TWI798647B - 電子封裝件及其製法 - Google Patents

電子封裝件及其製法 Download PDF

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TWI798647B
TWI798647B TW110106356A TW110106356A TWI798647B TW I798647 B TWI798647 B TW I798647B TW 110106356 A TW110106356 A TW 110106356A TW 110106356 A TW110106356 A TW 110106356A TW I798647 B TWI798647 B TW I798647B
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conductive elements
conductive
carrier board
electronic
metal sheet
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TW202306031A (zh
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董悅明
楊家銘
陳俊瑋
李盈撰
朱品華
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華泰電子股份有限公司
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Priority to US17/209,784 priority patent/US11462485B2/en
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Abstract

本發明之電子封裝件包含一載板、一電子元件、複數導電元件、一金屬片以及一成型層。該電子元件設置在該載板上，並與該載板電性連接。該些導電元件設置在該載板上，並與該載板上的接地電路電性連接。該金屬片設置在該電子元件上方，並與該些導電元件電性接觸。該成型層形成在該載板與該金屬片之間，並包覆該電子元件及該些導電元件。本發明另提供一種製造上述電子封裝件的方法。

Description

電子封裝件及其製法
本發明係有關一種電子封裝件及其製法，特別是關於一種具有電磁屏蔽結構的電子封裝件及其製法。
現有在電子封裝件上形成電磁屏蔽結構的方法，大都是先在電子元件周圍設置複數個排列成柵欄狀的金屬柱，再以封膠材料形成包覆電子元件和金屬柱的成型層。之後，研磨成型層頂部以裸露出金屬柱，然後再鍍上金屬層，使其與金屬柱結合。
前述方法需要磨除部分的成型層並鍍上金屬層，不僅浪費材料且還增加製造工序。
有鑒於此，本發明提供一種具有電磁屏蔽結構的電子封裝件及其製法，不會浪費材料更不增加製造工序。
為達上述目的，本發明之電子封裝件包含一載板、一電子元件、複數導電元件、一金屬片以及一成型層。該電子元件設置在該載板上，並與該載板電性連接。該些導電元件設置在該載板上，並與該載板上的接地電路電性連接。該些導電元件包含複數第一導電元件及複數第二導電元件。該些第一導電元件係並排設置並圍繞該電子元件。該些第二導電元件係並排設置並圍繞該些第一導電元件，且分別面對該些第一導電元件中相鄰兩者之間的間隙。該金屬片設置在該電子元件上方，並與該些導電元件電性接觸。該成型層形成在該載板與該金屬片之間，並包覆該電子元件及該些導電元件。
本發明之電子封裝件的製法包含：準備一載板；設置一電子元件於該載板上，並將該電子元件電性連接至該載板；設置複數導電元件於該載板上，並將該些導電元件與該載板上的接地電路電性連接；提供一金屬片，該金屬片係面對該電子元件與該些導電元件設置；提供一封膠材料，並加熱使該封膠材料熔化；使該金屬片與該些導電元件電性接觸；以及固化該封膠材料使其成型為一成型層，其中該成型層形成在該金屬片與該載板之間，並包覆該電子元件及該些導電元件。
於本發明之電子封裝件中，該電子元件受到該金屬片的屏蔽，並且利用該些導電元件以接地方式將所接收到的電磁信號導入該載板的接地端。因此，根據本發明之電子封裝件，於運作中可減少封裝件中電子元件受電磁干擾的機會，進而維持電子封裝件的正常運作。
根據本發明之電子封裝件的製法，不需要磨除部分的成型層及實施額外的濺鍍或塗佈製程以形成電磁屏蔽結構，如此可避免材料浪費並減少製造工序。
為了讓本發明之上述和其他目的、特徵、和優點能更明顯，下文特舉本發明實施例，並配合所附圖示，作詳細說明如下。
以下揭示內容提供用於實施本揭露之不同特徵的許多不同實施例或實例。下文描述組件及配置之特定實例以簡化本揭露。當然，此等組件及配置僅為實例且不意欲為限制性的。舉例而言，在以下描述中，第一構件在第二構件上方或上之形成可包括第一構件與第二構件直接接觸地形成之實施例，且亦可包括額外構件可在第一構件與第二構件之間形成使得第一構件與第二構件可不直接接觸之實施例。另外，本揭露可能在各種實例中重複參考數字及/或字母。此重複係出於簡單及清晰之目的，且本身並不指示所論述之各種實施例及/或組態之間的關係。
另外，本文中為易於描述而可能使用諸如「下伏」、「下方」、「下部」、「上覆」、「上部」及其類似者等空間相對術語，以描述如諸圖中所說明的一個元件或構件與另一或多個元件或構件的關係。除諸圖中所描繪之定向以外，空間相對術語意欲涵蓋在使用或操作中之裝置的不同定向。設備可以其他方式定向(旋轉90度或位於其他定向)，且本文中所使用之空間相對描述詞同樣可相應地進行解釋。
