TWI794408B - Substrate processing device, substrate processing method, and storage medium - Google Patents

Abstract

An object of the invention is to provide a substrate processing device that is effective in improving the precision of a supply position of a process liquid to a peripheral section of a substrate. A coating and developing device 2 comprises: a removal liquid supply section 50 having a removal liquid nozzle 52 that discharges a removal liquid onto a peripheral section of a wafer W; a drive section 60 which moves a moving body 51 that includes the removal liquid nozzle 52; a sensor 70 that detects information relating to the position of the moving body 51; and a control section 100 that is configured to execute output of a control command to the drive section 60 so as to move the moving body 51 from a first position P1 at which the removal liquid nozzle 52 is positioned outside the periphery Wc of the wafer W to a second position P2 at which the removal liquid nozzle 52 is positioned above the peripheral part of the wafer W, and also to adjust the control command, based on the relationship between the control command and information detected by the sensor 70 during the movement of the moving body 51 from the first position P1 to the second position P2, so as to reduce how much the movement completion position of the moving body 51 deviates from the second position P2.

Description

Substrate processing apparatus, substrate processing method, and recording medium

The present invention relates to a substrate processing device, a substrate processing method, and a recording medium.

Patent Document 1 discloses a device comprising: a nozzle mechanism for dissolving and removing the chemical film formed on the peripheral end of a semiconductor substrate; a sensor installed in the nozzle mechanism for detecting the position of the peripheral portion of the semiconductor substrate; a driving mechanism for driving the nozzle to The mechanism moves; and the control system controls the driving mechanism so that the peripheral part of the drug film can be dissolved and removed with a desired width according to the signal detected by the sensor.

[Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Laid-Open No. 7-142332

The object of the present invention is to provide a substrate processing apparatus, which can effectively improve the accuracy of the supply position of the processing liquid to the peripheral portion of the substrate.

The substrate processing apparatus of the present invention includes: a liquid supply unit having a nozzle for spraying the processing liquid on the peripheral portion of the substrate; a drive unit for moving a moving body including the nozzle; and a sensor for detecting the position of the moving body. information; and a control unit that executes the following steps: outputting to the drive unit a control command for moving the moving body from a first position where the nozzle is arranged outside the periphery of the substrate to a second position where the nozzle is arranged on the periphery of the substrate ; and according to the relationship between the information detected by the sensor and the control command during the movement of the mobile body from the first position to the second position, the control command is corrected so as to reduce the deviation between the end position of the mobile body and the second position .

According to this substrate processing apparatus, information about the position of the moving body is detected during the movement of the moving body, and control commands are corrected based on the information, thereby reducing the deviation between the movement end position of the moving body and the second position. In addition, according to the method based on the relationship between the information on the position of the moving body and the control command, it is not necessary to arrange sensors on the moving body itself as in the method of detecting the periphery of the substrate, so it is possible to avoid, for example, problems caused by the arrangement of the sensors. The enlargement of the mobile body, etc. In addition, based on the relationship between the information on the position of the moving body and the control command, it is possible to correct the control command with a margin at any point of time without detecting the periphery of the substrate or the like. Therefore, the substrate processing apparatus can effectively improve the accuracy of the supply position of the processing liquid to the peripheral portion of the substrate.

The control unit may further execute the step of controlling the driving unit so that the movement of the moving body from the first position to the second position is temporarily stopped before the nozzle reaches the periphery of the substrate, and the movement of the moving body from the first position to the second position is temporarily stopped according to the movement of the moving body from the first position to the second position. The information detected by the sensor when the movement of the second position is temporarily stopped is used to modify the control command. In this case, the control command can be corrected with a margin before the nozzle reaches the peripheral portion of the substrate.

The control part may further execute the following step: controlling the liquid supply part to spray the processing liquid from the nozzle when the moving body temporarily stops moving from the first position to the second position. In this case, the discharge of the processing liquid is performed at the timing of the temporary stop, and it is possible to suppress the particles contained in the processing liquid from adhering to the substrate when the discharge starts.

The control unit may correct the movement of the moving body from the first position to the second position based on information detected by the sensor after a standby time for attenuating the vibration of the moving body has elapsed after the movement of the moving body from the first position to the second position is temporarily stopped. Control instruction. In this case, it is possible to suppress a reduction in the accuracy of the supply position of the treatment liquid due to a difference in information detected by the sensor.

The control unit may also derive statistical values of information detected by the sensor during a predetermined period longer than the vibration period of the mobile body after the period in which the mobile body temporarily stops moving from the first position to the second position , and modify the control instruction according to the statistical value. In this case, it is possible to suppress a reduction in the accuracy of the supply position of the treatment liquid due to a difference in position information.

The control unit may further perform the following step: adjusting the correction amount of the control command according to the deviation between the movement end position of the moving body and the second position obtained in response to the corrected control command. In this case, the deviation between the movement end position of the moving body and the second position can be further reduced.

The substrate processing method of the present invention includes the step of: controlling the drive unit so that the moving body including the nozzle for spraying the processing liquid on the peripheral edge of the substrate moves from the first position where the nozzle is arranged outside the peripheral edge of the substrate. to the second position where the nozzle is arranged on the peripheral portion of the substrate; and from the first position according to the moving body Set the relationship between the information on the position of the mobile body detected during the movement to the second position and the control command to the drive unit, and correct the control command to the drive unit so that the distance between the end position of the mobile body and the second position can be reduced. deviation.

The computer-readable recording medium of the present invention records a program for enabling a device to execute the above substrate processing method.

According to the present invention, it is possible to provide a substrate processing apparatus capable of effectively improving the accuracy of the supply position of the processing liquid to the peripheral portion of the substrate.

1: Substrate processing system

2: Coating/developing device (substrate processing device)

3: Exposure device

4: Vehicle block

5: Processing blocks

6: Interface block

11: Processing module

12: Processing module

13: Processing module

14: Processing module

20: Rotation holding part

21: Keeping Department

22: Rotary drive unit

30: Coating liquid supply part

31: Moving body

32: Coating liquid nozzle

33: Coating liquid source

40: Drive Department

41: power source

42: Communication agency

43: reducer

44: Confirm the conveyor belt

50: Removal liquid supply part (liquid supply part)

51: Moving body

52: Remover nozzle (nozzle)

53: Remove the liquid source

60: drive unit

61: power source

62: Communication agency

63: reducer

64: Confirm the conveyor belt

70: sensor

100: Control Department

111: Coating solution supply control unit

112: Coating liquid nozzle movement control unit

113: Removal liquid supply control part

114: Remover nozzle movement control part

116: Control instruction holding unit

117: Control Command Correction Department

118: Correction amount adjustment department

119:Rotary control unit

120: circuit

121: Processor

122: memory

123: Storage

124: I/O port

125: timer

A1: Transfer arm

A3: Carrying arm

A7:Lift arm

A8: Transfer arm

C: vehicle

CL1: Center of rotation

F1: lamination

L1: Coating solution

L2: Remover

LL: lower limit value

P1: first position

P2: second position

S01~S09, S11~S15, S21~S27, S31~S36, S41~S48, S51~S57, S61~S67, S71~S77: steps

U1: coating unit

U2: heat treatment unit

U3: Developing unit

U4: heat treatment unit

U10: Pergola unit

U11: Trellis unit

UL: upper limit value

W: wafer (substrate)

Wa: surface

Wc: Perimeter

[FIG. 1] A perspective view of a schematic configuration of a substrate liquid processing system.

