JP6700755B2 - Debris collection mechanism, laser processing apparatus, and article manufacturing method - Google Patents

Description

The present invention, debris collection mechanism for collecting the debris generated by laser light irradiation, the laser processing apparatus having a debris collection mechanism, and a method of manufacturing an article.

  In a laser processing apparatus, ablation processing is widely used in which a work is instantly melted and evaporated by irradiating the work with high-energy laser light scanned by a galvano scanner and condensed by a condenser lens.

  In a laser processing device that performs ablation processing, the processing accuracy decreases due to the scattering of minute processing chips called debris during processing, the debris blocking the laser light and the debris adhering to the workpiece. was there. For this reason, there are widely provided a mechanism for removing debris from the laser optical path with an air blower or the like, and a mechanism for collecting debris with a dust collector or the like so that the debris does not adhere to the work.

  Patent Document 1 describes a method of removing debris from the laser optical path by blowing with air, and collecting the debris with a suction duct installed downstream of the air blowing direction. Further, in Patent Document 2, a duct having a suction port is installed on a work, and air having a strong wind velocity and air having a weak wind velocity from above and below are blown from the facing surface of the suction port to collect debris. Is listed.

JP-A-10-99978 JP 2000-317670 A

  In order to suppress the deterioration of the processing accuracy due to the debris blocking the laser light, it is necessary to remove the debris from the laser optical path in the vicinity of the processing point where the laser density is high. For this reason, it is effective to blow air with a strong wind speed in the vicinity of the processing point as in Patent Document 1. However, in the method of Patent Document 1, since the debris generated by laser processing diffuses, the debris cannot be reliably collected and there is a problem that the debris adheres to the work.

  On the other hand, in the method of Patent Document 2, it is possible to suppress the debris scattered from the work by confining it in the duct and collecting the debris from the work. However, when the duct as in the cited document 2 is installed on the work, there is a problem that the debris cannot be sufficiently removed from the laser optical path due to the air flow in the duct. That is, in the method of Patent Document 2, since the wind speed immediately above the work is weakened, debris may convection in the vicinity of the work and shield the laser light. Therefore, the effect of suppressing the deterioration of processing accuracy is low.

  Therefore, an object of the present invention is to prevent debris from adhering to a work and to effectively remove the debris from the laser optical path.

The debris collection mechanism of the present invention has a duct disposed between the surface of the work and a laser processing unit that processes the work by irradiating the surface of the work with laser light, and the duct is a top part. When a bottom portion opposed spaced the top portion, anda sides connecting the bottom portion and the top portion, the top portion includes a first opening portion in which the laser light passes Yes and, before Symbol bottom has a second aperture wherein the laser beam passes, one side of the sides, a third opening, a said bottom side of said third opening the A blower member for ejecting gas blown from a blower into the inside of the duct, which is arranged closer to the bottom than the center in the direction from the top to the bottom; A suction port, which is connected to the dust collector and through which gas and debris inside the duct that is sucked by the dust collector , is provided on a side surface facing one side surface of the side portion .

  According to the present invention, it is possible to suppress the debris from adhering to the work and to effectively remove the debris from the laser optical path, so that the processing accuracy is improved.

It is a perspective view which shows the structure of the laser processing apparatus which concerns on 1st Embodiment. (A) is a figure for demonstrating the mode of scattering of debris, (b) is a figure for demonstrating a mode of removing debris. It is a schematic diagram which shows the debris collection device in 1st Embodiment. It is a perspective view which shows the debris collection mechanism in 1st Embodiment. It is a perspective view which shows the debris collection mechanism in 1st Embodiment. It is a perspective view which shows the ejection member in 1st Embodiment. It is a schematic diagram which shows the debris collection device in 2nd Embodiment. It is a perspective view which shows the debris collection mechanism in 2nd Embodiment. It is a perspective view which shows the debris collection mechanism in 2nd Embodiment. FIG. 7A is a perspective view showing the ejection member according to the second embodiment. (B) is a central cross-sectional view showing the ejection member in the second embodiment. It is explanatory drawing which shows the flow of air seen in the direction which goes to a bottom part from the top part in the position of the bottom part of the duct in 2nd Embodiment. It is a schematic diagram which shows the debris collection device of a comparative example.

  Hereinafter, modes for carrying out the present invention will be described in detail with reference to the drawings.

[First Embodiment]
FIG. 1 is a perspective view showing the configuration of the laser processing apparatus according to the first embodiment. As shown in FIG. 1, the laser processing apparatus 1000 includes a processing machine 100 and a carrier machine 200. The transfer machine 200 transfers the work W to the processing machine 100. The processing machine 100 performs laser processing (ablation processing) on the conveyed work W. In the first embodiment, the work W is a flat member (wafer).

  The processing machine 100 simultaneously processes a plurality of works W (two works W in the first embodiment). Here, two directions that are horizontal to the surface of the processing machine 100 on which the work W is conveyed (the surfaces of work chucks 115L and 115R described later) and intersect (orthogonal) with each other are the X-axis direction and the Y-axis direction. And the vertical direction is the Z-axis direction.

