TWI782572B - ＳｎＺｎ銲料及其製造方法 - Google Patents

ＳｎＺｎ銲料及其製造方法 Download PDF

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Publication number
TWI782572B
TWI782572B TW110121193A TW110121193A TWI782572B TW I782572 B TWI782572 B TW I782572B TW 110121193 A TW110121193 A TW 110121193A TW 110121193 A TW110121193 A TW 110121193A TW I782572 B TWI782572 B TW I782572B
Authority
TW
Taiwan
Prior art keywords
ammonium chloride
chloride hydrate
solder
snzn
snzn solder
Prior art date
Application number
TW110121193A
Other languages
English (en)
Chinese (zh)
Other versions
TW202206613A (zh
Inventor
岡田守弘
新井傑也
菅原美愛子
小林賢一
小宮秀利
松井正五
錦織潤
森尚久
Original Assignee
日商亞特比目有限公司
岡田守弘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商亞特比目有限公司, 岡田守弘 filed Critical 日商亞特比目有限公司
Publication of TW202206613A publication Critical patent/TW202206613A/zh
Application granted granted Critical
Publication of TWI782572B publication Critical patent/TWI782572B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
TW110121193A 2020-06-16 2021-06-10 ＳｎＺｎ銲料及其製造方法 TWI782572B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020-103717 2020-06-16
JP2020103717 2020-06-16
JP2021-085447 2021-05-20
JP2021085447 2021-05-20

Publications (2)

Publication Number Publication Date
TW202206613A TW202206613A (zh) 2022-02-16
TWI782572B true TWI782572B (zh) 2022-11-01

Family

ID=79267825

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110121193A TWI782572B (zh) 2020-06-16 2021-06-10 ＳｎＺｎ銲料及其製造方法

Country Status (3)

Country Link
JP (1) JPWO2021256172A1 (https=)
TW (1) TWI782572B (https=)
WO (1) WO2021256172A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114799612B (zh) * 2022-05-27 2024-06-21 常州时创能源股份有限公司 一种光伏用钎焊焊料、其制备方法及应用
CN116060822B (zh) * 2023-02-22 2025-06-13 中国机械总院集团宁波智能机床研究院有限公司 一种自钎软钎料及其制备方法和应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003010996A (ja) * 2001-06-27 2003-01-15 Nippon Filler Metals Co Ltd 鉛フリーソルダペースト
CN1861311A (zh) * 2006-04-30 2006-11-15 北京市航天焊接材料厂 无铅抗氧化含稀土SnZn合金焊料及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58100995A (ja) * 1981-12-10 1983-06-15 Hitachi Ltd 低融点ろう材とその使用方法
CN1087994C (zh) * 1995-09-29 2002-07-24 松下电器产业株式会社 无铅钎料合金
JPH09155587A (ja) * 1995-11-30 1997-06-17 Mitsui Mining & Smelting Co Ltd 錫−亜鉛系無鉛半田合金
US5863493A (en) * 1996-12-16 1999-01-26 Ford Motor Company Lead-free solder compositions
WO2003061896A1 (en) * 2002-01-21 2003-07-31 Fujitsu Limited Solder alloy and soldered joint
US20090098012A1 (en) * 2005-07-01 2009-04-16 Nippon Mining & Metals Co., Ltd. High-Purity Tin or Tin Alloy and Process for Producing High-Purity Tin
CN101092006A (zh) * 2006-06-21 2007-12-26 北京有色金属研究总院 一种微合金化锡锌共晶合金无铅焊料
JP2018111872A (ja) * 2017-01-13 2018-07-19 古河電気工業株式会社 金属接合用材料、及び接合構造体
WO2018159306A1 (ja) * 2017-02-28 2018-09-07 アートビーム有限会社 太陽電池および太陽電池の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003010996A (ja) * 2001-06-27 2003-01-15 Nippon Filler Metals Co Ltd 鉛フリーソルダペースト
CN1861311A (zh) * 2006-04-30 2006-11-15 北京市航天焊接材料厂 无铅抗氧化含稀土SnZn合金焊料及其制备方法

Also Published As

Publication number Publication date
WO2021256172A1 (ja) 2021-12-23
JPWO2021256172A1 (https=) 2021-12-23
TW202206613A (zh) 2022-02-16

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