[ Fig. 2 ] A cross-sectional view showing a schematic configuration of a substrate processing apparatus.

[ Fig. 3 ] A schematic diagram of a schematic configuration of a coating unit.

[FIG. 4] A block diagram of the hardware configuration of the control unit.

[ Fig. 5 ] A flow chart of the film formation process program.

[ Fig. 6 ] A flowchart of a coating processing program.

[ FIG. 7 ] (a) to (c) Schematic diagrams of the state of the wafer during the execution of the coating process.

[ Fig. 8 ] A flow chart of a peripheral edge removal processing program.

[ Fig. 9 ] A flow chart of a peripheral edge removal processing program.

[ FIG. 10 ] (a) to (c) Schematic diagrams of the state of the wafer during the execution of the peripheral edge removal process.

[FIG. 11] (a), (b) Schematic diagrams of the state of the wafer during execution of the peripheral edge removal process.

[FIG. 12] An illustration of the relationship between the number of operations and the amount of deviation from the target position.

[ Fig. 13 ] A flowchart of a modified example of the peripheral edge removal processing program.

[ Fig. 14 ] A flowchart of a modified example of the peripheral edge removal processing program.

[ Fig. 15 ] A flowchart of another modified example of the peripheral edge removal processing program.

[ Fig. 16 ] A flowchart of another modified example of the peripheral edge removal processing program.

[Substrate Processing System]

The substrate processing system 1 is a system for forming a photosensitive coating, exposing the photosensitive coating, and developing the photosensitive coating on a substrate. The substrate to be processed is, for example, a semiconductor wafer W. The photosensitive film is, for example, a photoresist film. The substrate processing system 1 includes a coating/developing device 2 and an exposure device 3 . The exposure device 3 performs exposure processing of the photoresist film (photosensitive film) formed on the wafer W (substrate). Specifically, energy rays are irradiated to the exposure target portion of the photoresist film by a method such as liquid immersion exposure. The coating/developing device 2 performs the process of forming a photoresist film on the surface of the wafer W (substrate) before the exposure process performed by the exposure device 3 , and performs the process of developing the photoresist film after the exposure process.

[Substrate Processing Equipment]

Hereinafter, the configuration of the coating/developing device 2 will be described as an example of a substrate processing device. As shown in FIGS. 1 and 2 , the coating/developing device 2 includes a carrier block 4 , a processing block 5 , an interface block 6 and a control unit 100 .

The carrier block 4 carries the wafer W into the coating/developing device 2 and unloads the wafer W from the coating/developing device 2 . For example, the carrier block 4 can support a carrier C for a plurality of wafers W, and a built-in transfer arm A1. The carrier C houses a plurality of circular wafers W, for example. The transfer arm A1 takes out the wafer W from the carrier C and delivers it to the processing block 5 , and picks up the wafer W from the processing block 5 and returns it to the carrier C.

The processing block 5 has a plurality of processing modules 11 , 12 , 13 , 14 . The processing modules 11 , 12 , 13 are built with: a coating unit U1 , a heat treatment unit U2 , and a transfer arm A3 for transferring the wafer W to these units.

The processing module 11 forms a lower layer film on the surface of the wafer W through the coating unit U1 and the heat treatment unit U2. The coating unit U1 of the processing module 11 coats the processing liquid for forming the lower layer film on the wafer W. The heat treatment unit U2 of the processing module 11 performs various heat treatments accompanying the formation of the lower layer film.

The processing module 12 forms a photoresist film on the lower layer film through the coating unit U1 and the heat treatment unit U2. The coating unit U1 of the processing module 12 coats the processing solution for forming the photoresist film on the lower layer film. The heat treatment unit U2 of the processing module 12 performs various heat treatments accompanying the formation of the photoresist film.

The processing module 13 forms an upper film on the photoresist film through the coating unit U1 and the heat treatment unit U2. The coating unit U1 of the processing module 13 coats the liquid for forming the upper layer film on the photoresist film. The heat treatment unit U2 of the processing module 13 performs various heat treatments accompanying the formation of the upper layer film.

The processing module 14 is built with: a developing unit U3, a heat treatment unit U4, and a transfer arm A3 for transferring the wafer W to these units.

The processing module 14 uses the developing unit U3 and the thermal processing unit U4 to develop the exposed photoresist film. After the developing unit U3 coats the developing solution on the surface of the exposed wafer W, the developing solution is washed away with a rinse solution, so as to develop the photoresist film. Heat treatment unit U4, for accompanying development Various heat treatments. Specific examples of heat treatment include heat treatment before development (PEB: Post Exposure Bake), heat treatment after development (PB: Post Bake), and the like.

On the side of the carrier block 4 in the processing block 5, a shelving unit U10 is arranged. The shelf unit U10 is partitioned into a plurality of compartments arranged in the vertical direction. Near the shelving unit U10, a lifting arm A7 is provided. The lifting arm A7 lifts and lowers the wafer W between cells of the shelf unit U10 .

On the side of the interface block 6 in the processing block 5, a shelving unit U11 is provided. The shelf unit U11 is divided into a plurality of compartments arranged in the vertical direction.

The interface block 6 transfers the wafer W to and from the exposure device 3 . For example, the interface block 6 has a built-in transfer arm A8 and is connected to the exposure device 3 . The transfer arm A8 transfers the wafer W disposed on the rack unit U11 to the exposure device 3 , picks up the wafer W from the exposure device 3 , and returns it to the rack unit U11 .

The control unit 100 controls the coating/developing device 2 so that, for example, the coating/developing process is executed in the following procedure. First, the control unit 100 controls the transfer arm A1 to transport the wafer W in the carrier C to the shelf unit U10 , and controls the lift arm A7 to place the wafer W in the chamber for the processing module 11 .

Next, the control unit 100 controls the transport arm A3 so as to transport the wafer W on the shelf unit U10 to the coating unit U1 and the heat treatment unit U2 in the processing module 11, and controls the coating unit U1 and the heat treatment unit U2 so that An underlayer film is formed on the surface of the wafer W. Thereafter, the control unit 100 controls the transfer arm A3 so that the wafer W on which the lower layer film has been formed returns to the shelf unit U10, and controls the lifting arm A7 so that the wafer W is placed in the chamber for the processing module 12. .

Next, the control unit 100 controls the transport arm A3 so as to transport the wafer W on the shelf unit U10 to the coating unit U1 and the heat treatment unit U2 in the processing module 12, and controls the coating unit U1 and the heat treatment unit U2 so that A photoresist film is formed on the lower layer film of the wafer W. Thereafter, the control unit 100 controls the transfer arm A3 to return the wafer W to the rack unit U10 , and controls the lifting arm A7 to place the wafer W in the chamber for the processing module 13 .

Next, the control unit 100 controls the transfer arm A3 so as to transfer the wafer W of the shelf unit U10 to each unit in the processing module 13, and controls the coating unit U1 and the heat treatment unit U2 so as to ensure the light of the wafer W. An upper film is formed on the resist film. Thereafter, the control unit 100 controls the transfer arm A3 so as to transfer the wafer W to the shelf unit U11 .