  The processing machine 100 includes a gantry 101, a vibration isolation table 102, and a surface plate 103. The gantry 101 is installed on the floor. An anti-vibration table 102 is placed on the gantry 101, and a surface plate 103 is placed on the anti-vibration table 102. The vibration isolation table 102 damps the vibration transmitted from the floor to the surface plate 103 via the gantry 101. The surface plate 103 has a high rigidity and provides a stable surface for a unit mounted on the surface plate 103. The vibration isolation table 102 is not particularly limited as long as it has a property of damping and transmitting vibration, such as rubber or air spring.

  The processing machine 100 has a frame 104 and an XY stage 110 mounted on a surface plate 103. The XY stage 110 is a moving mechanism that simultaneously moves a plurality of works W in the XY axis directions. The XY stage 110 has a Y-axis stage guide 111, a Y-axis stage slider 112, an X-axis stage guide 113, and an X-axis stage slider 114.

  The X-axis stage slider 114 is mounted on the X-axis stage guide 113 and can move in the X-axis direction. The X-axis stage guide 113 is mounted on the Y-axis stage slider 112. The Y-axis stage slider 112 is mounted on the Y-axis stage guide 111 and can move in the Y-axis direction.

  A drive mechanism (for example, a rotary motor, a shaft coupling, and a ball screw) (not shown) that moves the Y-axis stage slider 112 in the Y-axis direction is mounted on the surface plate 103. Further, the surface plate 103 incorporates a scale (not shown) for measuring the position of the Y-axis stage slider 112 in the Y-axis direction.

  The Y-axis stage slider 112 is equipped with a drive mechanism (for example, a rotation motor, a shaft coupling, and a ball screw) (not shown) that moves the X-axis stage slider 114 in the X-axis direction. Further, the Y-axis stage slider 112 incorporates a scale (not shown) for measuring the position of the X-axis stage slider 114 in the X-axis direction.

  A plurality of work chucks (holding portions), in the first embodiment, two work chucks, that is, a work chuck 115L and a work chuck 115R are mounted on the X-axis stage slider 114. Each of the work chuck 115L and the work chuck 115R is provided with a large number of suction holes (not shown). The work chuck 115L and the work chuck 115R are vacuum-sucked by negative pressure air generated by a vacuum generator (not shown) and communicated with an internal groove (not shown). Can be held by.

  A cooling jacket (not shown) is attached to the back surface of each of the work chucks 115L and 115R. The cooling jacket has an internal groove (not shown), and the work chuck 115L and the work chuck 115R can be cooled by passing the cooling liquid pumped from a cooling device (not shown) through the internal groove.

  A work lifter (not shown) is attached to the back surface of each work chuck 115L, 115R. The work lifter has a drive mechanism, for example, an air cylinder. A work lift pin (not shown) is mounted on the movable-side end of the work lifter. Through holes (not shown) are provided in the work chuck 115L, the work chuck 115R, and the cooling jacket (not shown). Therefore, the work lifter can move the work lift pins up and down with respect to the work chuck surfaces of the work chucks 115L and 115R. Further, the work lift pin is provided with a suction hole, and the work can be fixed by vacuum suction by negative pressure air generated by a vacuum generator (not shown).

  Further, the processing machine 100 has cameras 138L and 138R for precise measurement, which images the work W held by the work chucks 115L and 115R. Further, the processing machine 100 has two Z stages 130L and 130R fixed to the upper portion of the frame 104 and corresponding to the two work chucks 115L and 115R, respectively.

  The Z stage 130L (130R) has a Z axis stage guide 132L (132R) and a Z axis stage slider 134L (134R). The Z-axis stage slider 134L (134R) is mounted on the Z-axis stage guide 132L (132R) and can move in the Z-axis direction.

  On the Z stage 130L (130R), a drive mechanism (for example, a rotary motor, a shaft coupling, and a ball screw) (not shown) for moving the Z axis stage slider 134L (134R) in the Z axis direction is mounted. Further, the Z stage 130L (130R) incorporates a scale (not shown) for measuring the position of the Z axis stage slider 134L (134R) in the Z axis direction.

  Further, the processing machine 100 has a plurality (two in the first embodiment) of laser optical systems 150L and 150R.

