JP2014104489A - Laser processing device and dust collection method for laser processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser processing device capable of preventing a workpiece and the inside of the device from being contaminated by sucking produced dust without shielding an irradiation region, and also reducing outflow of dust to outside the irradiation region.SOLUTION: In a laser processing device including an irradiation region 9 including a laser irradiation part which irradiates a workpiece 2 with processing laser light for processing in which a scan with the laser light is made, a mount table 5 on which the workpiece 2 is mounted, and a dust collection nozzle 10 which sucks a fluid in the irradiation region 9, the dust collection nozzle 10 includes an annular dust collection flow passage 14 which is installed in a region where the irradiation region 9 for the laser light is not shielded, and composed of an inner wall part 11 and an outer wall part 12 covering the irradiation region 9, and an upper wall part 13, and the mount table 5 includes a purge gas jet nozzle 20 which jets a purge gas from a nearby position outside an outer peripheral edge of the workpiece 2 toward the dust collection nozzle 10.

Description

  The present invention efficiently collects processing dust generated as a by-product by irradiating a workpiece with laser light in laser processing in which the workpiece is irradiated with laser light to process the workpiece. The present invention relates to a laser processing apparatus capable of performing the same and a dust collection method for the laser processing apparatus.

  In the prior art laser processing apparatus and dust collection method, an air blow nozzle and a dust collection nozzle are arranged in the vicinity of the laser irradiation position of the workpiece, and during the laser irradiation processing, air blow and dust collection suction are performed. Dust such as processed dust generated as a next product is removed (see, for example, Patent Documents 1 and 2).

Japanese Patent Laid-Open No. 10-99978 JP 2011-20147 A

  Conventionally, in laser processing, a workpiece moving type laser processing apparatus that fixes a laser beam irradiation position at one point and moves the workpiece relative to the irradiation position to perform processing, and a laser beam in the XY direction. There is a laser beam scanning laser processing apparatus that scans and processes a fixed workpiece.

  Since the workpiece moving type laser machining apparatus only needs to move the workpiece, machining of an arbitrary size can be realized by designing the size of the machining stage. However, the processing speed depends on the moving speed of the processing stage, and is generally about several meters / second.

  The laser beam scanning laser processing apparatus performs desired processing by moving the laser beam in the X and Y directions without moving the workpiece, but the processing size is a balance between processing accuracy and scannable angle. When an accuracy of about several tens of micrometers is required, the upper limit is about 200 mm × 200 mm. However, the scanning speed represented by the galvanometer mirror used for laser beam scanning is several tens of meters / second, and high-speed processing can be realized.

  In addition, since the workpiece moving type laser processing apparatus has a constant laser irradiation position, the air blow nozzle and the dust collection nozzle related to the dust collection described above can be arranged in the immediate vicinity of the laser irradiation position. It is thought that it can collect dust.

  However, since the laser beam scanning type laser processing apparatus has a wide laser irradiation position of about 200 mm × 200 mm as described above, an air blow nozzle and a dust collection nozzle cannot be provided in the irradiation region, and the irradiation region It is necessary to install a dust collection nozzle.

  Therefore, the dust collecting nozzle sucks the fluid in the irradiation area from the vicinity of the opening of the dust collecting nozzle, and even if dust called particles such as processed dust is generated, the dust collecting nozzle does not always suck the fluid immediately at the generated place, There is a problem that dust cannot be removed efficiently.

  The prior art described in Patent Document 1 described above relates to a laser device having a fixed laser irradiation position. In this case, an air blow nozzle and a dust collection nozzle can be installed in the vicinity of the irradiation area, but in the case of a laser beam scanning type laser processing apparatus, an air blow nozzle and a dust collection nozzle cannot be installed in the irradiation area. For this reason, it is installed in a place away from the irradiation region, and it is difficult to exhibit sufficient dust collection performance. In addition, when the work is blown, if the blown gas cannot be sucked so as not to leak, the dust is conversely wound up and cannot be collected effectively. It remains on the workpiece and fouls the inside of the device and the next device that performs subsequent processing. Therefore, the work piece is transported out of the apparatus while remaining in a state where sufficient dust cannot be removed from the work piece, and various troubles caused by dust occur in the next process of laser processing. It becomes a factor to occur. Moreover, in order to prevent these various troubles, it is necessary to install a cleaning device for cleaning an object to be cleaned on which dust remains, before the next step.

