TWI801019B - 薄膜電晶體的製造方法 - Google Patents
薄膜電晶體的製造方法 Download PDFInfo
- Publication number
- TWI801019B TWI801019B TW110145562A TW110145562A TWI801019B TW I801019 B TWI801019 B TW I801019B TW 110145562 A TW110145562 A TW 110145562A TW 110145562 A TW110145562 A TW 110145562A TW I801019 B TWI801019 B TW I801019B
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing
- thin film
- film transistor
- transistor
- thin
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66969—Multistep manufacturing processes of devices having semiconductor bodies not comprising group 14 or group 13/15 materials
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/42—Silicides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H01L21/0214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being a silicon oxynitride, e.g. SiON or SiON:H
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02312—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour
- H01L21/02315—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour treatment by exposure to a plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Plasma & Fusion (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Thin Film Transistor (AREA)
- Formation Of Insulating Films (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020-210352 | 2020-12-18 | ||
JP2020210352A JP2022097012A (ja) | 2020-12-18 | 2020-12-18 | 薄膜トランジスタの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202225441A TW202225441A (zh) | 2022-07-01 |
TWI801019B true TWI801019B (zh) | 2023-05-01 |
Family
ID=82058783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110145562A TWI801019B (zh) | 2020-12-18 | 2021-12-07 | 薄膜電晶體的製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2022097012A (zh) |
KR (1) | KR20230051692A (zh) |
CN (1) | CN116324019A (zh) |
TW (1) | TWI801019B (zh) |
WO (1) | WO2022130912A1 (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010056542A (ja) * | 2008-07-31 | 2010-03-11 | Semiconductor Energy Lab Co Ltd | 半導体装置及び半導体装置の作製方法 |
WO2013051644A1 (ja) * | 2011-10-07 | 2013-04-11 | 住友電気工業株式会社 | 絶縁膜およびその製造方法 |
US9929279B2 (en) * | 2014-02-05 | 2018-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
TW201812419A (zh) * | 2016-07-25 | 2018-04-01 | 半導體能源研究所股份有限公司 | 電晶體的製造方法及顯示裝置 |
TWI645471B (zh) * | 2012-04-06 | 2018-12-21 | 半導體能源研究所股份有限公司 | 絕緣膜,用於製造半導體的方法,及半導體裝置 |
TWI666707B (zh) * | 2014-10-01 | 2019-07-21 | 日商東京威力科創股份有限公司 | 電子元件、其製造方法及其製造裝置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008028252A (ja) * | 2006-07-24 | 2008-02-07 | Toshiba Matsushita Display Technology Co Ltd | 半導体層の処理方法、半導体層の処理装置、薄膜トランジスタの製造方法及び薄膜トランジスタの製造装置 |
JP5124189B2 (ja) * | 2007-07-11 | 2013-01-23 | シャープ株式会社 | 光電変換素子の製造方法 |
JP2009260044A (ja) * | 2008-04-17 | 2009-11-05 | Hitachi Displays Ltd | 表示装置 |
CN102834921B (zh) * | 2010-03-26 | 2016-04-27 | 株式会社半导体能源研究所 | 半导体装置的制造方法 |
JP5790893B1 (ja) * | 2015-02-13 | 2015-10-07 | 日新電機株式会社 | 膜形成方法および薄膜トランジスタの作製方法 |
WO2016199680A1 (ja) * | 2015-06-08 | 2016-12-15 | シャープ株式会社 | 半導体装置およびその製造方法 |
JP6924943B2 (ja) | 2017-05-12 | 2021-08-25 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
-
2020
- 2020-12-18 JP JP2020210352A patent/JP2022097012A/ja active Pending
-
2021
