinafter, the terms described as "upper" or "upper" include not only the case of contacting and being directly located above, but also the case of being located above without contact. Singular expressions include plural expressions unless the context clearly indicates otherwise. In addition, when a certain part "includes" a certain component, this means that other components may be included without excluding other components unless otherwise specified.

The term "said" and similar indicative terms are used to correspond to both the singular and the plural. As for the steps constituting the method, unless the order is explicitly stated or there is no contrary description, the steps may be performed in an appropriate order. The steps are not necessarily limited to the order in which they are described. The use of all examples or illustrative terms is only for explaining technical ideas in detail, and does not limit the scope of the above examples or illustrative terms that are not limited to the scope of the patent application.

Figure 1 schematically illustrates a laser marking system (100) according to an exemplary embodiment of the present invention.

Referring to Figure 1, a laser marking system (100) includes: a wafer frame (110) loaded with a wafer (W); and a laser marker (150) that performs operations on a wafer (50) formed on the wafer (W). Laser marking operations; and dust removal devices to remove dust generated during laser marking operations.

The wafer (W) may include a semiconductor wafer such as a silicon wafer, but is not limited thereto, and may include wafers of various materials. The wafer (W) may have a diameter of, for example, about 300 mm, but this is only exemplary, and the wafer (W) may have a diameter other than this. diameters of various sizes.

A plurality of wafers (50) divided by a dicing process in a semiconductor manufacturing process are formed in the wafer (W). For example, a prescribed pattern of semiconductor elements may be formed in each of the wafers (50).

Wafers (W) may be loaded on wafer frame (110). Here, the wafer frame (110) may be made in a ring shape and arranged to support the outer contour of the wafer (W). On the other hand, the lower surface of the wafer (W) may be attached to a transparent adhesive tape (not shown).

The laser marker (150) performs a laser marking operation on the wafer (50) to achieve the purpose of distinguishing the wafers (50) formed on the wafer (W) from each other. Specifically, the laser marker (150) may illuminate each of the wafers (50) with a laser beam (L) to mark letters, numbers, or the like. In this embodiment, the laser marker (150) is arranged at the lower part of the wafer (W), and irradiates the lower surface of the wafer (50) open through the wafer frame (110) with a laser beam, thereby performing the marking operation. .

In the laser marking operation, dust is generated during the irradiation of the laser beam (L) by the laser marker (150) to each of the wafers (50), and if the dust thus generated remains in the marking operation space Within, the travel of the laser beam (L) emitted from the laser marker (150) is hindered by the dust, thereby possibly degrading the marking quality. In order to solve this problem, in this embodiment, a dust removal device can be used to effectively remove dust in the marking work space.

The dust removal device may include: an air flow guiding unit to generate downward airflow; and a suction unit to suck in dust. This dust removal device can be Placed between the wafer frame (110) and the laser marker (150).

The air flow guide unit (120) can generate a downward airflow that guides the air flow around the unit (120) in a downward direction through air blowing. FIG. 2 illustrates an internal plan view of the air flow guide unit (120). Referring to FIG. 2 , the air flow guide unit (120) may include a ring-shaped structure having an empty space formed therein. Such an air flow guide unit (120) may include: an outer wall (121) through which at least one air inlet (121a) is formed; and an inner wall (122) through which a plurality of nozzles (122a) are formed.

The air inlet (121a) formed in the outer wall (121) may function as an inlet for supplying external air to the inside of the air flow guide unit (120). On the other hand, such an air inlet (121a) may be connected to an air supply device (not shown), but is not limited thereto. FIG. 2 exemplarily shows a case where two air inlets (121a) are formed through the outer wall (121), but the invention is not limited to this, and the number of air inlets (121a) can be variously modified. In addition, the position where the air inlet (121a) is formed can be variously modified.

The nozzle (122a) formed in the inner wall (122) functions to inject air supplied from the air inlet (121a) around the inner wall (122). FIG. 2 illustrates a case where four nozzles (122a) are formed corresponding to one air inlet (121a) and a total of eight nozzles (122a) are formed on the inner wall (122). Here, the eight nozzles (122a) may be arranged at fixed intervals from each other on the inner wall (122). On the other hand, the number and position of the nozzles (122a) formed on the inner wall (122) can be variously modified.

At least one manifold for uniformly distributing air supplied from the air flow inlet (121a) to the nozzles (122a) may be further disposed in the internal space of the air flow guide unit (120). FIG. 2 exemplifies a case where one manifold is arranged corresponding to one air inlet (121a) and two manifolds are arranged in total. Each of the manifolds may include a supply tube (161), a manifold block (160), a plurality of distribution tubes (162). Here, the supply pipe (161) may be a passage connecting the air inlet (121a) and the manifold block (160), and the plurality of distribution pipes (162) may be a passage connecting the manifold block (160) and a plurality of nozzles. (122a). On the other hand, in this embodiment, multiple manifolds may also be arranged corresponding to one air inlet (121a).