  In the prior art described in Patent Document 2 described above, the entire irradiation region is covered with a wall surface that surrounds the irradiation region and a window that allows transmission of laser light. Further, an air curtain is formed by ejecting air from the periphery of the opening provided at the bottom. It has been proposed that the dust collection performance can be improved by providing such a configuration.

  However, in the prior art described in Patent Document 2, since it is necessary to cover the entire irradiation region, it is necessary to provide a window at the laser light incident portion, and the laser light is attenuated by the transmittance of the window material. However, the processing capability will be reduced. Also, in a laser beam scanning type laser processing apparatus, if a window material constituting a window portion exists between the F-θ lens and the workpiece, the laser drawing position is shifted due to the difference in refractive index. In particular, there is a problem that the accuracy outside the irradiation region is lowered, and the laser drawing position needs to be corrected with high accuracy.

  An object of the present invention is to absorb effectively generated dust without blocking an irradiation area in a laser beam scanning laser processing apparatus, reduce outflow of dust to the outside of the irradiation area, It is an object of the present invention to provide a laser processing apparatus and a dust collection method for the laser processing apparatus that can prevent contamination inside the apparatus.

The present invention includes a placing table on which a workpiece is placed;
A laser irradiation unit that is disposed above the mounting table and that irradiates a workpiece placed on the mounting table with a laser beam;
A dust collection nozzle for sucking a fluid in an irradiation region through which laser light passes between the mounting table and the laser irradiation unit,
A cylindrical first wall disposed so as to surround the irradiation region;
A cylindrical second wall disposed so as to surround the first wall;
A third wall that closes between the upper end portion of the first wall portion and the upper end portion of the second wall portion and forms an annular flow path that opens downward between the first wall portion and the second wall portion. And
A dust collecting nozzle having a suction part for sucking the inside of the annular flow path;
A purge gas injection nozzle that is provided on the mounting table and that injects a purge gas toward the dust collection nozzle from a position near the outer periphery of the workpiece placed on the mounting table. This is a featured laser processing apparatus.

The present invention is also a dust collection method of a laser processing apparatus for collecting dust generated when laser processing a workpiece using the laser processing apparatus,
Laser processing the workpiece placed on the placing table while supplying the purge gas from the purge gas injection nozzle;
After the laser processing is finished, the purge gas from the purge gas injection nozzle is stopped, and the next workpiece is placed on the mounting table while the dust collecting nozzle sucks the fluid outside the irradiation region. And a dust collecting method for a laser processing apparatus.

  According to the present invention, in the laser beam scanning laser processing apparatus, the air curtain is formed by the purge gas ejected from a position near the outer periphery of the outer peripheral edge of the work piece of the mounting table without blocking the irradiation region, While preventing the leakage of the dust to the outside of the irradiation area, the fluid on the workpiece can be drawn in, and the effectively generated dust can be sucked and discharged. In addition, air can be drawn in from the upper part of the dust collection nozzle to form a down flow, reducing the outflow of dust from the upper part of the dust collection nozzle to the outside of the irradiation area, and preventing contamination of the work piece and internal contamination of the device. Can be prevented.

  In addition, by extending the second wall portion downward from the first wall portion, it is difficult to suck air from outside the irradiation region, and the purge gas ejected from the purge gas injection nozzle is made to follow the second wall portion. It can be made easy to flow, and an air curtain can be formed effectively. Thereby, it is possible to effectively prevent the leakage of dust to the outside of the irradiation area, and it is possible to prevent the workpiece from being stained and the inside of the apparatus from being damaged.

  In addition, the fluid in the annular channel is rectified in the annular channel by the rectifying plate provided inside, and can be sucked evenly, and can be uniformly sucked over the entire circumference of the irradiation region. It is possible to effectively prevent the leakage of dust to the outside, and to prevent the workpiece from being stained and the inside of the apparatus from being damaged.

  In addition, while the air purge from the purge gas injection nozzle is stopped, the air curtain disappears, so the dust collection nozzle can suck fluid outside the irradiation area and leaks out of the irradiation area without being collected. Even if there is dust, it can be sucked here, and contamination inside the apparatus can be prevented. Further, since the air curtain is eliminated, it is possible to prevent the workpiece from being placed on the placement table.

