JP2015146352A - Cleaning device and cleaning method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cleaning device capable of cleaning a substrate including a loading table for loading the substrate thereon without leaving an uncleaned part when cleaning the substrate.SOLUTION: Disclosed is a cleaning device equipped with a plurality of nozzles 1a to 1c for discharging the cleaning fluid for cleaning a substrate 10. This device includes discharge direction changing means 2a to 2c for changing discharge directions of a plurality of nozzles 1 independently from each other. Also, a cleaning method includes a step for changing the discharge direction of the cleaning liquid of at least one nozzle out of the plurality of nozzles 1a to 1c.

Description

  The present invention relates to a cleaning apparatus and a cleaning method.

  In Patent Document 1, the wafer is rotated at a first rotation speed and cleaned for a predetermined time, and then switched to a second rotation speed higher than the first rotation speed and rotated for cleaning for a predetermined time. A wafer cleaning method of a dicing apparatus that repeatedly cleans a wafer multiple times is described.

  In Patent Document 2, the substrate is positively charged by discharging pure water to the main surface of the substrate by the first pure water discharge unit, and pure water is discharged to the main surface of the substrate by the second pure water discharge unit. Describes a substrate cleaning apparatus for negatively charging the substrate and neutralizing the potential of the substrate by offsetting the positive charging of the substrate caused by the discharge of pure water from the first pure water discharge means.

  In Patent Document 3, a cleaning liquid channel having a cleaning liquid discharge port for discharging a cleaning liquid for surface treatment of a substrate, an ultrasonic vibration applying unit for applying ultrasonic vibration to the cleaning liquid flowing through the processing channel, There is described a cleaning liquid supply apparatus including a droplet jet forming means for mixing a cleaning liquid discharged from a cleaning liquid discharge port and a gas to form a jet of cleaning liquid droplets.

JP 2006-310395 A (released on November 9, 2006) JP 2011-143320 A (published July 28, 2011) JP 2004-260099 A (published September 16, 2004)

  However, Patent Documents 1 to 3 do not disclose a cleaning apparatus that can clean a substrate without a cleaning residue even when the substrate is placed. In Patent Documents 1 to 3, no consideration is given to the cleaning of the mounting table on which the substrate is mounted.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a cleaning apparatus capable of cleaning without cleaning residue up to a mounting table on which a substrate is placed when cleaning the substrate.

  In order to solve the above problems, a cleaning apparatus according to the present invention includes a plurality of nozzles that discharge a cleaning liquid for cleaning a substrate, and the discharge directions of the plurality of nozzles are independent of each other. The discharge direction changing means for changing is provided.

  The cleaning method according to the present invention is a cleaning method for cleaning a substrate with a cleaning apparatus having a plurality of nozzles for discharging a cleaning liquid for cleaning the substrate, wherein the discharge directions of the plurality of nozzles are independent of each other. And changing the discharge direction of the cleaning liquid from at least one of the plurality of nozzles by the discharge direction changing means.

  The present invention has an effect that when a substrate is cleaned, the mounting table on which the substrate is placed can be cleaned without any remaining cleaning.

It is a figure explaining the outline of the several nozzle with which the washing | cleaning apparatus which concerns on one Embodiment of this invention is provided. It is a figure explaining the outline of the washing device concerning one embodiment of the present invention. It is a figure explaining the outline of the washing | cleaning method which concerns on one Embodiment of this invention. It is a figure explaining the outline of the conventional cleaning method.

<Cleaning apparatus 100>
The cleaning apparatus 100 which is an embodiment of the cleaning apparatus according to the present invention will be described in more detail with reference to FIGS. 1 and 2. (A)-(c) of FIG. 1 is a figure explaining the nozzle 1 with which the washing | cleaning apparatus 100 is provided. FIG. 2A is a diagram illustrating an outline of the cleaning device 100 as viewed from above. FIG. 2B is a cross-sectional view illustrating an outline of the cleaning device 100 as viewed from the side.

  As shown in FIGS. 1 and 2, the cleaning apparatus 100 is a cleaning apparatus that includes a nozzle 1 that discharges a cleaning liquid for cleaning the substrate 10, and includes nozzles 1 a and 1 b that a plurality of nozzles 1 include. And a discharge direction changing section (discharge direction changing means) 2 for changing the discharge directions of 1c independently of each other.

  As shown in FIG. 2A, the cleaning device 100 includes an arm (arm member) 3 and a spin chuck (mounting table) 5.

