JP2007287999A - Liquid processing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid processing device that can make a footprint small while effectively preventing a mist from re-adhering onto a substrate. <P>SOLUTION: The liquid processing device has a wafer holder 1 that holds a wafer W horizontal and is rotatable together with the wafer W, a rotational cup 3 that surrounds the wafer W held by the wafer holder 1 and is rotatable together with the wafer W, a surface processing liquid supply nozzle 4 that supplies a process liquid onto the surface of the wafer W, and an exhaust/drainage section 6 that exhausts the air and drains the liquid of the rotational cup 3, wherein the rotational cup 3 has a vertical wall member 31 for receiving the process liquid shaken off from the wafer W and exhausting pores 33 and 34 for exhausting the process liquid formed on the vertical wall member 31, the exhaust/drainage section 6 has a drainage cup 41 outside the vertical wall member 31 for receiving and draining the process liquid exhausted from the exhausting pores 33 and 34, and a liquid film 37 is centrifugally formed of the process liquid on an inner surface of the vertical wall member 31 while the rotational cup 3 is being rotated. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a liquid processing apparatus that performs predetermined liquid processing on a substrate such as a semiconductor wafer.

  In a semiconductor device manufacturing process and a flat panel display (FPD) manufacturing process, a process of supplying a processing liquid to a semiconductor wafer or a glass substrate, which is a substrate to be processed, and performing liquid processing is frequently used. As such a process, for example, a cleaning process for removing particles or contamination attached to the substrate, a coating process of a photoresist solution or a developing solution in a photolithography process, and the like can be given.

  As such a liquid processing apparatus, a substrate such as a semiconductor wafer is held on a spin chuck, a processing liquid is supplied to the front surface or front and back surfaces of the wafer while the substrate is rotated, and a liquid film is applied to the front or back surface of the wafer. A device that forms a film and performs processing is known.

  In this type of apparatus, the processing liquid is usually supplied to the center of the wafer, and by rotating the substrate, the processing liquid is spread outward to form a liquid film, and the processing liquid is generally released. ing. A member such as a cup surrounding the outside of the wafer is provided so as to guide the processing liquid shaken off the substrate downward, so that the processing liquid shaken off from the wafer is quickly discharged. However, when a cup or the like is provided in this way, the processing liquid may scatter as mist and reach the substrate to cause defects such as watermarks and particles.

As a technique capable of preventing such a problem, Patent Document 1 discloses a processing liquid that receives a processing liquid scattered in the outer peripheral direction from a substrate so as to rotate integrally with a rotation support unit that rotates the substrate while being horizontally supported. There is disclosed a technique in which a receiving member is provided to receive a processing liquid and guide the processing liquid to the outside for recovery. In this Patent Document 1, the processing liquid receiving member includes, in order from the substrate side, a horizontal eaves part, an inclined guide part that guides the processing liquid outward and downward, a horizontal guide part that guides the processing liquid horizontally outward, and a vertical standing part. It has a wall to be installed, and the process liquid is forced into a narrow area and discharged to the horizontal outside through the drain port provided at the corner of the process receiving member while preventing the mist from reattaching to the substrate. Furthermore, the liquid is drained through a groove extending outwardly inside the spacer disposed outside the processing liquid receiving member.
JP-A-8-1064

  However, in Patent Document 1, since the processing liquid receiving member that rotates together with the substrate drives the processing liquid into a narrow area outside the substrate, the spacer portion outside the substrate becomes large, and the footprint of the apparatus is reduced. It will be big.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a liquid processing apparatus capable of reducing the footprint while effectively preventing re-adhesion of mist to the substrate.

In order to solve the above-described problems, the present invention provides a substrate holding unit that holds a substrate horizontally and can rotate with the substrate, a rotating cup that surrounds the substrate held by the substrate holding unit and can rotate with the substrate, A rotating mechanism that integrally rotates the rotating cup and the substrate holding unit; a liquid supply mechanism that supplies a processing liquid to the substrate;
An exhaust / drainage unit for exhausting and draining the rotary cup, the rotary cup receiving a processing liquid shaken off from the substrate, and being shaken off from the substrate formed on the wall. A discharge hole for discharging the treated liquid, and the exhaust / drain portion is provided outside the wall portion and has a drain cup for receiving and draining the treatment liquid discharged from the discharge hole. The wall portion is configured such that when the rotating cup is rotated together with the substrate, a liquid film of the processing liquid shaken off from the substrate is formed on the inner surface by centrifugal force. A liquid processing apparatus is provided.

