TWI801480B - 聚醯亞胺前驅物、聚醯亞胺、聚醯亞胺膜、清漆及基板 - Google Patents
聚醯亞胺前驅物、聚醯亞胺、聚醯亞胺膜、清漆及基板 Download PDFInfo
- Publication number
- TWI801480B TWI801480B TW107147626A TW107147626A TWI801480B TW I801480 B TWI801480 B TW I801480B TW 107147626 A TW107147626 A TW 107147626A TW 107147626 A TW107147626 A TW 107147626A TW I801480 B TWI801480 B TW I801480B
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- Prior art keywords
- formula
- polyimide
- group
- general formula
- quaternary
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
- B32B2379/08—Polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/208—Touch screens
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017-254392 | 2017-12-28 | ||
JP2017254392 | 2017-12-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201936717A TW201936717A (zh) | 2019-09-16 |
TWI801480B true TWI801480B (zh) | 2023-05-11 |
Family
ID=67067498
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107147626A TWI801480B (zh) | 2017-12-28 | 2018-12-28 | 聚醯亞胺前驅物、聚醯亞胺、聚醯亞胺膜、清漆及基板 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7047852B2 (ja) |
KR (1) | KR102422464B1 (ja) |
CN (1) | CN111757904B (ja) |
TW (1) | TWI801480B (ja) |
WO (1) | WO2019131894A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW202124531A (zh) * | 2019-11-18 | 2021-07-01 | 日商三菱瓦斯化學股份有限公司 | 聚醯亞胺樹脂、聚醯亞胺清漆以及聚醯亞胺薄膜 |
CN115348987B (zh) * | 2020-03-27 | 2024-08-23 | 三菱瓦斯化学株式会社 | 聚酰亚胺薄膜和层叠体 |
CN112409315B (zh) * | 2020-11-12 | 2023-03-28 | 广东工业大学 | 一种含有螺芴功能基团的二胺单体及其制备方法、低介电常数的聚酰亚胺 |
WO2022133722A1 (zh) * | 2020-12-22 | 2022-06-30 | 宁波长阳科技股份有限公司 | 聚酰亚胺材料及其制备方法和应用 |
CN112646183A (zh) * | 2020-12-22 | 2021-04-13 | 宁波长阳科技股份有限公司 | 聚酰亚胺材料及其制备方法和应用 |
CN114669206B (zh) * | 2022-04-19 | 2023-10-24 | 南阳师范学院 | 一种聚酮、气体分离膜及其制备方法、应用 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201348295A (zh) * | 2012-05-28 | 2013-12-01 | Ube Industries | 聚醯亞胺前驅體及聚醯亞胺 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107573506B (zh) | 2012-09-18 | 2020-06-30 | 宇部兴产株式会社 | 聚酰亚胺前体,聚酰亚胺,聚酰亚胺膜,清漆以及基板 |
CN107108886B (zh) * | 2014-10-23 | 2021-03-30 | 宇部兴产株式会社 | 聚酰亚胺前体、聚酰亚胺和聚酰亚胺膜 |
JP2016132686A (ja) * | 2015-01-15 | 2016-07-25 | Jxエネルギー株式会社 | ポリイミド、ポリイミドの製造方法、ポリイミド溶液及びポリイミドフィルム |
JP6492934B2 (ja) * | 2015-04-27 | 2019-04-03 | 宇部興産株式会社 | ポリアミック酸溶液組成物およびポリイミドフィルム |
JP2016204569A (ja) * | 2015-04-27 | 2016-12-08 | 宇部興産株式会社 | ポリアミック酸溶液組成物およびポリイミドフィルム |
US20190161581A1 (en) | 2016-05-06 | 2019-05-30 | Mitsubishi Gas Chemical Company, Inc. | Polyimide resin |
JP2017133027A (ja) | 2016-09-13 | 2017-08-03 | Jxtgエネルギー株式会社 | ポリイミド、ポリイミドの製造方法、ポリイミド溶液及びポリイミドフィルム |
WO2018066522A1 (ja) * | 2016-10-07 | 2018-04-12 | Jxtgエネルギー株式会社 | ポリイミド、ポリイミド前駆体樹脂、それらの溶液、ポリイミドの製造方法、及び、ポリイミドを用いたフィルム |
JP2018044180A (ja) * | 2017-12-26 | 2018-03-22 | Jxtgエネルギー株式会社 | ポリイミド樹脂組成物及びポリイミドワニス |
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2018
- 2018-12-27 JP JP2019562176A patent/JP7047852B2/ja active Active
- 2018-12-27 CN CN201880089562.4A patent/CN111757904B/zh active Active
- 2018-12-27 WO PCT/JP2018/048191 patent/WO2019131894A1/ja active Application Filing
- 2018-12-27 KR KR1020207021486A patent/KR102422464B1/ko active IP Right Grant
- 2018-12-28 TW TW107147626A patent/TWI801480B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201348295A (zh) * | 2012-05-28 | 2013-12-01 | Ube Industries | 聚醯亞胺前驅體及聚醯亞胺 |
Also Published As
Publication number | Publication date |
---|---|
KR20200093685A (ko) | 2020-08-05 |
JPWO2019131894A1 (ja) | 2021-01-14 |
JP7047852B2 (ja) | 2022-04-05 |
TW201936717A (zh) | 2019-09-16 |
WO2019131894A1 (ja) | 2019-07-04 |
CN111757904A (zh) | 2020-10-09 |
KR102422464B1 (ko) | 2022-07-20 |
CN111757904B (zh) | 2023-07-14 |
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