CN201332088Y - Automatic dust remover - Google Patents
Automatic dust remover Download PDFInfo
- Publication number
- CN201332088Y CN201332088Y CNU200820176661XU CN200820176661U CN201332088Y CN 201332088 Y CN201332088 Y CN 201332088Y CN U200820176661X U CNU200820176661X U CN U200820176661XU CN 200820176661 U CN200820176661 U CN 200820176661U CN 201332088 Y CN201332088 Y CN 201332088Y
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- wafer
- dust remover
- exhaust gear
- dedusting area
- automatic dust
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Abstract
The utility model relates to an automatic dust remover used for cleaning adsorbed particles on the surfaces of a plurality of wafers. The automatic dust remover comprises a machine body, a front-side dust removal area and a back-side dust removal area arranged at the downstream of the front-side dust removal area and a wafer turnover area, wherein the front-side dust removal area comprises a first air blowing mechanism and a first air exhaust mechanism, the first air blowing mechanism is used for providing deionized airflow blowing to one side of the wafers, and the first air exhaust mechanism is used for discharging the deionized airflow out; the back-side dust removal area comprises a second air blowing mechanism and a second air exhaust mechanism, the second air blowing mechanism is used for providing deionized airflow blowing to the other side of the wafers, and the air exhaust mechanism is used for discharging the deionized airflow out; and the wafer turnover area is arranged between the front-side dust removal area and the back-side dust removal area and provided with a wafer turnover mechanism so as to effectively improve the efficiency of removing the particles or the dust on the surfaces of the wafers.
Description
Technical field
The utility model relates to a kind of automatic dust remover, refers in particular to a kind of automatic dust remover that utilizes the deionization air-flow to remove the wafer surface particle.
Background technology
Along with modern society's science and technology is constantly progressive, electronic product is applied to the various aspects of daily life gradually, and the electronic component in most of electronic product must be considered the overall acceptability rate of procedure for producing and the market acceptance of product when producing.
Consider with product percent of pass, produce all in addition standardization of online manufacture process, produce that product just can be avoided the interference of human factor and the reduction that causes the processing procedure qualification rate with the processing procedure of standard.Especially with the production of semiconductor element, more beneficial its importance that shows of the lifting of qualification rate, small particle or dust all can influence follow-up working condition.For example tradition is at automatic inspection machine (the Auto VisualInspection of wafer; AVI) when the detection interpretation of carrying out product quality; the particle regular meeting that chip sucking is enclosed makes the automatic inspection machine that it is classified as the not good product of quality; but in fact; those particles only are to be adsorbed in wafer surface because of electrostatic interaction; be not the defective that is on the processing procedure to be caused, thus generally can before carrying out the automatic inspection machine, can use dust removal machine to remove the particle of product surface, to avoid the erroneous judgement of inspection machine.
Yet as above-mentioned existing dust removal machine still has following defective when reality is used:
1, traditional dust removal machine is the dust cleaning apparatus of contact; for example utilize the adhesive tape of sticking type directly to contact the particle that goes on wafer with glutinous with wafer; yet; the dust cleaning apparatus of contact has many restrictions in the use; above-mentioned non-even curface many pads that are convexly equipped with (bump) for example arranged, so just can't use the dust cleaning apparatus of this contact to remove particle or dust on the product of flip-chip encapsulating structure.
2, other contactless dust cleaning apparatus for example again, it utilizes coiled pipe to carry out the operation that blows of air, but the Control Parameter of this coiled pipe can't be done a standardized definition, so can cause the uncertain of dedusting operation because of operator's difference, in other words, the use coiled pipe carries out blowing of gas and can't form the work pattern of standard, so its efficient can't reaching an agreement property.
The utility model is at the defective of above-mentioned existing constructional device when actual the using, and proposes a kind of reasonable in design and effectively improve the automatic dust remover of the problems referred to above.
Summary of the invention
Main purpose of the present utility model; aim to provide a kind of automatic dust remover that utilizes the deionization air-flow to eliminate static and dedusting; this automatic dust remover can utilize the air-flow of blowing and bleeding that particle or dust are got rid of on wafer synchronously, to reach best dust removing effects.
