JP2017100170A - Debris recovery mechanism and laser processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress adhesion of debris onto a work-piece and to effectively remove debris from an optical path.SOLUTION: A debris recovery mechanism 170 has a duct 300 which is located between a work-piece W and a laser processing part 143 which irradiates a surface of the work-piece W with laser beam L and processes the work-piece W, and an ejection member 400 which is located on a side part of the duct 300 and ejects a gas delivered from a blower 180 into the duct 300. A suction port 310, which is connected to a dust collector 190 and through which the gas and debris in the duct 300 sucked by the dust collector 190 pass, is formed on a portion of the duct 300 facing the ejection member 400 at the side part thereof. An opening 311 through which laser beam L passes is formed on a top part 301 of the duct 300. An opening 312 through which laser beam L passes is formed on a bottom 302. An opening 313 is formed on a portion of the duct on a side near the top part 301 with respect to the ejection member 400 at the side part.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a debris collection mechanism for collecting debris generated by laser light irradiation, and a laser processing apparatus including the debris collection mechanism.

  In a laser processing apparatus, ablation processing in which a workpiece is instantaneously melted and evaporated by irradiating the workpiece with high-energy laser light scanned by a galvano scanner and condensed by a condenser lens is widely used.

  In laser processing equipment that performs ablation processing, there is a problem in that processing accuracy decreases due to scattering of minute processing scraps called debris during processing, such as debris shielding the laser beam and debris adhering to the workpiece. was there. For this reason, a mechanism for removing the debris from the laser beam path with an air blower or the like, and a mechanism for collecting the debris with a dust collector or the like so that the debris does not adhere to the work are widely provided.

  Patent Document 1 describes a method in which debris is removed from the laser optical path by blowing with air, and the debris is collected by a suction duct installed downstream in the air blowing direction. Patent Document 2 discloses a method for collecting debris by installing a duct having a suction port on a work and blowing strong air velocity air from the opposite surface of the suction port and weak air velocity air from above and below. Is described.

Japanese Patent Laid-Open No. 10-99978 JP 2000-317670 A

  In order to suppress a decrease in machining accuracy due to the debris shielding the laser beam, it is necessary to remove the debris from the laser beam path in the vicinity of the machining point having a high laser density. For this reason, as in Patent Document 1, it is effective to blow air with a strong wind speed near the processing point. However, in the method of Patent Document 1, since debris generated by laser processing diffuses, there is a problem that the debris cannot be reliably collected and the debris adheres to the workpiece.

  On the other hand, in the method of Patent Document 2, it is possible to suppress the debris scattered from the work from being attached to the work by confining it in the duct and collecting it. However, when a duct as in Patent Document 2 is installed on the workpiece, there is a problem that debris cannot be sufficiently removed from the laser light path due to the airflow in the duct. That is, in the method of Patent Document 2, since the wind speed just above the workpiece is weakened, debris sometimes convects the vicinity of the workpiece and shields the laser beam. For this reason, the effect of suppressing a decrease in processing accuracy is low.

  Therefore, an object of the present invention is to suppress the debris from adhering to the workpiece and to effectively remove the debris from the laser beam path.

  The debris collection mechanism of the present invention is disposed between a surface of a workpiece, a duct disposed between the surface of the workpiece and a laser processing unit that processes the workpiece by irradiating the surface of the workpiece with a laser beam, and a side portion of the duct. A jetting member that jets the gas blown from the blower into the duct, and the duct has a first opening through which the laser light passes through a top portion facing the laser processing portion. A second opening through which the laser beam passes at a bottom portion facing the surface of the workpiece; and a side portion of the second opening that is farther from the ejection member than the region through which the laser beam passes through the second opening. A suction port through which the gas and debris inside the duct that is connected to the dust collector and sucked by the dust collector passes, and a portion of the side portion that is closer to the top portion than the ejection member in the side portion; The opening, It has been made.

  According to the present invention, it is possible to suppress the debris from adhering to the workpiece and to effectively remove the debris from the laser light path, so that the processing accuracy is improved.

It is a perspective view which shows the structure of the laser processing apparatus which concerns on 1st Embodiment. (A) is a figure for demonstrating the mode of scattering of a debris, (b) is a figure for demonstrating a mode that a debris is removed. It is a schematic diagram which shows the debris collection | recovery apparatus in 1st Embodiment. It is a perspective view which shows the debris collection | recovery mechanism in 1st Embodiment. It is a perspective view which shows the debris collection | recovery mechanism in 1st Embodiment. It is a perspective view which shows the ejection member in 1st Embodiment. It is a schematic diagram which shows the debris collection | recovery apparatus in 2nd Embodiment. It is a perspective view which shows the debris collection | recovery mechanism in 2nd Embodiment. It is a perspective view which shows the debris collection | recovery mechanism in 2nd Embodiment. (A) is a perspective view which shows the ejection member in 2nd Embodiment. (B) is a center sectional view showing the ejection member in the second embodiment. It is explanatory drawing which shows the flow of the air seen in the direction which goes to a bottom part from the top part in the position of the bottom part of the duct in 2nd Embodiment. It is a schematic diagram which shows the debris collection | recovery apparatus of a comparative example.

  Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings.

[First Embodiment]
FIG. 1 is a perspective view showing the configuration of the laser processing apparatus according to the first embodiment. As shown in FIG. 1, the laser processing apparatus 1000 includes a processing machine 100 and a transport machine 200. The conveyor 200 conveys the workpiece W to the processing machine 100. The processing machine 100 performs laser processing (ablation processing) on the conveyed workpiece W. In the first embodiment, the workpiece W is a flat member (wafer).

  The processing machine 100 processes a plurality of workpieces W (two workpieces W in the first embodiment) at the same time. Here, two directions that are horizontal with respect to the surface (surfaces of workpiece chucks 115L and 115R described later) on which the workpiece W is conveyed in the processing machine 100 and intersect (orthogonal) each other are the X axis direction and the Y axis direction. And the vertical direction is the Z-axis direction.

  The processing machine 100 includes a gantry 101, a vibration isolation table 102, and a surface plate 103. The gantry 101 is installed on the floor. A vibration isolation table 102 is placed on the gantry 101, and a surface plate 103 is placed on the vibration isolation table 102. The vibration isolation table 102 attenuates vibration transmitted from the floor to the surface plate 103 via the gantry 101. The surface plate 103 has high rigidity and provides a stable surface to a unit mounted on the surface plate 103. The vibration isolation table 102 is not particularly limited as long as it has a property of attenuating and transmitting vibration, such as rubber and an air spring.

  The processing machine 100 includes a frame 104 and an XY stage 110 that are mounted on a surface plate 103. The XY stage 110 is a moving mechanism that simultaneously moves a plurality of workpieces W in the XY axis direction. The XY stage 110 includes a Y axis stage guide 111, a Y axis stage slider 112, an X axis stage guide 113, and an X axis stage slider 114.

  The X-axis stage slider 114 is mounted on the X-axis stage guide 113 and can move in the X-axis direction. The X axis stage guide 113 is mounted on the Y axis stage slider 112. The Y-axis stage slider 112 is mounted on the Y-axis stage guide 111 and can move in the Y-axis direction.

  On the surface plate 103, a drive mechanism (not shown) that moves the Y-axis stage slider 112 in the Y-axis direction (for example, a rotary motor, a shaft coupling, and a ball screw) is mounted. Further, the surface plate 103 incorporates a scale (not shown) for measuring the position of the Y-axis stage slider 112 in the Y-axis direction.

  The Y-axis stage slider 112 is mounted with a drive mechanism (not shown) (for example, a rotary motor, a shaft joint, and a ball screw) that moves the X-axis stage slider 114 in the X-axis direction. Further, the Y-axis stage slider 112 incorporates a scale (not shown) that measures the position of the X-axis stage slider 114 in the X-axis direction.

  On the X-axis stage slider 114, a plurality of work chucks (holding portions), in the first embodiment, two work chucks, that is, a work chuck 115L and a work chuck 115R are mounted. Each of the work chuck 115L and the work chuck 115R is provided with a large number of suction holes (not shown), communicated by an internal groove (not shown), and vacuum sucks the work by negative pressure air generated by a vacuum generator (not shown). It is possible to hold by.

  A cooling jacket (not shown) is attached to the back surface of each work chuck 115L, 115R. The cooling jacket has an internal groove (not shown), and the work chuck 115L and the work chuck 115R can be cooled by passing the coolant fed from a cooling device (not shown) through the internal groove.

  A work lifter (not shown) is attached to the back surface of each work chuck 115L, 115R. The work lifter has a drive mechanism such as an air cylinder. A work lift pin (not shown) is mounted on the movable tip of the work lifter. The work chuck 115L, the work chuck 115R, and the cooling jacket (not shown) are each provided with a through hole (not shown). Therefore, it is possible to raise and lower the work lift pins with respect to the work chuck surfaces of the work chuck 115L and the work chuck 115R by the work lifter. Further, the work lift pin is provided with a suction hole, and the work can be fixed by vacuum suction with negative pressure air generated by a vacuum generator (not shown).

  In addition, the processing machine 100 includes precision measurement cameras 138L and 138R that capture images of the workpiece W held by the workpiece chucks 115L and 115R. In addition, the processing machine 100 includes two Z stages 130L and 130R respectively corresponding to the two work chucks 115L and 115R fixed to the upper part of the frame 104.

  The Z stage 130L (130R) includes a Z axis stage guide 132L (132R) and a Z axis stage slider 134L (134R). The Z-axis stage slider 134L (134R) is mounted on the Z-axis stage guide 132L (132R) and can move in the Z-axis direction.

  The Z stage 130L (130R) is mounted with a driving mechanism (not shown) (for example, a rotary motor, a shaft coupling, and a ball screw) for moving the Z axis stage slider 134L (134R) in the Z axis direction. Further, a scale (not shown) for measuring the position of the Z-axis stage slider 134L (134R) in the Z-axis direction is incorporated in the Z stage 130L (130R).

  Further, the processing machine 100 includes a plurality (two in the first embodiment) of laser optical systems 150L and 150R.