It is sectional drawing which shows typically the structure of the laser processing apparatus 1 of Embodiment 1 of this invention. 2 is a cross-sectional view showing the structure of a dust collection nozzle 10 and a mounting table 5 of the laser processing apparatus 1. FIG. It is sectional drawing which shows typically the structure of the laser processing apparatus 1 of Embodiment 2 of this invention. It is sectional drawing which shows the structure of the dust collection nozzle 10 in Embodiment 2. FIG. It is sectional drawing which shows typically the structure of the laser processing apparatus 1 of Embodiment 3 of this invention. It is a flowchart for demonstrating operation | movement of the dust collection method of the laser processing apparatus of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Of course, the present invention is not limited to this, and the configuration described in the present embodiment is not intended to limit the scope of the present invention to this unless otherwise specified. It is only an example.

(Embodiment 1)
(Configuration example of laser processing equipment)
FIG. 1 is a cross-sectional view schematically showing a configuration of a laser processing apparatus 1 according to Embodiment 1 of the present invention. In the figure, the laser processing apparatus 1 will be described below assuming that it is placed on the floor of the processing chamber with the mounting table 5 on the lower side and the laser optical unit 8 on the upper side. The laser processing apparatus 1 of the present embodiment is a scanning laser processing apparatus, and passes laser light oscillated from a laser oscillator (not shown) to a workpiece 2 through a laser optical unit 8 and laser scanning means 7. Thus, the workpiece 2 is irradiated with the processing beam light so that laser processing can be performed. A space including the entire region through which the processing beam light passes between the laser optical unit 8 and the mounting table 5 is an irradiation region 9.

  The dust collection nozzle 10 is installed so as not to interfere with the irradiation area 9 and to suck the fluid in the irradiation area 9. The dust collection nozzle 10 has a substantially annular dust collection by an inner wall portion 11 that is a cylindrical first wall portion, an outer wall portion 12 that is a cylindrical second wall portion, and an upper wall portion 13 that is a third wall portion. A flow path 14 is formed. Therefore, the dust collection nozzle 10 has the inlet 15 which is an opening part opened below. The inner wall portion 11 is disposed so as to surround the irradiation region 9, the outer wall portion 12 is disposed so as to surround the inner wall portion 11, and the upper wall portion 13 is the upper end portion and the outer wall portion of the inner wall portion 11. The dust collecting flow path 14 that is opened downward is formed between the inner wall portion 11 and the outer wall portion 12.

  Further, by configuring as described above, the upper opening 16 is formed in the side portion in the dust collection nozzle 10 and can be installed without interfering with the irradiation region 9. The dust collection passage 14 is provided with an exhaust port 17 connected to a dust collector (not shown). In addition, the exhaust port 17 may be one place and may be installed in multiple numbers.

  Next, the mounting table 5 that holds the workpiece 2 will be described. The workpiece 2 placed under the irradiation area 9 is held by the workpiece holding means 3 so that the workpiece 2 does not move. Examples of the workpiece holding means 3 include a suction disk that vacuum-sucks and an electrostatic chuck that holds electrostatically. A processing base plate 4 is provided below the workpiece holding means 3, and the processing base plate 4 is provided with an annular purge gas channel 21 and covered with a purge gas channel lid 22, thereby purging the purge gas. A nozzle 20 is configured.

  A purge gas is introduced into the purge gas channel 21 from a purge gas inlet 23. The purge gas introduced from the purge gas introduction port 23 spreads in the purge gas flow path 21 and is ejected from the purge gas injection nozzle 20 constituted by the purge gas flow path cover 22 to form an air curtain 24.

  Processing dust (not shown), which is fine dust cut by processing, is floating on the processing surface, that is, the upper surface of the workpiece 2 that has been laser processed. It is effective to efficiently collect the dust, that is, to suck a fluid that is a mixture of the dust and air in the irradiation region 9.

  Since the dust collection nozzle 10 is installed so as not to interfere with the irradiation area 9 that is an area through which the scanning laser beam passes, when the dust collection nozzle 10 alone is installed and sucked, the dust collection nozzle 10 sucks. The fluid in the easy region is sucked, and the fluid other than the irradiation region 9 is sucked in, and it is difficult to exhibit a high collection effect. For this reason, the generated machining dust is scattered and adhered to the surface of the workpiece 2 or deposited in the apparatus, thereby fouling the laser processing apparatus and the next apparatus.

