TWI782012B - 雙組分無溶劑黏著劑組合物 - Google Patents
雙組分無溶劑黏著劑組合物 Download PDFInfo
- Publication number
- TWI782012B TWI782012B TW107114787A TW107114787A TWI782012B TW I782012 B TWI782012 B TW I782012B TW 107114787 A TW107114787 A TW 107114787A TW 107114787 A TW107114787 A TW 107114787A TW I782012 B TWI782012 B TW I782012B
- Authority
- TW
- Taiwan
- Prior art keywords
- isocyanate
- component
- adhesive composition
- reactive
- adhesive
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 97
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 97
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- 150000003077 polyols Chemical class 0.000 claims abstract description 59
- 239000012948 isocyanate Substances 0.000 claims abstract description 46
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 33
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- -1 phosphate ester Chemical class 0.000 claims abstract description 30
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- 239000002318 adhesion promoter Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000004823 Reactive adhesive Substances 0.000 claims abstract description 10
- 238000002156 mixing Methods 0.000 claims abstract description 8
- 239000005056 polyisocyanate Substances 0.000 claims description 25
- 229920001228 polyisocyanate Polymers 0.000 claims description 25
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 21
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 10
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- 125000003118 aryl group Chemical group 0.000 description 7
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- 125000004432 carbon atom Chemical group C* 0.000 description 4
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- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical group CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 4
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- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
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- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 150000003014 phosphoric acid esters Chemical class 0.000 description 2
