TWI776943B - 電磁波屏蔽膜 - Google Patents

電磁波屏蔽膜 Download PDF

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Publication number
TWI776943B
TWI776943B TW107129906A TW107129906A TWI776943B TW I776943 B TWI776943 B TW I776943B TW 107129906 A TW107129906 A TW 107129906A TW 107129906 A TW107129906 A TW 107129906A TW I776943 B TWI776943 B TW I776943B
Authority
TW
Taiwan
Prior art keywords
layer
wiring board
printed wiring
electromagnetic wave
adhesive
Prior art date
Application number
TW107129906A
Other languages
English (en)
Chinese (zh)
Other versions
TW201931985A (zh
Inventor
高見晃司
Original Assignee
日商拓自達電線股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商拓自達電線股份有限公司 filed Critical 日商拓自達電線股份有限公司
Publication of TW201931985A publication Critical patent/TW201931985A/zh
Application granted granted Critical
Publication of TWI776943B publication Critical patent/TWI776943B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW107129906A 2018-01-10 2018-08-28 電磁波屏蔽膜 TWI776943B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-001835 2018-01-10
JP2018001835A JP6970025B2 (ja) 2018-01-10 2018-01-10 電磁波シールドフィルム

Publications (2)

Publication Number Publication Date
TW201931985A TW201931985A (zh) 2019-08-01
TWI776943B true TWI776943B (zh) 2022-09-11

Family

ID=67188649

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107129906A TWI776943B (zh) 2018-01-10 2018-08-28 電磁波屏蔽膜

Country Status (4)

Country Link
JP (1) JP6970025B2 (ko)
KR (1) KR102504069B1 (ko)
CN (1) CN110022640B (ko)
TW (1) TWI776943B (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112136368B (zh) 2018-07-06 2024-05-28 拓自达电线株式会社 印制线路基材用贴附膜及屏蔽线路基材
JP6597927B1 (ja) * 2019-06-18 2019-10-30 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電磁波シールド性配線回路基板
JP6645610B1 (ja) * 2019-08-01 2020-02-14 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電磁波シールド性配線回路基板
JP6624331B1 (ja) * 2019-08-01 2019-12-25 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電磁波シールド性配線回路基板
JP2021052083A (ja) * 2019-09-25 2021-04-01 信越ポリマー株式会社 電磁波シールドフィルム及び回路基板
JP6690773B1 (ja) 2019-12-18 2020-04-28 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電磁波シールド性配線回路基板
JP6690801B1 (ja) 2020-01-21 2020-04-28 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電磁波シールド性配線回路基板
TWI812889B (zh) * 2020-03-03 2023-08-21 日商拓自達電線股份有限公司 電磁波屏蔽膜
JP7382259B2 (ja) 2020-03-04 2023-11-16 信越ポリマー株式会社 電磁波シールドフィルム、及び電磁波シールドフィルム付きプリント配線板
CN113597243A (zh) * 2021-07-22 2021-11-02 苏州市新广益电子有限公司 一种电磁屏蔽膜

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101223839A (zh) * 2005-07-14 2008-07-16 三井金属矿业株式会社 黑色化表面处理铜箔及使用该黑色化表面处理铜箔的等离子显示器的前板用电磁波屏蔽导电性丝网
US20090317592A1 (en) * 2006-12-19 2009-12-24 Yasumasa Yoshitomi Optical film
TW201640998A (zh) * 2014-12-05 2016-11-16 Tatsuta Densen Kk 電磁波遮蔽薄膜
WO2017018135A1 (ja) * 2015-07-24 2017-02-02 富士フイルム株式会社 剥離フィルムおよび粘着剤積層体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200738913A (en) * 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
JP4332204B2 (ja) * 2007-09-21 2009-09-16 積水化学工業株式会社 離型フィルム
JP5866266B2 (ja) * 2012-08-29 2016-02-17 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルムの製造方法、およびフレキシブルプリント配線板の製造方法
KR102291797B1 (ko) 2013-11-19 2021-08-24 루미리즈 홀딩 비.브이. 고체 발광 디바이스 및 고체 발광 디바이스를 제조하는 방법
CN103763893B (zh) 2014-01-14 2016-04-13 广州方邦电子股份有限公司 电磁波屏蔽膜以及包含屏蔽膜的线路板的制作方法
JP5861790B1 (ja) 2015-02-25 2016-02-16 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器
JP6443155B2 (ja) * 2015-03-19 2018-12-26 東レ株式会社 離型用二軸配向ポリエステルフィルム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101223839A (zh) * 2005-07-14 2008-07-16 三井金属矿业株式会社 黑色化表面处理铜箔及使用该黑色化表面处理铜箔的等离子显示器的前板用电磁波屏蔽导电性丝网
US20090317592A1 (en) * 2006-12-19 2009-12-24 Yasumasa Yoshitomi Optical film
TW201640998A (zh) * 2014-12-05 2016-11-16 Tatsuta Densen Kk 電磁波遮蔽薄膜
WO2017018135A1 (ja) * 2015-07-24 2017-02-02 富士フイルム株式会社 剥離フィルムおよび粘着剤積層体

Also Published As

Publication number Publication date
KR102504069B1 (ko) 2023-02-24
JP6970025B2 (ja) 2021-11-24
CN110022640A (zh) 2019-07-16
KR20190085465A (ko) 2019-07-18
CN110022640B (zh) 2022-08-12
JP2019121731A (ja) 2019-07-22
TW201931985A (zh) 2019-08-01

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