  In addition, it is conceivable to perform air blow directly on the work piece 2, but if the blown air cannot be sucked so as not to leak, the dust is conversely raised, and effective dust collection cannot be performed. Dust such as processing dust accumulates in the apparatus, and the next apparatus remains on the workpiece 2 and is contaminated.

  In the present invention, in addition to the dust collection nozzle 10 described above, purge gas is ejected from the purge gas injection nozzle 20 to form an air curtain 24, thereby preventing leakage of dust such as processing dust to the outside of the irradiation region 9. The fluid on the workpiece 2 can be drawn by the flow of the air curtain 24, and the generated dust can be efficiently sucked and discharged. In addition, air can be drawn from the upper opening 16 of the dust collection nozzle 10 to form a downflow from the upper side to the lower side of the irradiation region 9, and the irradiation region 9 can be formed from the upper opening 16 of the dust collection nozzle 10. The outflow of dust such as processing dust to the outside can be reduced, and the workpiece 2 and the inside of the apparatus can be prevented from being stained. The flow rate of the fluid sucked from the dust collection nozzle 10 is set to be larger than the purge gas flow rate ejected from the purge gas ejection nozzle 20.

  FIG. 2 is a cross-sectional view showing the structure of the dust collection nozzle 10 and the mounting table 5 of the laser processing apparatus 1. In the dust collection nozzle 10 according to the present embodiment, the outer wall portion 12 extends downward from the inner wall portion 11, and the outer wall portion 12 is disposed above the ejection position of the purge gas injection nozzle 20. Yes. In order to take out the workpiece 2, the outer wall portion 12 is installed with a gap L from the workpiece 2. Note that the gap L is appropriately determined according to use conditions.

  According to the above configuration, the outer wall portion 12 is extended downward from the inner wall portion 11, thereby making it difficult to suck air from outside the irradiation region 9. Further, since the outer wall portion 12 is disposed above the ejection position of the purge gas injection nozzle 20, the purge gas ejected from the purge gas injection nozzle 20 flows along the outer wall portion 12 due to the Coanda effect, thereby preventing the purge gas from diffusing. And an air curtain can be formed effectively. Thereby, it is possible to effectively prevent the leakage of dust to the outside of the irradiation region 9, and it is possible to prevent the workpiece 2 and the inside of the apparatus from being damaged.

(Embodiment 2)
(Other examples of dust collection nozzles)
FIG. 3 is a cross-sectional view schematically showing the configuration of the laser processing apparatus 1 according to the second embodiment of the present invention. Note that the same reference numerals are given to portions corresponding to the above-described embodiment. In the dust collection nozzle 10 according to the present embodiment, a rectifying plate 18 provided with a plurality of holes 18a is disposed inside the dust collection flow path 14 of the dust collection nozzle 10, and the dust collection flow path 14 and the suction port are arranged. 15 are separated.

  FIG. 4 is a cross-sectional view illustrating a configuration of the dust collection nozzle 10 according to the second embodiment. When there is no rectifying plate 18, the fluid in the dust collecting flow path 14 inside the dust collecting nozzle 10 has a flow rate distribution such that the closer to the exhaust port 17, the more fluid is sucked and the farther the fluid is sucked, the less the fluid is sucked. For this reason, variation occurs in the collection of dust such as generated dust. Therefore, by configuring as in the present invention, the fluid sucked into the dust collector from the exhaust port 17 is subjected to flow resistance by the rectifying plate 18, and the dust collection flow channel 14 acts as a buffer space, and the suction port 15. Can be sucked evenly. Thereby, it is possible to effectively prevent the leakage of dust to the outside of the irradiation region 9, and it is possible to prevent the workpiece 2 and the inside of the apparatus from being damaged.

  Furthermore, as another configuration of the current plate 18, a plurality of current plates 18 may be installed. Further, 18a provided on the rectifying plate 18 may be distributed in the hole diameter so that the 18a on the side close to the exhaust port 17 is made smaller and the 18a on the farthest side is made larger. It is appropriately determined depending on the size of the nozzle 10.