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- FDYWJVHETVDSRA-UHFFFAOYSA-N 1,1-diisocyanatobutane Chemical compound CCCC(N=C=O)N=C=O FDYWJVHETVDSRA-UHFFFAOYSA-N 0.000 description 1
- VKLNMSFSTCXMSB-UHFFFAOYSA-N 1,1-diisocyanatopentane Chemical compound CCCCC(N=C=O)N=C=O VKLNMSFSTCXMSB-UHFFFAOYSA-N 0.000 description 1
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- ROHUXHMNZLHBSF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCC(CN=C=O)CC1 ROHUXHMNZLHBSF-UHFFFAOYSA-N 0.000 description 1
- PFJZOBRGDTYDQC-UHFFFAOYSA-N 1,4-diisocyanato-4-methylpentane Chemical compound O=C=NC(C)(C)CCCN=C=O PFJZOBRGDTYDQC-UHFFFAOYSA-N 0.000 description 1
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- FPWRWTXOOZSCTB-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatocyclohexyl)methyl]cyclohexane Chemical compound C1CC(N=C=O)CCC1CC1C(N=C=O)CCCC1 FPWRWTXOOZSCTB-UHFFFAOYSA-N 0.000 description 1
- LFSYUSUFCBOHGU-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatophenyl)methyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=CC=C1N=C=O LFSYUSUFCBOHGU-UHFFFAOYSA-N 0.000 description 1
- ICLCCFKUSALICQ-UHFFFAOYSA-N 1-isocyanato-4-(4-isocyanato-3-methylphenyl)-2-methylbenzene Chemical compound C1=C(N=C=O)C(C)=CC(C=2C=C(C)C(N=C=O)=CC=2)=C1 ICLCCFKUSALICQ-UHFFFAOYSA-N 0.000 description 1
- WJIOHMVWGVGWJW-UHFFFAOYSA-N 3-methyl-n-[4-[(3-methylpyrazole-1-carbonyl)amino]butyl]pyrazole-1-carboxamide Chemical compound N1=C(C)C=CN1C(=O)NCCCCNC(=O)N1N=C(C)C=C1 WJIOHMVWGVGWJW-UHFFFAOYSA-N 0.000 description 1
- QNIXMCINXVRKGG-UHFFFAOYSA-N 4-ethyl-1-isocyanato-4-(isocyanatomethyl)octane Chemical compound CCCCC(CC)(CN=C=O)CCCN=C=O QNIXMCINXVRKGG-UHFFFAOYSA-N 0.000 description 1
- KEZMBAQUUXDDDQ-UHFFFAOYSA-N CCC.N=C=O.N=C=O Chemical compound CCC.N=C=O.N=C=O KEZMBAQUUXDDDQ-UHFFFAOYSA-N 0.000 description 1
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- SNYXHPGLJPPRHM-UHFFFAOYSA-N CCCCCCCCCC.N=C=O.N=C=O.N=C=O Chemical compound CCCCCCCCCC.N=C=O.N=C=O.N=C=O SNYXHPGLJPPRHM-UHFFFAOYSA-N 0.000 description 1
