TWI799874B - 透明接著劑用組成物及膜狀透明接著劑、以及附透明接著劑硬化層之構件之製造方法、電子零件及其製造方法 - Google Patents

透明接著劑用組成物及膜狀透明接著劑、以及附透明接著劑硬化層之構件之製造方法、電子零件及其製造方法 Download PDF

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Publication number
TWI799874B
TWI799874B TW110119413A TW110119413A TWI799874B TW I799874 B TWI799874 B TW I799874B TW 110119413 A TW110119413 A TW 110119413A TW 110119413 A TW110119413 A TW 110119413A TW I799874 B TWI799874 B TW I799874B
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TW
Taiwan
Prior art keywords
transparent adhesive
film
epoxy resin
transparent
particle size
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TW110119413A
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English (en)
Chinese (zh)
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TW202212403A (zh
Inventor
森田稔
坂井小雪
綿引慶太
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日商古河電氣工業股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/10—Transparent films; Clear coatings; Transparent materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Adhesive Tapes (AREA)
TW110119413A 2020-09-29 2021-05-28 透明接著劑用組成物及膜狀透明接著劑、以及附透明接著劑硬化層之構件之製造方法、電子零件及其製造方法 TWI799874B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020163561 2020-09-29
JPJP2020-163561 2020-09-29

Publications (2)

Publication Number Publication Date
TW202212403A TW202212403A (zh) 2022-04-01
TWI799874B true TWI799874B (zh) 2023-04-21

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TW110119413A TWI799874B (zh) 2020-09-29 2021-05-28 透明接著劑用組成物及膜狀透明接著劑、以及附透明接著劑硬化層之構件之製造方法、電子零件及其製造方法

Country Status (10)

Country Link
US (1) US12570880B2 (https=)
EP (1) EP4047065B1 (https=)
JP (1) JP7687960B2 (https=)
KR (1) KR102734913B1 (https=)
CN (1) CN114599758B (https=)
MY (1) MY196339A (https=)
PH (1) PH12022550506A1 (https=)
PT (1) PT4047065T (https=)
TW (1) TWI799874B (https=)
WO (1) WO2022070503A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117321159A (zh) * 2021-08-23 2023-12-29 古河电气工业株式会社 膜状粘接剂、使用其的电子部件及其制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9296925B2 (en) * 2012-08-02 2016-03-29 Lintec Corporation Film-like adhesive, adhesive sheet for semiconductor junction, and method for producing semiconductor device
CN106575625A (zh) * 2014-09-05 2017-04-19 古河电气工业株式会社 膜状粘接剂、使用膜状粘接剂的半导体封装及其制造方法
TW201918536A (zh) * 2017-11-07 2019-05-16 日商古河電氣工業股份有限公司 薄膜狀接著劑、使用薄膜狀接著劑之半導體封裝體之製造方法
JP2019143085A (ja) * 2018-02-23 2019-08-29 旭化成株式会社 熱硬化性エポキシ樹脂組成物、接着剤、エポキシ樹脂硬化物、塩、及び硬化剤