(Embodiment 3)
(Other examples of dust collection nozzles)
FIG. 5 is a cross-sectional view schematically showing the configuration of the laser processing apparatus 1 according to the third embodiment of the present invention. Note that the same reference numerals are given to portions corresponding to the above-described embodiment. In the dust collection nozzle 10 in the present embodiment, an inner inclined wall portion 19 is formed along the inclination of the irradiation region 9. When the inner inclined wall portion 19 is not provided, the fluid in the region other than the irradiation region 9 is also sucked, the area of the upper opening 16 is increased, and the air flow velocity drawn from the upper opening 16 is also reduced. It had become. However, by configuring as in the present embodiment, a region that is not the irradiation region 9 can be filled with the inner inclined wall portion 19, and unnecessary space is eliminated, and the upper opening portion 16 is configured to be the smallest. Therefore, the fluid in the irradiation region 9 can be sucked more effectively, and the air flow rate drawn from the upper opening 16 can be increased, so that the processing dust rises to the laser scanning means 7 and the lens or the like is damaged. Can be prevented.

(Operation flow of laser processing equipment)
Next, an embodiment according to the dust collection method of the laser processing apparatus of the present invention will be described.
FIG. 6 is a flowchart for explaining the dust collection method of the laser processing apparatus according to the embodiment of the present invention. Hereinafter, a case where the dust collection method according to the present invention is implemented by the laser processing apparatus 1 according to the first embodiment will be described with reference to the drawings. Note that portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted to avoid duplication.

  First, the workpiece 2 is placed on the placement table 5 and placed in the irradiation region 9 (step S1). Next, it is confirmed whether or not the dust collection nozzle 10 is sucking (step S2). If the dust collection nozzle 10 is sucking, the purge gas is ejected from the purge gas injection nozzle 20 (step S3).

  Note that ON / OFF of the dust collection nozzle 10 is not particularly defined, but it is preferable that the dust collection nozzle 10 is always ON if there is a capacity in terms of exhaust flow rate. This is to prevent dust that could not be collected from dust that has been raised by air blow from drifting in the device, and by constantly exhausting, the amount of dust that drifts can be reduced. .

  Here, the suction of the dust collection nozzle 10 is confirmed because if the dust collection nozzle 10 is not sucking, the purge gas from the purge gas injection nozzle 20 may raise dust and contaminate the inside of the apparatus. is there. When the air purge is started, the workpiece 2 is laser processed (step S4). After the laser processing is completed, the purge gas from the purge gas injection nozzle 20 is stopped (step S5).

  After the purge gas is stopped, the workpiece 2 is taken out from the placement table 5 and the next workpiece 2 is placed repeatedly. With this configuration, the air curtain 24 disappears while the air purge from the purge gas injection nozzle 20 is stopped, so that the dust collection nozzle 10 can also suck fluid outside the irradiation region 9 and capture it. Even if there is dust that has not been collected and has leaked outside the irradiation region 9, it can be sucked here, and contamination inside the apparatus can be prevented. Further, since the air curtain 24 is eliminated, the placement on the placement table 5 of the workpiece 2 is not disturbed.

  As described above, the present invention mounts the workpiece 2 with the irradiation region 9 including the laser irradiation unit that irradiates the workpiece 2 with the laser beam for processing to perform processing by scanning the laser beam. In the laser processing apparatus provided with the placed mounting table 5 and the dust collection nozzle 10 for sucking the fluid in the irradiation area 9, the dust collection nozzle 10 is installed in an area that does not block the laser light irradiation area 9. 9 has a dust collecting flow path 14 that is an annular flow path formed by the inner wall portion 11, the outer wall portion 12, and the upper wall portion 13, and the placement table 5 is near the outer periphery of the outer peripheral edge of the workpiece 2. A purge gas injection nozzle 20 that ejects purge gas from the position toward the dust collection nozzle 10 is provided.

  According to such a configuration, in the laser beam scanning laser processing apparatus 1, the air curtain is purged by the purge gas ejected from the position near the outer peripheral edge of the work piece 2 of the mounting table 5 without blocking the irradiation region 9. 24 can be formed to prevent the leakage of dust to the outside of the irradiation region 9, and the fluid on the workpiece 2 can be drawn in, and the dust generated effectively can be sucked and discharged. Further, air can be drawn in from the upper part of the annular dust collecting nozzle 10 to form a down flow, and the outflow of dust from the upper part of the dust collecting nozzle 10 to the outside of the irradiation region 9 can be reduced. It is possible to prevent contamination of the apparatus and internal contamination of the apparatus.