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- 229920000298 Cellophane Polymers 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
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- HDONYZHVZVCMLR-UHFFFAOYSA-N N=C=O.N=C=O.CC1CCCCC1 Chemical compound N=C=O.N=C=O.CC1CCCCC1 HDONYZHVZVCMLR-UHFFFAOYSA-N 0.000 description 1
- QCJBVWNJRIOSDN-UHFFFAOYSA-N N=C=O.N=C=O.CCC1CCCCC1 Chemical compound N=C=O.N=C=O.CCC1CCCCC1 QCJBVWNJRIOSDN-UHFFFAOYSA-N 0.000 description 1
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- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
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- JGCWKVKYRNXTMD-UHFFFAOYSA-N bicyclo[2.2.1]heptane;isocyanic acid Chemical compound N=C=O.N=C=O.C1CC2CCC1C2 JGCWKVKYRNXTMD-UHFFFAOYSA-N 0.000 description 1
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- 230000007613 environmental effect Effects 0.000 description 1
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- STBLQDMGPBQTMI-UHFFFAOYSA-N heptane;isocyanic acid Chemical compound N=C=O.N=C=O.CCCCCCC STBLQDMGPBQTMI-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
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- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
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- 239000000047 product Substances 0.000 description 1
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- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 235000015113 tomato pastes and purées Nutrition 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/08—Polyurethanes from polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/10—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of wood
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Abstract
揭示包括異氰酸酯組分及異氰酸酯反應性組分之雙組分無溶劑聚胺基甲酸酯黏著劑組合物,所述組合物包括:包括異氰酸酯封端之預聚物的異氰酸酯組分;及包括以下之異氰酸酯反應性組分:聚醚多元醇、磷酸酯黏著促進劑及基於生物之多元醇。亦揭示用於形成層狀結構之方法,所述方法包括:藉由混合包括異氰酸酯封端之預聚物的異氰酸酯黏著劑組分與包括聚醚多元醇、磷酸酯黏著促進劑及基於生物之多元醇的異氰酸酯反應性黏著劑組分,形成黏著劑組合物;將所述黏著劑組合物塗覆至第一基板之表面;及使第二基板之表面與所述第一基板之所述表面上的所述黏著劑組合物接觸,進而形成所述層狀結構。亦揭示層狀結構。