Next, the control unit 100 controls the transfer arm A8 so as to send the wafer W of the rack unit U11 to the exposure device 3 . Thereafter, the control unit 100 controls the transfer arm A8 so as to receive the exposed wafer W from the exposure device 3 and arrange it in the cell for the processing module 14 in the shelf unit U11 .

Next, the control unit 100 controls the transfer arm A3 so as to transfer the wafer W of the shelf unit U11 to each unit in the processing module 14, and controls the developing unit U3 and the heat treatment unit U4 so that the photoresist of the wafer W is The film is subjected to a development treatment. Thereafter, the control unit 100 controls the transfer arm A3 to return the wafer W to the shelf unit U10 , and controls the lifting arm A7 and the transfer arm A1 to return the wafer W to the carrier C. From the above, the coating/development process is completed.

In addition, the specific structure of the substrate processing apparatus is not limited to the structure of the coating/developing apparatus 2 exemplified above. Any substrate processing apparatus may be used as long as it includes the coating unit U1 and the control unit 100 capable of controlling the coating unit U1.

[Coating unit]

Next, the structure of the said coating unit U1 is demonstrated concretely. As shown in FIG. 3 , the coating unit U1 has a rotation holding unit 20 , a coating liquid supply unit 30 , a drive unit 40 , a removal liquid supply unit 50 , a drive unit 60 , and a sensor 70 .

The rotation holding unit 20 holds and rotates the wafer W. For example, the rotation holding part 20 has a holding part 21 and a rotation driving part 22 . The holding unit 21 supports the central portion of the horizontally arranged wafer W with the surface Wa facing upward, and holds the wafer W by, for example, vacuum suction or the like. The rotation driving part 22 is an actuator using an electric motor as a power source, for example, and rotates the holding part 21 around a vertical rotation center CL1. Thereby, the wafer W is also rotated.

The coating liquid supply unit 30 supplies a coating liquid (for example, a processing liquid for forming a lower layer film, a photoresist film, or an upper layer film) to the surface Wa of the wafer W. The coating liquid supply unit 30 has: a moving body 31 including a coating liquid nozzle 32 for discharging the coating liquid onto the wafer W; and a coating liquid source 33 . The coating liquid nozzle 32 opens on the surface Wa side (downward) of the wafer W, and discharges the coating liquid downward. The coating liquid source 33 supplies the coating liquid to the coating liquid nozzle 32 .

The driving unit 40 moves the movable body 31 including the coating liquid nozzle 32 . For example, the driving unit 40 has: a power source 41 such as an electric motor; and a transmission mechanism 42 that transmits the power of the power source 41 to the moving body 31 . The transmission mechanism 42 has, for example, a speed reducer 43 and a confirmation belt 44 , and converts the rotational torque of the power source 41 into translational force and transmits it to the moving body 31 .

The removal liquid supply unit 50 supplies a processing liquid (hereinafter, referred to as “removal liquid”) for removing the film of the coating liquid component to the peripheral portion of the surface Wa of the wafer W (the portion near the peripheral edge Wc). The removal liquid supply unit 50 has: a moving body 51 including a removal liquid nozzle 52 for spraying the removal liquid to the peripheral portion of the wafer W; and Liquid source 53 is removed. The removal liquid nozzle 52 opens on the surface Wa side (lower side) of the wafer W, and discharges the removal liquid downward. The removal liquid source 53 supplies the removal liquid to the removal liquid nozzle 52 . The removal liquid is, for example, an organic solvent that dissolves the film of the coating liquid component.

The driving unit 60 moves the moving body 51 including the removal liquid nozzle 52 . For example, the driving unit 60 has: a power source 61 such as an electric motor; and a transmission mechanism 62 that transmits the power of the power source 61 to the moving body 51 . The power source 61 may be an open-circuit controllable motor (a control method without feedback of a control variable) or a closed-circuit controllable motor (a control method with a control variable feedback). A specific example of an open-circuit controllable motor is, for example, a stepping motor or the like. A specific example of a closed-loop controllable motor is, for example, a servo motor or the like.

The transmission mechanism 62 has, for example, a speed reducer 63 and a confirmation belt 64 , and converts the rotational torque of the power source 61 into translational force and transmits it to the moving body 51 . When such a transmission mechanism 62 is provided, errors may occur in the position of the moving body 51 due to the characteristics of the transmission mechanism 62 (for example, the backlash of the speed reducer 63 and the elongation of the actuating conveyor belt 64 ). In addition, this error may change over time due to a characteristic change of the transmission mechanism 62 (for example, a change in the elongation amount of the actuator belt 64 ).

The sensor 70 detects information about the position of the mobile body 51 . The information on the position of the moving body 51 may be information directly indicating the position of the moving body 51 or information indirectly indicating the position of the moving body 51 . Specific examples of the sensor 70 include a position sensor that detects the position of the moving body 51 with an optical or magnetic linear scale, a non-contact distance sensor such as a laser displacement meter, and the like. Moreover, the sensor 70 may be the sensor which detects the arrival of the moving body 51 to the installation position, such as a photointerrupter, for example. In this case, the arrival time of the mobile body 51 to the set position can be detected as information about the position. Arrival can also be done by Information about the position can be obtained according to the delay or advance relative to the target time (design time without considering the above-mentioned error).

The coating unit U1 configured as described above is controlled by the control unit 100 . The control unit 100 executes the following steps: moving the moving body 51 from the first position P1 where the removal liquid nozzle 52 is disposed outside the peripheral edge Wc of the wafer W to a position where the removal liquid nozzle 52 is disposed on the peripheral portion of the wafer W. The control command of the second position P2 is output to the driving part 60; and according to the relationship between the information detected by the sensor 70 and the control command during the movement of the moving body 51 from the first position P1 to the second position P2, the correction is made. The control command is used to reduce the deviation between the movement end position of the mobile body 51 and the second position P2.

The control unit 100 may further execute the step of controlling the driving unit 60 so that the moving body 51 moves from the first position P1 to the second position P2 before the supply position of the removal liquid from the removal liquid nozzle 52 reaches the peripheral edge Wc of the wafer W. The movement of the mobile body 51 is temporarily stopped, and the control command is modified according to the information detected by the sensor 70 when the movement of the mobile body 51 from the first position P1 to the second position P2 is temporarily stopped. The control unit 100 may further perform the following step: controlling the removal liquid supply unit 50 so that the removal liquid is sprayed from the removal liquid nozzle 52 when the movement of the moving body 51 from the first position P1 to the second position P2 is temporarily stopped. The control unit 100 may also be configured to sense the time after the elapse of the standby time for attenuating the vibration of the mobile body 51 after the period in which the movement of the mobile body 51 from the first position P1 to the second position P2 is temporarily stopped. The information detected by the device 70 is used to modify the control instruction. The control unit 100 may also derive a signal detected by the sensor 70 during a predetermined period longer than the vibration period of the mobile body 51 after the period in which the mobile body 51 temporarily stops moving from the first position P1 to the second position P2 begins. The statistical value of the received information is used to modify the control instruction according to the statistical value.

