JPWO2021256172A1 - - Google Patents

Info

Publication number
JPWO2021256172A1
JPWO2021256172A1 JP2022532421A JP2022532421A JPWO2021256172A1 JP WO2021256172 A1 JPWO2021256172 A1 JP WO2021256172A1 JP 2022532421 A JP2022532421 A JP 2022532421A JP 2022532421 A JP2022532421 A JP 2022532421A JP WO2021256172 A1 JPWO2021256172 A1 JP WO2021256172A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022532421A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021256172A1 publication Critical patent/JPWO2021256172A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
JP2022532421A 2020-06-16 2021-05-21 Pending JPWO2021256172A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020103717 2020-06-16
JP2021085447 2021-05-20
PCT/JP2021/019414 WO2021256172A1 (ja) 2020-06-16 2021-05-21 ＳｎＺｎ半田およびその製造方法

Publications (1)

Publication Number Publication Date
JPWO2021256172A1 true JPWO2021256172A1 (https=) 2021-12-23

Family

ID=79267825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022532421A Pending JPWO2021256172A1 (https=) 2020-06-16 2021-05-21

Country Status (3)

Country Link
JP (1) JPWO2021256172A1 (https=)
TW (1) TWI782572B (https=)
WO (1) WO2021256172A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114799612B (zh) * 2022-05-27 2024-06-21 常州时创能源股份有限公司 一种光伏用钎焊焊料、其制备方法及应用
CN116060822B (zh) * 2023-02-22 2025-06-13 中国机械总院集团宁波智能机床研究院有限公司 一种自钎软钎料及其制备方法和应用

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6340639B2 (https=) * 1981-12-10 1988-08-11 Hitachi Ltd
WO1997012719A1 (en) * 1995-09-29 1997-04-10 Matsushita Electric Industrial Co., Ltd. Lead-free solder
JPH09155587A (ja) * 1995-11-30 1997-06-17 Mitsui Mining & Smelting Co Ltd 錫−亜鉛系無鉛半田合金
JPH10193172A (ja) * 1996-12-16 1998-07-28 Ford Motor Co 鉛を含まない鑞組成物
WO2003061896A1 (en) * 2002-01-21 2003-07-31 Fujitsu Limited Solder alloy and soldered joint
WO2007004394A1 (ja) * 2005-07-01 2007-01-11 Nippon Mining & Metals Co., Ltd. 高純度錫又は錫合金及び高純度錫の製造方法
CN101092006A (zh) * 2006-06-21 2007-12-26 北京有色金属研究总院 一种微合金化锡锌共晶合金无铅焊料
JP2018111872A (ja) * 2017-01-13 2018-07-19 古河電気工業株式会社 金属接合用材料、及び接合構造体
WO2018159306A1 (ja) * 2017-02-28 2018-09-07 アートビーム有限会社 太陽電池および太陽電池の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003010996A (ja) * 2001-06-27 2003-01-15 Nippon Filler Metals Co Ltd 鉛フリーソルダペースト
CN100462183C (zh) * 2006-04-30 2009-02-18 东莞市中实焊锡有限公司 无铅抗氧化含稀土SnZn合金焊料及其制备方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6340639B2 (https=) * 1981-12-10 1988-08-11 Hitachi Ltd
WO1997012719A1 (en) * 1995-09-29 1997-04-10 Matsushita Electric Industrial Co., Ltd. Lead-free solder
JPH09155587A (ja) * 1995-11-30 1997-06-17 Mitsui Mining & Smelting Co Ltd 錫−亜鉛系無鉛半田合金
JPH10193172A (ja) * 1996-12-16 1998-07-28 Ford Motor Co 鉛を含まない鑞組成物
WO2003061896A1 (en) * 2002-01-21 2003-07-31 Fujitsu Limited Solder alloy and soldered joint
WO2007004394A1 (ja) * 2005-07-01 2007-01-11 Nippon Mining & Metals Co., Ltd. 高純度錫又は錫合金及び高純度錫の製造方法
CN101092006A (zh) * 2006-06-21 2007-12-26 北京有色金属研究总院 一种微合金化锡锌共晶合金无铅焊料
JP2018111872A (ja) * 2017-01-13 2018-07-19 古河電気工業株式会社 金属接合用材料、及び接合構造体
WO2018159306A1 (ja) * 2017-02-28 2018-09-07 アートビーム有限会社 太陽電池および太陽電池の製造方法

Also Published As

Publication number Publication date
WO2021256172A1 (ja) 2021-12-23
TW202206613A (zh) 2022-02-16
TWI782572B (zh) 2022-11-01

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