In order to achieve the above object, the utility model provides a kind of automatic dust remover, it is characterized in that, in order to the adsorption particle (particles) that cleans a plurality of wafer surface, comprise: a body wherein is provided with a positive dedusting area, a back side dedusting area and a wafer Flip Zone.Positive dedusting area comprises one first inflatable body and one first exhaust gear, the one side that this first inflatable body provides a deionization air-flow to blow to described wafer, and this first exhaust gear is in order to discharge this deionization air-flow.The back side dedusting area that is arranged at the downstream of this front dedusting area comprises one second inflatable body and one second exhaust gear, the another side that this second inflatable body provides a deionization air-flow to blow to described wafer, and this second exhaust gear is in order to discharge this deionization air-flow.This wafer Flip Zone is arranged between this front dedusting area and this back side dedusting area, and this wafer Flip Zone has a wafer switching mechanism.
Useful technique effect of the present utility model is, by above-mentioned structure, this automatic dust remover can utilize the deionization air-flow to eliminate the static of wafer, simultaneously with the condition standardization in addition of blow-out nozzle, make on the wafer that adsorbed particle can be by band from wafer surface, and then reach the purpose that the subsequent production qualification rate promotes.
For enabling further to understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, be not to be used for the utility model is limited.
Description of drawings
Fig. 1 is the schematic diagram of automatic dust remover of the present utility model.
Fig. 2 is the end view of automatic dust remover of the present utility model.
Fig. 2 A is the vertical view of automatic dust remover of the present utility model.
Fig. 2 B is the enlarged drawing of the A part of Fig. 2 A.
Fig. 3 is the schematic diagram that exhaust gear of the present utility model is connected with collecting unit of dust.
Wherein, description of reference numerals is as follows:
1 automatic dust remover, 10 positive dedusting area
101 first inflatable bodies, 1011 blow-out nozzles
102 first exhaust gears, 103 loam cake tool mechanisms
104 charging storehouse mechanisms, 11 back side dedusting area
111 second inflatable bodies, 112 second exhaust gears
114 discharging storehouse mechanisms of 113 lower cover tool mechanisms
12 wafer Flip Zones, 13 bodies
14 exhaust lines, 20 collecting unit of dust
201 return air non-return valves, 202 dust collect plants
2021 dust bags, 2022 dust bags are changed indicator elment
203 stop valves, 30 wafer disks
Embodiment
At first, see also Fig. 1 and Fig. 2, the utility model proposes an automatic dust remover 1, it utilizes the deionization air-flow to brush the wafer that enters this automatic dust remover 1, to eliminate the static on the wafer, the particle (particles) that utilizes air-flow to take away simultaneously to be adsorbed on the described wafer is to reach the clean requirement of wafer surface.This automatic dust remover 1 comprises a body 13, one positive dedusting area 10, a back side dedusting area 11 and a wafer Flip Zone 12, wherein should front dedusting area 10, this back side dedusting area 11 and this wafer Flip Zone 12 all be arranged in this body 13.
Please refer to Fig. 1, Fig. 2, Fig. 2 A and Fig. 2 B, the inside of this automatic dust remover 1 mainly forms the space of a barotropic state, causes the automatic dust remover 1 or the secondary pollution of wafer to avoid the particulate in the outside air.The initiating terminal of this automatic dust remover 1 is positive dedusting area 10, its function is to remove the particle on the described wafer, 10 of this front dedusting area include one first inflatable body 101 and one first exhaust gear 102, eliminate the effect of static and dedusting to utilize the deionization air-flow; Moreover, this front dedusting area 10 also includes a loam cake tool mechanism 103 and a charging storehouse mechanism 104, this charging storehouse mechanism 104 is arranged on a side of a conveyer belt, so that wafer disk 30 (tray) is sent to the service area, and this loam cake tool mechanism 103 is used to be covered on this wafer disk 30, in order to follow-up rotary movement, this loam cake tool mechanism 103 is the structure of a framework, it can be selected according to the wafer disk 30 of different sizes, and this loam cake tool mechanism 103 has the structure of quick detach, can carry out automanual dismounting and installation at wafers having different sizes dish 30 fast, to promote operating efficiency.
The major function of this first inflatable body 101 is to provide the deionization air-flow, and in order to removing the static on the wafer, and said flow more can provide particle band that the strength of a physical property will be adsorbed in wafer from wafer.This first inflatable body 101 comprises a plurality of blow-out nozzles 1011, in this specific embodiment, it has four groups of blow-out nozzles 1011, and the angle of described blow-out nozzle 1011, position etc. all can be controlled, and the flow size that while blow-out nozzle 1011 is blown out also can be adjusted at different products; And this blow-out nozzle 1011 is standard type nozzle head or divergent channel head, and visual different application is selected for use.