  The laser optical system 150L includes a laser oscillator 144L that is a laser oscillator that emits laser light, a galvano scanner 140L, and an fθ lens 142L that is a condenser lens that condenses the laser light. The laser oscillator 144L is fixed to a device cover (not shown). The laser light emitted by the laser oscillator 144L is guided to the galvano scanner 140L via an optical system such as an optical fiber, a collimator, and a folding mirror. The galvano scanner 140L is attached to the Z-axis stage slider 134L of the Z stage 130L. The galvano scanner 140L has two mirrors with an encoder and scans the laser light in the XY axis directions. The fθ lens 142L is attached to the galvano scanner 140L. The focal length of the laser light that has passed through the fθ lens 142L and is focused is adjusted by the Z stage 130L so that the focal point is located on the processing surface (surface) of the work set on the work chuck 115L. At that time, the distance to the work surface is measured by the displacement meter 155L fixed to the frame 104, so that the focal length can be adjusted according to the thickness variation of each work. The galvano scanner 140L and the fθ lens 142L constitute a laser processing section 143L for processing the work by irradiating the surface of the work with laser light.

  The processable range of the laser processing unit 143L (galvano scanner 140L), that is, the range in which the laser light can be scanned is rectangular. A range (processing range) in which processing is actually performed by the laser processing unit 143L (galvano scanner 140L), that is, a range in which laser light is scanned is equal to or less than the processable range, and is rectangular in the first embodiment. The laser processing unit 143L performs processing by irradiating laser light within this processing range.

  The laser optical system 150R also has the same configuration as the laser optical system 150L, and includes a laser oscillator 144R and a laser processing unit 143R including a galvano scanner 140R and an fθ lens 142R. The focal length of the laser light that has passed through the fθ lens 142R and is focused is adjusted by the Z stage 130R so that the focal point is located on the processing surface (surface) of the work set on the work chuck 115R. At that time, the distance to the work surface is measured by the displacement gauge 155R fixed to the frame 104, so that the focal length can be adjusted according to the thickness variation of each work.

  With the above configuration, the XY stage 110 can relatively move the work chucks 115L, 115R and the laser processing units 143L, 143R by moving the work chucks 115L, 115R with respect to the galvano scanners 140L, 140R. .. That is, the XY stage 110 can move the processing range of each laser processing section 143L, 143R relative to each work chuck 115L, 115R (that is, each work) simultaneously in the same direction and by the same amount.

  Although the work chucks 115L and 115R are moved with respect to the laser processing units 143L and 143R, the work chucks 115L and 115R and the laser processing units 143L and 143R may be moved relatively. Therefore, the laser processing units 143L and 143R may be moved with respect to the work chucks 115L and 115R by the moving mechanism, or both may be moved. Further, the case has been described in which the laser light oscillated by the two laser oscillators 144L and 144R is guided to the laser processing units 143L and 143R, but the laser light oscillated by one laser oscillator is guided to the laser processing units 143L and 143R. It may be configured as follows.

  As described above, in the first embodiment, the laser light emitted from each laser oscillator is focused by the fθ lens on each work W conveyed onto each work chuck 115L, 115R, and the energy is applied to the processing point on the work. Work is done by concentrating and instantly melting and evaporating the work. Further, by repeating the rough positioning of the work W on the work chucks 115L and 115R by the XY stage 110 and the fine positioning of the laser light by the laser processing units 143L and 143R, it is possible to perform highly accurate processing on a large diameter work. ing. In other words, a combination of high-speed machining in a narrow range by the Galvano scanners 140L and 140R and step movement by the XY stage 110 enables machining in a wide range. In addition, in the first embodiment, the case where two workpieces are machined at the same time is described, but it is also possible to machine one workpiece alone.

  Here, debris generated when performing ablation processing with a laser beam will be described. FIG. 2A is a diagram for explaining how debris is scattered, and FIG. 2B is a diagram for explaining how debris is removed.

  In a laser processing apparatus that performs ablation processing, as shown in FIG. 2A, when processing, minute processing chips called debris D scatter and block the laser light L or adhere to the work W. There is a problem that processing accuracy is reduced. Therefore, as shown in FIG. 2B, it is necessary to remove the debris D with the air A from the laser optical path. Further, in order to effectively suppress the deterioration of the processing accuracy due to the debris D blocking the laser light L, as shown in FIG. 2B, the strong air A near the processing point P where the laser density is high is used. To remove the debris D from the laser optical path.

  In the first embodiment, as shown in FIG. 1, the processing machine 100 has a plurality (two in the first embodiment) of debris collection devices 160L and 160R.

  Here, a debris collection device of a comparative example will be described. FIG. 12 is a schematic diagram showing a debris collection device of a comparative example. The debris collection device 160X has a debris collection mechanism 170X, a blower 180X, and a dust collector 190X. The debris collection mechanism 170X has a duct 300X and an ejection member 400X.

  The ejection member 400X is attached to the duct 300X and is connected to the blower 180X via a connection pipe 181X. As a result, the ejection member 400X ejects the air blown from the blower 180X into the inside of the duct 300X.

  Openings 311X and 312X through which the laser light L passes are formed in the top portion 301X and the bottom portion 302X of the duct 300X. Further, a suction port 310X connected to the dust collector 190X via a flexible hose 191X is formed in a portion of the duct 300X facing the ejection member 400X. By operating the dust collector 190X, the air and debris in the duct 300X are sucked from the suction port 310X.