  The cleaning device 100 may include a clamp (holding unit).

  As shown in FIG. 2B, the cleaning apparatus 100 includes an upper exhaust port 6a, a first shielding part 6, a lower exhaust port 7a, a second shielding part 7, and an airflow changing part 9.

  The cleaning apparatus 100 may include a pure water discharge nozzle and an air blow nozzle.

  As shown in FIGS. 2A and 2B, in the cleaning device 100, the plurality of nozzles 1 move inside the inner peripheral portions of the first shielding part 6 and the second shielding part 7. Here, the first shielding part 6 and the second shielding part 7 prevent the cleaning liquid mist from splashing outside the cup 8. Thereby, it can prevent that the circumference | surroundings of the cup 8 of the washing | cleaning apparatus 100 are contaminated with washing | cleaning liquid mist.

  On the other hand, when the inner diameters of the first shielding part 6 and the second shielding part 7 are set so that the first shielding part 6 and the second shielding part 7 can suitably prevent scattering of the cleaning liquid mist, the rotation of the arm 3 can be performed. The movement range of the plurality of nozzles 1 that are moved by the movement is limited. For this reason, cleaning residue is likely to occur in the spin chuck 5 and the clamp provided in the cleaning device 100.

  However, in the cleaning device 100, even if the movement range of the plurality of nozzles 1 is limited by the first shielding unit 6 and the second shielding unit 7, at least one of the plurality of nozzles 1 of the plurality of nozzles 1 is controlled by the ejection direction changing unit 2. The discharge direction of the cleaning liquid can be changed. Thereby, the range in which the plurality of nozzles 1 supply the cleaning liquid can be widened. Therefore, the spin chuck 5 and the clamp can be cleaned without any remaining cleaning.

  In other words, according to the cleaning apparatus 100, not only the spin chuck 5 and the clamp can be cleaned without remaining cleaning, but also the contamination around the cup 8 due to the scattering of the cleaning liquid mist can be prevented.

[Nozzle 1]
As shown in FIG. 1A, the nozzle 1 is for discharging a cleaning liquid for cleaning the substrate 10, and includes nozzles 1 a, 1 b and 1 c as a plurality of nozzles 1. The nozzles 1a, 1b, and 1c can change the discharge direction of the cleaning liquid independently of each other by the discharge direction changing unit 2.

  Further, as the nozzles 1a, 1b, and 1c, typically, a two-fluid spray nozzle can be used. Further, the number of nozzles is not limited to three. The cleaning apparatus 100 preferably includes two or more and six or less two-fluid spray nozzles as the plurality of nozzles. Thereby, not only the substrate 10 but also the spin chuck 5 and the like can be suitably cleaned.

[Discharge direction changing unit 2]
The discharge direction changing unit (discharge direction changing means) 2 is for changing the discharge direction of the nozzle 1 and includes discharge direction changing units 2a, 2b and 2c. Here, the ejection direction changing units 2a, 2b, and 2c are independently provided in the nozzles 1a, 1b, and 1c, respectively. Accordingly, the discharge direction changing units 2a, 2b, and 2c can change the discharge directions of the nozzles 1a, 1b, and 1c independently of each other. By changing the discharge directions of the nozzles 1a, 1b, and 1c, it is possible to adjust the range in which the cleaning liquid is supplied when the substrate 10 is cleaned. For this reason, when cleaning the substrate, the cleaning liquid can be suitably supplied not only to the substrate but also to the mounting table on which the substrate is mounted. Therefore, when cleaning the substrate, the mounting table on which the substrate is placed can be cleaned without any remaining cleaning.

  The discharge direction changing unit 2 can change the discharge direction of the cleaning liquid of at least one of the nozzles 1 from the center of the spin chuck 5 toward the outside.

  That is, for example, as shown in FIG. 1B, the discharge direction changing unit 2 changes the discharge direction of the cleaning liquid of some nozzles 1c among the plurality of nozzles 1 to the cleaning liquid of the remaining nozzles 1a and 1b. The direction can be changed to a direction different from the discharge direction, that is, a direction from the center of the spin chuck 5 toward the outside. Accordingly, the plurality of nozzles 1 can supply the cleaning liquid to the range up to the spin chuck 5 positioned outside the end of the outer peripheral portion of the dicing frame 12 ((a) to (c) in FIG. 3). .