Mainly will the carry under one's arms air-flow of particle of this first exhaust gear 102 is discharged this automatic dust remover 1, this first exhaust gear 102 and second exhaust gear 112 all can be a fan, it is communicated near the wafer disk 30 of positive dedusting area 10 and back side dedusting area 11 by an exhaust line 14 respectively, to increase the effect of discharging dust granule, can not have influence on the positive pressure condition of body 13 inside simultaneously; And in the design of integral body, the breathing space of side and top can be reserved in the inner space of this automatic dust remover 1, to reach preferable dust removing effects.
This wafer Flip Zone 12 then is arranged at the downstream of this front dedusting area 10, its major function is the action of overturning at the wafer of finishing positive dedusting, for example use a wafer disk switching mechanism that entire wafer dish 30 is carried out rotary movement, so that the back side of described wafer up, and then can carry out the dust removal step of follow-up chip back surface.
This back side dedusting area 11 is established in the downstream of this wafer Flip Zone 12, its major function is to carry out dedusting at the back side of wafer, and the framework of this back side dedusting area 11 is equal to this front dedusting area 10 in fact, and both difference only is that one are feed end, and another person is a discharge end; So similarly, this back side dedusting area 11 comprises one second inflatable body 111 and one second exhaust gear 112, this second inflatable body 111 is equal to this first inflatable body 101, and for example the control of the form of this blow-out nozzle and air blowing condition is equal to the form or the controlled condition of blow-out nozzle 1011; Second exhaust gear 112 then is same as first exhaust gear 102, and for example this second exhaust gear 112 can be an extraction fan etc. equally, so do not repeat them here.
In addition, please refer to Fig. 3, it is the whole dust collect plant of this automatic dust remover 1, and wherein this second exhaust gear 112 is connected in outside collecting unit of dust 20 with this first exhaust gear 102, and dust or the particle that originally is adsorbed on the wafer mainly collected and deposited to this collecting unit of dust 20.Be provided with a return air non-return valve 201 between this first exhaust gear 102 and this second exhaust gear 112 and this collecting unit of dust 20, and in this specific embodiment, this collecting unit of dust 20 has two groups of dust collect plants 202, each group dust collect plant 202 is equipped with a dust bag 2021 and a dust bag is changed indicator elment 2022, described two groups of dust collect plants 202 can be set at crossing operation, but for example a certain dust collect plant 202 isolated operations one hour, carry out control of dust via automaticallying switch to convert another dust collect plant 202 to again, and two groups of dust collect plants 202 can also utilize the deixis of dust bag replacing indicator elment 2022 to carry out the replacing of dust bag 2021.On the other hand; the pipeline in each dust collect plant 202 the place ahead is provided with stop valve 203; this stop valve 203 can cooperate return air non-return valve 201 to carry out operation; cause the pollution of automatic dust remover 1 inside in the time of can avoiding changing dust bag, the disappearance of pressure in the time of simultaneously can avoiding shutting down and cause the problem of back flow of gas.
Below will describe the process that wafer carries out dedusting in detail.At first wafer is positioned on the wafer disk 30 and is stacked in this charging storehouse mechanism 104, and utilizes devices such as conveyer belt to be sent to this front dedusting area 10.The one side of utilizing first inflatable body 101 of this front dedusting area 10 to provide a deionization air-flow to blow to described wafer to eliminate the static of described wafer, utilizes the particle that effect will adsorb thereon that brushes of air-flow to be removed simultaneously; This first exhaust gear 102, as ventilating fan, this particle is discharged and collected to then this is carried under one's arms deionization air-flow of particle of exhaust line 14 devices such as grade in above-mentioned dust collect plant 202, make the one side of described wafer become the clean surface of no particle absorption, this first inflatable body 101 has four groups of blow-out nozzles, (working pressure is that 0.05～0.5MPa) condition is blown to be about 5l/min with the maximum air consumption of continuous air blowing, the air blowing of described blow-out nozzle number of times back and forth can be set at 0 to 9 time, and the air blowing angle of described blow-out nozzle can be controlled in 90 degree between 60 degree, the one side cleaning of described wafer can be become the clean surface of no particle absorption with this.When carrying out positive dedusting, wafer disk 30 is by these 103 fixings of loam cake tool mechanism.
