TWI786165B - 保護片材及附保護片材之積層體 - Google Patents

保護片材及附保護片材之積層體 Download PDF

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Publication number
TWI786165B
TWI786165B TW107128404A TW107128404A TWI786165B TW I786165 B TWI786165 B TW I786165B TW 107128404 A TW107128404 A TW 107128404A TW 107128404 A TW107128404 A TW 107128404A TW I786165 B TWI786165 B TW I786165B
Authority
TW
Taiwan
Prior art keywords
adhesive layer
protective sheet
mentioned
fluororesin
protected
Prior art date
Application number
TW107128404A
Other languages
English (en)
Chinese (zh)
Other versions
TW201912407A (zh
Inventor
降旗涉
井上真邦
村上由夏
長塚保則
櫻山隆夫
伊藤弘幸
谷口貴久
Original Assignee
日商大日本印刷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商大日本印刷股份有限公司 filed Critical 日商大日本印刷股份有限公司
Publication of TW201912407A publication Critical patent/TW201912407A/zh
Application granted granted Critical
Publication of TWI786165B publication Critical patent/TWI786165B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09J201/04—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing halogen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Materials For Medical Uses (AREA)
TW107128404A 2017-08-24 2018-08-15 保護片材及附保護片材之積層體 TWI786165B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017161243A JP6693487B2 (ja) 2017-08-24 2017-08-24 保護シートおよび保護シート付積層体
JP2017-161243 2017-08-24

Publications (2)

Publication Number Publication Date
TW201912407A TW201912407A (zh) 2019-04-01
TWI786165B true TWI786165B (zh) 2022-12-11

Family

ID=65440090

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107128404A TWI786165B (zh) 2017-08-24 2018-08-15 保護片材及附保護片材之積層體

Country Status (3)

Country Link
JP (1) JP6693487B2 (enExample)
TW (1) TWI786165B (enExample)
WO (1) WO2019039340A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113574083B (zh) * 2019-03-20 2025-06-10 积水化学工业株式会社 粘合剂组合物、粘合带及电子部件的处理方法
JP7136388B1 (ja) * 2020-10-01 2022-09-13 Dic株式会社 粘着剤組成物、及びこれを用いた積層フィルム
KR102376882B1 (ko) * 2021-02-10 2022-03-21 (주)이녹스첨단소재 디스플레이용 점착 시트

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003073629A (ja) * 2001-09-03 2003-03-12 Somar Corp 粘着組成物及び粘着シート
JP2011184603A (ja) * 2010-03-10 2011-09-22 Furukawa Electric Co Ltd:The 粘着テープおよび半導体加工用テープ
JP2016044186A (ja) * 2014-08-19 2016-04-04 リンテック株式会社 表面保護フィルム
JP2017019158A (ja) * 2015-07-09 2017-01-26 三菱樹脂株式会社 積層フィルム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10120994A (ja) * 1996-10-23 1998-05-12 Sekisui Chem Co Ltd 硬化型粘接着シート及び部材の接合方法
JP4676297B2 (ja) * 2005-01-24 2011-04-27 電気化学工業株式会社 粘着剤、それを用いた粘着シート、及び粘着シートを用いた電子部品製造方法。
JP4538398B2 (ja) * 2005-10-31 2010-09-08 株式会社巴川製紙所 半導体装置製造用接着シート及び半導体装置の製造方法
JP2008138130A (ja) * 2006-12-05 2008-06-19 Nitto Denko Corp 光硬化型粘着テープ又はシートの製造方法、及び光硬化型粘着テープ又はシート
TWI461501B (zh) * 2010-12-20 2014-11-21 漢高智慧財產控股公司 光可固化切割黏晶膠帶
JP5945438B2 (ja) * 2012-03-26 2016-07-05 リンテック株式会社 ダイシングシート
JP5998762B2 (ja) * 2012-09-03 2016-09-28 大日本印刷株式会社 粘着剤組成物及び粘着テープ
WO2017150290A1 (ja) * 2016-03-04 2017-09-08 日東電工株式会社 表面保護フィルム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003073629A (ja) * 2001-09-03 2003-03-12 Somar Corp 粘着組成物及び粘着シート
JP2011184603A (ja) * 2010-03-10 2011-09-22 Furukawa Electric Co Ltd:The 粘着テープおよび半導体加工用テープ
JP2016044186A (ja) * 2014-08-19 2016-04-04 リンテック株式会社 表面保護フィルム
JP2017019158A (ja) * 2015-07-09 2017-01-26 三菱樹脂株式会社 積層フィルム

Also Published As

Publication number Publication date
TW201912407A (zh) 2019-04-01
JP2019038922A (ja) 2019-03-14
JP6693487B2 (ja) 2020-05-13
WO2019039340A1 (ja) 2019-02-28

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