  The present invention also includes a substrate holding unit that holds the substrate horizontally and can rotate with the substrate, a rotating cup that surrounds the substrate held by the substrate holding unit and can rotate with the substrate, the rotating cup, A rotating mechanism for integrally rotating the substrate holder, a surface liquid supplying mechanism for supplying a processing liquid to the surface of the substrate, a back surface liquid supplying mechanism for supplying a processing liquid to the back surface of the substrate, and exhaust and exhaust of the rotating cup. The rotary cup includes a wall portion that receives the processing liquid shaken off from the substrate, and a discharge that is formed on the wall portion and discharges the processing liquid shaken off from the substrate. And the exhaust / drainage part is provided outside the wall part, and has a drainage cup for receiving and draining the processing liquid discharged from the discharge hole, and the wall part is When the rotating cup is rotated together with the substrate To provide a liquid processing apparatus characterized by being configured such that the liquid film of the process liquid spun off from the substrate on its inner surface by the centrifugal force is formed.

  In the present invention, a guide member is further provided outside the substrate on the holding member so as to rotate together with the holding member and the rotary cup, and guides the processing liquid shaken off from the substrate to the outside of the substrate. be able to.

  The exhaust / drainage unit may further include an exhaust cup that is provided outside the drainage cup and exhausts the rotary cup. Further, the wall portion may be provided so as to be perpendicular to and surround the substrate on the holding member, and the rotating cup has an annular shape inward from the upper end of the wall portion. It can be set as the structure which further has the collar member provided in.

  According to the present invention, since the rotating cup that rotates together with the rotation of the substrate is provided, centrifugal force acts on the rotating cup, and the rebound of the mist of the processing liquid as in the case where the fixed cup is provided can be prevented. In addition, the rotary cup is configured to have a wall portion that receives the processing liquid shaken off from the substrate, and a discharge hole that is formed in the wall portion and discharges the processing liquid shaken off from the substrate. Is provided with a drain cup for receiving and draining the processing liquid discharged from the discharge hole outside the wall, and the wall is centrifuged when the rotating cup is rotated together with the substrate. Since the liquid film of the processing liquid shaken off from the substrate is formed on the inner surface by the force, even if the liquid discharged from the discharge hole rebounds at the wall of the liquid discharge cup, the liquid film Therefore, it is possible to reliably prevent the liquid from returning to the rotary cup through the discharge hole, and there is no possibility that the drainage mist reaches the substrate in the rotary cup. Further, the rotating cup and the drainage cup can be brought close to each other, and the drainage cup can be reduced in size. Therefore, it is possible to reduce the footprint of the apparatus while effectively preventing the mist from reattaching to the substrate.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Here, a case where the present invention is applied to a liquid processing apparatus that performs front and back surface cleaning of a semiconductor wafer (hereinafter simply referred to as a wafer) will be described.

  FIG. 1 is a sectional view showing a schematic configuration of a liquid processing apparatus according to a first embodiment of the present invention, FIG. 2 is a plan view thereof, and FIG. 3 is an enlarged sectional view showing an exhaust / drainage portion. The liquid processing apparatus 100 includes a wafer holding unit 1 that rotatably holds a wafer W that is a substrate to be processed, a rotation motor 2 that rotates the wafer holding unit 1, and a wafer W held on the wafer holding unit 1. A rotating cup 3 that is provided so as to rotate together with the wafer holder 1, a surface treatment liquid supply nozzle 4 that supplies a treatment liquid to the surface of the wafer W, and a back surface treatment liquid that supplies the treatment liquid to the back surface of the wafer W It has a supply nozzle 5 and an exhaust / drainage part 6 provided at the peripheral edge of the rotary cup 3. A casing 8 is provided so as to cover the periphery of the exhaust / drainage unit 6 and the upper portion of the wafer W. A fan filter unit (FFU) 9 is provided on the upper portion of the casing 8 so that a downflow of clean air is supplied to the wafer W held by the wafer holder 1.