For example, as a functional structure (hereinafter referred to as "functional module"), the control unit 100 has: a rotation control unit 119; a coating liquid nozzle movement control unit 112; a coating liquid supply control unit 111; The removal liquid supply control unit 113; the control command storage unit 116; the control command correction unit 117; and the correction amount adjustment unit 118.

The rotation control unit 119 controls the rotation holding unit 20 so as to hold and rotate the wafer W. The coating liquid nozzle movement control unit 112 controls the driving unit 40 so that the moving body 31 is at the standby position where the coating liquid nozzle 32 is disposed outside the peripheral edge Wc of the wafer W held by the rotation holding unit 20 and on the wafer W. The coating liquid nozzle 32 moves between the coating target positions arranged on the center of the surface Wa.

The coating liquid supply control unit 111 controls the coating liquid supply unit 30 so as to supply the coating liquid to the surface Wa of the wafer W held by the rotation control unit 119 . For example, the coating liquid supply control unit 111 controls the coating liquid supply unit 30 so as to supply the coating liquid from the coating liquid source 33 to the coating liquid nozzle 32 with the moving body 31 located at the coating target position.

The removing liquid nozzle movement control unit 114 controls the driving unit 60 so that the moving body 51 is disposed at the standby position (first position) and the removing liquid nozzle 52 at the standby position (first position) outside the periphery Wc of the wafer W held by the rotating holding unit 20 . The nozzle 52 is arranged to move between removal target positions (second positions) on the peripheral portion of the wafer W. As shown in FIG. For example, the removal liquid nozzle movement control unit 114 combines a control command (hereinafter referred to as "outgoing control command") for moving the moving body 51 from the standby position to the removal target position and a control command for moving the moving body 51 from the removal target position to the removal target position. A control command for moving to the standby position (hereinafter referred to as “return control command”) is output to the drive unit 60 . The removal liquid nozzle movement control unit 114 may be configured to control the drive unit 60 in the above-mentioned open-circuit manner, or may be configured to control the drive unit 60 in the above-mentioned closed-circuit manner.

The removal liquid nozzle movement control unit 114 may also be configured to: further execute the following step: control the driving unit 60 so that the moving body 51 is removed from the standby position before the removal liquid nozzle 52 reaches the periphery Wc of the wafer W. The movement of the target position is temporarily stopped. The phrase “the removing liquid nozzle 52 reaches the peripheral edge Wc of the wafer W” means that the intersection point of the center line of the removing liquid nozzle 52 opening and the plane along the surface Wa reaches the peripheral edge Wc. The so-called "temporary stop" means that the movement according to the control command is stopped. That is, a state where vibration due to inertia continues even after the movement according to the control command stops is also included in the temporarily stopped state.

The removal liquid supply control unit 113 controls the removal liquid supply unit 50 so that the removal liquid is sprayed from the removal liquid nozzle 52 to the peripheral portion of the wafer W. For example, the removal liquid supply control unit 113 controls the removal liquid supply unit 50 so that the removal liquid is supplied from the removal liquid source 53 to the removal liquid nozzle 52 in a state where the removal liquid nozzle 52 is located on the peripheral portion of the wafer W. The removal liquid supply control unit 113 may control the removal liquid supply unit 50 so as to spray the removal liquid from the removal liquid nozzle 52 even when the moving body 51 temporarily stops moving from the standby position to the removal target position. For example, the removal liquid supply control part 113 may also control the removal liquid supply part 50 so that when the movement of the moving body 51 from the standby position to the removal target position is temporarily stopped, the removal liquid is started to be supplied from the removal liquid source 53 to the removal liquid nozzle 52. , and then continue to supply the removal liquid from the removal liquid source 53 to the removal liquid nozzle 52 until the discharge of the removal liquid to the peripheral portion of the wafer W is completed.

The control command holding unit 116 records the above-mentioned outbound control command and the above-mentioned return control command. The control instruction modification unit 117 modifies the outbound control instruction according to the relationship between the information detected by the sensor 70 and the outbound control instruction during the movement of the moving body 51 from the standby position to the removal target position, so as to reduce the size of the moving object 51. Move the end position and remove the deviation from the target position. For example, the control command modification unit 117 calculates the deviation of the position of the mobile body 51 relative to the forward control command based on the relationship between the information detected by the sensor 70 and the forward control command, and corrects the forward control command so as to reduce the deviation. More specifically, when the position of the moving body 51 obtained based on the information detected by the sensor 70 does not reach the target position at the point of time when the information is detected (designally reached predetermined position when the error is not considered) Then, the control command correction unit 117 corrects the outbound control command so that the moving distance of the mobile body 51 after the detected time point is increased. on the other hand, When the position of the mobile body 51 obtained based on the information detected by the sensor 70 exceeds the target position at the detection time point of the information, the control command modification unit 117 modifies the outbound control command so that after the detection time point Therefore, the moving distance of the moving body 51 is shortened.

Also, when the sensor 70 is a sensor for detecting the arrival of the moving body 51 to its installation position, the control command correction unit 117 corrects the control command as follows. That is, when the arrival time of the mobile body 51 to the installation position of the sensor 70 is later than the target time, the control command modification unit 117 modifies the outbound control command so as to make the movement of the mobile body 51 after the detection time point The distance increases. On the other hand, when the arrival time of the mobile body 51 to the installation position of the sensor 70 is earlier than the target time, the control command modification unit 117 modifies the outbound control command so that the movement after the above-mentioned detection time point The moving distance of the body 51 is shortened.

The control command correction unit 117 may also be configured to correct the outbound control command according to the information detected by the sensor 70 when the moving body 51 temporarily stops moving from the standby position to the removal target position. The control command correction unit 117 may be configured to be configured by the sensor after the elapse of the standby time for attenuating the vibration of the mobile body 51 after the period in which the movement of the mobile body 51 from the standby position to the removal target position is temporarily stopped. 70 The detected information is used to modify the control instruction. The control command modification unit 117 may also be configured to derive a signal from the sensor 70 during a predetermined period longer than the vibration period of the mobile body 51 after the period in which the movement of the mobile body 51 from the standby position to the removal target position is temporarily stopped. A statistical value (for example, an average value) of the detected information, and the control instruction is modified according to the statistical value.

The correction amount adjusting unit 118 adjusts the control command executed by the control command correcting unit 117 based on the deviation between the movement end position of the moving body 51 obtained in response to the corrected outbound control command executed by the control command correcting unit 117 and the removal target position. correction amount. The so-called "control instruction executed by the control instruction modification unit 117 "Correction amount of command" means, for example, an amount to increase or decrease the moving distance of the moving body 51 after the detection time point described above.

More specifically, the correction amount adjustment unit 118 judges that “the correction amount is too small” based on the deviation between the movement end position of the mobile body 51 obtained in response to the corrected outbound control command executed by the control command correction unit 117 and the removal target position. In the case of ", increase the correction amount, and decrease the correction amount when it is judged that "the correction amount is too large". As a specific example of the situation where it is judged that "the correction amount is too small", such as: the situation where the end position of the movement of the mobile body 51 has not reached the removal target position even if the moving distance after the above-mentioned detection time point is lengthened, and even if the above-mentioned detection time point A case where the movement end position of the moving body 51 still exceeds the target position is eliminated in the subsequent movement distance shortening. Specific examples of the situation where it is judged that the "correction amount is too large" are as follows: the movement distance after the above-mentioned detection time point is lengthened, and as a result, the movement end position of the mobile body 51 exceeds the removal target position; The movement distance is shortened, and as a result, the movement end position of the moving body 51 does not reach the removal target position.