  In addition, as shown in FIG. 1C, for example, the discharge direction changing unit 2 sets the direction of discharging the cleaning liquid in the entire nozzle 1 while keeping the directions of the nozzles 1a, 1b, and 1c in the same direction. It is also possible to change the direction from the center toward the outside. Accordingly, the cleaning liquid can be supplied to a range wider than the range in which the arm 3 can move, and the spin chuck 5 can be cleaned ((d) to (f) in FIG. 3).

  Thus, by changing the range in which the plurality of nozzles 1 can supply the cleaning liquid by the discharge direction changing unit 2, the plurality of nozzles 1 are end portions of the outer peripheral portion of the dicing frame 12 shown in FIG. The cleaning liquid can be supplied to the spin chuck 5 and the clamp located on the outer side. For this reason, even the spin chuck 5 holding the dicing frame 12 can be suitably cleaned without any remaining cleaning.

  The discharge direction changing unit 2 can be realized by, for example, a configuration such as a fixing screw that is independent of each other and can be tightened or loosened, and can change the discharge direction in an arbitrary direction.

[Arm 3]
The cleaning apparatus 100 according to an embodiment includes one arm (arm member) 3, and a plurality of nozzles 1 are provided in a line at the tip of the arm 3.

  The arm 3 can be rotated around the rotation shaft 4 as indicated by a dotted line in FIG. Accordingly, a plurality of nozzles 1 provided at the tip of the arm 3 can move above the substrate 10 held by the spin chuck 5 inside the first shielding portion 6 shown in FIG. .

  Here, when the arm 3 is rotated, the discharge direction of the cleaning liquid from the plurality of nozzles 1 provided at the tip of the arm 3 is changed as shown in FIG. 1B or C, for example. In this case, the cleaning liquid can be supplied in a wider range than the discharge direction of the cleaning liquid in the nozzle 1 as shown in FIG.

[Spin chuck 5]
The spin chuck (mounting table) 5 is a table on which a dicing frame (frame portion) 12 of a dicing tape (supporting film) 11 that supports the substrate 10 is placed.

  Further, the spin chuck 5 sucks and holds the dicing tape 11 by a mechanism such as a vacuum pump. Here, the substrate 10 is held by the adhesiveness of the dicing tape 11. The dicing frame 12 is held on the spin chuck 5 by a clamp. As a result, the substrate 10 is held by the spin chuck 5 via the dicing tape 11. Further, the spin chuck 5 may be any as long as it can rotate the adsorbed substrate 10 in the in-plane direction of the adsorption surface.

  For the spin chuck 5, for example, a general spin chuck and a spin chuck composed of a motor can be used.

[Clamp]
The cleaning apparatus 100 preferably includes a clamp (holding unit, not shown) that holds the dicing frame 12 of the dicing tape 11 that holds the substrate 10.

  The clamp holds the dicing frame 12 on the spin chuck 5 at four cutout portions provided on the outer peripheral portion of the dicing frame 12 shown in FIG. Thereby, when the cleaning apparatus 100 cleans the substrate 10, the substrate 10 supported by the dicing tape 11 of the dicing frame 12 can be more preferably prevented from being detached from the spin chuck 5.

  When the dicing frame 12 is held by the clamp and the substrate 10 is cleaned, a cleaning residue is generated in the spin chuck 5 and the clamp exposed from the notches of the clamp and the dicing frame 12. Here, in the cleaning apparatus 100, the discharge direction of the cleaning liquid is changed in at least one of the nozzles 1a, 1b, and 1c included in the plurality of nozzles 1, and the cleaning liquid is supplied to the clamp and the spin chuck 5. Can do. For this reason, it can wash | clean suitably until the washing | cleaning remainder produced in the clamp and the spin chuck 5 can be performed.

[Upper exhaust port 6a]
In the cleaning apparatus 100, the upper exhaust port 6 a is located above the substrate 10 placed on the spin chuck 5 accommodated in the cup 8. Further, the upper exhaust port 6 a is provided on the side surface side of the cup 8. That is, it is provided outside the outer periphery of the substrate 10 provided on the spin chuck 5. Thereby, the upper exhaust port 6a exhausts the gas flowing on the substrate from above the outer periphery of the substrate.