  The wafer holding unit 1 includes a horizontally-rotating rotating plate 11 having a disk shape, and a cylindrical rotating shaft 12 connected to the center of the back surface and extending vertically downward. A circular hole 11 a that communicates with the hole 12 a in the rotating shaft 12 is formed at the center of the rotating plate 11. And the back surface treatment liquid supply nozzle 5 can be moved up and down in the holes 12a and 11a. As shown in FIG. 2, the rotary plate 11 is provided with three holding members 13 that hold the outer edge of the wafer W at equal intervals. The holding member 13 is configured to hold the wafer W horizontally with the wafer W slightly floating from the rotating plate 11. The holding member 13 is movable between a holding position that holds the wafer W and a release position that rotates backward to release the holding. In the vicinity of the end portion of the rotating plate 11, an inclined portion 11 b is formed by circling so that the outer portion is lower than the central portion. Therefore, the end portion of the rotating plate 11 is formed thinner than the other portions.

  A belt 14 is wound around the lower end of the rotary shaft 12, and the belt 14 is also wound around a pulley 15. The pulley 15 can be rotated by the motor 2, and the rotation shaft 12 is rotated via the pulley 15 and the belt 14 by the rotation of the motor 2.

  The surface treatment liquid supply nozzle 4 is held at the tip of the nozzle arm 16 so that the treatment liquid is supplied from a liquid supply tube (not shown), and the treatment liquid is discharged through a nozzle hole provided therein. It has become. Examples of the processing liquid to be discharged include cleaning chemicals, rinsing liquids such as pure water, and dry solvents such as IPA. One type or two or more types of processing liquids can be discharged. As shown in FIG. 2, the nozzle arm 16 is provided so as to be rotatable about a shaft 17, and is driven between a discharge position on the center of the wafer W and a retreat position outside the wafer W by a drive mechanism (not shown). It is possible to move with. The nozzle arm 16 is provided so as to be movable up and down. When the nozzle arm 16 is rotated, the nozzle arm 16 is raised. When the treatment liquid is discharged from the surface treatment liquid supply nozzle 4, the nozzle arm 16 is lowered.

  The backside treatment liquid supply nozzle 5 has a nozzle hole 5a extending along the longitudinal direction thereof. A predetermined processing liquid is supplied from the lower end of the nozzle hole 5a through a processing liquid tube (not shown), and the processing liquid is discharged to the back surface of the wafer W through the nozzle hole 5a. Examples of the treatment liquid to be discharged include cleaning chemicals, rinsing liquids such as pure water, and dry solvents such as IPA, as with the surface treatment liquid supply nozzle 4. The liquid can be discharged. The back surface treatment liquid supply nozzle 5 also has a function as a wafer lifting member, and has a wafer support 18 for supporting the wafer W at the upper end thereof. On the upper surface of the wafer support 18, there are three wafer support pins 19 (only two are shown) for supporting the wafer W. A cylinder mechanism 21 is connected to the lower end of the back surface processing liquid supply nozzle 5 via a connecting member 20. The back surface processing liquid supply nozzle 5 is moved up and down by the cylinder mechanism 21 to move the wafer W up and down. W loading and unloading are performed.

  As shown in FIG. 3, the rotary cup 3 includes a cylindrical vertical wall member 31 provided around the substrate so as to extend upward from the end of the rotary plate 11 to form a vertical wall, and a vertical wall member 31. And an annular flange member 32 extending inwardly from the upper end of the ring.

  The vertical wall member 31 is formed with a plurality of discharge holes 33 and 34 that penetrate from the inside to the outside and discharge the processing liquid vertically and along the circumferential direction. Further, an annular and plate-shaped guide member 35 whose inner end reaches the vicinity of the periphery of the wafer W is provided at a position substantially the same height as the wafer W between the discharge holes 33 and 34 of the vertical wall member 31. It has been. The discharge hole 33 is provided such that the lower surface thereof is in contact with the surface of the guide member 35, and the discharge hole 34 is provided so that the lower surface thereof is in contact with the surface of the rotating plate 11.

  As shown in the enlarged view of FIG. 3, the exhaust / drainage unit 6 includes an annular drainage cup 41 that receives the drainage discharged from the discharge holes 33 and 34 of the vertical wall member 31 in the rotary cup 3, and An annular exhaust cup 42 is provided so as to surround the drain cup 41.