Description
本發明係關於無溶劑黏著劑組合物。更特定言之,本發明係關於用於層狀結構中之雙組分無溶劑聚胺基甲酸酯黏著劑組合物。所揭示之黏著劑組合物包括:包括異氰酸酯封端之預聚物的異氰酸酯組分;及包括以下之異氰酸酯反應性組分:聚醚多元醇、磷酸酯黏著促進劑及基於生物之多元醇。所揭示之黏著劑組合物展現優於當前無溶劑黏著劑系統之改良特性,例如比當前系統更快固化、更快一級芳胺(「PAA」)衰變、更好的與金屬化膜之黏著性,諸如此類。
本發明進一步關於用於形成層狀結構之方法。更特定言之,所揭示之方法包括:藉由混合包括異氰酸酯封端之預聚物的異氰酸酯黏著劑組分與包括聚醚多元醇、磷酸酯黏著促進劑及基於生物之多元醇的異氰酸酯反應性黏著劑組分,形成黏著劑組合物;將所述黏著劑組合物塗覆至第一基板之表面;及使第二基板之表面與所述第一基板之所述表面上的所述黏著劑組合物接觸,進而形成所述層狀結構。
黏著劑組合物適用於各種目的。舉例而言,黏著劑組合物用以將基板,諸如聚乙烯、聚丙烯、聚酯、聚醯胺、金屬、紙或塞璐芬(cellophane)黏結在一起以形成複合膜,亦即層壓物。黏著劑在不同的最終用途應用中之用途通常為已知的。舉例而言,黏著劑可用於製造用於封裝行業中,尤其用於食品封裝之膜/膜及膜/箔層壓物。用於層壓應用中之黏著劑或「層壓黏著劑」通常可分為三種類別:基於溶劑、基於水及無溶劑。黏著劑之效能視類別及塗覆黏著劑之應用而改變。
可塗覆高達100%固體且無有機溶劑或水性載劑之無溶劑層壓黏著劑。因為在塗覆後不需要自黏著劑乾燥有機溶劑或水,所以此等黏著劑可在高線速度下操作。基於溶劑及基於水之層壓黏著劑受到在塗覆黏著劑後可有效乾燥且自層狀結構中移除溶劑或水之速率的限制。出於環境、健康及安全原因,層壓黏著劑較佳為水性或無溶劑的。然而,無溶劑黏著劑常常遇到諸如以下之問題:緩慢黏結出現、緩慢一級芳胺(「PAA」)衰變、較低的與金屬表面之黏著性、油墨塗污及不良耐化學性及耐熱性,尤其在其用於要求更高的應用中時。
在無溶劑層壓黏著劑之類別內,存在許多種類。一種特定種類包含雙組分基於聚胺基甲酸酯之層壓黏著劑。典型地,雙組分基於聚胺基甲酸酯之層壓黏著劑包含:包括異氰酸酯封端之預聚物的第一組分;及包括多元醇之第二組分。預聚物可藉由使過量聚異氰酸酯與每分子含有兩個或多於兩個羥基之聚醚多元醇及/或聚酯多元醇反應而獲得。第二組分包括每分子含有兩個或多於兩個羥基之聚醚多元醇及/或聚酯多元醇。將兩種組分以預定比率組合,且隨後塗覆於第一基板(亦稱為「載體幅材」)上。隨後,使第一基板與第二基板結合在一起以形成層狀結構。可將額外基板層添加至結構中,其中額外黏著劑組合物層位於各連續基板之間。隨後,使黏著劑在室溫或高溫下固化,進而使基板黏結在一起。
層狀結構之進一步加工視黏著劑之固化速度而定。黏著劑之固化速度由層壓基板之間的機械黏結變得足以允許進一步加工(例如,切割層壓膜)且層壓物符合適用規定(例如,食品接觸規定)所花費的時間指示。緩慢固化速度導致較低轉化效率。雙組分無溶劑層壓黏著劑與傳統含溶劑黏著劑相比展現較弱初始黏結且切割需要等待更長時間。
因此,需要具有改良之黏結強度、更快固化速度、更快PAA衰變、更好抗產品性及改良之金屬化膜黏著性的雙組分無溶劑基於聚胺基甲酸酯之層壓黏著劑組合物。
揭示雙組分無溶劑聚胺基甲酸酯黏著劑組合物。在一些實施例中,無溶劑黏著劑組合物包含包括異氰酸酯封端之預聚物的異氰酸酯組分。無溶劑黏著劑組合物進一步包含包括以下之異氰酸酯反應性組分:聚醚多元醇、磷酸酯黏著促進劑及基於生物之多元醇。包含聚醚多元醇、磷酸酯黏著促進劑及基於生物之多元醇的異氰酸酯反應性組分與異氰酸酯組分反應以生成交聯聚合物網路。當塗覆於層壓結構中時,異氰酸酯反應性組分中存在之磷酸酯官能基與金屬化膜或聚合物膜上之反應性位點反應/錯合以改良黏著性。
在一些實施例中,基於生物之多元醇為蓖麻油。在一些實施例中,異氰酸酯組分及異氰酸酯反應性組分以100:45至100:75(異氰酸酯組分重量份比異氰酸酯反應性組分重量份)之混合比存在。
相對於現有雙組分無溶劑聚胺基甲酸酯黏著劑組合物,所揭示之黏著劑組合物及用於形成層狀結構之方法提供更快固化及PAA衰變、更好金屬化膜黏著性、增強之箔黏著性、增加之耐化學性及耐熱性及更合乎需要的可加工性。所揭示之黏著劑組合物適用於典型地用於食品、醫學及工業封裝應用中的包括多個層壓基板之寬範圍之層狀結構,包含層壓金屬化膜及一系列聚酯、聚烯烴膜。另外,所揭示之黏著劑組合物經由使用含有二級及一級羥基兩者之組分平衡固化與適用期特性。調整含有羥基之組分的官能度以調節與異氰酸酯組分之反應速率。
在一些實施例中,根據本發明之雙組分無溶劑黏著劑組合物包含異氰酸酯組分及異氰酸酯反應性組分。異氰酸酯組分