  A plurality of upper exhaust ports 6a may be provided in the cleaning apparatus 100. Further, the upper exhaust port 6a may further include suction means (not shown) for sucking the gas on the substrate 10. Thereby, the airflow which flows toward the upper exhaust port 6a on the board | substrate 10 generate | occur | produces, and the gas on the board | substrate 10 can be exhausted more efficiently from the upper exhaust port 6a. In FIG. 2B, the upper exhaust port 6a is located at the end of the upper wall, and the opening diameter of the upper exhaust port 6a is from the upper portion of the substrate 10 to the upper exhaust port 6a. Although it is smaller than the inner diameter, the configuration of the upper exhaust port 6a is not limited to this.

[First shielding part 6]
As shown in FIG. 2B, the first shielding part 6 is provided so as to extend from the upper exhaust port 6a in the direction of the spin chuck 5, that is, in the direction of the substrate 10 placed on the spin chuck 5. It is a plate-like body. Moreover, the 1st shielding part 6 is connected to the upper wall which continues to the upper exhaust port 6a.

  The 1st shielding part 6 changes the direction through which gas flows so that the gas which flows on the board | substrate 10 may flow into the upper exhaust port 6a. In other words, the first shielding part 6 is a gas flowing on the substrate 10 and is positioned in the traveling direction of the gas upward from the substrate 10, thereby blocking the flow and changing to the upper exhaust port 6 a. To do.

  When the cleaning liquid is discharged from the plurality of nozzles 1 while moving the plurality of nozzles 1 by rotating the arm 3, the cleaning liquid mist diffuses and the surroundings of the cleaning apparatus 100 become conspicuous. Here, since the cleaning apparatus 100 includes the upper exhaust port 6a and the first shielding part 6, the gas flowing on the substrate 10 can be efficiently exhausted from above the outer periphery of the substrate. For this reason, the cleaning liquid mist can be discharged (drained) from the upper exhaust port 6a to the outside of the cup 8 along with the exhaust of the gas.

[Second shielding part 7]
The second shielding part 7 is located above the spin chuck 5, that is, between the upper surface of the substrate 10 and the upper exhaust port 6a. The second shielding part 7 is located closer to the substrate 10 than the first shielding part 6, and extends from the upper exhaust port 6 a toward the spin chuck 5, that is, toward the substrate 10 placed on the spin chuck 5. It is the plate-shaped object provided in. Moreover, the 2nd shielding part 7 is located below the upper wall to which the 1st shielding part 6 was connected, and is connected to the lower wall which continues to the upper exhaust port 6a.

  The 2nd shielding part 7 changes the direction through which gas flows so that the gas which flows upwards of the board | substrate 10 may flow toward the downward direction of a board | substrate. That is, the second shielding part 7 is a gas that flows on the substrate 10, and is located in the traveling direction of the gas upward from the substrate 10, so that the flow is blocked and the second shielding part 7 is directed downward from the substrate 10. Change to

  As described above, the gas whose flow is changed by the second shielding portion 7 so as to be directed downward from the substrate 10 is exhausted through the lower exhaust port 7a described later. Accordingly, it is possible to discharge the cleaning liquid mist diffused on the substrate 10 to the outside of the cup 8 as the gas is exhausted from the lower exhaust port 7a. Thereby, it can prevent more reliably that the circumference | surroundings of the cup 8 are contaminated. Note that, of the gas traveling upward from the substrate 10, the flow of the gas flowing through the position away from the second shielding portion 7 is blocked by the first shielding portion 6. For this reason, the flow of the gas is changed by the first shielding part 6 so as to go to the upper exhaust port 6a.

  In this way, since the air flow is changed in two stages by the first shielding part 6 and the second shielding part 7 with respect to the gas directed upward of the substrate 10, the gas flowing on the substrate 10 can be more reliably transferred to the upper exhaust port 6 a. And can be led to the lower exhaust port 7a. As a result, the cleaning liquid mist can be discharged from the upper exhaust port 6a and the lower exhaust port 7a along with the gas guided to the upper exhaust port 6a and the lower exhaust port 7a. As described above, according to the cleaning apparatus 100, the cleaning liquid mist is not scattered outside the cup 8, so that the surroundings of the cup 8 can be more reliably prevented from being contaminated.

  In addition, the upper exhaust port 6a and the 1st shielding part 6, and the cup 8 provided with the lower wall to which the 2nd shielding part 7 is connected are provided independently. In addition, the second shielding part 7 is provided on the outer periphery of the substrate 10 in a circumferential shape, similarly to the first shielding part 6.