  The drainage cup 41 is provided so that its outer wall is relatively close to the vertical wall member 31 of the rotating cup 3, and a drainage port 43 is provided at one place on the bottom thereof. A drainage pipe 44 is connected to the drainage port 43. A suction mechanism (not shown) is provided on the downstream side of the drainage pipe 44, and the drainage collected from the rotary cup 3 to the drainage cup 41 is quickly discharged through the drainage port 43 and the drainage pipe 44. Discarded or recovered. Note that a plurality of drain ports 43 may be provided.

  The exhaust cup 42 also surrounds the rotary cup 3, and its upper wall 42 a is located above the flange member 32. The exhaust cup 42 sucks and exhausts gas from the opening 42b between the upper wall 42a and the flange member 32. In addition, an exhaust port 45 is provided below the exhaust cup 42, and an exhaust pipe 46 is connected to the exhaust port 45. A suction mechanism (not shown) is provided on the downstream side of the exhaust pipe 46 so that the periphery of the rotary cup 3 can be exhausted. A plurality of exhaust ports 45 are provided, and can be switched and used in accordance with the type of processing liquid. As shown in FIG. 3, the exhaust cup 42 is provided with a plurality of air intakes 47 along the circumferential direction on the upper wall thereof, and a plurality of air intakes along the circumferential direction in two upper and lower stages on the inner wall. An inlet 48 is provided. The air intake 47 sucks the atmosphere in the upper region of the exhaust cup 42, and the air intake 48 sucks the atmosphere of the mechanism part existing below the rotating plate 11, and removes the gasification component of the staying processing liquid. It can be removed. As described above, since the exhaust cup 42 is provided outside the drain cup 41 so as to surround it, the mist leaked from the drain cup 41 can also be surely sucked, and the mist of the processing liquid is discharged to the outside. It is prevented from spreading.

  A liquid film 37 is formed inside the vertical wall member 31 of the rotary cup 3 as the rotary cup 3 and the wafer W rotate during the cleaning process (liquid process). That is, during the cleaning process, the wafer holding member 1 and the rotating cup 3 are rotated together with the wafer W by the motor 2 so that the process is performed from the surface treatment liquid supply nozzle 4 and the back surface treatment liquid supply nozzle 5 to the center of the front and back surfaces of the wafer W. At this time, the processing liquid on the front and back surfaces of the wafer W spreads by centrifugal force and is swung off from the periphery of the wafer W. In this case, since the vertical wall member 31 is provided, the processing liquid shaken off from the wafer W comes into contact with the vertical wall member 31. At that time, centrifugal force acts on the processing liquid, as shown in FIG. As described above, the liquid film 37 can be formed around the discharge holes 33 and 34 on the inner surface of the vertical wall member 31 without being rebounded by the vertical wall member 31. As will be described later, the liquid film 37 can prevent the mist from reattaching to the wafer W.

  The guide member 35 is provided such that the front and back surfaces thereof are substantially continuous with the front and back surfaces of the wafer W. The processing liquid shaken off from the surface of the wafer W is guided to the surface of the guide member 35 provided substantially continuously, reaches the vertical wall member 31, passes through the hole 33 by centrifugal force, and goes to the outside of the rotary cup 3. It is supposed to be discharged. Similarly, when the wafer holding member 1 and the rotating cup 3 are rotated together with the wafer W and the processing liquid is supplied from the back surface processing liquid supply nozzle 5 to the center of the back surface of the wafer W, the processing liquid is subjected to centrifugal force by the wafer W. Is spread from the periphery of the wafer W. The processing liquid shaken off from the back surface of the wafer W is guided by the back surface of the guide member 35 provided substantially continuously with the back surface of the wafer W, reaches the vertical wall member 31, and rotates through the hole 34 by centrifugal force. The liquid is discharged to the outside of the cup 3. Further, since the guide member 35 guides the processing liquid shaken off from the front surface and the back surface of the wafer W in this way, the processing liquid detached from the peripheral edge of the wafer W is difficult to be turbulent and rotates without misting the processing liquid. Can be led out of the cup. The height of the front and back surfaces of the portion adjacent to the wafer W of the guide member 35 is preferably the same as the height of the front and back surfaces of the wafer W. As shown in FIG. 2, the guide member 35 is provided with a notch 36 at a position corresponding to the wafer holding member 13 so as to avoid the wafer holding member 13.

