TWI787420B - 研磨墊 - Google Patents

研磨墊 Download PDF

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Publication number
TWI787420B
TWI787420B TW107146763A TW107146763A TWI787420B TW I787420 B TWI787420 B TW I787420B TW 107146763 A TW107146763 A TW 107146763A TW 107146763 A TW107146763 A TW 107146763A TW I787420 B TWI787420 B TW I787420B
Authority
TW
Taiwan
Prior art keywords
mass
polyol
polishing pad
polishing
less
Prior art date
Application number
TW107146763A
Other languages
English (en)
Chinese (zh)
Other versions
TW201930382A (zh
Inventor
小田善之
柴雄一郎
Original Assignee
日商Ｄｉｃ股份有限公司
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Filing date
Publication date
Application filed by 日商Ｄｉｃ股份有限公司 filed Critical 日商Ｄｉｃ股份有限公司
Publication of TW201930382A publication Critical patent/TW201930382A/zh
Application granted granted Critical
Publication of TWI787420B publication Critical patent/TWI787420B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6666—Compounds of group C08G18/48 or C08G18/52
    • C08G18/667—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/6674—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6666—Compounds of group C08G18/48 or C08G18/52
    • C08G18/667—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/6681—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/32 or C08G18/3271 and/or polyamines of C08G18/38
    • C08G18/6685—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/32 or C08G18/3271 and/or polyamines of C08G18/38 with compounds of group C08G18/3225 or polyamines of C08G18/38

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW107146763A 2017-12-26 2018-12-24 研磨墊 TWI787420B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-249395 2017-12-26
JP2017249395 2017-12-26

Publications (2)

Publication Number Publication Date
TW201930382A TW201930382A (zh) 2019-08-01
TWI787420B true TWI787420B (zh) 2022-12-21

Family

ID=67023375

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107146763A TWI787420B (zh) 2017-12-26 2018-12-24 研磨墊

Country Status (3)

Country Link
JP (1) JP7259311B2 (ja)
CN (1) CN109957088B (ja)
TW (1) TWI787420B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102287235B1 (ko) * 2019-10-30 2021-08-06 에스케이씨솔믹스 주식회사 가교도가 조절된 연마패드 및 이의 제조방법
JP7484208B2 (ja) * 2020-02-14 2024-05-16 Dic株式会社 ウレタン樹脂組成物、及び、多孔体の製造方法
EP3978190A1 (en) * 2020-09-29 2022-04-06 SKC Solmics Co., Ltd. Polishing pad and method of fabricating semiconductor device using the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201704340A (zh) * 2015-04-03 2017-02-01 Fujibo Holdings Inc 研磨墊及其製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003062748A (ja) * 2001-08-24 2003-03-05 Inoac Corp 研磨用パッド
KR100845481B1 (ko) * 2001-11-13 2008-07-10 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
JP3570681B2 (ja) * 2001-12-10 2004-09-29 東洋ゴム工業株式会社 研磨パッド
JP5008927B2 (ja) * 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
JP5389448B2 (ja) * 2007-03-20 2014-01-15 株式会社クラレ 金属膜研磨用パッドおよびそれを用いる金属膜の研磨方法
SG189457A1 (en) * 2010-10-26 2013-05-31 Toyo Tire & Rubber Co Polishing pad and method for producing same
JP5945874B2 (ja) * 2011-10-18 2016-07-05 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP5661129B2 (ja) * 2013-01-29 2015-01-28 東洋ゴム工業株式会社 研磨パッド
KR101791453B1 (ko) * 2013-09-04 2017-10-30 디아이씨 가부시끼가이샤 발포 우레탄 조성물 및 범프 쿠션
JP6315246B2 (ja) * 2014-03-31 2018-04-25 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
US9731398B2 (en) * 2014-08-22 2017-08-15 Rohm And Haas Electronic Materials Cmp Holding, Inc. Polyurethane polishing pad
KR102398130B1 (ko) * 2014-10-31 2022-05-13 주식회사 쿠라레 연마층용 비다공성 성형체, 연마 패드 및 연마 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201704340A (zh) * 2015-04-03 2017-02-01 Fujibo Holdings Inc 研磨墊及其製造方法

Also Published As

Publication number Publication date
TW201930382A (zh) 2019-08-01
CN109957088A (zh) 2019-07-02
JP7259311B2 (ja) 2023-04-18
JP2019116616A (ja) 2019-07-18
CN109957088B (zh) 2022-04-26

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