  Here, the air A1X, A2X flows into the duct 300X from the openings 311X, 312X of the duct 300X by the suction of air by the dust collector 190X. At this time, the flow of the air B1X from the ejection member 400X is blocked by the air A2X flowing from the opening portion 312X. As a result, debris cannot be sufficiently removed from the laser optical path. The debris scattered on the upper part of the duct 300X rides on the flow of the air A1X flowing from the opening 311X of the top 301X, convects the inside of the duct 300X while shielding the laser light, and enters the dust collector 190X via the suction port 310X. Be recovered. As described above, the debris blocks the laser light, so that the processing accuracy is significantly reduced.

  The debris collection devices 160L and 160R of the first embodiment will be described. FIG. 3 is a schematic diagram showing the debris collection device in the first embodiment. Since the debris collection device 160L and the debris collection device 160R have the same configuration, they will be described below as the debris collection device 160. Further, since the laser processing section 143L and the laser processing section 143R have the same configuration, they will be described as the laser processing section 143 (the galvano scanner 140 and the fθ lens 142). In FIG. 3, the work W is shown as being fixed to the work chucks 115L and 115R.

  The debris collection device 160 has a debris collection mechanism 170, a blower 180, and a dust collector 190. The debris collection mechanism 170 has the duct 300 and the ejection member 400. The debris collection mechanism 170 (that is, the duct 300) is fixed to the frame 104 (FIG. 1). The duct 300 has a box shape.

  In the first embodiment, the blower 180 is individually provided for each of the two debris collecting mechanisms, but one blower may be shared by the two debris collecting mechanisms. Similarly, the dust collectors 190 are individually provided for the two debris collection mechanisms, but one dust collector may be shared by the two debris collection mechanisms.

  The blower 180 blows high-pressure gas (air). The dust collector 190 is a suction device that sucks dust and the like, and sucks dust together with gas (air). The blower 180 may be configured to blow a gas other than air.

  4 and 5 are perspective views showing the debris collection mechanism in the first embodiment. The duct 300 has a top portion 301, a bottom portion 302 that faces the top portion 301 with a gap, and a side portion 303 that connects the top portion 301 and the bottom portion 302. An inner space of the duct 300 is formed by being surrounded by the top portion 301, the bottom portion 302, and the side portion 303. The internal space of the duct 300 is formed in a trapezoidal shape that tapers from the top 301 to the bottom 302.

  As shown in FIG. 3, the duct 300 includes an fθ lens 142 such that the top portion 301 faces the fθ lens 142 of the laser processing portion 143 and the bottom portion 302 faces the surface of the work W conveyed to the work chuck. It is arranged between the work W (work chuck).

  The ejection member 400 is attached to a part (one side surface) of the side portion 303 of the duct 300, and is connected to the blower 180 via the connection pipe 181. As a result, the ejection member 400 ejects the air blown from the blower 180 into the duct 300.

  An opening (first opening) 311 through which the laser light that has passed through the fθ lens 142 passes is formed in the top portion 301. An opening (second opening) 312 through which the laser light that has passed through the fθ lens 142 passes is formed in the bottom portion 302. In FIGS. 4 and 5, the region R is a region through which the laser light passes in the bottom portion 302 (opening 312). The opening 312 is formed to be slightly larger (for example, one side has a length of about 1 mm) than the region R through which the laser light passes.

  In the side portion 303 of the duct 300, a suction port 310 is formed in a portion farther from the ejection member 400 than the region R, that is, a portion (the other side surface) facing the ejection member 400 in the first embodiment. A flange 320 that connects the flexible hose 191 is attached to the suction port 310. Therefore, the suction port 310 is connected to the dust collector 190 via the flange 320 and the flexible hose 191. By operating the dust collector 190, the air and debris in the duct 300 are sucked from the suction port 310. That is, through the suction port 310, the gas and debris inside the duct 300 sucked by the dust collector 190 pass.

  In the side portion 303 (one side surface), an opening (third opening) 313 is formed in a portion closer to the ceiling 301 with respect to the ejection member 400. Specifically, by arranging (fixing) the ejection member 400 on the side portion 303 so as to block a part of the opening of the side portion 303, the opening portion 313 is formed in the remaining portion of the opening.

  Here, the Z-axis direction is a direction from the top 301 to the bottom 302 (that is, a direction perpendicular to the top 301 or the bottom 302), and is also a direction in which the work W is irradiated with laser light. The XY axis direction is a direction horizontal to the top 301 or the bottom 302 and also a direction orthogonal to the laser light irradiation direction. Of the XY axis directions, the Y axis direction is a direction from the opening 313 toward the suction port 310, and the X axis direction is a direction orthogonal to the Y axis direction.

  The ejection member 400 is arranged so as to eject the air B1 along the bottom portion 302, in the side portion 303 closer to the bottom portion 302 than the center in the Z-axis direction, in contact with the bottom portion 302 in the first embodiment.