  Next, the operation of the liquid processing apparatus 100 configured as described above will be described with reference to FIG. First, as shown in FIG. 5A, the wafer W is delivered from the transfer arm (not shown) onto the support pins of the wafer support base 18 with the back surface treatment liquid supply nozzle 5 raised. Next, as shown in FIG. 5B, the back surface treatment liquid supply nozzle 5 is lowered to a position where the wafer W can be held by the holding member 13, and the wafer W is chucked by the holding member 13. Then, as shown in FIG. 5C, the surface treatment liquid supply nozzle 4 is moved from the retracted position to the ejection position on the center of the wafer W.

  In this state, as shown in FIG. 5 (d), the motor 2 rotates the holding member 1 together with the rotary cup 3 and the wafer W while performing predetermined processing from the surface treatment liquid supply nozzle 4 and the back surface treatment liquid supply nozzle 5. The liquid is supplied to perform the cleaning process.

  In this cleaning process, the processing liquid supplied to the front and back surfaces of the wafer W spreads outward by centrifugal force on the front and back surfaces of the wafer W, and is further shaken off from the periphery of the wafer W. In this case, since the vertical wall member 31 of the rotating cup 3 is provided, the processing liquid spun off from the wafer W comes into contact with the vertical wall member 31, but the rotating cup 3 is rotating, so that the vertical wall member is rotated. Since the centrifugal force acts on the processing liquid in contact with 31 and forms a liquid film 37 around the discharge holes 33 and 34 of the vertical wall member 31, the processing liquid hardly rebounds as in the case of the fixed wall. The processing liquid that rebounds from the vertical wall member 31 does not substantially return to the wafer W side.

A part of the processing liquid constituting the liquid film 37 is discharged outward from the discharge holes 33 and 34 by centrifugal force, but the liquid film 37 is maintained without being broken while the processing liquid is supplied. The For this reason, even if the mist of the treatment liquid bounced off the wall of the drain cup 41 enters the discharge holes 33 and 34, the presence of the liquid film 37 prevents the mist from entering the rotary cup 3, This prevents the mist from reattaching to the wafer W. When the supply of the processing liquid is stopped, the processing liquid accumulated around the discharge holes 33 and 34 of the vertical wall member 31 as the liquid film 37 is also discharged from the discharge holes 33 and 34, and the processing liquid is put into the rotary cup 3. It is assumed that it does not exist.

  Thus, even if mist is generated in the drain cup 41 due to the presence of the rotating cup 3, there is substantially no possibility that the mist will contaminate the wafer W. The footprint of the apparatus can be reduced while effectively preventing mist from reattaching to the wafer W.

  Further, since the guide member 35 is provided so that the front and back surfaces are substantially continuous with the front and back surfaces of the wafer W, the processing liquid spun off from the periphery on the front and back surfaces of the wafer W by centrifugal force is in a laminar flow state. Are guided to the vertical wall member 31 and discharged to the outside through the discharge holes 33 and 34. Therefore, mist formation of the processing liquid at the time when the processing liquid is shaken off from the wafer W can be extremely effectively suppressed, and re-adhesion of the mist to the wafer W can be further effectively prevented.

  Further, since the exhaust cup 42 is provided so as to surround the drainage cup 41, even if the mist of the processing liquid leaks from the drainage cup 41, it can be trapped by the exhaust cup 42, and the processing liquid is discharged outside the apparatus. It is possible to prevent the mist from being scattered and having an adverse effect.

  The present invention can be variously modified without being limited to the above embodiment. For example, the guide member is provided to prevent the generation of mist due to turbulent flow, but it is not always necessary. In the above embodiment, the exhaust cup 42 is provided in the exhaust / drain section 6 so as to surround the drain cup 41 that receives the drain from the rotary cup 3. It is not limited to. Furthermore, in the above-described embodiment, an example in which the vertical wall member 31 is used as the wall portion of the rotating cup has been described. However, the present invention is not limited to this, and for example, a curved wall portion 31 ′ as shown in FIG. Good. Furthermore, in the above-described embodiment, a liquid processing apparatus that performs front and back surface cleaning of a wafer has been shown as an example, but the present invention is not limited thereto, and may be a liquid processing apparatus that performs surface cleaning processing. The liquid process is not limited to the cleaning process, and other liquid processes such as a resist liquid coating process and a subsequent development process may be used. Furthermore, in the above embodiment, the case where a semiconductor wafer is used as the substrate to be processed has been described. However, other substrates such as a flat panel display (FPD) substrate represented by a glass substrate for a liquid crystal display device (LCD) are used. Needless to say, this is applicable.