在一些實施例中,異氰酸酯組分包括異氰酸酯封端之預聚物。在一些實施例中,異氰酸酯封端之預聚物為聚異氰酸酯與多元醇組分之反應產物。在這一反應中,聚異氰酸酯過量存在以便產生異氰酸酯封端之預聚物。如本文所用,「聚異氰酸酯」為含有兩個或多於兩個異氰酸酯基之任何化合物。在一些實施例中,聚異氰酸酯可為異氰酸酯單體。在一些實施例中,聚異氰酸酯可包含二聚體、三聚體等。
在一些實施例中,根據本發明適用之聚異氰酸酯可選自由以下組成之群:脂族聚異氰酸酯、環脂族聚異氰酸酯、芳族聚異氰酸酯及其兩者或多於兩者之組合。「芳族聚異氰酸酯」為異氰酸酯基鍵結至芳族基且含有一或多個芳族環之聚異氰酸酯。「脂族聚異氰酸酯」不含有直接鍵結至芳族環之異氰酸酯基或更好地定義為含有鍵結至脂族基之異氰酸酯基的異氰酸酯,所述脂族基可鍵結至其他脂族基、環脂族基或芳族環(基)。「環脂族聚異氰酸酯」為脂族聚異氰酸酯之子集,其中化學鏈為環結構。
適合芳族聚異氰酸酯包含但不限於二異氰酸1,3-伸苯酯與二異氰酸1,4-伸苯酯、二異氰酸1,5-伸萘酯、二異氰酸2,6-甲苯酯(「2,6-TDI」)、二異氰酸2,4-甲苯酯(「2,4-TDI」)、2,4'-二苯基甲烷二異氰酸酯(「2,4'-MDI」)、4,4'-二苯基甲烷二異氰酸酯(「4,4'-MDI」)、3,3'-二甲基-4,4'-聯苯二異氰酸酯(「TODI」)及其兩者或多於兩者之混合物。適合脂族聚異氰酸酯在直鏈或分支鏈伸烷基殘基中具有3至16個碳原子或4至12個碳原子,諸如二異氰酸六亞甲酯(「HDI」)及1,4-二異氰酸酯基丁烷及其兩者或多於兩者之混合物。
適合環脂族聚異氰酸酯在環伸烷基殘基中具有4至18個碳原子或6至15個碳原子。環脂族二異氰酸酯係指環且脂族鍵結之NCO基團,諸如異佛爾酮二異氰酸酯(「IPDI」)、1,3/1,4-二異氰酸酯基環己烷、1,3-/1,4-雙(異氰酸酯基甲基)環己烷及二異氰酸酯基二環己基甲烷(「H12MDI」)及其兩者或多於兩者之混合物。
適合脂族及環脂族聚異氰酸酯包含但不限於環己烷二異氰酸酯、甲基環己烷二異氰酸酯、乙基環己烷二異氰酸酯、丙基環己烷二異氰酸酯、甲基二乙基環己烷二異氰酸酯、丙烷二異氰酸酯、丁烷二異氰酸酯、戊烷二異氰酸酯、己烷二異氰酸酯、庚烷二異氰酸酯、辛烷二異氰酸酯、壬烷二異氰酸酯、壬烷三異氰酸酯(諸如4-異氰酸酯基甲基-1,8-辛烷二異氰酸酯(「TIN」))、癸烷二異氰酸酯及癸烷三異氰酸酯、十一烷二異氰酸酯及十一烷三異氰酸酯及十二烷二異氰酸酯及十二烷三異氰酸酯、異佛爾酮二異氰酸酯(「IPDI」)、二異氰酸六亞甲酯(「HDI」)、二異氰酸酯基二環己基甲烷(「H12MDI」)、2-甲基戊烷二異氰酸酯(「MPDI」)、二異氰酸2,2,4-三甲基六亞甲酯/二異氰酸2,4,4-三甲基六亞甲酯(「TMDI」)、降冰片烷二異氰酸酯(「NBDI」)、二異氰酸二甲苯酯(「XDI」)、二異氰酸四甲基二甲苯酯及二聚體、三聚體及其兩者或多於兩者之混合物。根據本發明適用之其他聚異氰酸酯包含但不限於4-甲基-環己烷1,3-二異氰酸酯、二異氰酸2-丁基-2-乙基五亞甲酯、異氰酸3(4)-異氰酸酯基甲基-1-甲基環己酯、異氰酸2-異氰酸酯基丙基環己酯、2,4'-亞甲基雙(環己基)二異氰酸酯、1,4-二異氰酸酯基-4-甲基-戊烷及其兩者或多於兩者之混合物。
在一些實施例中,異氰酸酯組分之NCO含量為至少3%、或至少6%、或至少10%。在一些實施例中,異氰酸酯組分之NCO含量不超過25%、或18%、或14%。在一些實施例中,異氰酸酯組分之NCO含量為3至25%、或6至18%、或10至14%。NCO含量係根據ASTM D2572測定。在一些實施例中,如藉由ASTM D2196之方法所量測,異氰酸酯組分在25℃下之黏度為300至40,000 mPa-s、或500至20,000 mPa-s、或1,000至10,000 mPa-s。
在一些實施例中,待與聚異氰酸酯反應以形成異氰酸酯封端之預聚物的多元醇組分包括羥基官能度為二或大於二之多元醇。如本文所用,術語「羥基官能度」係指分子上異氰酸酯反應性位點之數目。對於多元醇,平均羥基官能度通常為OH之總莫耳數除以多元醇之總莫耳數。在一些實施例中,官能度為二或大於二之多元醇係選自由以下組成之群:聚酯多元醇、聚醚多元醇及其混合物。
異氰酸酯組分可進一步包括一般熟習此項技術者通常已知之其他成分。異氰酸酯反應性組分
在一些實施例中,異氰酸酯反應性組分包括聚醚多元醇、磷酸酯黏著促進劑及基於生物之多元醇。