- 2021-11-22 KR KR1020237009288A patent/KR20230051692A/ko unknown
- 2021-11-22 CN CN202180063924.4A patent/CN116324019A/zh active Pending
- 2021-11-22 WO PCT/JP2021/042788 patent/WO2022130912A1/ja active Application Filing
- 2021-12-07 TW TW110145562A patent/TWI801019B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010056542A (ja) * | 2008-07-31 | 2010-03-11 | Semiconductor Energy Lab Co Ltd | 半導体装置及び半導体装置の作製方法 |
WO2013051644A1 (ja) * | 2011-10-07 | 2013-04-11 | 住友電気工業株式会社 | 絶縁膜およびその製造方法 |
TWI645471B (zh) * | 2012-04-06 | 2018-12-21 | 半導體能源研究所股份有限公司 | 絕緣膜,用於製造半導體的方法,及半導體裝置 |
US9929279B2 (en) * | 2014-02-05 | 2018-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
TWI666707B (zh) * | 2014-10-01 | 2019-07-21 | 日商東京威力科創股份有限公司 | 電子元件、其製造方法及其製造裝置 |
TW201812419A (zh) * | 2016-07-25 | 2018-04-01 | 半導體能源研究所股份有限公司 | 電晶體的製造方法及顯示裝置 |
Non-Patent Citations (2)
Title |
---|
期刊 Jae-Sung Kim, Min-Kyu Joo, Ming Xing Piao, Seung-Eon Ahn, Yong-Hee Choi, Ho-Kyun Jang, and Gyu-Tae Kim Plasma treatment effect on charge carrier concentrations and surface traps in a-InGaZnO thin-film transistors Journal of Applied Physics 115(11) AIP 19 March 2014 114503;期刊 Xiaoming Huang ,Dong Zhou andWeizong Xu Influence of N2/O2 Partial Pressure Ratio during Channel Layer Deposition on the Temperature and Light Stability of a-InGaZnO TFTs Appl. Sci. 9(9) MDPI 8 May 2019 1880 * |
期刊 Xiaoming Huang ,Dong Zhou andWeizong Xu Influence of N2/O2 Partial Pressure Ratio during Channel Layer Deposition on the Temperature and Light Stability of a-InGaZnO TFTs Appl. Sci. 9(9) MDPI 8 May 2019 1880 |
Also Published As
Publication number | Publication date |
---|---|
KR20230051692A (ko) | 2023-04-18 |
JP2022097012A (ja) | 2022-06-30 |
TW202225441A (zh) | 2022-07-01 |
CN116324019A (zh) | 2023-06-23 |
WO2022130912A1 (ja) | 2022-06-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI799618B (zh) | 切割用黏著帶及半導體晶片之製造方法 | |
EP3686936A4 (en) | THIN-LAYER TRANSISTOR STRUCTURE AND MANUFACTURING PROCESS FOR IT | |
GB202017982D0 (en) | Organic thin film transistor | |
EP3413335A4 (en) | THIN-LAYER TRANSISTOR AND MANUFACTURING METHOD THEREFOR | |
TWI799905B (zh) | 半導體元件和半導體元件的製造方法 | |
TWI801019B (zh) | 薄膜電晶體的製造方法 | |
TWI800493B (zh) | 化合物半導體基板之製造方法及化合物半導體基板 | |
TWI799952B (zh) | 顯示裝置之製造方法 | |
TWI799706B (zh) | 一種薄膜轉移方法 | |
TWI799544B (zh) | 黏著膠帶及半導體裝置的製造方法 | |
CL2022002112S1 (es) | Sustrato | |
KR102470396B9 (ko) | 박막트랜지스터의 제조방법 | |
DK3650608T3 (da) | Fremgangsmåde til fremstilling af en tætningsbåndrulle | |
TWI799621B (zh) | 蝕刻方法及半導體裝置的製造方法 | |
KR102462893B9 (ko) | 산화물 반도체 박막 트랜지스터 및 그 제조 방법 | |
EP3848977A4 (en) | ORGANIC THIN-LAYER TRANSISTOR AND PROCESS FOR MANUFACTURING ORGANIC THIN-LAYER TRANSISTOR | |
TWI799681B (zh) | 化合物和含鋰膜之製造方法 | |
EP3657547A4 (en) | TOP GRID THIN FILM TRANSISTOR MANUFACTURING PROCESS | |
EP3676876A4 (en) | THIN FILM TRANSISTOR, ARRAY SUBSTRATE, DISPLAY DEVICE AND METHOD OF MANUFACTURING A THIN FILM TRANSISTOR | |
TWI801173B (zh) | 半導體裝置及製造半導體裝置的方法 | |
EP3843128A4 (en) | ORGANIC THIN-FILM TRANSISTOR AND METHOD FOR MANUFACTURING AN ORGANIC THIN-FILM TRANSISTOR | |
TWI856296B (zh) | 蝕刻方法 | |
JP1750283S (ja) | 時計フィルム貼り付け装置 | |
JP1763689S (ja) | 門 | |
JP1763351S (ja) | 門 |