  As shown in FIG. 3, air A1, A2, A3 flows into the duct 300 from the openings 311, 312, 313 by the dust collector 190. In the first embodiment, most of the air flowing into the duct 300 due to the operation of the dust collector 190 is the air A3 flowing from the opening 313.

  Further, the flow rate of the air A2 flowing from the opening 312 is extremely small because the air B1 ejected from the ejection member 400 serves as an air curtain. The flow rate of the air A1 flowing from the opening 311 is larger than the flow rate of the air A2 flowing from the opening 312.

  The air B1 flows in the vicinity of the processing point P while maintaining the direction and flow velocity without being obstructed by the air A2 flowing from the opening 312. As a result, the debris is removed from the laser optical path in the vicinity of the processing point P where the laser density is high. Most of the air flowing into the duct 300 is the air A3 flowing from the opening 313. Therefore, the air A1 flowing in from the opening 311 is entrained in the air A3 and becomes a flow rectified in the Y-axis direction toward the suction port 310.

  As described above, according to the first embodiment, the ejection member 400 can blow the strong air B1 in the vicinity of the processing point P. Further, the air A3 flowing from the opening 313 can create a rectified air flow from the opening 313 toward the suction port 310 inside the duct 300.

  Therefore, it is possible to remove the debris from the laser optical path in the vicinity of the processing point P where the laser density is high, and to collect the debris by the dust collector 190 without blocking the laser light L. Furthermore, it becomes possible to reliably collect the debris without attaching it to the work. Therefore, it is possible to significantly suppress the deterioration of the processing accuracy due to debris.

  Here, the duct 300 is arranged so that the gap between the duct 300 and the workpiece W is as small as possible without contacting the workpiece W. Thereby, while preventing the vibration of the duct 300 from propagating to the work W, the air B1 ejected from the ejection member 400 can be made to flow in the vicinity of the processing point P of the work W.

  The height of the duct 300 in the Z-axis direction should be as high as possible. This can prevent debris from scattering from the opening 311 to the outside of the duct 300.

  Further, the opening 311 and the opening 312 are formed as small as possible while ensuring an area that does not block the passage of the laser light L. The suction operation of the dust collector 190 reduces the flow rates of the air A1 and A2 flowing into the duct 300 from the openings 311 and 312.

  On the other hand, the opening 313 has a larger opening area than the opening 311. The suction operation of the dust collector 190 increases the flow rate of the air A3 flowing into the duct 300 from the opening 313. Therefore, most of the air flowing into the duct 300 can be taken in from the opening 313 by the dust collector 190.

  As shown in FIGS. 4 and 5, the opening 313 is formed in a trapezoidal shape in which the side close to the bottom 302 is shorter than the side close to the top 301, following the internal space of the duct 300. As a result, the opening shape of the opening 313 is matched with the laser condensing shape, and the flow velocity of the air in the duct 300 on the bottom 302 side can be increased. By increasing the flow velocity of the air in the duct 300, the debris collection capability is improved.

  FIG. 6 is a perspective view showing the ejection member according to the first embodiment. As shown in FIG. 6, the ejection member 400 is formed with a plurality of (16 in the first embodiment) nozzle openings 401 for ejecting air. The plurality of nozzle openings 401 are arranged in multiple stages in the Z-axis direction (four-stage arrangement in the first embodiment) and in multiple rows in the X-axis direction (four-row arrangement in the first embodiment).

  In the first embodiment, a single large nozzle opening is used instead of a single large nozzle opening, so that the air velocity of the air ejected from each nozzle opening 401 is increased. Further, of the plurality of nozzle openings 401 arranged in multiple stages, the air ejected from the bottommost nozzle opening 401 will flow along the bottom portion 302 of the duct 300, and the strong air in the Y-axis direction will flow through the opening 312. Can be sprayed. Further, by arranging the nozzle openings 401 in multiple rows in the X-axis direction, it is possible to flow air over the entire laser scanning range of the laser processing unit 143.

[Second Embodiment]
Next, a laser processing apparatus according to the second embodiment will be described. FIG. 7 is a schematic diagram showing a debris collection device according to the second embodiment. 8 and 9 are perspective views showing the debris collection mechanism in the second embodiment. In the second embodiment, the same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted. In the second embodiment, the second opening is largely opened at the bottom of the duct, and the gas ejected by the ejection member is blown onto the surface of the work. The details will be described below.

  The debris collection device 160A has a debris collection mechanism 170A, a blower 180A, and a dust collector 190A. The debris collection mechanism 170A has a duct 300A and a jetting member 400A. The debris collection mechanism 170A (that is, the duct 300A) is fixed to the frame 104 (see FIG. 1). The duct 300A has a box shape.

  In the second embodiment, the blower 180A is provided individually for each of the two debris collection mechanisms, but one blower may be shared by the two debris collection mechanisms. Similarly, although the dust collectors 190A are individually provided for the two debris collection mechanisms, one dust collector may be shared by the two debris collection mechanisms.