在一些實施例中,聚醚多元醇之羥基官能度為二或大於二(例如,二官能、三官能,諸如此類)。在一些實施例中,根據ASTM D4274所量測,聚醚多元醇之羥基值為100至400 mg KOH/g。在一些實施例中,聚醚多元醇之數均分子量為100至3,000、200至2,500、或350至1,500。在一些實施例中,根據ASTM D4878所量測,聚醚多元醇在25℃下之黏度為50至1000 cps。根據本發明適用之聚醚多元醇之商業上可獲得的實例包含以商標名VORANOL™ CP-450、VORANOL™ CP-755、VORANOL™ CP-1055、VORANOL™ 220-260、VORANOL™ 220-056N及VORANOL™ 220-110N銷售之產品,所述產品各自可獲自陶氏化學公司(The Dow Chemical Company)。在一些實施例中,聚醚多元醇進一步包括分子量小於300之三醇。根據本發明適用之三醇之商業上可獲得的實例包含可獲自西格瑪-奧德里奇(Sigma-Aldrich)之三羥甲基丙烷(「TMP」)。在一些實施例中,以異氰酸酯反應性組分之重量計,異氰酸酯反應性組分中聚醚多元醇之量以重量計為10至90重量%、或40至80重量%、或55至70重量%。
在一些實施例中,磷酸酯黏著促進劑包括基於磷酸酯之多元醇。在一些實施例中,基於磷酸酯之多元醇由三官能或二官能丙二醇、聚磷酸及聚異氰酸酯製成。在一些實施例中,基於磷酸酯之多元醇的磷酸含量以磷酸酯多元醇之重量計小於4重量%,或磷酸含量以磷酸酯多元醇之重量計為0.1至3重量%,或磷酸含量以磷酸酯多元醇之重量計為1.5至2.5重量%。在一些實施例中,如藉由ASTM D2196之方法所量測,基於磷酸酯之多元醇的黏度在25℃下小於40,000 cps、或在25℃下小於30,000 cps。在一些實施例中,根據ASTM D4274所量測,基於磷酸酯之多元醇的羥基值為200至350 mg KOH/g。在一些實施例中,以異氰酸酯反應性組分之重量計,異氰酸酯反應性組分中磷酸酯黏著促進劑之量以重量計為0.5至15重量%、或1至10重量%、或2至5重量%。用於製備適合磷酸酯黏著促進劑之技術的一個實例在下文提供於本發明之實例中。
在一些實施例中,基於生物之多元醇為蓖麻油或其他天然來源之油。根據本發明適用之蓖麻油之商業上可獲得的實例包含可獲自康寶公司(Campbell & Co.)之胺基甲酸酯級蓖麻油。在一些實施例中,以異氰酸酯反應性組分之重量計,異氰酸酯反應性組分中基於生物之多元醇的量以重量計為5至80重量%、或20至50重量%、或30至40重量%。
在一些實施例中,一或多種添加劑可視情況包含於黏著劑組合物中。適合添加劑之實例包含但不限於增黏劑、增塑劑、流變改質劑、黏著促進劑、抗氧化劑、填充劑、著色劑、界面活性劑、消泡劑、濕潤劑、調平劑、溶劑及其兩者或多於兩者之組合。
異氰酸酯反應性組分可進一步包括一般熟習此項技術者通常已知的其他成分,例如額外多元醇、異氰酸酯等。
在一些實施例中,異氰酸酯組分中存在之NCO基團與異氰酸酯反應性組分中存在之OH基團的莫耳比為0.8:1.0至1.6:1.0、或1.0:1.0至1.5:1.0、或1.2:1.0至1.4:1.0。異氰酸酯組分及異氰酸酯反應性組分以重量計之混合比可基於所需的NCO基團與OH基團比率而確定。在一些實施例中,最終黏著劑組合物中異氰酸酯組分與異氰酸酯反應性組分以重量計之混合比可為100:45至100:75、或100:50至100:70。
在一些實施例中,異氰酸酯組分及異氰酸酯反應性組分可以套裝製造及銷售。在一些實施例中,異氰酸酯組分及異氰酸酯反應性組分可各自獨立地製造及銷售。層壓物形成
包括所揭示之黏著劑組合物的層壓物可藉由以下方式形成:混合黏著劑組合物之異氰酸酯及異氰酸酯反應性組分,且隨後將混合之黏著劑組合物塗覆至膜。如本文所用,「膜」為一個維度為0.5 mm或小於0.5 mm且其他兩個維度為1 cm或大於1 cm之任何結構。「聚合物膜」為由聚合物或聚合物之混合物製成的膜。聚合物膜之組成典型地為80重量%或大於80重量%一或多種聚合物。
舉例而言,將混合黏著劑層塗覆至第一基板之表面。使第一基板之包括混合黏著劑組合物的表面與第二基板之表面接觸,且隨後兩個基板穿過用於施加外部壓力至第一及第二基板之裝置(諸如軋輥)。塗覆設備中之所述輥配置通常在此項技術中已知。隨後在室溫(亦即約25℃)達至50℃或高於50℃之任何溫度下使混合黏著劑組合物固化或允許其固化。所塗覆黏著劑至膜基板之塗佈重量在一些實施例中為1.2 g/m2
至3.5 g/m2
,在一些實施例中為1.6 g/m2
至3.0 g/m2
。
層狀結構中之適合基板包含膜,諸如紙、編織及非編織織物、金屬箔、聚合物膜及金屬塗佈之聚合物膜。一些膜視情況具有上面用油墨印刷有影像之表面,所述油墨可與黏著劑組合物接觸。基板分層以形成層狀結構,其中根據本發明之黏著劑組合物將基板中之一或多者黏著在一起。本發明之實例
現將藉由描述說明所揭示之黏著劑組合物及現有黏著劑組合物之實例(統稱為「實例」)來更詳細地解釋本發明。然而,本發明之範疇當然不限於所述實例。原料
在室溫下在氮氣沖洗下添加55.1公克VORANOL™ CP-450及1.5公克聚磷酸至反應器。隨後將反應器溫度設定為100℃且攪拌反應器內含物1小時。使反應器溫度降至50℃,且隨後引入18.4公克ISONATE™ 125M至反應器中。反應器溫度歸因於放熱反應而升高至80℃。控制反應溫度在78℃下2小時。所得磷酸酯黏著促進劑根據ASTM D4274所量測之羥基值為293 mg KOH/g,且根據ASTM D2196所量測在25℃下之黏度為18,000 cps。製備異氰酸酯反應性組分