  The laser optical system 150L includes a laser oscillator 144L that is a laser oscillation unit that emits laser light, a galvano scanner 140L, and an fθ lens 142L that is a condenser lens that condenses the laser light. The laser oscillator 144L is fixed to a device cover (not shown). The laser light emitted from the laser oscillator 144L is guided to the galvano scanner 140L via an optical system such as an optical fiber, a collimator, and a folding mirror. The galvano scanner 140L is attached to the Z-axis stage slider 134L of the Z stage 130L. The galvano scanner 140L has two mirrors with an encoder, and scans laser light in the XY axis directions. The fθ lens 142L is attached to the galvano scanner 140L. The focal length of the laser beam condensed after passing through the fθ lens 142L is adjusted by the Z stage 130L so that the focal point is located on the processing surface (front surface) of the workpiece placed on the workpiece chuck 115L. At that time, the distance to the workpiece processing surface is measured by a displacement meter 155L fixed to the frame 104, so that the focal length corresponding to the thickness variation for each workpiece can be adjusted. The galvano scanner 140L and the fθ lens 142L constitute a laser processing unit 143L that processes the workpiece by irradiating the surface of the workpiece with laser light.

  The processable range of the laser processing unit 143L (galvano scanner 140L), that is, the range in which the laser beam can be scanned is rectangular. The range (processing range) in which actual processing is performed by the laser processing unit 143L (galvano scanner 140L), that is, the range in which the laser beam is scanned is less than the processable range, and is rectangular in the first embodiment. The laser processing unit 143L performs processing by irradiating laser light within this processing range.

  The laser optical system 150R has the same configuration as the laser optical system 150L, and includes a laser oscillator 144R and a laser processing unit 143R including a galvano scanner 140R and an fθ lens 142R. The focal length of the laser beam collected through the fθ lens 142R is adjusted by the Z stage 130R so that the focal point is positioned on the processing surface (surface) of the workpiece placed on the workpiece chuck 115R. At that time, the distance to the workpiece processing surface is measured by a displacement meter 155R fixed to the frame 104, so that the focal length corresponding to the thickness variation for each workpiece can be adjusted.

  With the above configuration, the XY stage 110 can move the work chucks 115L and 115R relative to the laser processing units 143L and 143R by moving the work chucks 115L and 115R relative to the galvano scanners 140L and 140R. . That is, the XY stage 110 can move the processing ranges of the laser processing units 143L and 143R relative to the workpiece chucks 115L and 115R (that is, the workpieces) simultaneously in the same direction and by the same amount.

  In addition, although it was set as the structure which moves the work chuck | zipper 115L, 115R with respect to the laser processing part 143L, 143R, the work chuck | zipper 115L, 115R and the laser processing part 143L, 143R should just move relatively. Accordingly, the laser processing units 143L and 143R may be moved with respect to the work chucks 115L and 115R by the moving mechanism, or both may be moved. Further, the case where the laser beams oscillated by the two laser oscillators 144L and 144R are guided to the laser processing units 143L and 143R has been described. However, the laser beam oscillated by one laser oscillator is guided to the laser processing units 143L and 143R. You may comprise as follows.

  As described above, in the first embodiment, the laser beam emitted from each laser oscillator is condensed by the fθ lens on each workpiece W conveyed on each workpiece chuck 115L, 115R, and the energy is used as a processing point on the workpiece. Concentrate and instantly melt and evaporate the workpiece. In addition, by repeating the rough positioning of the workpiece W on the workpiece chucks 115L and 115R by the XY stage 110 and the fine positioning of each laser beam by the laser processing units 143L and 143R, high-precision machining can be performed on a large-diameter workpiece. ing. That is, a wide range of processing is possible by combining a narrow range of high speed processing with the galvano scanners 140L and 140R and step movement with the XY stage 110. In addition, although 1st Embodiment described the case where two workpieces were processed simultaneously, it is also possible to process one single workpiece | work.

  Here, debris generated when ablation processing is performed with laser light will be described. FIG. 2A is a diagram for explaining how debris is scattered, and FIG. 2B is a diagram for explaining how debris is removed.

  In a laser processing apparatus that performs ablation processing, as shown in FIG. 2 (a), when minute processing scraps called debris D are scattered during processing, this shields the laser beam L or adheres to the workpiece W. There is a problem that processing accuracy is lowered. For this reason, it is necessary to remove the debris D from the laser beam path with air A as shown in FIG. Further, in order to effectively suppress a decrease in processing accuracy due to the debris D shielding the laser light L, as shown in FIG. 2B, strong air A is provided in the vicinity of the processing point P having a high laser density. It is effective to remove the debris D from the laser beam path.

  In the first embodiment, as illustrated in FIG. 1, the processing machine 100 includes a plurality (two in the first embodiment) of debris collection devices 160L and 160R.

  Here, the debris collection apparatus of the comparative example will be described. FIG. 12 is a schematic view showing a debris collection device of a comparative example. The debris collection device 160X includes a debris collection mechanism 170X, a blower 180X, and a dust collector 190X. The debris collection mechanism 170X includes a duct 300X and an ejection member 400X.