The control unit 100 is composed of one or a plurality of control computers. For example, the control unit 100 has a circuit 120 shown in FIG. 4 . The circuit 120 has: one or a plurality of processors 121 , a memory 122 , a storage 123 , an input/output port 124 and a timer 125 . The storage 123 has a computer-readable recording medium such as a hard disk, for example. The recording medium records a program for causing the coating unit U1 to execute a substrate processing procedure described later. The recording medium may also be a removable medium such as a non-volatile semiconductor memory, a magnetic disk, and an optical disk. The memory 122 temporarily records programs loaded from the recording medium of the storage 123 and calculation results generated by the processor 121 . The processor 121 cooperates with the memory 122 to execute the above-mentioned programs to form the above-mentioned functional modules. The input/output port 124 communicates electrical signals between the rotation holding unit 20 , the coating solution supply unit 30 , the drive unit 40 , the removal solution supply unit 50 , the drive unit 60 and the sensor 70 according to instructions from the processor 121 . input and output. The timer 125 measures the elapsed time, for example, by counting a reference pulse of a fixed period. Also, the hardware configuration of the control unit 100 is not It is not necessary to be limited to those that constitute each functional module with a program. For example, each functional module of the control unit 100 may also be constituted by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit: Application Specific Integrated Circuit) integrating the logic circuit.

[Film formation process]

Hereinafter, as an example of a substrate processing method, a film formation processing procedure executed in the coating unit U1 will be described. As shown in FIG. 5 , the control unit 100 first executes steps S01 and S02 in sequence. In step S01 , the rotation control unit 119 controls the rotation holding unit 20 so that the rotation of the wafer W by the rotation driving unit 22 is started while the wafer W is held by the holding unit 21 . Step S02 is a step of controlling the coating liquid supply unit 30 and the driving unit 40 so as to apply the coating liquid to the surface Wa of the wafer W. The specific content will be explained later.

Next, the control unit 100 executes steps S03 and S04 in sequence. Steps S03 and S04 are steps of controlling the rotation holding unit 20 so that the liquid film of the coating liquid formed in step S02 is dried to form a coating. In step S03, the rotation control unit 119 controls the rotation holding unit 20 so as to change the rotation speed of the wafer W to the rotation speed set in advance for drying. In step S04, the rotation control part 119 stands by and waits for the drying period set beforehand to pass.

Next, the control unit 100 executes steps S05 and S06 in sequence. Steps S05 and S06 are steps of controlling the removing liquid supply unit 50 and the driving unit 60 so as to remove the peripheral portion of the film formed in steps S02, S03 and S04. In step S05 , the rotation control unit 119 controls the rotation holding unit 20 so as to change the rotation speed of the wafer W to the preset rotation speed for removing the periphery. Step S06 is a step of controlling the removal liquid supply unit 50 and the drive unit 60 so as to supply the removal liquid to the peripheral portion of the wafer W. The specific content will be explained later.

Next, the control unit 100 executes steps S07, S08, and S09 in sequence. In step S07, the rotation control unit 119 controls the rotation holding unit 20 so as to change the rotation speed of the wafer W to the rotation speed set in advance for drying. In step S08, the rotation control part 119 stands by and waits for the drying period set beforehand to pass. In step S09 , the rotation control unit 119 controls the rotation holding unit 20 so that the rotation of the wafer W performed by the rotation driving unit 22 is stopped. So far, the film forming procedure ends.

(coating process)

Next, a specific procedure of the above-mentioned step S02 will be exemplified. As shown in FIG. 6 , the control unit 100 executes steps S11 , S12 , S13 , S14 , and S15 in sequence. In step S11, the coating liquid nozzle movement control part 112 controls the drive part 40 so that the moving body 31 may move from the said standby position to the said coating target position. Thereby, the coating liquid nozzle 32 moves to the center of the wafer W (refer FIG. 7(a)). In step S12, the coating liquid supply control part 111 controls the coating liquid supply part 30, so that the supply of the coating liquid L1 from the coating liquid source 33 to the coating liquid nozzle 32 is started (refer to FIG. 7 (b)) . In step S13, the coating liquid supply control part 111 stands by and waits for the coating period set beforehand to pass. In step S14 , the coating liquid supply control unit 111 controls the coating liquid supply unit 30 so as to stop the supply of the coating liquid from the coating liquid source 33 to the coating liquid nozzle 32 . In step S15, the coating liquid nozzle movement control part 112 controls the drive part 40 so that the moving body 31 may move from the said coating target position to the said standby position (refer FIG.7(c)). Thereby, the coating liquid nozzle 32 moves outside the peripheral edge Wc of the wafer W. As shown in FIG. So far, the coating processing procedure has ended. A liquid film of the coating liquid L1 is formed on the surface Wa of the wafer W through the execution of the coating processing program.

(peripheral removal handler)

Next, a specific procedure of the above-mentioned step S06 will be exemplified. This program comprises the steps of: controlling the drive unit 60 so that the mobile body 51 moves from the above-mentioned standby position to the above-mentioned removal target position; Body 51 location information and support The relationship between the control commands of the drive unit 60 is to correct the control commands to the drive unit 60 so as to reduce the deviation between the movement end position of the moving body 51 and the removal target position.

As shown in FIG. 8, the control unit 100 first executes step S21. In step S21 , the removal liquid nozzle movement control unit 114 outputs a control command (hereinafter referred to as “first forward control command”) to move the moving body 51 from the standby position to the temporary stop target position to the drive unit 60 . The driving unit 60 temporarily stops the moving body 51 after moving in response to the first control command of the forward journey (refer to (a) of FIG. 10 ). The temporary stop target position is set so that the removal liquid nozzle 52 does not reach the peripheral edge Wc of the wafer W. As shown in FIG.

Next, the control unit 100 executes steps S22, S23, and S24. In step S22 , the control command correction unit 117 waits for the elapse of the standby time set in advance for attenuating the vibration of the mobile body 51 on standby. In step S23 , the control command modification unit 117 obtains the information detected by the sensor 70 . In step S24, the control instruction modification unit 117 modifies the outbound control instruction according to the relationship between the information obtained in step S23 and the outbound control instruction, so as to reduce the deviation between the moving end position of the mobile body 51 and the removal target position. For example, the control command correction unit 117 calculates the position of the mobile body 51 relative to The deviation of the outbound control command is corrected from the temporary stop target position to the removal target position (hereinafter referred to as "the second outbound control command") so as to reduce the deviation. More specifically, when the current position of the mobile body 51 has not reached the above-mentioned temporary stop target position, the control command modification unit 117 modifies the second control command of the forward journey so that the moving distance of the mobile body 51 after restarting the movement is lengthened. . On the other hand, when the current position of the mobile body 51 exceeds the temporary stop target position, the control command modification unit 117 modifies the second outbound control command so that the moving distance of the mobile body 51 after the resumption of movement is shortened.