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5890466A (ja) 1982-11-04 1983-05-30 Toshiba Corp 研削砥石
JPS6336905U (https=) 1986-08-25 1988-03-09
JP3513835B2 (ja) * 1993-03-09 2004-03-31 日立化成工業株式会社 接着フィルム
US6294271B1 (en) * 1999-02-12 2001-09-25 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
JP2006323039A (ja) * 2005-05-18 2006-11-30 Shin Etsu Chem Co Ltd 液晶表示素子用シール剤組成物
CN101379108B (zh) * 2006-02-03 2011-11-30 旭化成电子材料株式会社 微胶囊型环氧树脂用固化剂、母料型环氧树脂用固化剂组合物、单液型环氧树脂组合物、及其加工品
KR20080072321A (ko) * 2007-02-02 2008-08-06 동우 화인켐 주식회사 경화성 수지 조성물 및 액정표시장치
JP5253315B2 (ja) * 2009-07-27 2013-07-31 大成プラス株式会社 溶剤型エポキシ接着剤及び接着方法
JP5871428B2 (ja) * 2011-03-16 2016-03-01 古河電気工業株式会社 高熱伝導性フィルム状接着剤用組成物、高熱伝導性フィルム状接着剤、並びに、それを用いた半導体パッケージとその製造方法
WO2014054631A1 (ja) * 2012-10-02 2014-04-10 大日本印刷株式会社 接着剤組成物およびそれを用いた接着シート
JP2014227423A (ja) * 2013-05-17 2014-12-08 味の素株式会社 プリプレグ及びプリプレグ用エポキシ樹脂組成物
CN107111193A (zh) * 2015-05-20 2017-08-29 积水化学工业株式会社 液晶显示元件用密封剂、上下导通材料及液晶显示元件
JP6606894B2 (ja) * 2015-07-15 2019-11-20 味の素株式会社 エポキシ樹脂組成物の製造方法
JP6619628B2 (ja) * 2015-11-20 2019-12-11 旭化成株式会社 接着フィルム用エポキシ樹脂組成物。
JP6799910B2 (ja) * 2015-11-20 2020-12-16 旭化成株式会社 封止材用エポキシ樹脂組成物、及び封止材。
CN107406742B (zh) 2016-03-15 2020-12-29 古河电气工业株式会社 膜状接合剂用组合物、膜状接合剂及制造方法、使用膜状接合剂的半导体封装及制造方法
CN108264726B (zh) * 2016-12-30 2019-11-05 比亚迪股份有限公司 一种环氧树脂复合材料和制品及其制备方法
TWI778041B (zh) * 2017-03-31 2022-09-21 日商日鐵化學材料股份有限公司 纖維強化複合材料用環氧樹脂組成物、纖維強化複合材料及成形體
CN109554065B (zh) * 2018-10-17 2021-07-13 擎天材料科技有限公司 一种耐海洋性气候的底涂粉末涂料及其制备方法
CN111745177A (zh) 2019-03-29 2020-10-09 日本碍子株式会社 圆柱状工件的开孔装置及其开孔方法、圆柱状产品的制造方法以及圆柱状工件的检查方法
JP7275996B2 (ja) * 2019-08-26 2023-05-18 東レ株式会社 熱硬化接着剤シート、半導体装置および半導体装置の製造方法
CN111187438B (zh) * 2020-02-10 2021-03-05 北京航空航天大学 一种真空袋成型工艺用碳纤维/增韧环氧树脂预浸料的制备方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9296925B2 (en) * 2012-08-02 2016-03-29 Lintec Corporation Film-like adhesive, adhesive sheet for semiconductor junction, and method for producing semiconductor device
CN106575625A (zh) * 2014-09-05 2017-04-19 古河电气工业株式会社 膜状粘接剂、使用膜状粘接剂的半导体封装及其制造方法
TW201918536A (zh) * 2017-11-07 2019-05-16 日商古河電氣工業股份有限公司 薄膜狀接著劑、使用薄膜狀接著劑之半導體封裝體之製造方法
JP2019143085A (ja) * 2018-02-23 2019-08-29 旭化成株式会社 熱硬化性エポキシ樹脂組成物、接着剤、エポキシ樹脂硬化物、塩、及び硬化剤

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JPWO2022070503A1 (https=) 2022-04-07
TW202212403A (zh) 2022-04-01
EP4047065A1 (en) 2022-08-24
PH12022550506A1 (en) 2023-03-20
US20220186095A1 (en) 2022-06-16
MY196339A (en) 2023-03-24
CN114599758A (zh) 2022-06-07
CN114599758B (zh) 2024-05-14
EP4047065B1 (en) 2025-03-26
KR102734913B1 (ko) 2024-11-28
PT4047065T (pt) 2025-04-23
EP4047065A4 (en) 2023-12-20
KR20220044948A (ko) 2022-04-12
US12570880B2 (en) 2026-03-10
WO2022070503A1 (ja) 2022-04-07
JP7687960B2 (ja) 2025-06-03

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