After the positive dedusting of finishing wafer, this wafer disk 30 overturns entire wafer dish 30 to utilize the wafer disk switching mechanism, so that the back side of described wafer up along with devices such as conveyer belt are sent to wafer Flip Zone 12.And because loam cake tool mechanism 103 provides the function of fixing, so wafer is still furnished among wafer disk 30 reposefully.
Then, 30 of wafer disks after above-mentioned being reversed are sent to back side dedusting area 11 by devices such as conveyer belts once more, to carry out the dedusting of chip back surface, overleaf in the dedusting area 11, this second inflatable body 111 provides the deionization air-flow to carry out destaticing of chip back surface and dedusting operation equally, utilizes this second exhaust gear 112, exhaust line 14 to carry out exhaust again and also this particle is collected in above-mentioned dust collect plant 202; And during with the air-flow dedusting, this wafer disk 30 can be by 113 fixings of lower cover tool mechanism of back side dedusting area 11.Finish after the dedusting of wafer the directly discharging or be stacked in the discharging storehouse mechanism 114 of back side dedusting area 11 of this wafer disk 30.
In addition, it should be noted that the utility model does not limit the order of front wafer surface or back side dedusting, for example also can carry out dedusting at the back side of wafer earlier, again dedusting is carried out in the front of wafer; In other words, the utility model can be adjusted the dedusting order of wafer arbitrarily, or selects wafer stack or directly advance/work pattern of discharging.
In sum, the utlity model has following all advantage:
1, automatic dust remover of the present utility model can pass through the work of deionization air-flow in order to eliminate the static on the wafer, utilize air-flow to carry out contactless air blowing dedusting operation simultaneously, cooperate the airflow design of blowing synchronously and bleeding again, can significantly improve the efficient of wafer dedusting.
2, automatic dust remover of the present utility model is contactless dedusting operation; so can be applicable to the product of flip-chip encapsulation (flip chip), utilize the contact dedusting method can't remove the particle of the spot area (bump area) on the flip-chip potted element or the problem of dust to solve tradition.
3, in addition standardization of the condition of the employed blow-out nozzle of automatic dust remover of the present utility model, for example the size of the angle of Chui Qiing, flow etc. all can be controlled, to solve that tradition is used coiled pipe and the processing procedure uncertainty that caused by interference from human factor.
The above only is a preferable possible embodiments of the present utility model, is not so limits to scope of the present utility model, so the equivalence techniques that all utilizations specification of the present utility model and accompanying drawing content are done changes, all is contained in the scope of the present utility model.
Claims (10)
1, a kind of automatic dust remover is characterised in that, it comprises in order to clean the adsorption particle of a plurality of wafer surface:
One body;
One is arranged at the positive dedusting area of this internal body, it comprises one first inflatable body and one first exhaust gear, this first inflatable body provides a deionization air-flow, and this deionization air-flow blows to the one side of described wafer, and this first exhaust gear is in order to discharge this deionization air-flow;
One is arranged at the back side dedusting area of this internal body, it is arranged at the downstream of this front dedusting area, this back side dedusting area comprises one second inflatable body and one second exhaust gear, this second inflatable body provides a deionization air-flow, this deionization air-flow blows to the another side of described wafer, and this second exhaust gear is in order to discharge this deionization air-flow; And
One is arranged at the wafer Flip Zone of this internal body, and it is arranged between this front dedusting area and this back side dedusting area, and this wafer Flip Zone has a wafer switching mechanism.
2, automatic dust remover as claimed in claim 1 is characterized in that: this front dedusting area also includes a loam cake tool mechanism and a charging storehouse mechanism.
3, automatic dust remover as claimed in claim 2 is characterized in that: this back side dedusting area also includes a lower cover tool mechanism and a discharging storehouse mechanism.
4, automatic dust remover as claimed in claim 1 is characterized in that: this first inflatable body and this second inflatable body all comprise a plurality of blow-out nozzles.
5, automatic dust remover as claimed in claim 4 is characterized in that: each blow-out nozzle is standard type nozzle head or divergent channel head.
6, automatic dust remover as claimed in claim 1 is characterized in that: this first exhaust gear and this second exhaust gear are connected in a collecting unit of dust, and are provided with a return air non-return valve between this first exhaust gear and this second exhaust gear and this collecting unit of dust.
7, automatic dust remover as claimed in claim 6 is characterized in that: this collecting unit of dust has at least two group dust collect plants, and each group dust collect plant is equipped with a dust bag and a dust bag is changed indicator elment.