  As shown in FIG. 2B, the distance A between the second shielding part 7 and the outer periphery of the dicing frame 12 is preferably 3 to 20 mm, and the second shielding part 7 and the dicing frame 12 are arranged. The distance B between the upper surface and the upper surface of the substrate is preferably 10 to 50 mm. Thereby, generation | occurrence | production of the gas which goes upwards beyond the 2nd shielding part 7 from a board | substrate can be suppressed, and scattering of the washing | cleaning liquid mist by the said gas can be prevented. The distance A and the distance B can be changed as appropriate according to the size of the dicing frame 12, the number of rotations of the substrate 10, the number of nozzles, and the like.

  When the substrate is held on the spin chuck without using the dicing frame, the distance A can be a distance between the second shielding part 7 and the outer periphery of the substrate 10. Further, the distance B may be a distance between the second shielding part 7 and the upper surface of the substrate 10.

[Lower exhaust port 7a]
The lower exhaust port 7 a is located below the spin chuck 5, that is, below the substrate 10, and exhausts gas from below the substrate 10. Of the gas flowing on the substrate 10, the gas whose direction of flow is changed so as to flow downward of the substrate 10 by the second shielding part 7 is exhausted from the lower exhaust port 7 a. As the gas flows, the cleaning liquid mist on the substrate 10 is discharged from the lower exhaust port. Thus, by providing an exhaust port also below the substrate 10, it is possible to more reliably prevent the cleaning liquid mist from diffusing. In order to efficiently guide the gas flowing below the substrate 10 to the lower exhaust port 7 a, the lower exhaust port 7 a may be provided at the end of an exhaust duct provided below the substrate 10. A plurality of lower exhaust ports 7a may be provided. In this case, it is preferable that the lower exhaust ports 7a are provided at equal intervals on a concentric circle of the substrate 10.

[Airflow changer 9]
The air flow changing unit 9 is located below the spin chuck 5, that is, below the substrate 10, and changes the direction in which the gas flows so that the gas flowing toward the lower side of the substrate 10 flows into the lower exhaust port 7 a. As shown in FIG. 2, the center of the airflow changing unit 9 may be the same as the center of the spin chuck 5, but the diameter is larger than the diameter of the spin chuck 5 and protrudes outside the outer periphery of the spin chuck 5. Is provided. The airflow changing unit 9 is a plate-like body, and is curved downward from the center to the outer periphery. That is, the airflow changing unit 9 is curved toward the inlet of the exhaust duct connected to the lower exhaust port 7a. Thereby, as shown by the arrow in FIG. 2, the gas flowing toward the lower side of the substrate 10 is changed by the air flow changing unit 9 in the direction of the exhaust duct where the flow is connected to the lower exhaust port 7 a. As a result, the exhaust is efficiently exhausted from the lower exhaust port 7a through the exhaust duct, and the cleaning liquid mist is discharged along with this.

[Pure water discharge nozzle]
The cleaning apparatus 100 may include, for example, a pure water discharge nozzle (not shown) that discharges pure water to the substrate 10, the dicing tape 11, and the dicing frame 12 cleaned with the cleaning liquid. After the cleaning liquid is discharged by the plurality of nozzles 1 to clean the substrate 10, water-soluble stains remaining on the substrate 10 are suitably obtained by supplying the substrate 10, the dicing tape 11, and the dicing frame 12 with the nozzle for discharging pure water. Can be removed.

[Air blow nozzle]
Moreover, the cleaning apparatus 100 may be provided with an air blow nozzle (not shown) for drying the cleaned substrate 10, dicing tape 11, and dicing frame 12. Thereby, the board | substrate 10, the dicing tape 11, and the dicing frame 12 can be dried more rapidly. Note that an inert gas such as N ₂ is preferably used for air blowing.

[Substrate 10]
The substrate 10 to be cleaned by the cleaning apparatus 100 is supported (attached) to a support plate and subjected to processes such as thinning, conveyance, and mounting. The substrate 10 is not limited to a wafer substrate, and may be any substrate such as a ceramic substrate, a thin film substrate, or a flexible substrate that needs to be supported by a support plate. Moreover, the circuit element may be formed in the board | substrate 10, for example.

  The substrate 10 to be cleaned in the cleaning apparatus 100 may be a substrate separated from a support plate for supporting the substrate. In this case, residues such as an adhesive layer or a separation layer remain as dirt on the substrate 10.