Next, the control unit 100 executes steps S25, S26, and S27. In step S25, the removal liquid supply control unit 113 controls the removal liquid supply unit 50 so as to start supply of the removal liquid L2 from the removal liquid source 53 to the removal liquid nozzle 52 (see (b) of FIG. 10 ). In step S26, the removal liquid nozzle movement control part 114 stands by and waits for the elapse of the simulated discharge time set in advance. In step S27 , output the outbound second control command corrected in step S24 to the drive unit 60 . The driving unit 60 restarts the movement of the mobile body 51 in response to the second control command of the forward stroke, and temporarily stops the movement of the mobile body 51 after moving the mobile body 51 to the removal target position or its vicinity. Thereby, the removal liquid L2 is supplied to the peripheral part of the wafer W (refer (c) of FIG. 10).

As shown in FIG. 9 , the control unit 100 then executes steps S31 , S32 , and S33 in sequence. In step S31 , the correction amount adjustment unit 118 waits for the elapse of a standby time set in advance for attenuating the vibration of the moving body 51 . In step S32 , the correction amount adjustment unit 118 acquires information detected by the sensor 70 . In step S33, the correction amount adjustment unit 118 adjusts the deviation between the position of the moving body 51 obtained based on the information obtained in step S32 (hereinafter referred to as "current position") and the removed target position, and adjusts the next step S24. The correction amount of the control instruction in . More specifically, the correction amount adjustment unit 118 increases the correction amount in the next and subsequent steps S24 when it is judged that the correction amount in step S24 is too small based on the deviation between the current position of the mobile body 51 and the removal target position. ; When judging that the correction amount in step S24 is too large, reduce the correction amount in the next and subsequent steps S24. For example, the correction amount adjustment unit 118 may adjust the position of the moving body 51 even if the current position of the moving body 51 has not reached the removal target position even if the movement distance after the restart of the movement in step S24 is increased, or even if the movement distance after the restart of the movement in step S24 is shortened. If the current position of the mobile body 51 still exceeds the removal target position, the correction amount in step S24 after the next time is increased. On the other hand, when the correction amount adjusting unit 118 increases the movement distance after restarting movement in step S24 so that the movement end position of the moving body 51 exceeds the removal target position, or increases the movement distance after restarting movement in step S24 In the case where the movement end position of the mobile body 51 does not reach the removal target position due to shortening, the correction amount in step S24 after the next time is decreased.

Next, the control unit 100 executes steps S34, S35, and S36. In step S34 , the removal liquid nozzle movement control unit 114 outputs a control command (hereinafter referred to as “return first control command”) for moving the moving body 51 from the removal target position to the temporary stop target position to the driving unit 60 . The driving unit 60 stops temporarily after moving the moving body 51 in response to the first control command of the return stroke (refer to (a) of FIG. 11 ). In step S35 , the removal liquid supply control unit 113 controls the removal liquid supply unit 50 so as to stop the supply of the removal liquid L2 from the removal liquid source 53 to the removal liquid nozzle 52 . In step S36 , the removal liquid nozzle movement control unit 114 outputs a control command for moving the moving body 51 from the temporary stop target position to the standby position (hereinafter referred to as “second return control command”) to the drive unit 60 . The driving unit 60 stops after moving the moving body 51 in response to the second control command of the return stroke (refer to (b) of FIG. 11 ). From the above, the peripheral edge removal processing program ends. By executing the peripheral edge removal processing program, the peripheral edge portion of the coating film F1 (the coating film formed in the above steps S03 and S04 ) on the surface Wa is removed.

[Effect of this embodiment]

As described above, the coating/developing device 2 includes: the removal liquid supply unit 50 having the removal liquid nozzle 52 for spraying the removal liquid to the peripheral portion of the wafer W; 51 moves; the sensor 70 detects information about the position of the moving body 51; the control unit 100 is configured to execute the following steps: disposing the moving body 51 from the removing liquid nozzle 52 outside the periphery Wc of the wafer W; The first position P1 is moved to the control command of the second position P2 where the removal liquid nozzle 52 is arranged on the peripheral portion of the wafer W, and is output to the drive unit 60; and according to the moving body 51 from the first position P1 to the second position P2 The relationship between the information detected by the sensor 70 and the control command during the movement of the mobile body 51 is used to modify the control command so as to reduce the deviation between the end position of the moving body 51 and the second position P2.

According to this coating/developing device 2, information about the position of the moving body 51 is detected during the movement of the moving body 51, and the control command is corrected based on the information, whereby the movement end position and the second position of the moving body 51 can be narrowed down. Set the deviation of P2. In addition, according to the method based on the relationship between the information on the position of the moving body 51 and the control command, it is not necessary to arrange the sensor 70 on the moving body 51 itself as in the method of detecting the periphery Wc of the wafer W, so it is possible to avoid, for example, the detection of The enlargement of the mobile body 51 due to the arrangement of the device 70 and the like. In addition, based on the relationship between the information on the position of the movable body 51 and the control command, it is possible to correct the control command at any point of time without detecting the peripheral edge Wc of the wafer W or the like. Therefore, the coating/developing device 2 can effectively improve the accuracy of the supply position of the removal liquid to the peripheral portion of the wafer W.

Fig. 12 is an illustration of the relationship between the number of operations and the amount of deviation from the target position. The "deviation amount calculated from the target position" refers to the deviation between the movement end position of the mobile body 51 obtained in response to the outbound control command and the removed target position. The dotted line in the graph indicates the amount of deviation from the target position when no correction of the control command executed by the control command correction unit 117 is performed. The solid line in the graph represents the amount of deviation from the target position when the control command executed by the control command correcting unit 117 is corrected.

The deviation shown by the dotted line greatly exceeds the range of the upper limit UL and the lower limit LL when the number of operations is small, and gradually converges to the range of the upper limit UL and the lower limit LL as the number of operations increases Inside. We think that this is due to the slow and steady elongation of the conveyor belt 64 . However, even after converging within the range of the upper limit value UL and the lower limit value LL, the amount of deviation shown by the dotted line reaches a value close to the lower limit value LL many times. We think that this is due to the influence of the backlash of the speed reducer 63 and the like after the elongation of the conveyor belt 64 is confirmed to be stable. On the other hand, the deviation shown by the solid line has enough margin to converge within the range of the upper limit UL and the lower limit LL even when the number of operations is small. same. In this way, the correction of the control command by the control command correction unit 117 can effectively improve the accuracy of the supply position of the processing liquid to the peripheral portion of the substrate.

The control unit 100 may also be configured to further perform the following steps: control the driving unit 60 so that the moving body 51 temporarily moves from the first position P1 to the second position P2 before the removal liquid nozzle 52 reaches the periphery Wc of the wafer W. stop, and when the movement of the mobile body 51 from the first position P1 to the second position P2 temporarily stops, the control command is corrected according to the information detected by the sensor 70 . In this case, before the removal liquid nozzle 52 reaches the peripheral portion of the wafer W, the control command can be corrected with a margin.

The control unit 100 may be configured to further execute the step of controlling the removal liquid supply unit 50 so that the removal liquid is sprayed from the removal liquid nozzle 52 when the movement of the moving body 51 from the first position P1 to the second position P2 is temporarily stopped. In this case, the ejection of the removal liquid is started at the timing of the temporary stop, and it is possible to suppress the particles contained in the removal liquid from adhering to the wafer W at the start of the ejection.