A cross-section of each of the nozzles (122a) formed in the inner wall (122) of the air flow guide unit (120) shown in Fig. 2 is shown in Fig. 3 . Referring to FIG. 3 , each of the nozzles ( 122 a ) may be formed such that its outlet is inclined downward and penetrates the inner wall ( 122 ). Here, the angle (θ) at which the nozzle (122a) is tilted in the downward direction (y direction in FIG. 3) may be, for example, approximately 10 to 20 degrees. However, it does not need to be limited to this. Therefore, air can be sprayed from each of the nozzles (122a) in a direction inclined downward by about 10 to 20 degrees.

As described above, when air is sprayed from each of the nozzles (122a) in a direction inclined to the lower side, it is possible to spray air around each of the nozzles (122a) and in a region directly below the nozzle (122a) Forming a low pressure that is relatively low compared to its surroundings. Therefore, in the space formed inside the inner wall (122) of the air flow guide unit (120), a downward airflow that guides the flow of air from the upper direction to the lower direction can be generated as shown in FIG. 4 .

As described above, when the downdraft is generated by the air flow guide unit (120), the dust generated during the laser marking operation will not remain in the marking operation space, but will move downward and can be removed as will be described later. It is sucked in by the suction unit (130) and discharged to the outside.

The suction unit (130) may be disposed at a lower portion of the air flow guide unit (120), and may function to suck in dust moved downward by the downward airflow guided by the air flow guide unit (120).

Figure 5 is a perspective view showing the suction unit (130). Moreover, FIG. 6 shows a state in which the suction unit (130) is arranged at the window panel (140), and FIG. 7 is a side view of FIG. 6 .

Referring to FIGS. 5 to 7 , a window panel (140) may be arranged at a lower portion of the air flow guide unit (120). A transparent window (145) through which the laser beam (L) can pass is arranged at the window panel (140). Here, the window (145) may be arranged at a position corresponding to the wafer (W). The laser beam (L) emitted from the laser marker (150) passes through the window (145) and is irradiated to the lower surface of the wafer (50) formed on the wafer (W), whereby the marking operation can be performed.

The suction unit (130) can be arranged on the window panel (140) on the outer contour of the window (145). For example, the suction unit (130) may be arranged on one side of the window panel (140) in a manner surrounding three sides of the window (145).

The suction surface of the suction unit (130) may include a first surface (131) formed obliquely with respect to the direction of the downward airflow generated by the air flow guide unit (120), and may be formed on the first surface (131). Multiple first suctions are formed at (131) hole(131a). Therefore, by guiding the downward airflow generated by the air flow guide unit (120) toward the inclined first surface (131) side of the suction unit (130), it is possible to pass the first air flow formed in the suction unit (130). The first suction hole (131a) on the surface effectively sucks in dust.

In addition, the suction surface of the suction unit (130) may further include a second surface (132) arranged below the aforementioned first surface (131), and a plurality of second surfaces (132) may be formed on this second surface (132). Suction hole (132a). Dust that has not been sucked into the inclined first surface (131) of the suction unit (130) and has fallen on the window and moved to the edge side of the window (145) by the wiper (171) described later Dust may be sucked in through the second suction hole (132a) formed on the second surface (132) of the suction unit (130).

On the other hand, a dust collector (135) for discharging dust flowing into the inside of the suction unit (130) to the outside may be disposed at a lower portion of the suction unit (130). At such a dust collector (135) drive means (not shown) for providing an attraction force to the suction unit (130) can be connected.

A wiper (171) can also be further arranged on the other side of the window panel (140). Here, the wiper (171) may function to remove dust accumulated on the upper surface of the window (145). Specifically, the wiper (171) may be disposed on the window panel (140) in such a manner that it can move back and forth in one direction (x direction in FIG. 7). As mentioned above, the wiper (171) moves back and forth on the window panel (140) while cleaning the dust generated by the laser marking operation and accumulated on the upper surface of the window (145), thereby removing the dust from the window (145). Remove dust.

In addition, the window panel (140) located between the window (145) and the wiper (171) A dust removal component (172) can also be arranged on it. Here, the dust covering the wiper (171) can be removed from the wiper (171) by the wiper (171) moving and passing through the dust removal component (172). As described above, by arranging the wiper (171) on the window panel (140) for cleaning and removing dust accumulated on the window (145), the marking quality can be further improved.

According to the above exemplary embodiment, the dust generated when the laser marker (150) irradiates the laser beam (L) to the wafer (50) formed on the wafer (W) to perform the marking operation is made by using air. The air flow guide unit (120) that generates a downward airflow that guides the air flow around it in the downward direction is purged, so that the dust moving downward can be smoothly moved in the downward direction, and the dust moved downward in this way can be sucked to the suction unit (130 ) and discharged to the outside. Therefore, dust generated by the marking operation in the marking operation space can be prevented from interfering with the progress of the laser beam (L), thereby improving the marking quality. In addition, the dust accumulated on the window (145) is cleaned and removed by the wiper (171) arranged on the window panel (140), thereby further improving the marking quality.