  The ejection member 400X is attached to the duct 300X, and is connected to the blower 180X via the connection pipe 181X. Thereby, the ejection member 400X ejects the air sent from the blower 180X into the duct 300X.

  Openings 311X and 312X through which the laser light L passes are formed in the top portion 301X and the bottom portion 302X of the duct 300X. Further, a suction port 310X connected to the dust collector 190X via the flexible hose 191X is formed in a portion of the duct 300X facing the ejection member 400X. By operating the dust collector 190X, air and debris in the duct 300X are sucked from the suction port 310X.

  Here, the air A1X and A2X flow into the duct 300X from the openings 311X and 312X of the duct 300X due to the suction of air by the dust collector 190X. At this time, the flow of the air B1X from the ejection member 400X is hindered by the air A2X flowing from the opening 312X. As a result, the debris cannot be sufficiently removed from the laser beam path. The debris scattered in the upper part of the duct 300X rides on the flow of the air A1X flowing from the opening 311X of the top part 301X, convects the inside of the duct 300X while shielding the laser light, and enters the dust collector 190X through the suction port 310X. Collected. As described above, the debris shields the laser light, so that the processing accuracy is greatly reduced.

  Debris collection devices 160L and 160R of the first embodiment will be described. FIG. 3 is a schematic diagram illustrating the debris collection device according to the first embodiment. Hereinafter, since the debris collection device 160L and the debris collection device 160R have the same configuration, the debris collection device 160 will be described. Since the laser processing unit 143L and the laser processing unit 143R have the same configuration, the laser processing unit 143 (the galvano scanner 140 and the fθ lens 142) will be described. In FIG. 3, the workpiece W is shown in a state of being fixed to the workpiece chucks 115L and 115R.

  The debris collection device 160 includes a debris collection mechanism 170, a blower 180, and a dust collector 190. The debris collection mechanism 170 includes a duct 300 and an ejection member 400. The debris collection mechanism 170 (that is, the duct 300) is fixed to the frame 104 (FIG. 1). The duct 300 is formed in a box shape.

  In the first embodiment, the blower 180 is individually provided for each of the two debris collection mechanisms. However, one blower may be shared by the two debris collection mechanisms. Similarly, although the dust collector 190 is individually provided for each of the two debris collection mechanisms, the two debris collection mechanisms may share one dust collector.

  The blower 180 blows high-pressure gas (air). The dust collector 190 is a suction device that sucks dust and the like, and sucks dust together with gas (air). The blower 180 may be configured to blow a gas other than air.

  4 and 5 are perspective views showing the debris collection mechanism in the first embodiment. The duct 300 includes a top portion 301, a bottom portion 302 that faces the top portion 301 with a space therebetween, and a side portion 303 that connects the top portion 301 and the bottom portion 302. An internal space of the duct 300 is formed by being surrounded by the top portion 301, the bottom portion 302, and the side portion 303. The internal space of the duct 300 is formed in a trapezoidal shape that tapers from the top portion 301 toward the bottom portion 302.

  As shown in FIG. 3, the duct 300 includes an fθ lens 142 so that the top 301 faces the fθ lens 142 of the laser processing unit 143 and the bottom 302 faces the surface of the workpiece W conveyed to the workpiece chuck. It arrange | positions between the workpiece | work W (work chuck | zipper).

  The ejection member 400 is attached to a part (one side surface) of the side portion 303 of the duct 300 and is connected to the blower 180 via the connection pipe 181. Thereby, the ejection member 400 ejects the air blown from the blower 180 into the duct 300.

  The top portion 301 is formed with an opening (first opening) 311 through which the laser light that has passed through the fθ lens 142 passes. An opening (second opening) 312 through which the laser beam that has passed through the fθ lens 142 passes is formed in the bottom 302. 4 and 5, a region R is a region through which laser light passes at the bottom 302 (opening 312). The opening 312 is formed slightly larger (for example, the length of one side is about 1 mm) than the region R through which the laser beam passes.

  In the side portion 303 of the duct 300, a suction port 310 is formed in a portion farther than the region R with respect to the ejection member 400, in a portion (other side surface) facing the ejection member 400 in the first embodiment. A flange 320 for connecting the flexible hose 191 is attached to the suction port 310. Therefore, the suction port 310 is connected to the dust collector 190 via the flange 320 and the flexible hose 191. By operating the dust collector 190, air and debris in the duct 300 are sucked from the suction port 310. That is, the gas and debris inside the duct 300 sucked by the dust collector 190 pass through the suction port 310.

  In the side portion 303 (one side surface), an opening (third opening) 313 is formed in a portion closer to the top portion 301 with respect to the ejection member 400. Specifically, by arranging (fixing) the ejection member 400 on the side portion 303 so as to block a part of the opening of the side portion 303, the opening portion 313 is formed in the remaining portion of the opening.

