TWI787420B - 研磨墊 - Google Patents
研磨墊 Download PDFInfo
- Publication number
- TWI787420B TWI787420B TW107146763A TW107146763A TWI787420B TW I787420 B TWI787420 B TW I787420B TW 107146763 A TW107146763 A TW 107146763A TW 107146763 A TW107146763 A TW 107146763A TW I787420 B TWI787420 B TW I787420B
- Authority
- TW
- Taiwan
- Prior art keywords
- mass
- polyol
- polishing pad
- polishing
- less
- Prior art date
Links
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
- C08G18/6666—Compounds of group C08G18/48 or C08G18/52
- C08G18/667—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
- C08G18/6674—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
- C08G18/6666—Compounds of group C08G18/48 or C08G18/52
- C08G18/667—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
- C08G18/6681—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/32 or C08G18/3271 and/or polyamines of C08G18/38
- C08G18/6685—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/32 or C08G18/3271 and/or polyamines of C08G18/38 with compounds of group C08G18/3225 or polyamines of C08G18/38
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Polyurethanes Or Polyureas (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017-249395 | 2017-12-26 | ||
JP2017249395 | 2017-12-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201930382A TW201930382A (zh) | 2019-08-01 |
TWI787420B true TWI787420B (zh) | 2022-12-21 |
Family
ID=67023375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107146763A TWI787420B (zh) | 2017-12-26 | 2018-12-24 | 研磨墊 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7259311B2 (ja) |
CN (1) | CN109957088B (ja) |
TW (1) | TWI787420B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102287235B1 (ko) * | 2019-10-30 | 2021-08-06 | 에스케이씨솔믹스 주식회사 | 가교도가 조절된 연마패드 및 이의 제조방법 |
JP7484208B2 (ja) * | 2020-02-14 | 2024-05-16 | Dic株式会社 | ウレタン樹脂組成物、及び、多孔体の製造方法 |
EP3978190A1 (en) * | 2020-09-29 | 2022-04-06 | SKC Solmics Co., Ltd. | Polishing pad and method of fabricating semiconductor device using the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201704340A (zh) * | 2015-04-03 | 2017-02-01 | Fujibo Holdings Inc | 研磨墊及其製造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003062748A (ja) * | 2001-08-24 | 2003-03-05 | Inoac Corp | 研磨用パッド |
KR100845481B1 (ko) * | 2001-11-13 | 2008-07-10 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 그 제조 방법 |
JP3570681B2 (ja) * | 2001-12-10 | 2004-09-29 | 東洋ゴム工業株式会社 | 研磨パッド |
JP5008927B2 (ja) * | 2006-08-31 | 2012-08-22 | 東洋ゴム工業株式会社 | 研磨パッド |
JP5389448B2 (ja) * | 2007-03-20 | 2014-01-15 | 株式会社クラレ | 金属膜研磨用パッドおよびそれを用いる金属膜の研磨方法 |
SG189457A1 (en) * | 2010-10-26 | 2013-05-31 | Toyo Tire & Rubber Co | Polishing pad and method for producing same |
JP5945874B2 (ja) * | 2011-10-18 | 2016-07-05 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
JP5661129B2 (ja) * | 2013-01-29 | 2015-01-28 | 東洋ゴム工業株式会社 | 研磨パッド |
KR101791453B1 (ko) * | 2013-09-04 | 2017-10-30 | 디아이씨 가부시끼가이샤 | 발포 우레탄 조성물 및 범프 쿠션 |
JP6315246B2 (ja) * | 2014-03-31 | 2018-04-25 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
US9731398B2 (en) * | 2014-08-22 | 2017-08-15 | Rohm And Haas Electronic Materials Cmp Holding, Inc. | Polyurethane polishing pad |
KR102398130B1 (ko) * | 2014-10-31 | 2022-05-13 | 주식회사 쿠라레 | 연마층용 비다공성 성형체, 연마 패드 및 연마 방법 |
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2018
- 2018-12-17 JP JP2018235416A patent/JP7259311B2/ja active Active
- 2018-12-24 TW TW107146763A patent/TWI787420B/zh active
- 2018-12-24 CN CN201811581083.2A patent/CN109957088B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201704340A (zh) * | 2015-04-03 | 2017-02-01 | Fujibo Holdings Inc | 研磨墊及其製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201930382A (zh) | 2019-08-01 |
CN109957088A (zh) | 2019-07-02 |
JP7259311B2 (ja) | 2023-04-18 |
JP2019116616A (ja) | 2019-07-18 |
CN109957088B (zh) | 2022-04-26 |
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