The control unit 100 may also be configured to sense the time after the elapse of the standby time for attenuating the vibration of the mobile body 51 after the period in which the movement of the mobile body 51 from the first position P1 to the second position P2 is temporarily stopped. The information detected by the device 70 is used to modify the control instruction. In this case, it is possible to suppress a reduction in the accuracy of the supply position of the removal liquid due to a difference in information detected by the sensor 70 .

The control unit 100 may also be configured to further execute the step of adjusting the correction amount of the control command according to the deviation between the movement end position of the moving body 51 obtained in response to the corrected control command and the second position P2. In this case, the deviation between the movement end position of the moving body 51 and the second position P2 can be further reduced.

[modified example]

The control unit 100 may also be configured such that, after the period in which the movement of the moving body 51 from the first position P1 to the second position P2 is temporarily stopped, it is derived by the sensor during a predetermined period longer than the vibration cycle of the moving body 51. 70 Statistical value of the detected information, and modify the control command according to the statistical value. In this case, the The accuracy of the supply position of the removal liquid is reduced due to the difference in position information. Hereinafter, the peripheral edge removal processing program executed by the control unit 100 configured in this way will be specifically exemplified. As shown in FIG. 13 , the control unit 100 first executes step S41. In step S41 , similar to step S21 , the removing liquid nozzle movement control unit 114 outputs the above-mentioned forward first control command to the drive unit 60 .

Next, the control unit 100 executes steps S42 and S43. In step S42 , the control command modification unit 117 acquires information detected by the sensor 70 . In step S43 , the control command correction unit 117 checks whether or not the data collection period set in advance to be longer than the vibration period of the mobile body 51 has elapsed. In step S43, when it is determined that the data collection period has not passed, the control unit 100 returns the process to step S42. Afterwards, the information detected by the sensor 70 is repeatedly obtained until the data collection period passes.

In step S43, when it is determined that the data collection period has passed, the control unit 100 executes step S44. In step S44 , the control instruction modifying unit 117 derives a statistical value (for example, an average value) of the information detected by the sensor 70 in step S42 .

Next, the control unit 100 executes step S45. In step S45, the control instruction modification unit 117 modifies the outbound control instruction according to the relationship between the statistical value derived in step S44 and the first outbound control instruction, so as to reduce the deviation between the moving end position of the mobile body 51 and the removal target position. The specific processing content of step S45 is the same as the above step S24 except that the above statistical value is used as the point of information detected by the sensor 70 .

Next, the control unit 100 sequentially executes steps S46, S47, and S48 that are the same as steps S25, S26, and S27. In step S46 , the removal liquid supply control unit 113 controls the removal liquid supply unit 50 so as to start supply of the removal liquid L2 from the removal liquid source 53 to the removal liquid nozzle 52 . In step S47, the remover nozzle movement control unit 114 Stand by to wait for the simulated spraying time set in advance to pass. In step S48 , output the outbound second control command corrected in step S45 to the drive unit 60 .

As shown in FIG. 14 , the control unit 100 then executes steps S51 and S52. In step S51 , the control instruction modification unit 117 acquires information detected by the sensor 70 . In step S52 , the control command correction unit 117 checks whether or not the data collection period set in advance to be longer than the vibration period of the mobile body 51 has elapsed. In step S52, when it is determined that the data collection period has not passed, the control unit 100 returns the process to step S52. Afterwards, the information detected by the sensor 70 is repeatedly obtained until the data collection period passes.

In step S52, when it is determined that the data collection period has passed, the control unit 100 executes step S53. In step S53 , the control instruction modifying unit 117 derives a statistical value (for example, an average value) of the information detected by the sensor 70 in step S52 .

Next, the control unit 100 executes step S54. In step S54, the correction amount adjustment unit 118 adjusts the next step and subsequent steps based on the deviation between the position of the mobile body 51 obtained based on the statistical value derived in step S53 (hereinafter referred to as "current position") and the removed target position. The correction amount of the control command in S45. The specific processing content of step S54 is the same as the above step S33 except that the above statistical value is used as the point of information detected by the sensor 70 .

Next, the control unit 100 sequentially executes steps S55 , S56 , and S57 that are the same as steps S34 , S35 , and S36 . In step S55 , the removing liquid nozzle movement control unit 114 outputs the above-mentioned return first control command to the driving unit 60 . In step S56 , the removal liquid supply control unit 113 controls the removal liquid supply unit 50 so as to stop the supply of the removal liquid L2 from the removal liquid source 53 to the removal liquid nozzle 52 . In step S57, the removal liquid nozzle movement control The part 114 outputs the above-mentioned backhaul second control command to the drive part 60 . From the above, the peripheral edge removal processing program ends.

The control unit may be configured so that the movement of the moving body 51 between the standby position and the removal target position does not temporarily stop. Hereinafter, the peripheral edge removal processing program executed by the control unit 100 configured in this way will be specifically exemplified.

As shown in FIG. 15 , the control unit 100 first executes steps S61 and S62 in sequence. In step S61 , the removal liquid nozzle movement control unit 114 controls the driving unit 60 according to the forward stroke control command, so as to start moving the moving body 51 from the standby position to the removal target position. In step S62 , the removal liquid supply control unit 113 waits for the progress of the control of the drive unit 60 for moving the moving body 51 to reach a predetermined discharge start stage. The discharge start stage is, for example, a stage in which the output of a control command (hereinafter referred to as "the first outbound control command") for moving the mobile body 51 to a preset discharge start position is completed.

Next, the control unit 100 sequentially executes steps S63, S64, and S65 that are the same as steps S23, S24, and S25. In step S63 , the control command modification unit 117 obtains the information detected by the sensor 70 . In step S64, the control instruction modifying unit 117 modifies the outbound control instruction according to the relationship between the information obtained in step S63 and the first outbound control instruction, so as to reduce the deviation between the moving end position of the mobile body 51 and the removal target position. In step S65 , the removal liquid supply control unit 113 controls the removal liquid supply unit 50 so as to start supply of the removal liquid L2 from the removal liquid source 53 to the removal liquid nozzle 52 .

Next, the control unit 100 executes steps S66 and S67 in sequence. In step S66, the removal liquid nozzle movement control part 114 waits for progress of the control of the drive part 60 for moving the moving body 51 to reach the preset movement stop stage. The mobile stop stage is the step S64 of the amended outgoing control command. The stage at which the output ends. In step S67, the removal liquid supply control unit 113 controls the drive unit 60 so that the movement of the moving body 51 is stopped.

As shown in FIG. 16 , the control unit 100 then sequentially executes steps S71 and S72 that are the same as steps S32 and S33 . In step S71 , the correction amount adjustment unit 118 acquires information detected by the sensor 70 . In step S72, the correction amount adjustment unit 118 adjusts the correction amount of the control command in the next and subsequent steps S64 based on the deviation between the position of the moving body 51 obtained based on the information acquired in step S71 and the removal target position.