  The blower 180A blows high-pressure gas (air). The dust collector 190A is a suction device that sucks dust and the like, and sucks dust together with gas (air). The blower 180A may be configured to blow a gas other than air.

  The duct 300A has a top portion 301A, a bottom portion 302A facing the top portion 301A with a gap, and a side portion 303A connecting the top portion 301A and the bottom portion 302A. Surrounded by the top portion 301A, the bottom portion 302A, and the side portions 303A, an internal space of the duct 300A is formed.

  In the duct 300A, the top portion 301A faces the fθ lens 142 of the laser processing portion 143, and the bottom portion 302A faces the surface (working surface) of the work W conveyed to the work chuck. Work chuck).

  The ejection member 400A is attached to a part (one side surface) of the side portion 303A of the duct 300A, and is connected to the blower 180A via a connection pipe 181A. As a result, the ejection member 400A ejects the gas (air) blown from the blower 180A into the duct 300A.

  An opening portion (first opening portion) 311A through which the laser light that has passed through the fθ lens 142 passes is formed in the top portion 301A. The bottom portion 302A is formed with an opening portion (second opening portion) 312A through which the laser light having passed through the fθ lens 142 passes. In FIG. 9, a region R is a region through which laser light passes at the bottom portion 302A (opening portion 312A).

  In the side portion 303A of the duct 300A, a suction port 310A is formed in a portion farther than the region R with respect to the ejection member 400A, that is, a portion facing the ejection member 400A (the other side surface) in the second embodiment. A flange 320A for connecting the flexible hose 191A is attached to the suction port 310A. Therefore, the suction port 310A is connected to the dust collector 190A via the flange 320A and the flexible hose 191A. By operating the dust collector 190A, the air and debris in the duct 300A are sucked from the suction port 310A. That is, in the suction port 310A, the gas and debris inside the duct 300A sucked by the dust collector 190A pass.

  In the side portion 303A (one side surface), an opening (third opening) 313A is formed in a portion closer to the ceiling 301A with respect to the ejection member 400A.

  The ejection member 400A is arranged so as to eject air along the bottom portion 302A, in the side portion 303A, on the side closer to the bottom portion 302A than the center in the Z-axis direction, in contact with the bottom portion 302A in the second embodiment.

  In the second embodiment, the debris collection mechanism 170A further includes an auxiliary ejection member 410A and a punching metal 420A that is an adjustment member.

  The auxiliary ejection member 410A is connected to the blower 180A by a connection pipe 181A. The auxiliary jetting member 410A is arranged in the side portion 303A (one side surface) at a portion closer to the ceiling portion 301A with respect to the opening 313A, and jets the gas blown from the blower 180A into the duct 300A. The auxiliary ejection member 410A is arranged so as to eject air along the top portion 301A, in the side portion 303A, on the side closer to the top portion 301A than the center in the Z-axis direction, in contact with the top portion 301A in the second embodiment. ing.

  Although the case where the auxiliary blower member 410A is connected to the blower 180A has been described, the auxiliary blower member 410A is connected to a blower (not shown) different from the blower 180A and blows air independently of the blower member 400A. You may.

  The punching metal 420A is a member that is disposed in the opening 313A and adjusts the air flow rate. That is, the punching metal 420A limits the aperture ratio in the opening 313A. The adjusting member is not limited to the punching metal 420A, but may be a filter, grating, mesh, or the like, and is not particularly limited as long as it can limit (adjust) the aperture ratio.

  The opening portion 312A is formed in the bottom portion 302A so as to open from the region R through which the laser light passes toward the ejection member 400A. Specifically, the opening portion 312A is formed so as to extend toward the ejection member 400 side with respect to the center point between the region R and the ejection member 400A in the Y-axis direction.

  In the second embodiment, the opening portion 312A is formed so as to open up to the ejection member 400A. Therefore, the opening portion 312A is formed so as to include at least the region R1 shown by the alternate long and short dash line in FIG.

  Further, the opening portion 312A is formed in the bottom portion 302A so as to open from the region R toward the suction port 310A. Specifically, the opening portion 312A is formed so as to extend toward the suction port 310A side with respect to the center point between the region R and the suction port 310A in the Y-axis direction. In the second embodiment, the opening portion 312A is formed so as to open up to the suction port 310A. That is, the opening portion 312A is formed so that the entire bottom portion 302A is opened.

  FIG. 10A is a perspective view showing the ejection member according to the second embodiment. FIG. 10B is a central cross-sectional view showing the ejection member according to the second embodiment. As shown in FIG. 10A, a plurality of nozzle openings 401A and 402A are formed in the ejection member 400A. In the second embodiment, 16 nozzle openings 401A that are the first nozzle openings are formed, and 4 nozzle openings 402A that are the second nozzle openings are formed.