請參考圖1至圖3，本發明電子封裝件的第一實施例包含一載板110，其上佈設有導電線路層114。該載板110具有相對的一第一表面111與一第二表面112，且該第一表面111與該第二表面112位於相異的平面，例如該第一表面111為頂面而該第二表面112為底面，但不限於此。
該載板110的該第一表面111上設有一電子元件120，其電性連接到該載板110。其中該電子元件120可為一主動元件或被動元件。
於一具體實施例中，該電子元件120可為一晶片，並利用覆晶(flip chip)技術連接到該載板110。進一步而言，該電子元件120具有一主動面，其上設置複數導電柱130，該些導電柱130並各自利用一焊料凸塊132固定在該載板110的該第一表面111。藉此，該電子元件120利用該些導電柱130電性連接至該載板110。
該載板110的該第一表面111上還設有複數導電元件，其通過導電線路層114電性連接到該載板110上的接地線路。
於一具體實施例中，該些導電元件係以打線製程所形成之銲線（bonding wire），故該些導電元件係由金屬線160構成並呈現拱形體，即弧線狀，且各該金屬線160的兩端與該載板110接合。該些弧線狀金屬線160的高度係大於該電子元件120的高度，且圍繞該電子元件120設置。
於一具體實施例中，該些金屬線160排列形成如同圍欄（fence）般圍繞該電子元件120設置。
在本發明的另一具體實施例中，該些金屬線160包含複數第一金屬線161及複數第二金屬線162，其中該些第二金屬線162圍繞該些第一金屬線161設置。進一步而言，該載板110上可定義出兩個封閉的環，分別為一第一環與一第二環。該第一環與該第二環大致上為矩形，其中該第一環圍繞該電子元件120，該第二環圍繞該第一環與該電子元件120。該些第一金屬線161並排設置排列成該第一環的形狀。該些第二金屬線162並排設置排列成該第二環的形狀，且分別面對該些第一金屬線161中相鄰兩者之間的間隙。
該電子元件120上方設置一金屬片150，其底面與弧線狀的該些金屬線160的弧形頂部直接接觸，以達成和該些金屬線160電性接觸的目的。該載板110的該第一表面111上還形成一成型層170，其係由封膠材料形成。該成型層170形成在該金屬片150與該載板110之間，並且包覆該些金屬線160以及該電子元件120。
於一具體實施例中，該封膠材料可為環氧樹脂(epoxy)。
依據本發明之電子封裝件，其中該些導電元件還可由其他形式的導電元件構成，亦即圖1至圖3中的弧線狀金屬線160係可由其他形式的導電元件所取代。
進一步而言，導電元件係可由條狀或塊狀形式的導電元件組成。圖4與圖5所示者分別為本發明電子封裝件的第二實施例的立體示意圖與剖面示意圖。圖中所示的導電元件係由複數垂直金屬線260構成，其大致垂直設置在該載板110上。該些垂直金屬線260的下端固定在該載板110上，並通過導電線路層114電性連接到該載板110上的接地線路。該些垂直金屬線260的上端直接接觸到該金屬片150的底面，以達成和該金屬片150電性接觸的目的。該些垂直金屬線260包含複數第一金屬線261及複數第二金屬線262，其中該些第一金屬線261圍繞該電子元件120設置，該些第二金屬線262圍繞該電子元件120與該些第一金屬線261設置。該些第一金屬線261並排設置排列成如同環狀的圍欄。該些第二金屬線262並排設置排列成如同環狀的圍欄，且分別面對該些第一金屬線261中相鄰兩者之間的間隙。
圖6與圖7所示者分別為本發明電子封裝件的第三實施例的立體示意圖與剖面示意圖。圖中所示的導電元件係由複數柱狀的導電柱360構成，其大致垂直設置在該載板110上。該些導電柱360的下端固定在該載板110上，並通過導電線路層114電性連接到該載板110上的接地線路。該些導電柱360的上端直接接觸到該金屬片150的底面，以達成和該金屬片150電性接觸的目的。該些導電柱360包含複數第一導電柱361及複數第二導電柱362，其中該些第一導電柱361圍繞該電子元件120設置，該些第二導電柱362圍繞該電子元件120與該些第一導電柱361設置。該些第一導電柱361並排設置排列成如同環狀的圍欄。該些第二導電柱362並排設置排列成如同環狀的圍欄，且分別面對該些第一導電柱361中相鄰兩者之間的間隙。
圖8與圖9所示者分別為本發明電子封裝件的第四實施例的立體示意圖與剖面示意圖。圖中所示的導電元件係由複數球狀的導電塊460構成。該些導電塊460的底部固定在該載板110上，並通過導電線路層114電性連接到該載板110上的接地線路。該些導電塊460的頂端直接接觸到該金屬片150的底面，以達成和該金屬片150電性接觸的目的。該些導電塊460包含複數第一導電塊461及複數第二導電塊462，其中該些第一導電塊461圍繞該電子元件120設置，該些第二導電塊462圍繞該電子元件120與該些第一導電塊461設置。該些第一導電塊461並排設置排列成如同環狀的圍欄。該些第二導電塊462並排設置排列成如同環狀的圍欄，且分別面對該些第一導電塊461中相鄰兩者之間的間隙。
請參考圖10至圖15，其顯示圖1所示之電子封裝件的製法。
如圖10所示，根據本發明之電子封裝件的製法，首先，準備一載板110，該載板110具有相對的一第一表面111與一第二表面112，且該第一表面111與該第二表面112位於相異的平面。該載板110上係佈設有導電線路層114。
接著，根據本發明之電子封裝件的製法，將一電子元件120設置在該載板110的該第一表面111，並與該載板110 電性連接，如圖11所示。
該電子元件120可為一主動元件或被動元件。於一具體實施例中，該電子元件120可為一晶片，並利用覆晶技術連接到該載板110。進一步而言，該電子元件120的主動面上設置複數導電柱130，該些導電柱130並各自利用一焊料凸塊132固定在該載板110的該第一表面111。藉此，該電子元件120利用該些導電柱130電性連接至該載板110。