用於實例1至3之異氰酸酯反應性組分的相關成分詳述於表2中。使用實例3之異氰酸酯反應性組分作為樣品製備之典型實例,將約600公克VORANOL™ 220-260、約360公克基於生物之多元醇、約20公克磷酸酯黏著促進劑及約20公克TMP饋入玻璃反應器。將反應器加熱至約70℃,且攪拌混合物約2小時,維持所述溫度。隨後將反應器內含物冷卻至約60℃,且將樣品轉移及封裝以便後續使用。 表2:異氰酸酯反應性組分組成 黏著劑配方
使用LABO-COMBI™層壓機製備層狀結構,軋溫度設定為120℉且線速度設定為100呎/分鐘。塗層重量調整為約1至1.2 lbs/rm(1.6至1.9 g/m2
)。對於各配方製備約100呎層壓物,插入一些黏結條帶以促進黏結測試。使形成之層狀結構在室溫下固化1週。評估各種結構,包含48-LBT/GF-19、耐綸/GF-10及48LBT/Met-PET。測試方法及效能結果
在具有200 N負荷單元之英斯特朗(Instron)拉伸測試器上在10吋/分鐘之速率下對1吋層壓物樣品條帶量測T剝離黏結強度。對各層壓物樣品測試三個條帶,且記錄高及平均黏結強度以及失效模式。在膜撕裂及膜拉伸之情況下,報導高值。在其他失效模式下,報導平均T剝離黏結強度。典型失效模式包含:「AF」黏著失效(一級黏著劑),「AT」黏著劑轉移(二級黏著劑),「AS」黏著劑破裂(黏著劑之內聚失效),「FT」膜撕裂(破壞黏結),「FS」膜拉伸(破壞黏結),及「MT」金屬轉移。
在使樣品在25℃,50% RH下固化2天之後測試一級芳胺(「PAA」)衰變。摺疊固化之層狀結構以形成雙層,使得一個層之聚乙烯膜與另一層之聚乙烯膜接觸。隨後用切紙器修整邊緣以獲得約6.5吋×7吋之摺疊片。隨後熱封邊緣以形成內部大小為5.5吋×5.6吋之小袋。隨後向小袋填充100 mL 3%乙酸。在70℃下在空氣循環烘箱中萃取這些小袋2小時之時間段。在於冷自來水中驟冷冷卻小袋之後,使測試溶液在室溫下平衡,將100 ml測試溶液轉移至燒杯中。藉由利用經典比色方法測定萃取至3%乙酸溶液中的一級芳胺之量。
亦對層狀結構執行可煮袋測試。摺疊固化之層狀結構(約9吋×11吋)以形成雙層,使得一個層之聚乙烯膜與另一層之聚乙烯膜接觸。隨後用切紙器修整邊緣以獲得約5吋×7吋之摺疊片。隨後熱封邊緣以形成內部大小為4吋×6吋之小袋。隨後經由開放邊緣向小袋填充100 mL 1/1/1醬(亦即,等重量份番茄醬、醋及植物油之摻合物)。在填充之後,以使小袋內部滯留之空氣減至最少的方式密封小袋。隨後將經填充之小袋小心地置於沸水中且保持浸沒於水中30分鐘。當完成時,將隧穿、分層及/或洩漏之程度與明顯的預先存在之缺陷比較。隨後清空袋,且自小袋切割至少三個1吋條帶,且隨後儘快量測T剝離黏結強度。
除了上文所描述之實施例及實例中所闡述之實施例之外,特定組合之許多實施例屬於本發明之範疇內,下文描述其中一些:
實施例1. 一種雙組分無溶劑黏著劑組合物,其包括: 包括異氰酸酯封端之預聚物的異氰酸酯組分;及 包括以下之異氰酸酯反應性組分: 聚醚多元醇; 磷酸酯黏著促進劑;及 基於生物之多元醇。
實施例2. 如以上或以下任一實施例所述的雙組分無溶劑黏著劑組合物,其中所述聚醚多元醇佔所述異氰酸酯反應性組分之總重量的10至90%。
實施例3. 如以上或以下任一實施例所述的雙組分無溶劑黏著劑組合物,其中所述聚醚多元醇佔所述異氰酸酯反應性組分之總重量的40至80%。
實施例4. 如以上或以下任一實施例所述的雙組分無溶劑黏著劑組合物,其中所述聚醚多元醇佔所述異氰酸酯反應性組分之總重量的55至70%。
實施例5. 如以上或以下任一實施例所述的雙組分無溶劑黏著劑組合物,其中所述磷酸酯由三官能丙二醇、聚磷酸及聚異氰酸酯製成,所述磷酸酯之磷酸含量以所述磷酸酯之重量計小於3重量%。
實施例6. 如以上或以下任一實施例所述的雙組分無溶劑黏著劑組合物,其中所述磷酸酯黏著促進劑佔所述異氰酸酯反應性組分之總重量的0.5至15%。
實施例7. 如以上或以下任一實施例所述的雙組分無溶劑黏著劑組合物,其中所述磷酸酯黏著促進劑佔所述異氰酸酯反應性組分之總重量的1至10%。
實施例8. 如以上或以下任一實施例所述的雙組分無溶劑黏著劑組合物,其中所述磷酸酯黏著促進劑佔所述異氰酸酯反應性組分之總重量的2至5%。
實施例9. 如以上或以下任一實施例所述的雙組分無溶劑黏著劑組合物,其中所述基於生物之多元醇佔所述異氰酸酯反應性組分之總重量的5至80%。
實施例10. 如以上或以下任一實施例所述的雙組分無溶劑黏著劑組合物,其中所述基於生物之多元醇佔所述異氰酸酯反應性組分之總重量的20至50%。