  The nozzle openings 401A are arranged in multiple stages in the Z-axis direction. The nozzle opening 402A is arranged in only one step in the Z-axis direction, and is formed at the same position as the lowest step of the nozzle opening 401A in the Z-axis direction. That is, the nozzle opening 402A is formed so as to be located at least in the step closest to the bottom portion 302A among the plurality of nozzle openings. Note that the nozzle openings 402A may also be arranged in multiple stages, similar to the nozzle openings 401A.

  The nozzle openings 401A are arranged in multiple rows (for example, four rows) in the X-axis direction. The nozzle openings 402A are arranged on both sides of the plurality of nozzle openings 401A in the X-axis direction, and are arranged in multiple rows (for example, two rows) in the X-axis direction at each position.

  As shown in FIG. 10B, the inside of the ejection member 400A has a hollow structure. Then, high-pressure air is supplied from the air supply hole 415A provided on the surface corresponding to the nozzle opening 401A, so that the air is ejected from the nozzle openings 401A and 402A.

  Of the plurality of nozzle openings 401A and 402A, at least the nozzle opening 401A located at the stage closest to the bottom portion 302A is formed to be inclined so as to eject gas toward the bottom portion 302A. Although not shown, the nozzle opening 402A is also formed so as to be inclined so as to eject gas toward the bottom portion 302A. In the second embodiment, the nozzle openings 401A are also formed to be inclined in stages other than the lowest stage. The lower the nozzle opening, the larger the gradient.

  Also in the second embodiment, the duct 300A is arranged so that the gap between the duct 300A and the workpiece W in the non-contact state with the workpiece W is as small as possible. This prevents the vibration of the duct 300A from propagating to the work W.

  Here, as shown in FIG. 8, a plate member (flush plate) 118A having the same height as the surface (working surface) of the work W is installed on the XY stage 110 around the work W. The same-face plate 118A is formed so that even if the work W is moved by the XY stage 110 during laser processing, all of the openings 312A have an area that is located on the work W and the same-face plate 118A. This stabilizes the air flow sucked into the duct 300A.

  FIG. 11: is explanatory drawing which shows the flow of air A12, B11, B12 seen in the direction which goes to the bottom part 302A from the top part 301A in the position of the bottom part 302A of the duct 300A in 2nd Embodiment.

  As shown in FIG. 11, air B11 is ejected from the nozzle opening 401A (FIG. 10A), and air B12 is ejected from the nozzle opening 402A (FIG. 10A). When viewed in the Z-axis direction, the nozzle port 401A is arranged so as to eject gas toward a region R corresponding to the processing range (scanning range). Further, the nozzle port 402A is arranged so as to eject the gas toward a region on the side of the region R in the X-axis direction when viewed in the Z-axis direction. Therefore, the high-speed air B11 ejected from the nozzle opening 401A flows in the region R.

  The broken line in FIG. 11 represents the wind speed distribution of the air B11, and the air speed in the center of the air B11 is high as in this distribution. The nozzle openings 401A of the ejection member 400A determine the number of nozzle openings in the X-axis direction, the nozzle opening interval, the air pressure supplied to the ejection member 400A, and the like so that a desired wind speed can flow in the region (on the scanning range) R.

  The air B12 ejected from the nozzle openings 402A located at both ends of the ejection member 400A serves to prevent the air A12 flowing into the duct 300A from the opening 312A from obstructing the flow of the air B11. The air B12 is pushed by the flow of the air A12, flows inward of the duct 300A, and determines the nozzle position, the air pressure supplied to the ejection member 400A, and the like so as not to leak to the outside of the duct 300A. As a result, the debris does not leak to the outside of the duct 300A and can be collected without adhering to the work W.

  Next, the air flow on the YZ plane passing through the center of the duct 300A in the X-axis direction will be described. The high-speed air B11 ejected from the nozzle port 401A shown in FIG. 10A flows along the surface of the workpiece W in the Y-axis direction and flows near the processing point P, as shown in FIG. The air B11 is lifted by the air A15 flowing into the duct from the inner side of the opening 312A at the downstream of the processing point P in the air blowing direction, and flows into the duct 300A.

  As a result, the debris does not leak to the outside of the duct 300A and can be collected without adhering to the work W. The air A15 is the air that flows into the duct 300A when the dust collector 190A exhausts the air from the duct 300A.

  The number of nozzle openings in the ejection member 400A in the Z-axis direction, the nozzle opening interval, the air pressure supplied to the ejection member 400A, and the downward direction of the nozzle opening 401A shown in FIG. 10B so that a desired wind speed can flow near the processing point P. The inclination angle and the like are determined.

  When the flow of the air B11 leaks to the outside of the duct 300A stronger than the flow of the air A15 on the inner side of the opening 312A in the Y-axis direction, the depth of the opening 312A is increased and the position where it collides with the air A15 is blown out. Flow can be improved by shifting downstream in the direction.

  Further, the punching metal 420A can reduce the opening ratio of the opening 313A and reduce the flow rate of the air A13 flowing into the duct 300A from the front surface of the duct 300A, thereby increasing the flow rate of the air A15 and improving the flow. .