8, automatic dust remover as claimed in claim 1 is characterized in that: this internal body is a barotropic state.
9, automatic dust remover as claimed in claim 3 is characterized in that: this loam cake tool mechanism and this lower cover tool mechanism are all a framework, and this framework has the package assembly of quick detach.
10, automatic dust remover as claimed in claim 1 is characterized in that: this first exhaust gear and this second exhaust gear are communicated with this front dedusting area and this back side dedusting area by an exhaust line respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820176661XU CN201332088Y (en) | 2008-11-12 | 2008-11-12 | Automatic dust remover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820176661XU CN201332088Y (en) | 2008-11-12 | 2008-11-12 | Automatic dust remover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201332088Y true CN201332088Y (en) | 2009-10-21 |
Family
ID=41225470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU200820176661XU Expired - Lifetime CN201332088Y (en) | 2008-11-12 | 2008-11-12 | Automatic dust remover |
Country Status (1)
| Country | Link |
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| CN (1) | CN201332088Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101947528A (en) * | 2010-10-09 | 2011-01-19 | 苏州工业园区天势科技有限公司 | Ion duster |
| CN102426412A (en) * | 2011-07-12 | 2012-04-25 | 上海华力微电子有限公司 | Method for removing surface dust of mask plate |
| CN102652945A (en) * | 2011-12-31 | 2012-09-05 | 东莞华贝电子科技有限公司 | Automatic dust removal device of circuit board |
| CN105234129A (en) * | 2015-10-28 | 2016-01-13 | 中山联合光电科技股份有限公司 | Lens dust removing and flatly-placing mechanism |
| CN110303007A (en) * | 2019-04-23 | 2019-10-08 | 南宁聚信众信息技术咨询有限公司 | A kind of dedusting type sorting equipment of the high reliablity based on flip-chip technology |
| CN111029273A (en) * | 2018-10-10 | 2020-04-17 | 沈阳芯源微电子设备股份有限公司 | Low contact wafer upset system |
| CN115534003A (en) * | 2022-08-19 | 2022-12-30 | 深圳市科晶智达科技有限公司 | Die cutting equipment, dust removal device and dust removal method |
-
2008
- 2008-11-12 CN CNU200820176661XU patent/CN201332088Y/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101947528A (en) * | 2010-10-09 | 2011-01-19 | 苏州工业园区天势科技有限公司 | Ion duster |
| CN102426412A (en) * | 2011-07-12 | 2012-04-25 | 上海华力微电子有限公司 | Method for removing surface dust of mask plate |
| CN102652945A (en) * | 2011-12-31 | 2012-09-05 | 东莞华贝电子科技有限公司 | Automatic dust removal device of circuit board |
| CN105234129A (en) * | 2015-10-28 | 2016-01-13 | 中山联合光电科技股份有限公司 | Lens dust removing and flatly-placing mechanism |
| CN105234129B (en) * | 2015-10-28 | 2018-04-03 | 中山联合光电科技股份有限公司 | A kind of eyeglass dedusting laying mechanism |
| CN111029273A (en) * | 2018-10-10 | 2020-04-17 | 沈阳芯源微电子设备股份有限公司 | Low contact wafer upset system |
| CN111029273B (en) * | 2018-10-10 | 2022-04-05 | 沈阳芯源微电子设备股份有限公司 | Low contact wafer upset system |
| CN110303007A (en) * | 2019-04-23 | 2019-10-08 | 南宁聚信众信息技术咨询有限公司 | A kind of dedusting type sorting equipment of the high reliablity based on flip-chip technology |
| CN115534003A (en) * | 2022-08-19 | 2022-12-30 | 深圳市科晶智达科技有限公司 | Die cutting equipment, dust removal device and dust removal method |
| CN115534003B (en) * | 2022-08-19 | 2023-08-04 | 深圳市科晶智达科技有限公司 | Die cutting equipment, dust removing device and dust removing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: XINXING ELECTRONICS CO., LTD. |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20111013 Address after: 215123 No. 160 Feng Feng street, Suzhou Industrial Park, Jiangsu Patentee after: Unimicron Technology (SuZhou) Corp. Address before: 215123 No. 160 windy street, Suzhou Industrial Park, Jiangsu, Suzhou, China Co-patentee before: Xinxing Electronics Co., Ltd. Patentee before: Unimicron Technology (SuZhou) Corp. |
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| CX01 | Expiry of patent term |
Granted publication date: 20091021 |
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| CX01 | Expiry of patent term |