  Here, the Z-axis direction is also a direction from the top 301 to the bottom 302 (that is, a direction perpendicular to the top 301 or the bottom 302), and is also a direction in which the workpiece W is irradiated with laser light. The XY axis direction is also a direction horizontal to the top part 301 or the bottom part 302, and is also a direction orthogonal to the laser light irradiation direction. Among the XY axis directions, the Y axis direction is a direction from the opening 313 toward the suction port 310, and the X axis direction is a direction orthogonal to the Y axis direction.

  The ejection member 400 is disposed on the side 303 closer to the bottom 302 than the center in the Z-axis direction, in contact with the bottom 302 in the first embodiment, so as to eject the air B1 along the bottom 302.

  As shown in FIG. 3, air A <b> 1, A <b> 2, A <b> 3 flows into the duct 300 from the openings 311, 312, 313 by the dust collector 190. In the first embodiment, most of the air that flows into the duct 300 by the operation of the dust collector 190 is the air A <b> 3 that flows from the opening 313.

  Further, the flow rate of the air A2 flowing from the opening 312 is extremely small because the air B1 ejected from the ejection member 400 serves as an air curtain. Note that the flow rate of air A1 flowing from the opening 311 is larger than the flow rate of air A2 flowing from the opening 312.

  The air B1 flows in the vicinity of the machining point P while maintaining the direction and the flow velocity without being blocked by the air A2 flowing in from the opening 312. Thereby, debris is removed from the laser beam path in the vicinity of the processing point P having a high laser density. In addition, the air A3 flowing in from the opening 313 occupies most of the air flowing into the duct 300. Therefore, the air A1 flowing in from the opening 311 is entrained in the air A3 and becomes a flow rectified in the Y-axis direction toward the suction port 310.

  As described above, according to the first embodiment, the blowing member 400 can blow strong air B1 in the vicinity of the processing point P. Furthermore, the flow of rectified air from the opening 313 toward the suction port 310 can be created inside the duct 300 by the air A3 flowing in from the opening 313.

  Therefore, debris can be removed from the laser beam path in the vicinity of the processing point P having a high laser density, and the debris can be collected by the dust collector 190 without shielding the laser beam L. Furthermore, it becomes possible to reliably collect debris without adhering to the workpiece. Therefore, it is possible to greatly suppress a decrease in processing accuracy due to debris.

  Here, the duct 300 is arranged so that the gap between the workpiece W and the workpiece W is in a non-contact state as small as possible. Thereby, the air B1 ejected from the ejection member 400 can be caused to flow near the machining point P of the workpiece W while preventing the vibration of the duct 300 from propagating to the workpiece W.

  The height of the duct 300 in the Z-axis direction is preferably as high as possible. Thereby, debris can be prevented from scattering from the opening 311 to the outside of the duct 300.

  In addition, the opening 311 and the opening 312 are formed as small as possible while ensuring an area that does not block the passage of the laser light L. By the suction operation of the dust collector 190, the flow rates of the air A1 and A2 flowing into the duct 300 from the openings 311 and 312 are reduced.

  On the other hand, the opening 313 has a larger opening area than the opening 311. Due to the suction operation of the dust collector 190, the flow rate of the air A3 flowing into the duct 300 from the opening 313 is increased. Therefore, most of the air flowing into the duct 300 by the dust collector 190 can be taken in from the opening 313.

  As shown in FIGS. 4 and 5, the opening 313 is formed in a trapezoidal shape in which the side near the bottom 302 is shorter than the side near the top 301 following the internal space of the duct 300. Thereby, the opening shape of the opening 313 is matched with the laser condensing shape, and the flow velocity of the air in the duct 300 on the bottom 302 side can be increased. By increasing the flow rate of the air in the duct 300, the debris collection capability is improved.

  FIG. 6 is a perspective view showing the ejection member in the first embodiment. As shown in FIG. 6, the ejection member 400 is formed with a plurality of nozzle ports 401 (16 in the first embodiment) for ejecting air. The plurality of nozzle ports 401 are arranged in multiple stages in the Z-axis direction (four-stage arrangement in the first embodiment) and arranged in multiple rows in the X-axis direction (four-line arrangement in the first embodiment).

  In the first embodiment, a plurality of nozzle ports 401 are used instead of one large nozzle port, so that the wind speed of air ejected from each nozzle port 401 is increased. Of the plurality of nozzle ports 401 arranged in multiple stages, the air ejected from the lowermost nozzle port 401 flows along the bottom portion 302 of the duct 300, and strong wind air in the Y-axis direction enters the opening 312. Can be sprayed. In addition, since the nozzle ports 401 are arranged in multiple rows in the X-axis direction, air can flow over the entire laser scanning range by the laser processing unit 143.

[Second Embodiment]
Next, a laser processing apparatus according to the second embodiment will be described. FIG. 7 is a schematic diagram illustrating a debris collection device according to the second embodiment. 8 and 9 are perspective views showing a debris collection mechanism in the second embodiment. Note that in the second embodiment, identical symbols are assigned to configurations similar to those in the first embodiment and descriptions thereof are omitted. In the second embodiment, the second opening is greatly opened at the bottom of the duct, and the gas jetted by the jetting member is blown onto the surface of the workpiece. This will be specifically described below.