  Similarly, the air B21 ejected from the auxiliary ejection member 410A functions as an air curtain of the opening 311A, and the flow rate of the air A11 flowing from the top 301A into the duct 300A is decreased to increase the flow rate of the air A15. It can also improve the flow.

  At this time, the wind speed or the like is set so that the air A21 does not leak to the outside of the duct 300A. If the air of a desired wind speed can be made to flow in the vicinity of the processing point P and the air B11 can create a flow that does not leak from the depth of the opening 312 to the outside of the duct 300A, the punching metal 420A and the auxiliary ejection member 410A are eliminated. I don't care.

  As described above, according to the debris collection mechanism 170A of the second embodiment, since high-speed air can be flown on the work W, the debris can be removed from the laser optical path in the vicinity of the processing point P where the laser density is high. . Further, the debris can be collected while being confined inside the duct 300A to prevent the debris from adhering to the work W. Therefore, it is possible to significantly reduce the reduction in processing accuracy due to debris.

  The present invention is not limited to the embodiments described above, and many modifications can be made within the technical idea of the present invention. In addition, the effects described in the embodiments of the present invention are merely listed as the most suitable effects resulting from the present invention, and the effects according to the present invention are not limited to those described in the embodiments of the present invention.

  In the above-described embodiment, the case where the laser processing apparatus includes the blower and the dust collector has been described, but the present invention is not limited to this, and the blower and the dust collector may be connected to the laser processing apparatus.

  Further, in the above embodiment, the case where the laser processing unit 143 adopts the scan optical system (that is, the case where the laser processing unit 143 has the galvano scanner) has been described, but the case where the scan optical system is not adopted may be adopted.

143... Laser processing part, 170... Debris collection mechanism, 180... Blower, 190... Dust collector, 300... Duct, 301... Top part, 302... Bottom part, 303... Side part, 310... Suction port, 311... Opening part (first Opening part), 312... Opening part (second opening part), 313... Opening part (third opening part), 400... Spouting member, 1000... Laser processing device

Claims (13)

Has a surface of a workpiece, the duct is arranged between the laser processing unit for irradiating a laser beam on the surface of the workpiece to machine the workpiece,
The duct has a top portion, a bottom portion facing the top portion with a space, and a side portion connecting the top portion and the bottom portion ,
Before Kiten portion has a first opening portion in which the laser beam passes,
Before Symbol bottom portion has a second opening which the laser beam passes,
One side surface of the side portion is disposed on a side closer to the bottom than the third opening and the bottom side of the third opening, and the center of the direction from the top to the bottom. A blowing member for blowing the gas blown from a blower into the inside of the duct;
On the side opposite to the one side surface of said side a said side is connected to a dust collector, and having a suction port gas and debris inside the duct to be sucked into the dust collector passes Debris collection mechanism. Debris collection mechanism according to claim 1, characterized in that said bottom surface of said workpiece is said duct is arranged so that non-contact. The debris collection mechanism according to claim 1 or 2 , wherein the second opening is formed in the bottom so as to open from a region through which the laser light passes toward the ejection member. The debris collection mechanism according to claim 3 , wherein the second opening is further formed in the bottom so as to open from a region through which the laser light passes toward the suction port. The debris collection mechanism according to claim 3 or 4 , further comprising an adjusting member that is arranged in the third opening and adjusts a ventilation amount. Wherein the ejection member has a debris collection mechanism according to any one of claims 1 to 5, characterized in that multistage arranged plurality of nozzle orifices in a direction toward the bottom portion from the top portion is formed . The plurality of nozzle openings are, when viewed in a direction from the top to the bottom, a first nozzle opening for ejecting gas toward a region through which the laser light passes, and a side of the region through which the laser light passes. The debris recovery mechanism according to claim 6 , further comprising a second nozzle port that ejects gas toward the region. The debris collection mechanism according to claim 7 , wherein the second nozzle port is located in a step closest to the bottom portion among the plurality of nozzle ports. Nozzle opening located nearest stage to the bottom of the plurality of nozzle orifices is any one of the claims 6 to 8, characterized in that towards the bottom is formed to be inclined so spewing gas The debris collection mechanism according to item. And wherein the disposed portion of the top portion side with respect to the third opening in one side surface of the side, with the air blowing gaseous from the blower further part material you ejected into the interior of the duct debris collection mechanism according to any one of claims 1 to 9. A debris collection mechanism according to any one of claims 1 to 10 ,
The laser beam is irradiated on the surface of the workpiece, the laser machining apparatus being characterized in that and a laser processing unit for processing the workpiece. The laser processing apparatus according to claim 11 , further comprising a plate member disposed around the work and having the same height as the surface of the work. Method of manufacturing an article, characterized by producing an article by processing said workpiece while collecting the debris by the debris collection mechanism according to any one of claims 1 to 10.

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