  The present invention is effective for a cleaning apparatus for removing particles and contamination adhering to a semiconductor wafer.

1 is a cross-sectional view illustrating a schematic configuration of a liquid processing apparatus according to an embodiment of the present invention. 1 is a schematic plan view showing a liquid processing apparatus according to an embodiment of the present invention with a part cut away. Sectional drawing which expands and shows the exhaust_gas | exhaustion / drainage part of the liquid processing apparatus of FIG. The schematic diagram for demonstrating the state of the process liquid shaken off from the wafer. The figure for demonstrating the processing operation of the liquid processing apparatus which concerns on one Embodiment of this invention. The schematic diagram which shows the modification of the wall part of the rotating cup in the liquid processing apparatus of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1; Wafer holding part 2; Rotary motor 3; Rotary cup 4; Surface treatment liquid supply nozzle 5; Back surface treatment liquid supply nozzle 6; Exhaust / drainage part 8; Casing 9;
11; Rotating plate 12; Rotating shaft 13; Holding member 31; Vertical wall member 32; Trap member 33, 34; Discharge hole 35; Guide member 37; Liquid film 41; Drain cup 42; Exhaust cup 100; ; Wafer

Claims (6)

A substrate holding unit that holds the substrate horizontally and can rotate with the substrate;
A rotating cup that surrounds the substrate held by the substrate holding unit and is rotatable together with the substrate;
A rotation mechanism for integrally rotating the rotary cup and the substrate holding part;
A liquid supply mechanism for supplying a processing liquid to the substrate;
An exhaust / drainage unit for exhausting and draining the rotating cup;
The rotating cup has a wall portion that receives the processing liquid shaken off from the substrate, and a discharge hole that is formed on the wall portion and discharges the processing liquid shaken off from the substrate.
The exhaust / drainage part is provided outside the wall part, and has a drainage cup that receives and drains the processing liquid discharged from the discharge hole,
The wall is configured such that when the rotating cup is rotated together with the substrate, a liquid film of the processing liquid shaken off from the substrate is formed on the inner surface by centrifugal force. Processing equipment. A substrate holding unit that holds the substrate horizontally and can rotate with the substrate;
A rotating cup that surrounds the substrate held by the substrate holding unit and is rotatable together with the substrate;
A rotation mechanism for integrally rotating the rotary cup and the substrate holding part;
A surface liquid supply mechanism for supplying a treatment liquid to the surface of the substrate;
A back surface liquid supply mechanism for supplying a processing liquid to the back surface of the substrate;
An exhaust / drainage unit for exhausting and draining the rotating cup;
The rotating cup has a wall portion that receives the processing liquid shaken off from the substrate, and a discharge hole that is formed on the wall portion and discharges the processing liquid shaken off from the substrate.
The exhaust / drainage part is provided outside the wall part, and has a drainage cup that receives and drains the processing liquid discharged from the discharge hole,
The wall is configured such that when the rotating cup is rotated together with the substrate, a liquid film of the processing liquid shaken off from the substrate is formed on the inner surface by centrifugal force. Processing equipment.   A guide member is further provided outside the substrate on the holding member so as to rotate together with the holding member and the rotary cup, and guides the processing liquid shaken off from the substrate to the outside of the substrate. The liquid processing apparatus of Claim 1 or Claim 2.   The exhaust / drain portion is further provided with an exhaust cup that is provided outside the drain cup and exhausts the rotary cup. 4. Liquid processing equipment.   5. The liquid treatment according to claim 1, wherein the wall portion is provided so as to be perpendicular to and surround the substrate on the holding member. apparatus.   The liquid processing apparatus according to claim 5, wherein the rotating cup further includes a flange member provided in an annular shape inward from an upper end of the wall portion.

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