實施例11. 如以上或以下任一實施例所述的雙組分無溶劑黏著劑組合物,其中所述基於生物之多元醇佔所述異氰酸酯反應性組分之總重量的30至40%。
實施例12. 如以上或以下任一實施例所述的雙組分無溶劑黏著劑組合物,其中所述基於生物之多元醇為蓖麻油。
實施例13. 如以上或以下任一實施例所述的雙組分無溶劑黏著劑組合物,其中所述異氰酸酯組分中存在之NCO基團與所述異氰酸酯反應性組分中存在之OH基團的莫耳比為0.8:1.0至1.6:1.0。
實施例14. 如以上或以下任一實施例所述的雙組分無溶劑黏著劑組合物,其中所述異氰酸酯組分中存在之NCO基團與所述異氰酸酯反應性組分中存在之OH基團的莫耳比為1.0:1.0至1.5:1.0。
實施例15. 如以上或以下任一實施例所述的雙組分無溶劑黏著劑組合物,其中所述異氰酸酯組分中存在之NCO基團與所述異氰酸酯反應性組分中存在之OH基團的莫耳比為1.2:1.0至1.4:1.0。
實施例16. 一種層狀結構,其包括如以上或以下任一實施例所述的雙組分無溶劑黏著劑組合物。
實施例17. 一種用於形成層狀結構之方法,其包括: 藉由混合包括異氰酸酯封端之預聚物的異氰酸酯黏著劑組分與包括聚醚多元醇、磷酸酯黏著促進劑及基於生物之多元醇的異氰酸酯反應性黏著劑組分,形成黏著劑組合物; 將所述黏著劑組合物塗覆至第一基板之表面;及 使第二基板之表面與所述第一基板之所述表面上的所述黏著劑組合物接觸,進而形成所述層狀結構。
實施例18. 如以上或以下任一實施例所述的用於形成層狀結構之方法,其中混合所述異氰酸酯黏著劑組分與所述異氰酸酯反應性黏著劑組分在所述異氰酸酯組分中存在之NCO基團與所述異氰酸酯反應性組分中存在之OH基團的莫耳比為0.8:1.0至1.6:1.0下進行。
實施例19. 如以上或以下任一實施例所述的用於形成層狀結構之方法,其中混合所述異氰酸酯黏著劑組分與所述異氰酸酯反應性黏著劑組分在所述異氰酸酯組分中存在之NCO基團與所述異氰酸酯反應性組分中存在之OH基團的莫耳比為1.0:1.0至1.5:1.0下進行。
實施例20. 如以上或以下任一實施例所述的用於形成層狀結構之方法,其中混合所述異氰酸酯黏著劑組分與所述異氰酸酯反應性黏著劑組分在所述異氰酸酯組分中存在之NCO基團與所述異氰酸酯反應性組分中存在之OH基團的莫耳比為1.2:1.0至1.4:1.0下進行。
實施例21. 如以上或以下任一實施例所述的用於形成層狀結構之方法,其中所述第一基板及所述第二基板各自獨立地選自由以下組成之群:木質材料、金屬材料、塑膠材料、複合材料、紙質材料、織物材料及其兩者或多於兩者之組合。
Claims (10)
- 一種雙組分無溶劑黏著劑組合物,其包括:包括異氰酸酯封端之預聚物的異氰酸酯組分;及包括以下之異氰酸酯反應性組分:聚醚多元醇;磷酸酯黏著促進劑,其由二官能聚醚多元醇、聚磷酸及聚異氰酸酯製成,其中所述磷酸酯黏著促進劑佔所述異氰酸酯反應性組分之總重量的0.5至15%;及基於生物之多元醇。
- 如請求項1所述的雙組分無溶劑黏著劑組合物,其中所述聚醚多元醇佔所述異氰酸酯反應性組分之總重量的10至90%。
- 如請求項1所述的雙組分無溶劑黏著劑組合物,其中所述磷酸酯黏著促進劑佔所述異氰酸酯反應性組分之總重量的1至10%。
- 如請求項1所述的雙組分無溶劑黏著劑組合物,其中所述基於生物之多元醇佔所述異氰酸酯反應性組分之總重量的5至80%。
- 如請求項1所述的雙組分無溶劑黏著劑組合物,其中所述基於生物之多元醇為蓖麻油。
- 如請求項1所述的雙組分無溶劑黏著劑組合物,其中所述異氰酸酯組分中存在之NCO基團與所述異氰酸酯反應性組分中存在之OH基團的莫耳比為0.8:1.0至1.6:1.0。
- 一種層狀結構,其包括如請求項1所述的雙組分無溶劑黏著劑組合物。
- 一種用於形成層狀結構之方法,其包括:藉由混合包括異氰酸酯封端之預聚物的異氰酸酯黏著劑組分與包括聚醚多 元醇、磷酸酯黏著促進劑及基於生物之多元醇的異氰酸酯反應性黏著劑組分,形成黏著劑組合物,所述磷酸酯黏著促進劑由二官能聚醚多元醇、聚磷酸及聚異氰酸酯製成,其中所述磷酸酯黏著促進劑佔所述異氰酸酯反應性黏著劑組分之總重量的0.5至15%;將所述黏著劑組合物塗覆至第一基板之表面;及使第二基板之表面與所述第一基板之所述表面上的所述黏著劑組合物接觸,進而形成所述層狀結構。
- 如請求項8所述的用於形成層狀結構之方法,其中混合所述異氰酸酯黏著劑組分與所述異氰酸酯反應性黏著劑組分在所述異氰酸酯黏著劑組分中存在之NCO基團與所述異氰酸酯反應性黏著劑組分中存在之OH基團的莫耳比為0.8:1.0至1.6:1.0下進行。
- 如請求項8所述的用於形成層狀結構之方法,其中所述第一基板及所述第二基板各自獨立地選自由以下組成之群:木質材料、金屬材料、塑膠材料、複合材料、紙質材料、織物材料及其兩者或多於兩者之組合。
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