TWI810213B - 保護膜形成用複合片及半導體晶片的製造方法 - Google Patents
保護膜形成用複合片及半導體晶片的製造方法 Download PDFInfo
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- TWI810213B TWI810213B TW107137714A TW107137714A TWI810213B TW I810213 B TWI810213 B TW I810213B TW 107137714 A TW107137714 A TW 107137714A TW 107137714 A TW107137714 A TW 107137714A TW I810213 B TWI810213 B TW I810213B
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Classifications
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- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
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- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/10—Presence of homo or copolymers of propene
- C09J2423/106—Presence of homo or copolymers of propene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- H—ELECTRICITY
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- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laminated Bodies (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2017-208435 | 2017-10-27 | ||
JP2017208435 | 2017-10-27 |
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TW201930069A TW201930069A (zh) | 2019-08-01 |
TWI810213B true TWI810213B (zh) | 2023-08-01 |
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KR (1) | KR102560242B1 (ja) |
CN (2) | CN113969114B (ja) |
TW (1) | TWI810213B (ja) |
WO (1) | WO2019082968A1 (ja) |
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JP7478524B2 (ja) * | 2019-09-05 | 2024-05-07 | リンテック株式会社 | 保護膜形成用フィルム、保護膜形成用複合シート、及び保護膜付きワーク加工物の製造方法 |
JP7430056B2 (ja) | 2019-12-20 | 2024-02-09 | 日東電工株式会社 | ダイシングダイボンドフィルム |
Citations (2)
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TW201402768A (zh) * | 2012-07-06 | 2014-01-16 | Furukawa Electric Co Ltd | 半導體晶圓表面保護用黏著帶及使用其之半導體晶圓之製造方法 |
TW201726749A (zh) * | 2015-10-29 | 2017-08-01 | 琳得科股份有限公司 | 保護膜形成用膜以及保護膜形成用複合片 |
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CN1313520C (zh) * | 2000-03-15 | 2007-05-02 | 鹿儿岛县 | 再生发泡性聚苯乙烯系树脂粒子的制造方法 |
CN1848564A (zh) * | 2001-03-09 | 2006-10-18 | 精工爱普生株式会社 | 发光元件的制造方法、半导体激光器及其制造方法 |
JP2004253643A (ja) | 2003-02-20 | 2004-09-09 | Lintec Corp | 半導体チップの製造方法 |
JP2008133408A (ja) * | 2006-10-31 | 2008-06-12 | Yasuhara Chemical Co Ltd | アクリル系粘着剤組成物および該組成物を用いた粘着シート又は粘着テープ |
JP2010287884A (ja) * | 2009-05-15 | 2010-12-24 | Shin-Etsu Chemical Co Ltd | 半導体チップの製造方法 |
RU2012156386A (ru) * | 2010-05-27 | 2014-07-10 | Мерк Патент Гмбх | Состав и способ получения органических электронных устройств |
JP2013173875A (ja) * | 2012-02-27 | 2013-09-05 | Nitto Denko Corp | 粘着テープ |
JP6027856B2 (ja) * | 2012-11-12 | 2016-11-16 | リンテック株式会社 | 水分散型粘着剤組成物、再剥離性粘着シートの製造方法、及び再剥離性粘着シート |
KR102143744B1 (ko) * | 2013-09-30 | 2020-08-12 | 린텍 가부시키가이샤 | 수지막 형성용 복합 시트 |
JP6585068B2 (ja) | 2014-10-29 | 2019-10-02 | リンテック株式会社 | 保護膜形成フィルムおよび保護膜形成用複合シート |
JP2016121306A (ja) * | 2014-12-25 | 2016-07-07 | 日東電工株式会社 | 粘着剤組成物、粘着シート、及び、光学部材 |
JP6631344B2 (ja) * | 2016-03-17 | 2020-01-15 | 東洋インキScホールディングス株式会社 | 粘着剤組成物および粘着シート |
JP6648906B2 (ja) | 2016-03-30 | 2020-02-14 | リンテック株式会社 | リワーク方法 |
JP6868345B2 (ja) | 2016-04-22 | 2021-05-12 | 日東電工株式会社 | 硬化性樹脂組成物、偏光フィルムおよびその製造方法、光学フィルムならびに画像表示装置 |
KR102456771B1 (ko) * | 2016-04-28 | 2022-10-20 | 린텍 가부시키가이샤 | 보호막 형성용 필름 및 보호막 형성용 복합 시트 |
WO2019082961A1 (ja) * | 2017-10-27 | 2019-05-02 | リンテック株式会社 | 保護膜形成用複合シート、及び半導体チップの製造方法 |
TWI786209B (zh) * | 2017-10-27 | 2022-12-11 | 日商琳得科股份有限公司 | 保護膜形成用複合片及半導體晶片的製造方法 |
-
2018
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201402768A (zh) * | 2012-07-06 | 2014-01-16 | Furukawa Electric Co Ltd | 半導體晶圓表面保護用黏著帶及使用其之半導體晶圓之製造方法 |
TW201726749A (zh) * | 2015-10-29 | 2017-08-01 | 琳得科股份有限公司 | 保護膜形成用膜以及保護膜形成用複合片 |
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