接著，根據本發明之電子封裝件的製法，將作為導電元件的複數金屬線160圍繞該電子元件120設置在該載板110的該第一表面111。該些金屬線160係通過導電線路層114電性連接到該載板110上的接地線路，且其高度大於該電子元件120的高度，如圖12所示。
於一具體實施例中，該些金屬線160係以打線製程所形成之銲線，各該金屬線160的兩端與該載板110接合。該些弧線狀金屬線160的高度係大於該電子元件120的高度。
在本發明的另一具體實施例中，該些金屬線160包含複數第一金屬線161及複數第二金屬線162，其中該些第二金屬線162圍繞該些第一金屬線161設置，其設置方式如圖1及3所示，於此不多做贅述。須注意的是，為簡化圖式，圖12省略了該電子元件120後方的金屬線160。
接著，根據本發明之電子封裝件的製法，將圖12所示的結構倒置，並於其下方放置一金屬片150，使該金屬片150面對該電子元件120與該些金屬線160。然後，在該金屬片150上放置封膠材料175，使該封膠材料175位在該金屬片150與該載板110之間，如圖13所示。
於一具體實施例中，該封膠材料175可為環氧樹脂(epoxy)。此外，該封膠材料175可為粉狀或塊狀封膠材料。圖13所示的封膠材料175係為粉狀的封膠材料。
接著，根據本發明之電子封裝件的製法，對該金屬片150加熱使其上的該封膠材料175受熱熔化，此時該封膠材料175轉變成液態且體積膨脹，如圖14所示。
最後，如圖15所示，根據本發明之電子封裝件的製法係將該載板110接近該金屬片150，使該金屬片150與該些金屬線160的弧形部分直接接觸，以達成和該些金屬線160電性接觸的目的。待該封膠材料175固化冷卻成型為該成型層170包覆該些金屬線160及該電子元件120後，即完成本發明之電子封裝件。
關於圖4至圖9所示之電子封裝件，其製法類似圖1所示之電子封裝件的製法。進一步而言，做為複數導電元件的該些垂直金屬線260、該些導電柱360或該些導電塊460分別按照圖4至圖9所示的方式設置在該載板110上，並通過導電線路層114電性連接到該載板110上的接地線路。該些垂直金屬線260、該些導電柱360或該些導電塊460並設置成圍繞該電子元件120，且其高度大於該電子元件120的高度。
之後，依序按照圖13至圖15所示之製法，將該載板110倒置放置在該金屬片150上方，並對該金屬片150加熱使其上的該封膠材料175受熱熔化。在該封膠材料175熔化時，將該載板110接近該金屬片150，使該金屬片150與該些垂直金屬線260、該些導電柱360或該些導電塊460直接接觸。待該封膠材料175固化冷卻成型為該成型層170包覆該電子元件120與該些垂直金屬線260、該些導電柱360或該些導電塊460後，即完成圖4-5、圖6-7或圖8-9所示之電子封裝件。
於本發明之電子封裝件中，該電子元件受到該金屬片的屏蔽，並且利用該些導電元件以接地方式將所接收到的電磁信號導入該載板的接地端。因此，根據本發明之電子封裝件，於運作中可減少封裝件中電子元件受電磁干擾的機會，進而維持電子封裝件的正常運作。
根據本發明之電子封裝件的製法，不需要磨除部分的成型層及實施額外的濺鍍或塗佈製程以形成電磁屏蔽結構，如此可避免材料浪費並減少製造工序。
雖然本發明已以前述實施例揭示，然其並非用以限定本發明，任何本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與修改。因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。
110       載板 111       第一表面 112       第二表面 114       導電線路層 120       電子元件 130       導電柱 132       焊料凸塊 150       金屬片 160       金屬線 161       第一金屬線 162       第二金屬線 170       成型層 175       封膠材料 260       垂直金屬線 261       第一金屬線 262       第二金屬線 360       導電柱 361       第一導電柱 362       第二導電柱 460       導電塊 461       第一導電塊 462       第二導電塊
當結合附圖閱讀時，自以下詳細描述最好地理解本揭露之態樣。應注意，根據業界中之標準實務，各種構件未按比例繪製。實際上，為論述清楚起見，可任意增大或減小各種構件之尺寸。 圖1為本發明電子封裝件的第一實施例的立體示意圖。 圖2為本發明電子封裝件的第一實施例的一剖面示意圖。 圖3為本發明電子封裝件的第一實施例的另一剖面示意圖。 圖4為本發明電子封裝件的第二實施例的立體示意圖。 圖5為本發明電子封裝件的第二實施例的剖面示意圖。 圖6為本發明電子封裝件的第三實施例的立體示意圖。 圖7為本發明電子封裝件的第三實施例的剖面示意圖。 圖8為本發明電子封裝件的第四實施例的立體示意圖。 圖9為本發明電子封裝件的第四實施例的剖面示意圖。 圖10至15顯示圖1所示之電子封裝件的製法。
110       載板 111       第一表面 112       第二表面 114       導電線路層 120       電子元件 130       導電柱 132       焊料凸塊 150       金屬片 160       金屬線 170       成型層