  The residue of the adhesive layer includes, for example, thermoplastic resins such as acrylic resins, styrene resins, maleimide resins, hydrocarbon resins, and elastomers. The residue of the separation layer includes, for example, an organic film residue such as a fluorocarbon film or an inorganic film residue such as a metal film formed by a CVD method.

[Cleaning liquid]
The cleaning liquid used in the cleaning apparatus 100 is not limited as long as it can dissolve and remove the residue of the adhesive layer or the separation layer. Examples of the cleaning liquid include linear hydrocarbons, branched hydrocarbons having 4 to 15 carbon atoms, cyclic hydrocarbons, terpene solvents, ketones, polyhydric alcohols, alkyl ester derivatives of polyhydric alcohols, Examples thereof include alkyl ether derivatives of polyhydric alcohols, cyclic ethers, esters and aromatic organic solvents.

[Dicing tape 11]
A dicing tape (support film) 11 is bonded to one side of the substrate 10 in order to reinforce the strength of the substrate 10. The substrate 10 is attached to a dicing tape 11 having a dicing frame 12 attached to the outer periphery thereof.

  As the dicing tape 11, for example, a dicing tape having a configuration in which an adhesive layer is formed on a base film can be used. As the base film, for example, a resin film such as PVC (polyvinyl chloride), polyolefin, or polypropylene can be used. The outer diameter of the dicing tape 11 is larger than the outer diameter of the substrate 10. When these are bonded together, a part of the dicing tape 11 is exposed at the outer edge portion of the substrate 10.

[Dicing frame 12]
A dicing frame (frame portion) 12 for preventing bending of the dicing tape 11 is attached to the outer periphery of the exposed surface of the dicing tape 11. That is, the dicing frame 12 is exposed at the outer edge portion of the dicing tape 11. Examples of the dicing frame 12 include a metal dicing frame such as aluminum, an alloy dicing frame such as stainless steel (SUS), and a resin dicing frame. Examples of the resin dicing frame include a resin dicing frame manufactured by Shin-Etsu Polymer Co., Ltd. or DISCO Corporation.

[Modification]
The cleaning apparatus according to the present invention is not limited to the above embodiment. The cleaning apparatus according to the modified example may include, for example, a discharge direction control unit that controls the discharge direction changing unit to change the discharge direction based on cleaning condition information indicating a cleaning condition input in advance by a user. Good.

  In other words, the discharge direction control means includes a CPU such as an MPU that executes instructions of a program that realizes each function, a ROM (Read Only Memory) that stores the program, and a RAM (Random Access) that expands the program into an executable format. Memory) and a storage device (recording medium) such as a memory for storing the program and various data.

  The object of the present invention is not limited to the case where the discharge direction control means is fixedly held in the program memory, and the program code (execution format program, intermediate code program, or source program) of the program is recorded. This can also be achieved by supplying a medium to the apparatus and reading and executing the program code recorded on the recording medium.

<Washing method>
An embodiment of the cleaning method according to the present invention will be described in detail with reference to FIG.

[Embodiment 1 of Cleaning Method]
As shown in FIGS. 3A to 3C, the cleaning method according to an embodiment (Embodiment 1) includes a plurality of nozzles 1 a, 1 b, and 1 c that discharge a cleaning liquid for cleaning the substrate 10. In the cleaning method of cleaning the substrate 10 with the cleaning apparatus 100, the plurality of nozzles 1a are formed by the discharge direction changing units 2a, 2b, and 2c that independently change the discharge directions of the plurality of nozzles 1a, 1b, and 1c. 1b and 1c including a step of changing the discharge direction of the cleaning liquid of at least one nozzle. In addition, the cleaning method according to an embodiment includes a nozzle moving step of moving the nozzles 1a, 1b, and 1c that discharge the cleaning liquid.

[Discharge direction changing process]
As shown in FIG. 3A, in the discharge direction changing step included in the cleaning method according to the present embodiment, the discharge direction changing unit 2 discharges the cleaning liquid from the nozzle 1c among the nozzles 1a, 1b, and 1c. The direction is changed from the center of the spin chuck 5 to the outside. As a result, the nozzle can supply the cleaning liquid to the spin chuck 5 located outside the end of the outer peripheral portion of the dicing frame 12. For this reason, when the substrate 10 is cleaned, the spin chuck 5 can be preferably cleaned. Moreover, if the dicing frame 12 is fixed by the clamp, the clamp can be suitably cleaned.

