TWI780171B - 可撓性裝置基板形成用組成物 - Google Patents

可撓性裝置基板形成用組成物 Download PDF

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Publication number
TWI780171B
TWI780171B TW107122940A TW107122940A TWI780171B TW I780171 B TWI780171 B TW I780171B TW 107122940 A TW107122940 A TW 107122940A TW 107122940 A TW107122940 A TW 107122940A TW I780171 B TWI780171 B TW I780171B
Authority
TW
Taiwan
Prior art keywords
flexible device
substrate
composition
device substrate
forming
Prior art date
Application number
TW107122940A
Other languages
English (en)
Chinese (zh)
Other versions
TW201920361A (zh
Inventor
奚偉恩
何邦慶
Original Assignee
日商日產化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日產化學股份有限公司 filed Critical 日商日產化學股份有限公司
Publication of TW201920361A publication Critical patent/TW201920361A/zh
Application granted granted Critical
Publication of TWI780171B publication Critical patent/TWI780171B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
TW107122940A 2017-07-03 2018-07-03 可撓性裝置基板形成用組成物 TWI780171B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-130419 2017-07-03
JP2017130419 2017-07-03

Publications (2)

Publication Number Publication Date
TW201920361A TW201920361A (zh) 2019-06-01
TWI780171B true TWI780171B (zh) 2022-10-11

Family

ID=64949990

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107122940A TWI780171B (zh) 2017-07-03 2018-07-03 可撓性裝置基板形成用組成物

Country Status (5)

Country Link
JP (1) JP7054064B2 (ja)
KR (1) KR102592065B1 (ja)
CN (1) CN110832031B (ja)
TW (1) TWI780171B (ja)
WO (1) WO2019009259A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023085041A1 (ja) * 2021-11-11 2023-05-19 三菱瓦斯化学株式会社 ポリイミド樹脂、ワニス及びポリイミドフィルム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011216535A (ja) * 2010-03-31 2011-10-27 Shiima Electronics Inc 複合型ガラスエポキシ基板及びそれを用いた金属積層基板
CN103987763A (zh) * 2011-08-19 2014-08-13 阿克伦聚合物体系有限公司 热稳定的低双折射共聚聚酰亚胺膜
TW201710388A (zh) * 2015-07-16 2017-03-16 宇部興產股份有限公司 聚醯胺酸溶液組成物及聚醯亞胺膜

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007137933A (ja) * 2005-11-15 2007-06-07 Toray Ind Inc 樹脂組成物、これを用いた耐熱性樹脂積層フィルム、及び金属層付き積層フィルム
JP2014114429A (ja) 2012-01-12 2014-06-26 New Japan Chem Co Ltd 溶剤可溶性ポリイミド樹脂
JP5845918B2 (ja) 2012-01-20 2016-01-20 宇部興産株式会社 ポリイミド前駆体及びポリイミド
WO2013154141A1 (ja) * 2012-04-13 2013-10-17 宇部興産株式会社 ポリアミック酸溶液組成物、及びポリイミド
JP2015129201A (ja) * 2012-10-15 2015-07-16 宇部興産株式会社 ポリアミック酸溶液組成物、及びポリイミド
EP2847250B1 (en) * 2012-05-11 2020-03-18 Akron Polymer Systems, Inc. Thermally stable, flexible substrates for electronic devices
WO2014051050A1 (ja) * 2012-09-27 2014-04-03 三菱瓦斯化学株式会社 ポリイミド樹脂組成物
WO2014077253A1 (ja) * 2012-11-16 2014-05-22 日産化学工業株式会社 ポリイミド樹脂フィルム及びポリイミド樹脂フィルムからなる電子デバイス用基板
KR102345844B1 (ko) * 2014-03-31 2021-12-31 닛산 가가쿠 가부시키가이샤 수지 박막의 제조방법 및 수지 박막형성용 조성물
WO2016010003A1 (ja) * 2014-07-17 2016-01-21 旭化成イーマテリアルズ株式会社 樹脂前駆体及びそれを含有する樹脂組成物、ポリイミド樹脂膜、樹脂フィルム及びその製造方法
US11078378B2 (en) * 2015-03-31 2021-08-03 Asahi Kasei Kabushiki Kaisha Polyimide film, polyimide varnish, and product and layered product using the polyimide film

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011216535A (ja) * 2010-03-31 2011-10-27 Shiima Electronics Inc 複合型ガラスエポキシ基板及びそれを用いた金属積層基板
CN103987763A (zh) * 2011-08-19 2014-08-13 阿克伦聚合物体系有限公司 热稳定的低双折射共聚聚酰亚胺膜
TW201710388A (zh) * 2015-07-16 2017-03-16 宇部興產股份有限公司 聚醯胺酸溶液組成物及聚醯亞胺膜

Also Published As

Publication number Publication date
KR20200024775A (ko) 2020-03-09
CN110832031A (zh) 2020-02-21
JP7054064B2 (ja) 2022-04-13
KR102592065B1 (ko) 2023-10-23
JPWO2019009259A1 (ja) 2020-05-07
WO2019009259A1 (ja) 2019-01-10
CN110832031B (zh) 2023-08-11
TW201920361A (zh) 2019-06-01

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