TWI805930B - 測試半導體裝置之設備及測試半導體裝置之方法 - Google Patents

測試半導體裝置之設備及測試半導體裝置之方法 Download PDF

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Publication number
TWI805930B
TWI805930B TW109121246A TW109121246A TWI805930B TW I805930 B TWI805930 B TW I805930B TW 109121246 A TW109121246 A TW 109121246A TW 109121246 A TW109121246 A TW 109121246A TW I805930 B TWI805930 B TW I805930B
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TW
Taiwan
Prior art keywords
probe card
chuck
semiconductor device
wafer
testing
Prior art date
Application number
TW109121246A
Other languages
English (en)
Chinese (zh)
Other versions
TW202101008A (zh
Inventor
金勇九
崔時龍
Original Assignee
南韓商細美事有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商細美事有限公司 filed Critical 南韓商細美事有限公司
Publication of TW202101008A publication Critical patent/TW202101008A/zh
Application granted granted Critical
Publication of TWI805930B publication Critical patent/TWI805930B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0425—Test clips, e.g. for IC's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/14—Braking arrangements; Damping arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00—Magnets
    • H01F7/06—Electromagnets; Actuators including electromagnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW109121246A 2019-06-27 2020-06-23 測試半導體裝置之設備及測試半導體裝置之方法 TWI805930B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020190076869A KR102294884B1 (ko) 2019-06-27 2019-06-27 반도체 소자의 검사 장치 및 반도체 소자의 검사 방법
KR10-2019-0076869 2019-06-27

Publications (2)

Publication Number Publication Date
TW202101008A TW202101008A (zh) 2021-01-01
TWI805930B true TWI805930B (zh) 2023-06-21

Family

ID=74110986

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109121246A TWI805930B (zh) 2019-06-27 2020-06-23 測試半導體裝置之設備及測試半導體裝置之方法

Country Status (4)

Country Link
JP (1) JP7239527B2 (ko)
KR (1) KR102294884B1 (ko)
CN (1) CN112230114A (ko)
TW (1) TWI805930B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115213858A (zh) * 2022-06-29 2022-10-21 李理 一种计算机软件开发用测试装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015524616A (ja) * 2012-07-26 2015-08-24 エテル・ソシエテ・アノニム ウェハを試験するための設備

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JPH03146801A (ja) * 1989-11-01 1991-06-21 Matsushita Electric Ind Co Ltd ピエゾ駆動型探針ユニット粗動機構
JPH0774219A (ja) * 1993-08-31 1995-03-17 Kurisutaru Device:Kk プローブ基板およびその製造方法並びにプローブ装置
US5828224A (en) * 1994-03-18 1998-10-27 Fujitsu, Limited Test carrier for semiconductor integrated circuit and method of testing semiconductor integrated circuit
KR100253836B1 (ko) * 1996-12-24 2000-04-15 이준세 전자파 차폐필름의 제조방법
JP2006032593A (ja) * 2004-07-15 2006-02-02 Renesas Technology Corp プローブカセット、半導体検査装置および半導体装置の製造方法
KR100558494B1 (ko) * 2004-07-29 2006-03-07 삼성전자주식회사 웨이퍼 리프팅 장치를 가진 반도체 제조설비
JP2006216502A (ja) * 2005-02-07 2006-08-17 Jsr Corp 異方導電性コネクター、プローブカード並びにウエハ検査装置およびウエハ検査方法
JP2009150746A (ja) * 2007-12-20 2009-07-09 Fujitsu Microelectronics Ltd プローブカード、半導体集積回路試験装置、及び、半導体集積回路試験方法
JP2010133787A (ja) * 2008-12-03 2010-06-17 Tokyo Electron Ltd プローブカード
JP2010164406A (ja) * 2009-01-15 2010-07-29 Micro System:Kk プローブユニット及び配線確認システム
JP5500421B2 (ja) * 2009-12-14 2014-05-21 住友電気工業株式会社 ウェハ保持体およびそれを搭載したウェハプローバ
US10451672B2 (en) * 2015-04-24 2019-10-22 Telefonaktiebolaget Lm Ericsson (Publ) Probing apparatus for tapping electric signals generated by a device-under-test
JP6501726B2 (ja) * 2016-04-19 2019-04-17 三菱電機株式会社 プローブ位置検査装置および半導体評価装置ならびにプローブ位置検査方法
KR20190051240A (ko) * 2017-11-06 2019-05-15 삼성전자주식회사 테스트 장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015524616A (ja) * 2012-07-26 2015-08-24 エテル・ソシエテ・アノニム ウェハを試験するための設備

Also Published As

Publication number Publication date
JP7239527B2 (ja) 2023-03-14
TW202101008A (zh) 2021-01-01
JP2021007149A (ja) 2021-01-21
CN112230114A (zh) 2021-01-15
KR20210001187A (ko) 2021-01-06
KR102294884B1 (ko) 2021-08-27

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