Claims (8)

  1. 一種電子封裝件的製法，包含：準備一載板；設置一電子元件於該載板上，並將該電子元件電性連接至該載板；設置複數導電元件於該載板上，並將該些導電元件與該載板上的接地電路電性連接；提供一金屬片，該金屬片係面對該電子元件與該些導電元件設置；將一封膠材料放置在該金屬片上，並加熱該金屬片使該封膠材料受熱熔化；使該金屬片與該些導電元件電性接觸；以及固化該封膠材料使其成型為一成型層，其中該成型層形成在該金屬片與該載板之間，並包覆該電子元件及該些導電元件。
  2. 如請求項1之電子封裝件的製法，其中，該些導電元件係為複數金屬線，該製法還包含：以打線製程將各該金屬線的兩端與該載板接合。
  3. 如請求項1之電子封裝件的製法，其中，該封膠材料為粉狀的封膠材料。
  4. 如請求項1之電子封裝件的製法，其中，該些導電元件圍繞該電子元件設置。
  5. 如請求項1之電子封裝件的製法，其中，該些導電元件包含複數第一導電元件及複數第二導電元件，該些第一導電元件係並排設置並圍繞該電子元件，該些第二導電元件係並排設置並圍繞該些第一導電元件，該些第二導電元件分別面對該些第一導電元件中相鄰兩者之間的間隙。
  6. 如請求項1之電子封裝件的製法，其中，該些導電元件係選自於由垂直金屬線、導電柱以及導電塊所組成的群組之一。
  7. 一種電子封裝件，包含：一載板；一電子元件，設置在該載板上，並與該載板電性連接；由金屬線構成的複數導電元件，各該導電元件的兩端與該載板接合，該些導電元件並與該載板上的接地電路電性連接，其中該些導電元件包含複數第一導電元件及複數第二導電元件，該些第一導電元件係並排設置並圍繞該電子元件，該些第二導電元件係並排設置並圍繞該些第一導電元件，該些第二導電元件分別面對該些第一導電元件中相鄰兩者之間的間隙；一金屬片，設置在該電子元件上方，並與該些導電元件電性接觸；以及一成型層，形成在該載板與該金屬片之間，並包覆該電子元件及該些導電元件。
  8. 如請求項7之電子封裝件，其中，該些導電元件為弧線狀金屬線，該金屬片與該些弧線狀金屬線的弧形部分直接接觸。
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