  The debris collection device 160A includes a debris collection mechanism 170A, a blower 180A, and a dust collector 190A. 170 A of debris collection | recovery mechanisms have the duct 300A and the ejection member 400A. Debris collection mechanism 170A (that is, duct 300A) is fixed to frame 104 (see FIG. 1). The duct 300A is formed in a box shape.

  In the second embodiment, the blower 180A is individually provided for each of the two debris collection mechanisms, but one blower may be shared by the two debris collection mechanisms. Similarly, although the dust collector 190A is individually provided for each of the two debris collection mechanisms, the two debris collection mechanisms may share one dust collector.

  The blower 180A blows high-pressure gas (air). The dust collector 190A is a suction device that sucks dust and the like, and sucks dust together with gas (air). The blower 180A may be configured to blow a gas other than air.

  The duct 300A includes a top portion 301A, a bottom portion 302A that faces the top portion 301A with a space therebetween, and a side portion 303A that connects the top portion 301A and the bottom portion 302A. Surrounded by the top portion 301A, the bottom portion 302A, and the side portion 303A, an internal space of the duct 300A is formed.

  The duct 300A includes an fθ lens 142A and a workpiece W (the workpiece 301) such that the top portion 301A faces the fθ lens 142 of the laser processing portion 143 and the bottom portion 302A faces the surface (processing surface) of the workpiece W transferred to the workpiece chuck. (Work chuck).

  The ejection member 400A is attached to a part (one side surface) of the side portion 303A of the duct 300A, and is connected to the blower 180A via the connection pipe 181A. Thereby, the ejection member 400A ejects the gas (air) blown from the blower 180A into the duct 300A.

  The top 301A is formed with an opening (first opening) 311A through which the laser light that has passed through the fθ lens 142 passes. An opening (second opening) 312A through which the laser light that has passed through the fθ lens 142 passes is formed in the bottom 302A. In FIG. 9, a region R is a region through which laser light passes at the bottom 302A (opening 312A).

  In the side portion 303A of the duct 300A, a suction port 310A is formed in a portion farther from the region R than the ejection member 400A, that is, in a portion (other side surface) facing the ejection member 400A in the second embodiment. A flange 320A for connecting the flexible hose 191A is attached to the suction port 310A. Therefore, the suction port 310A is connected to the dust collector 190A via the flange 320A and the flexible hose 191A. By operating the dust collector 190A, air and debris in the duct 300A are sucked from the suction port 310A. That is, in the suction port 310A, the gas and debris inside the duct 300A sucked by the dust collector 190A pass.

  In the side portion 303A (one side surface), an opening (third opening) 313A is formed in a portion closer to the top portion 301A with respect to the ejection member 400A.

  The ejection member 400A is disposed on the side 303A closer to the bottom 302A than the center in the Z-axis direction, in contact with the bottom 302A in the second embodiment, so as to eject air along the bottom 302A.

  In the second embodiment, the debris collection mechanism 170A further includes an auxiliary ejection member 410A and a punching metal 420A that is an adjustment member.

  The auxiliary ejection member 410A is connected to the blower 180A by a connecting pipe 181A. The auxiliary ejection member 410A is disposed in a portion of the side portion 303A (one side surface) closer to the top portion 301A than the opening 313A, and ejects the gas blown from the blower 180A into the duct 300A. The auxiliary ejection member 410A is disposed on the side 303A closer to the top 301A than the center in the Z-axis direction, in contact with the top 301A in the second embodiment, so as to eject air along the top 301A. ing.

  In addition, although the auxiliary | assistant ejection member 410A demonstrated the case where it was connected to the air blower 180A, it was connected to the air blower (not shown) different from the air blower 180A, and it was made to eject air independently from the air ejection member 400A. May be.

  The punching metal 420A is a member that is disposed in the opening 313A and adjusts the air flow rate. That is, the punching metal 420A limits the aperture ratio at the opening 313A. The adjustment member is not limited to the punching metal 420A, and may be a filter, a grating, a mesh, or the like, and is not particularly limited as long as the aperture ratio can be limited (adjusted).

  The opening 312A is formed at the bottom 302A so as to open from the region R through which the laser beam passes toward the ejection member 400A. Specifically, the opening 312A is formed so as to open in the Y-axis direction so as to extend toward the ejection member 400 from the central point between the region R and the ejection member 400A.

  In the second embodiment, the opening 312A is formed to open up to the ejection member 400A. Therefore, the opening 312A is formed so as to include at least a region R1 indicated by a one-dot chain line in FIG.

  Furthermore, the opening 312A is formed so as to open from the region R toward the suction port 310A at the bottom 302A. Specifically, the opening 312A is formed to open in the Y-axis direction so as to extend to the suction port 310A side from the central point between the region R and the suction port 310A. In the second embodiment, the opening 312A is formed to open to the suction port 310A. That is, the opening 312A is formed so that the entire bottom 302A is opened.

  Fig.10 (a) is a perspective view which shows the ejection member in 2nd Embodiment. FIG. 10B is a central sectional view showing the ejection member in the second embodiment. As shown in FIG. 10A, a plurality of nozzle ports 401A and 402A are formed in the ejection member 400A. In the second embodiment, 16 nozzle ports 401A that are first nozzle ports are formed, and four nozzle ports 402A that are second nozzle ports are formed.