  Here, the spin chuck 5 rotates while holding the substrate 10 and the dicing tape 11 and the dicing frame 12 that support the substrate 10. The rotation speed of the spin chuck 5 is preferably 10 rpm or more and 3000 rpm or less, more preferably 100 rpm or more and 2500 rpm or less, and most preferably 200 rpm or more and 2200 rpm or less. If the rotation speed of the spin chuck 5 is 10 rpm or more and 3000 rpm or less, the substrate 10 can be cleaned suitably while suppressing excessive scattering of the cleaning liquid.

[Nozzle movement process]
In the nozzle moving process, after changing the discharge direction of the cleaning liquid from the nozzle 1c in the discharge direction changing process, the cleaning liquid is supplied from above the substrate 10 to the spin chuck 5 located outside the end of the outer peripheral portion of the dicing frame 12. As shown, the nozzles 1a, 1b and 1c are moved by the arm 3 ((b) and (c) in FIG. 3).

  Here, in the nozzle moving step, after the substrate 10 is intensively cleaned by adjusting the moving width of the nozzle ((a) and (c) in FIG. 3), the cleaning liquid is supplied to the spin chuck 5 and the clamp. You may move a nozzle so that it can do ((c) of FIG. 3). Further, the nozzle moving step may be performed a plurality of times as necessary in one cleaning of the substrate 10.

  In the nozzle moving step, the discharge direction of the cleaning liquid from the nozzle 1c may be changed by the discharge direction changing step while the nozzles 1a, 1b, and 1c are reciprocally moved.

  That is, in the cleaning method according to the present embodiment, the timing of changing the discharge direction of the cleaning liquid of the nozzle 1c by the discharge direction changing unit 2c in the discharge direction changing step, the movement width of the plurality of nozzles 1 by the arm 3 in the nozzle moving step, and The number of reciprocating movements of the plurality of nozzles 1 may be adjusted as appropriate.

  Thereby, in the cleaning method according to the present embodiment, the substrate 10 can be intensively cleaned ((a) and (b) in FIG. 3). Further, it is possible to clean the spin chuck 5 as well ((c) in FIG. 3). Further, since the range in which the cleaning liquid is supplied can be changed according to the degree of contamination of the substrate 10 and the spin chuck 5, it is possible to prevent the cleaning liquid from being consumed excessively.

[Embodiment 2 of cleaning method]
The cleaning method according to the present invention is not limited to the first embodiment. For example, in another embodiment (Embodiment 2) of the cleaning method according to the present invention, as shown in FIGS. 3D to 3F, in the discharge process changing step, the discharge direction changing units 2a, 2b and 2c. Accordingly, the directions of the nozzles 1a, 1b, and 1c may be set to the same direction, and the direction in which the cleaning liquid is discharged from the nozzles 1a, 1b, and 1c may be changed from the center of the spin chuck 5 to the outside. Thereby, similarly to the cleaning method according to the first embodiment, the cleaning liquid can be suitably supplied to the spin chuck 5, the clamp, and the like ((f) in FIG. 3).

  In the cleaning method according to the second embodiment, it is needless to say that the discharge direction of the cleaning liquid in the nozzle can be changed by the discharge direction changing step while moving the nozzle by the nozzle moving step. Needless to say, in the nozzle moving step, the moving width of the nozzles 1a, 1b and 1c and the number of reciprocating movements of the nozzles 1a, 1b and 1c can be adjusted. Thus, similarly to the case of performing the cleaning method according to the first embodiment, the cleaning method according to the second embodiment can focus on the substrate 10 ((d) and (e) in FIG. 3). . In addition, the cleaning liquid can be suitably supplied to the spin chuck 5 when the substrate 10 is cleaned ((f) in FIG. 3).

  In the cleaning method according to the first and second embodiments, the discharge direction of the cleaning liquid can be changed by the discharge direction changing unit 2 and the cleaning liquid can be suitably supplied to the spin chuck 5. For this reason, when the substrate 10 is cleaned, the spin chuck 5 can be preferably cleaned, and the remaining cleaning of the spin chuck 5 can be prevented.

  On the other hand, as shown in FIGS. 4A to 4C, the nozzle 20 that does not include the discharge direction changing unit cannot suitably supply the cleaning liquid to the spin chuck 5 when the substrate 10 is cleaned. . For this reason, in the cleaning apparatus including the nozzle 20 that does not include the discharge direction changing unit, a cleaning residue is generated in the spin chuck 5 when the substrate 10 is cleaned.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

[Cleaning evaluation]
As an example, the substrate was cleaned by changing the discharge direction of the cleaning liquid in the nozzle using a cleaning device provided with three two-fluid spray nozzles and a discharge direction changing unit at the tip of the arm. Then, the presence or absence of cleaning residue on the substrate, spin chuck and clamp was evaluated.

