TW200744126A - Semiconductor wafer regenerating system and method - Google Patents

Abstract

A semiconductor wafer regenerating system capable of easily and efficiently removing fabricated patterns formed on a semiconductor wafer to enable the reuse of the semiconductor wafer. The system, which removes patterns of semiconductor wafer in a dry manner by blasting grits onto a surface of the semiconductor wafer, includes a mesh conveyor, a grit blaster, swinging means, collecting means, separating means, and a dust collector. The mesh conveyor transports the semiconductor wafer in a condition that the patterns are faced in an upward direction. The grit blaster is installed above the mesh conveyor and has at least one blasting nozzle for blasting grits toward the surface of the semiconductor wafers to remove the patterns from the semiconductor wafer. The swinging means swings the blasting nozzle in a plane perpendicular to a transporting path of the semiconductor wafer along the mesh conveyor. The collecting means is provided underneath the mesh conveyor and collects pulverulent bodies including grits, chips, and dusts falling from the mesh conveyor. The separating means is connected to the collecting means to separate the grits and chips from the dusts. The dust collector is connected to the separating means to collect the dusts separated by the separating means.