TWI811250B - 積層陶瓷電容器及積層陶瓷電容器之製造方法 - Google Patents
積層陶瓷電容器及積層陶瓷電容器之製造方法 Download PDFInfo
- Publication number
- TWI811250B TWI811250B TW107136324A TW107136324A TWI811250B TW I811250 B TWI811250 B TW I811250B TW 107136324 A TW107136324 A TW 107136324A TW 107136324 A TW107136324 A TW 107136324A TW I811250 B TWI811250 B TW I811250B
- Authority
- TW
- Taiwan
- Prior art keywords
- ceramic
- laminated
- internal electrodes
- ceramic capacitor
- side edge
- Prior art date
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 75
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title description 16
- 239000000919 ceramic Substances 0.000 claims abstract description 151
- 239000000463 material Substances 0.000 claims abstract description 24
- 239000010953 base metal Substances 0.000 claims abstract description 22
- 239000012634 fragment Substances 0.000 claims description 38
- 230000003647 oxidation Effects 0.000 claims description 22
- 238000007254 oxidation reaction Methods 0.000 claims description 22
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 19
- 238000005520 cutting process Methods 0.000 claims description 18
- 239000011777 magnesium Substances 0.000 claims description 10
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 9
- 229910052749 magnesium Inorganic materials 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 238000003475 lamination Methods 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 24
- 239000003990 capacitor Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 14
- 238000005245 sintering Methods 0.000 description 11
- 238000001354 calcination Methods 0.000 description 10
- 238000010304 firing Methods 0.000 description 9
- 238000005336 cracking Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000007772 electrode material Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- DJOYTAUERRJRAT-UHFFFAOYSA-N 2-(n-methyl-4-nitroanilino)acetonitrile Chemical compound N#CCN(C)C1=CC=C([N+]([O-])=O)C=C1 DJOYTAUERRJRAT-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical class O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- DQBAOWPVHRWLJC-UHFFFAOYSA-N barium(2+);dioxido(oxo)zirconium Chemical class [Ba+2].[O-][Zr]([O-])=O DQBAOWPVHRWLJC-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- WEUCVIBPSSMHJG-UHFFFAOYSA-N calcium titanate Chemical compound [O-2].[O-2].[O-2].[Ca+2].[Ti+4] WEUCVIBPSSMHJG-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-206830 | 2017-10-26 | ||
| JP2017206830A JP7019374B2 (ja) | 2017-10-26 | 2017-10-26 | 積層セラミックコンデンサ及び積層セラミックコンデンサの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201923798A TW201923798A (zh) | 2019-06-16 |
| TWI811250B true TWI811250B (zh) | 2023-08-11 |
Family
ID=66244153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107136324A TWI811250B (zh) | 2017-10-26 | 2018-10-16 | 積層陶瓷電容器及積層陶瓷電容器之製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10971307B2 (ko) |
| JP (1) | JP7019374B2 (ko) |
| KR (1) | KR102614537B1 (ko) |
| CN (1) | CN109712812B (ko) |
| TW (1) | TWI811250B (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190116113A (ko) * | 2019-06-21 | 2019-10-14 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 제조 방법 |
| KR102284127B1 (ko) * | 2019-12-18 | 2021-07-30 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 이의 제조 방법 |
| JP7234951B2 (ja) | 2020-01-17 | 2023-03-08 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| JP7444008B2 (ja) * | 2020-09-24 | 2024-03-06 | 株式会社村田製作所 | 積層セラミックコンデンサ |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102543424A (zh) * | 2010-09-28 | 2012-07-04 | 株式会社村田制作所 | 层叠陶瓷电子部件以及其制造方法 |
| JP2014096551A (ja) * | 2012-11-07 | 2014-05-22 | Samsung Electro-Mechanics Co Ltd | 積層セラミック電子部品 |
| CN106887333A (zh) * | 2015-12-15 | 2017-06-23 | 太阳诱电株式会社 | 层叠陶瓷电容器和其制造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5723662B2 (ja) * | 2011-04-20 | 2015-05-27 | 太陽誘電株式会社 | 積層セラミックコンデンサの製造方法 |
| JP6014581B2 (ja) * | 2013-02-18 | 2016-10-25 | 太陽誘電株式会社 | インターポーザ付き積層セラミックコンデンサと、積層セラミックコンデンサ用インターポーザ |
| KR101699389B1 (ko) * | 2013-04-25 | 2017-01-24 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층 세라믹 콘덴서 및 그 제조방법 |
| JP6665438B2 (ja) * | 2015-07-17 | 2020-03-13 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| JP6487364B2 (ja) * | 2016-03-30 | 2019-03-20 | 太陽誘電株式会社 | 積層セラミック電子部品の製造方法 |
| JP2018037492A (ja) * | 2016-08-30 | 2018-03-08 | 太陽誘電株式会社 | 積層セラミックコンデンサ及びその製造方法 |
-
2017
- 2017-10-26 JP JP2017206830A patent/JP7019374B2/ja active Active
-
2018
- 2018-10-12 US US16/159,182 patent/US10971307B2/en active Active
- 2018-10-16 TW TW107136324A patent/TWI811250B/zh active
- 2018-10-19 KR KR1020180124931A patent/KR102614537B1/ko active IP Right Grant
- 2018-10-26 CN CN201811256092.4A patent/CN109712812B/zh active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102543424A (zh) * | 2010-09-28 | 2012-07-04 | 株式会社村田制作所 | 层叠陶瓷电子部件以及其制造方法 |
| JP2014096551A (ja) * | 2012-11-07 | 2014-05-22 | Samsung Electro-Mechanics Co Ltd | 積層セラミック電子部品 |
| CN106887333A (zh) * | 2015-12-15 | 2017-06-23 | 太阳诱电株式会社 | 层叠陶瓷电容器和其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109712812B (zh) | 2022-04-05 |
| JP2019079977A (ja) | 2019-05-23 |
| KR20190046650A (ko) | 2019-05-07 |
| CN109712812A (zh) | 2019-05-03 |
| TW201923798A (zh) | 2019-06-16 |
| JP7019374B2 (ja) | 2022-02-15 |
| KR102614537B1 (ko) | 2023-12-18 |
| US20190131074A1 (en) | 2019-05-02 |
| US10971307B2 (en) | 2021-04-06 |
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