Next, the control unit 100 executes steps S73, S74, S75, S76, and S77 in sequence. In step S73 , the removal liquid nozzle movement control unit 114 controls the drive unit 60 according to the return stroke control command, so as to start moving the moving body 51 from the removal target position to the standby position. In step S74 , the removal liquid supply control unit 113 waits for the progress of the control of the drive unit 60 for moving the movable body 51 to reach the predetermined discharge stop stage. The discharge stop stage is, for example, a stage in which the output of a control command (hereinafter referred to as "return first control command") for moving the mobile body 51 to a preset discharge stop position is completed. In step S75 , the removal liquid supply control unit 113 controls the removal liquid supply unit 50 so as to stop the supply of the removal liquid L2 from the removal liquid source 53 to the removal liquid nozzle 52 . In step S76, the removal liquid nozzle movement control part 114 waits for progress of the control of the drive part 60 for moving the moving body 51 to reach the preset movement stop stage. The movement stop phase is the phase in which the output of the return control command is completed. In step S77 , the removal liquid nozzle movement control unit 114 controls the drive unit 60 so that the movement of the moving body 51 is stopped. From the above, the peripheral edge removal processing program ends.

As mentioned above, although embodiment was demonstrated, this invention is not necessarily limited to the said embodiment, In the range which does not deviate from the summary, various changes are possible. The process of supplying the processing liquid to the peripheral portion of the substrate is not limited to the process of supplying the above-mentioned removal liquid to the peripheral portion of the substrate. Supply the processing liquid to the peripheral part of the substrate The processing may be a process of supplying a coating liquid to the peripheral portion of the substrate to form a coating on the peripheral portion of the substrate. The substrate to be processed is not limited to a semiconductor wafer, and may be, for example, a glass substrate, a photomask substrate, an FPD (Flat Panel Display: flat panel display), and the like.

20: Rotation holding part

21: Keeping Department

22: Rotary drive unit

30: Coating liquid supply part

31: Moving body

32: Coating liquid nozzle

33: Coating liquid source

40: Drive Department

41: power source

42: Communication agency

43: reducer

44: Confirm the conveyor belt

50: Removal liquid supply part (liquid supply part)

51: Moving body

52: Remover nozzle (nozzle)

53: Remove the liquid source

60: drive unit

61: power source

62: Communication agency

63: reducer

64: Confirm the conveyor belt

70: sensor

100: Control Department

111: Coating solution supply control unit

112: Coating liquid nozzle movement control unit

113: Removal liquid supply control part

114: Remover nozzle movement control unit

116: Control instruction holding unit

117: Control Command Correction Department

118: Correction amount adjustment department

119:Rotary control unit

CL1: Center of rotation

P1: first position

P2: second position

U1: coating unit

W: wafer (substrate)

Wa: surface

Wc: Perimeter

Claims (13)

A substrate processing apparatus comprising: a liquid supply unit having a nozzle for spraying a treatment liquid to a peripheral portion of a substrate; a drive unit for moving a moving body including the nozzle; a sensor for detecting information on the position of the moving body and a control unit that executes the following steps: a control command for moving the moving body from a first position where the nozzle is disposed outside the periphery of the substrate to a second position where the nozzle is disposed on the periphery of the substrate, output to the drive unit; control the drive unit so that the movement of the moving body from the first position to the second position is temporarily stopped before the nozzle reaches the periphery of the substrate; and according to the movement of the moving body from the Correcting the relationship between the information detected by the sensor and the control command when the moving object temporarily stops moving from the first position to the second position during the movement from the first position to the second position. A control command is used to reduce the deviation between the moving end position of the mobile body and the second position. The substrate processing apparatus according to claim 1 of the scope of the patent application, wherein the control part further executes the following steps: controlling the liquid supply part so that when the moving body temporarily stops moving from the first position to the second position, The treatment liquid is sprayed from the nozzle. The substrate processing apparatus according to claim 1 or 2 of the scope of the patent application, wherein, after the period in which the movement of the moving body from the first position to the second position is temporarily stopped, the control unit, based on the After the vibration attenuation standby time passes, the information detected by the sensor is used to modify the control command. As for the substrate processing device in claim 1 or 2 of the scope of the patent application, wherein, The control unit derives the signal detected by the sensor during a predetermined period longer than the vibration period of the mobile body after the movement of the mobile body from the first position to the second position is temporarily stopped. A statistical value of the information, and modify the control instruction according to the statistical value. The substrate processing apparatus according to claim 1 or 2 of the scope of the patent application, wherein the control unit further executes the following steps: according to the deviation between the movement end position of the moving body and the second position obtained according to the corrected control command , to adjust the correction amount of the control command. A substrate processing apparatus comprising: a liquid supply unit having a nozzle for spraying a treatment liquid to a peripheral portion of a substrate; a drive unit for moving a moving body including the nozzle; a sensor for detecting information on the position of the moving body and a control unit that executes the following steps: a control command for moving the moving body from a first position where the nozzle is disposed outside the periphery of the substrate to a second position where the nozzle is disposed on the periphery of the substrate, output to the driving part; according to the relationship between the information detected by the sensor and the control command during the movement of the mobile body from the first position to the second position, the control command is corrected so as to reduce the The deviation between the moving end position of the mobile body and the second position; and adjusting the correction amount of the control command according to the deviation between the moving end position of the mobile body and the second position obtained according to the corrected control command. A method for processing a substrate, comprising the steps of: controlling a drive unit so that a moving body including a nozzle for spraying a processing liquid on a peripheral portion of a substrate moves from a first position where the nozzle is disposed outside the peripheral edge of the substrate to the nozzle is disposed at a second position on the peripheral portion of the substrate; temporarily stopping the movement of the moving body from the first position to the second position before the nozzle reaches the periphery of the substrate; The relationship between the information on the position of the mobile body detected when the movement of the mobile body from the first position to the second position is temporarily stopped and the control command to the drive part is corrected so that the control command to the drive part is corrected. The deviation between the movement end position of the mobile body and the second position is reduced. The substrate processing method according to item 7 of the scope of the patent application further includes the following step: spraying the processing liquid from the nozzle when the movement of the moving body from the first position to the second position is temporarily stopped. The substrate processing method according to claim 7 or 8 of the patent claims, wherein after the period in which the movement of the moving body from the first position to the second position is temporarily stopped, the method for attenuating the vibration of the moving body The information detected after the standby time has elapsed is used to modify the control command. The substrate processing method according to claim 7 or 8 of the scope of the patent application, wherein after the period in which the movement of the moving body from the first position to the second position is temporarily stopped, it is derived at a period longer than the vibration period of the moving body The statistical value of the information detected in the predetermined period, and the control instruction is corrected according to the statistical value. For example, the substrate processing method in item 7 or 8 of the scope of the patent application further includes the following steps: adjusting the control command according to the deviation between the moving end position of the moving body and the second position obtained according to the corrected control command correction amount. A method for processing a substrate, comprising the steps of: controlling a drive unit so that a moving body including a nozzle for spraying a processing liquid on a peripheral portion of a substrate moves from a first position where the nozzle is disposed outside the peripheral edge of the substrate to The nozzle is arranged at a second position on the peripheral portion of the substrate; according to the information about the position of the moving body detected during the movement of the moving body from the first position to the second position and the driving part The relationship between the control command, modifying the control command of the drive unit, so as to reduce the deviation between the end position of the moving body and the second position; and the end position of the moving body obtained according to the corrected control command The deviation from the second position is used to adjust the correction amount of the control command. A computer-readable recording medium, which records a program for enabling a device to execute the substrate processing method according to any one of items 7-12 of the patent application scope.

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