  The nozzle ports 401A are arranged in multiple stages in the Z-axis direction. Nozzle port 402A is arranged in one stage in the Z-axis direction, and is formed at the same position as the lowermost stage of nozzle port 401A in the Z-axis direction. That is, the nozzle port 402A is formed so as to be positioned at a level closest to at least the bottom 302A among the plurality of nozzle ports. Note that the nozzle ports 402A may be arranged in multiple stages in the same manner as the nozzle ports 401A.

  Further, the nozzle ports 401A are arranged in multiple rows (for example, 4 rows) in the X-axis direction. The nozzle ports 402A are arranged on both sides in the X-axis direction of the plurality of nozzle ports 401A, and are arranged in multiple rows (for example, two rows) in the X-axis direction at each position.

  As shown in FIG. 10B, the inside of the ejection member 400A has a hollow structure. Then, when high-pressure air is supplied from an air supply hole 415A provided on a surface corresponding to the nozzle port 401A, air is ejected from the nozzle ports 401A and 402A.

  Of the plurality of nozzle ports 401A, 402A, at least the nozzle port 401A located in the step closest to the bottom portion 302A is formed so as to incline gas toward the bottom portion 302A. In addition, although illustration is abbreviate | omitted, it is formed so that the nozzle mouth 402A may also incline so that a gas may be ejected toward the bottom part 302A. In the second embodiment, the nozzle ports 401A are formed so as to be inclined at stages other than the lowest stage. And the gradient is large as the lower nozzle opening.

  Also in the second embodiment, the duct 300A is arranged so that the gap between the workpiece W and the workpiece W is in a non-contact state as small as possible. This prevents the vibration of the duct 300A from propagating to the workpiece W.

  Here, as shown in FIG. 8, a plate member (same surface plate) 118 </ b> A having the same height as the surface (working surface) of the workpiece W is installed on the XY stage 110 around the workpiece W. The coplanar plate 118A is formed so that all of the opening 312A has an area located on the work W and the coplanar plate 118A even if the workpiece W is moved by the XY stage 110 during laser processing. Thereby, the airflow sucked into the duct 300A is stabilized.

  FIG. 11 is an explanatory diagram illustrating the flow of air A12, B11, and B12 at the position of the bottom portion 302A of the duct 300A in the second embodiment, as viewed from the top portion 301A toward the bottom portion 302A.

  As shown in FIG. 11, air B11 is ejected from the nozzle port 401A (FIG. 10A), and air B12 is ejected from the nozzle port 402A (FIG. 10A). When viewed in the Z-axis direction, the nozzle port 401A is arranged so as to eject gas toward the region R corresponding to the processing range (scanning range). Further, the nozzle port 402A is arranged so as to eject gas toward a region of the region R in the X-axis direction as viewed in the Z-axis direction. Accordingly, high-speed air B11 ejected from the nozzle port 401A flows in the region R.

  The broken line in FIG. 11 represents the wind speed distribution of the air B11, and the wind speed at the center of the air B11 becomes faster like this distribution. The nozzle port 401A of the ejection member 400A determines the number of nozzle ports in the X-axis direction, the nozzle port interval, the air pressure supplied to the ejection member 400A, and the like so that a desired wind speed can flow in the region (on the scanning range) R.

  The air B12 ejected from the nozzle ports 402A located at both ends of the ejection member 400A serves to prevent the air A12 flowing into the duct 300A from the opening 312A from obstructing the flow of the air B11. Air B12 is pushed by the flow of air A12, flows inward of duct 300A, and determines the nozzle position, the air pressure supplied to ejection member 400A, and the like so as not to leak out of duct 300A. Thus, the debris can be recovered without leaking out of the duct 300A and without adhering to the workpiece W.

  Subsequently, the air flow on the YZ plane passing through the center of the duct 300A in the X-axis direction will be described. The high-speed air B11 ejected from the nozzle port 401A shown in FIG. 10A flows in the Y-axis direction along the surface of the workpiece W and flows in the vicinity of the processing point P as shown in FIG. The air B11 is lifted by the air A15 flowing into the duct from the back side of the opening 312A downstream of the processing point P in the air blowing direction, and flows into the duct 300A.

  As a result, the debris does not leak out of the duct 300A and can be collected without adhering to the workpiece W. The air A15 is air that flows into the duct 300A when the dust collector 190A exhausts the air in the duct 300A.

  In order to allow a desired wind speed to flow in the vicinity of the processing point P, the number of nozzle ports in the Z-axis direction of the ejection member 400A, the nozzle port spacing, the air pressure supplied to the ejection member 400A, and the downward direction of the nozzle port 401A shown in FIG. The inclination angle and the like are determined.

  When the flow of the air B11 is stronger than the flow of the air A15 at the back side in the Y axis direction of the opening 312A and leaks out of the duct 300A, the depth of the opening 312A is widened and the position where the air collides with the air A15 is blown out. The flow can be improved by shifting downstream in the direction.