(Preparation of substrate)
The substrate used for cleaning evaluation was prepared as follows. First, under the conditions of a flow rate of 400 sccm, a pressure of 700 mTorr, a high frequency power of 2500 W, and a film forming temperature of 240 ° C., a fluorocarbon film (thickness 1 μm) as a separation layer is supported by a CVD method using C ₄ F ₈ as a reaction gas. (12-inch glass support plate, thickness 700 μm). Next, TZNR (registered trademark) -A3007t (manufactured by Tokyo Ohka Kogyo Co., Ltd.), which is an adhesive composition, is spin-coated on a 12-inch silicon wafer and heated at 100 ° C., 160 ° C., and 200 ° C. for 3 minutes each. An adhesive layer was formed (film thickness 50 μm). Then, the silicon wafer and the support plate were bonded to each other through the adhesive layer and the separation layer for 3 minutes under a condition of 220 ° C. and 4000 Kg under vacuum to produce a laminate. Thereafter, the back surface of the silicon wafer was thinned (50 μm) using a back grinder manufactured by DISCO.

  After that, the separation layer was altered by irradiating the laminate produced under the above production conditions with a pulsed laser having a wavelength of 532 nm from the support plate side of the laminate. As laser conditions, the irradiation speed was 6,500 mm / sec, the pulse frequency was 40 kHz, and the irradiation pitch was 180 μm. The silicon wafer in which the residue of the adhesive and separation layer obtained by this was used for cleaning evaluation.

  In Example 1, in Steps 9 to 13 in Table 1 below, the discharge direction of the cleaning liquid in one of the two two-fluid spray nozzles was automatically changed by the discharge direction control means. Here, in steps 9, 11 and 13, the nozzle was directed outward from the center of the spin chuck, and the cleaning liquid was supplied to the outer peripheral portion of the spin chuck and the clamp to perform cleaning. Table 1 shows the spin rotation speed and processing time of the spin chuck in each step.

  In Example 2, the discharge direction of the cleaning liquid at the nozzle was changed manually in Steps 9 to 13 in the same manner as the conditions in Example 1.

〔Evaluation results〕
In Example 1 and Example 2, it was confirmed that not only the substrate but also the spin chuck and the clamp could be cleaned without any remaining cleaning.

  The present invention can be used for cleaning substrates used in various fields.

DESCRIPTION OF SYMBOLS 1 Nozzle 1a Nozzle 1b Nozzle 1c Nozzle 2 Discharge direction change part (discharge direction change means)
2a Discharge direction changing part (discharge direction changing means)
2b Discharge direction changing part (discharge direction changing means)
2c Discharge direction changing part (discharge direction changing means)
3 Arm (arm member)
5 Spin chuck (mounting table)
11 Dicing tape (support film)
12 Dicing frame (frame part)
100 Cleaning device

Claims (6)

A cleaning apparatus comprising a plurality of nozzles for discharging a cleaning liquid for cleaning a substrate,
A cleaning apparatus comprising: a discharge direction changing unit that changes the discharge directions of the plurality of nozzles independently of each other.   The discharge direction changing means changes the discharge direction of the cleaning liquid of some of the plurality of nozzles to a direction different from the discharge direction of the cleaning liquid of the remaining nozzles. The cleaning apparatus according to 1. A mounting table for the substrate;
The discharge direction changing means changes the discharge direction of the cleaning liquid of at least one of the plurality of nozzles from the center of the mounting table to the outside. The cleaning device described.   The cleaning apparatus according to claim 1, further comprising a single arm member, wherein the plurality of nozzles are arranged in a line at a tip of the arm member.   The cleaning apparatus according to claim 1, further comprising a holding portion that holds a frame portion of a support film that supports the substrate. A cleaning method for cleaning a substrate with a cleaning apparatus including a plurality of nozzles for discharging a cleaning liquid for cleaning the substrate,
A cleaning method comprising: changing a discharge direction of the cleaning liquid of at least one of the plurality of nozzles by a discharge direction changing unit that changes the discharge directions of the plurality of nozzles independently of each other.

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