  Therefore, even when the workpiece 2 is inspected by an apparatus for the next process, for example, an inspection apparatus, it is possible to prevent an inspection error due to the presence of dust and contamination of the lens of the inspection camera. Furthermore, since the inside of the laser processing apparatus 1 and the unloading area are kept clean, contamination of jigs such as an arm and a pick-up tool for taking out the workpiece 2 during unloading work can be prevented. Can prevent secondary contamination.

  The outer wall 12 constituting the annular dust collecting flow path 14 of the dust collecting nozzle 10 extends downward from the inner wall 11, and the outer wall 12 is disposed above the ejection position of the purge gas injection nozzle 20. It is installed.

  According to such a configuration, by extending the outer wall portion 12 downward from the inner wall portion 11, it is difficult to suck air from outside the irradiation region 9, and the purge gas ejected from the purge gas injection nozzle 20 The air curtain 24 can be easily formed along the portion 12, and the air curtain 24 can be effectively formed. Thereby, it is possible to effectively prevent the leakage of dust to the outside of the irradiation region 9, and it is possible to prevent the workpiece 2 and the inside of the apparatus from being damaged.

  A rectifying plate 18 having a plurality of holes is disposed in the internal space of the dust collection passage 14 of the dust collection nozzle 10.

  If not according to the above configuration, the fluid in the dust collecting channel 14 is connected to the channel connected to the dust collector, but the fluid is easily sucked from the region close to the connecting portion. The fluid in the dust collecting channel 14 is rectified in the dust collecting channel 14 by the rectifying plate 18 provided therein, and can be sucked evenly, and sucked uniformly over the entire circumference of the irradiation region 9. Therefore, it is possible to effectively prevent the leakage of dust to the outside of the irradiation region 9, and to prevent the workpiece 2 and the inside of the apparatus from being damaged.

  Further, the workpiece 2 placed on the placing table 5 is laser processed while supplying the purge gas from the purge gas injection nozzle 20, and after the laser processing is finished, the purge gas from the purge gas injection nozzle 20 is stopped, and the dust collecting nozzle No. 10 can place the next workpiece while sucking the fluid other than the irradiation region 9.

  The present invention can be advantageously applied to a laser scanning type laser processing apparatus that is required to effectively remove dust generated during processing of the workpiece 2.

DESCRIPTION OF SYMBOLS 1 Laser processing apparatus 2 Workpiece 3 Workpiece holding means 4 Processing base board 5 Mounting table 7 Laser scanning means 8 Laser optical part 9 Irradiation area 10 Dust collection nozzle 11 Inner wall part 12 Outer wall part 13 Upper wall part 14 Dust collection Flow path 15 Suction port 16 Upper opening portion 17 Exhaust port 18 Rectifier plate 19 Inner slant wall portion 20 Purge gas injection nozzle 21 Purge gas flow channel 22 Purge gas flow channel cover 23 Purge gas introduction port 24 Air curtain

Claims (4)

A mounting table on which a workpiece is mounted;
A laser irradiation unit that is disposed above the mounting table and that irradiates a workpiece placed on the mounting table with a laser beam;
A dust collection nozzle for sucking a fluid in an irradiation region through which laser light passes between the mounting table and the laser irradiation unit,
A cylindrical first wall disposed so as to surround the irradiation region;
A cylindrical second wall disposed so as to surround the first wall;
A third wall that closes between the upper end portion of the first wall portion and the upper end portion of the second wall portion and forms an annular flow path that opens downward between the first wall portion and the second wall portion. And
A dust collecting nozzle having a suction part for sucking the inside of the annular flow path;
A purge gas injection nozzle that is provided on the mounting table and that injects a purge gas toward the dust collection nozzle from a position near the outer periphery of the workpiece placed on the mounting table. A featured laser processing apparatus.   2. The laser processing according to claim 1, wherein the second wall portion extends downward from the first wall portion and is disposed above an injection position of the purge gas injection nozzle. apparatus.   The laser processing apparatus according to claim 1, wherein a rectifying plate in which a plurality of holes are formed is disposed in the annular flow path of the dust collection nozzle. A dust collection method for a laser processing apparatus for collecting dust generated when laser processing a workpiece using the laser processing apparatus according to claim 1,
Laser processing the workpiece placed on the placing table while supplying the purge gas from the purge gas injection nozzle;
After the laser processing is finished, the purge gas from the purge gas injection nozzle is stopped, and the next workpiece is placed on the mounting table while the dust collecting nozzle sucks the fluid outside the irradiation region. And a dust collection method for a laser processing apparatus.

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