  Further, the opening ratio of the opening 313A is lowered by the punching metal 420A, and the flow rate of the air A15 flowing into the inside of the duct 300A from the front surface of the duct 300A is lowered, thereby increasing the flow rate of the air A15 and improving the flow. .

  Similarly, the air B21 ejected from the auxiliary ejection member 410A is caused to function as an air curtain of the opening 311A, and the flow rate of the air A11 flowing into the duct 300A from the top 301A is decreased, thereby increasing the flow rate of the air A15. The flow can also be improved.

  At this time, the wind speed and the like are set so that the air A21 does not leak outside the duct 300A. If air at a desired wind speed can flow near the processing point P and the air B11 can create a flow that does not leak out of the duct 300A from the back of the opening 312, the punching metal 420A and the auxiliary ejection member 410A are not necessary. It doesn't matter.

  As described above, according to the debris collection mechanism 170A of the second embodiment, high-speed air can be flowed over the workpiece W. Therefore, debris can be removed from the laser beam path in the vicinity of the processing point P having a high laser density. . Further, the debris can be collected while confining the debris inside the duct 300A and suppressing the debris from adhering to the workpiece W. Therefore, it is possible to greatly suppress a decrease in processing accuracy due to debris.

  The present invention is not limited to the embodiment described above, and many modifications are possible within the technical idea of the present invention. In addition, the effects described in the embodiments of the present invention only list the most preferable effects resulting from the present invention, and the effects of the present invention are not limited to those described in the embodiments of the present invention.

  In the above-described embodiment, the case where the laser processing apparatus includes the blower and the dust collector has been described. However, the present invention is not limited to this, and the laser processing apparatus may be configured to connect the blower and the dust collector.

  In the above-described embodiment, the case where the laser processing unit 143 employs the scanning optical system (that is, the case where the laser processing unit 143 includes the galvano scanner) has been described. However, the scanning optical system may not be employed.

143 ... Laser processing part, 170 ... Debris collection mechanism, 180 ... Blower, 190 ... Dust collector, 300 ... Duct, 301 ... Top part, 302 ... Bottom part, 303 ... Side part, 310 ... Suction port, 311 ... Opening part (first (Opening), 312 ... opening (second opening), 313 ... opening (third opening), 400 ... jetting member, 1000 ... laser processing apparatus

Claims (13)

A duct disposed between the surface of the workpiece and a laser processing portion that processes the workpiece by irradiating the surface of the workpiece with laser light;
An ejection member that is disposed on a side of the duct and ejects gas blown from a blower into the duct;
In the duct,
A first opening through which the laser beam passes in a top portion facing the laser processing portion;
A second opening through which the laser beam passes, at the bottom facing the surface of the workpiece;
In the side portion, the gas and debris in the duct connected to the dust collector and sucked into the dust collector are connected to the dust collector at a portion farther than the region through which the laser light passes in the second opening with respect to the ejection member. A suction port passing through,
A debris collection mechanism in which a third opening is formed in a portion of the side portion closer to the top portion than the ejection member.   2. The debris collection mechanism according to claim 1, wherein the ejection member is disposed on a side closer to the bottom portion than a center in a direction from the top portion to the bottom portion in the side portion.   The debris collection mechanism according to claim 1 or 2, wherein the duct is disposed so that the bottom and the surface of the workpiece are not in contact with each other.   The debris collection mechanism according to any one of claims 1 to 3, wherein the second opening is formed at the bottom so as to open from the region through which the laser beam passes toward the ejection member.   5. The debris collection mechanism according to claim 4, wherein the second opening portion is further formed at the bottom portion so as to open from the region through which the laser light passes toward the suction port.   The debris collection mechanism according to claim 4 or 5, further comprising an adjustment member that is disposed in the third opening and adjusts an air flow rate.   The debris collection mechanism according to any one of claims 1 to 6, wherein the ejection member is formed with a plurality of nozzle openings arranged in multiple stages in a direction from the top to the bottom.   The plurality of nozzle openings are seen in a direction from the top to the bottom, and a first nozzle opening that ejects gas toward a region through which the laser beam passes, and a side of the region through which the laser beam passes. The debris collection mechanism according to claim 7, further comprising a second nozzle port that ejects gas toward the region.   The debris collection mechanism according to claim 8, wherein the second nozzle port is located in a step closest to the bottom portion among the plurality of nozzle ports.   The debris according to any one of claims 7 to 9, wherein a nozzle port located at a step closest to the bottom portion among the plurality of nozzle ports is formed to be inclined so as to eject gas toward the bottom portion. Collection mechanism.   The auxiliary | assistant ejection member which is arrange | positioned in the part near the said top part with respect to the said 3rd opening part in the said side part, and further ejects the gas ventilated from the air blower to the inside of the said duct. The debris collection mechanism according to any one of the above. The debris collection mechanism according to any one of claims 1 to 11,
A laser processing apparatus comprising: a laser processing unit configured to irradiate a surface of the work with laser light to process the work.   The laser processing apparatus according to claim 12, further comprising a plate member disposed around the workpiece and having the same height as the surface of the workpiece.

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