Although the embodiments of the present invention have been described above, they are only illustrative, and those of ordinary skill in the art will understand that various modifications and other equivalent embodiments can be made accordingly.

50:wafer

100:Laser marking system

110: Wafer frame

120:Air flow guidance unit

121:Outer wall

122:Inner wall

130:Suction unit

140:Window panel

145:Window

150:Laser marker

L: laser beam

W:wafer

x, y, z: direction

Claims (20)

A dust removal device is a device that performs a marking operation to remove generated dust by irradiating a laser beam to a semiconductor chip on a wafer, including: an air flow guide unit arranged at a lower part of the wafer, and Air is sprayed downward through a plurality of nozzles, and air blowing generates a downward airflow that guides the air flow around it downward, so that the dust moves downward; and a suction unit is arranged in the The dust moved downward by the air flow guide unit is sucked into the window panel of the window through which the laser beam passes. The dust removal device according to claim 1, wherein the air flow guide unit includes an annular structure, and the annular structure includes an outer wall formed through at least one air flow inlet and an outer wall formed through the The inner wall of multiple nozzles. The dust removal device of claim 2, wherein external air is supplied at the at least one air inlet, and the plurality of nozzles spray the air supplied by the at least one air inlet through the inner wall. . The dust removal device of claim 3, wherein the nozzle is arranged in such a manner that the outlet of the nozzle is inclined downward. The dust removal device of claim 4, wherein the nozzle is inclined downward at an angle of 10 degrees to 20 degrees. The dust removal device of claim 3, wherein at least one manifold is arranged between the at least one air inlet and the plurality of nozzles, and the at least one manifold is used to flow air from the at least one oral confession The corresponding air is evenly distributed to the plurality of nozzles. The dust removal device according to claim 1, wherein the suction unit is arranged on the outer contour of the window. The dust removal device according to claim 1, wherein the suction surface of the suction unit includes a first surface arranged obliquely with respect to the direction of the downdraft generated by the air flow guide unit, and A plurality of first suction holes are formed. The dust removal device according to claim 8, wherein the suction surface of the suction unit further includes a second surface, the second surface is arranged below the first surface and is formed with a plurality of second suction surfaces. Suction holes. The dust removal device according to claim 1, wherein the dust removal device further includes a wiper, the wiper is arranged in a manner that can move back and forth on the window panel to clean the accumulation at the window. of dust. The dust removal device of claim 10, wherein a dust removal component is arranged on the window panel between the wiper and the window, and the dust removal component will cover the wiper. Dust removal. A laser marking system includes: a wafer frame that supports the outline of a wafer on which a semiconductor wafer is formed; and an air flow guide unit that is arranged at the lower part of the wafer frame and injects air downward through a plurality of nozzles. The air blowing generates a downward airflow that guides the air flow around it in the downward direction, so that the dust moves in the downward direction; the suction unit is arranged at the window panel including the window for the laser beam to pass, The dust moved downward by the air flow guide unit is sucked in; and a laser marker is arranged at the lower part of the suction unit to irradiate the semiconductor wafer with a laser beam to perform a marking operation. The laser marking system according to claim 12, wherein the air flow guide unit includes a ring-shaped structure, and the ring-shaped structure includes an outer wall formed with at least one air flow inlet and a plurality of air flow inlets formed therethrough. The inner wall of the nozzle. The laser marking system of claim 13, wherein the nozzle is arranged in such a manner that the outlet of the nozzle is inclined downward. The laser marking system of claim 12, wherein the suction unit is arranged on the outer contour of the window. The laser marking system of claim 12, wherein the suction surface of the suction unit includes a first surface arranged obliquely with respect to the direction of the downdraft generated by the air flow guide unit, and A plurality of first suction holes are formed. The laser marking system of claim 16, wherein the suction surface of the suction unit further includes a second surface, the second surface is arranged below the first surface and is formed with a plurality of second suction surfaces. Suction hole. The laser marking system of claim 12, wherein a wiper is further arranged on the window panel, and the wiper moves back and forth while cleaning dust accumulated at the window. An air flow guide unit is arranged at the lower part of the wafer to guide the flow of surrounding air in a specific direction. It injects air downward through multiple nozzles and uses air blowing to generate a downward airflow that guides the surrounding air flow downward. , so that the dust moves downward, the air flow guide unit includes an annular structure, and the annular structure includes an outer wall through which at least one air inlet is formed, and an outer wall through which the plurality of nozzles are formed. inner wall. The laser marking system of claim 12, wherein the laser marker is arranged at a lower part of the wafer and irradiates the laser beam through the lower surface of the semiconductor wafer where the wafer frame is open. The laser beam is used to perform the marking operation.

Images