TWI774662B - 基板之汽相氫氧自由基處理用系統及方法 - Google Patents

基板之汽相氫氧自由基處理用系統及方法 Download PDF

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Publication number
TWI774662B
TWI774662B TW106107706A TW106107706A TWI774662B TW I774662 B TWI774662 B TW I774662B TW 106107706 A TW106107706 A TW 106107706A TW 106107706 A TW106107706 A TW 106107706A TW I774662 B TWI774662 B TW I774662B
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substrate
hydrogen peroxide
vapor
processing
peroxide vapor
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TW106107706A
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English (en)
Chinese (zh)
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TW201801177A (zh
Inventor
意恩 Ｊ 布朗
華勒斯 Ｐ 普林茲
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日商東京威力科創股份有限公司
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    • H10P14/24—
    • H10P72/0406—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/452—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by activating reactive gas streams before their introduction into the reaction chamber, e.g. by ionisation or addition of reactive species
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H01L21/31122—Etching inorganic layers by chemical means by dry-etching of layers not containing Si, e.g. PZT, Al2O3
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • H01L21/31138—Etching organic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H10P50/285—
    • H10P50/287—
    • H10P72/0421—
    • H10P72/0468—

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
TW106107706A 2016-03-09 2017-03-09 基板之汽相氫氧自由基處理用系統及方法 TWI774662B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662305715P 2016-03-09 2016-03-09
US62/305,715 2016-03-09

Publications (2)

Publication Number Publication Date
TW201801177A TW201801177A (zh) 2018-01-01
TWI774662B true TWI774662B (zh) 2022-08-21

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US (1) US10490399B2 (enExample)
JP (1) JP6948808B2 (enExample)
KR (1) KR102362672B1 (enExample)
CN (1) CN107180774B (enExample)
TW (1) TWI774662B (enExample)

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CA3049436C (en) 2017-01-09 2024-02-20 Synexis Llc Application of dry hydrogen peroxide (dhp) gas to methods of poultry production
KR102111835B1 (ko) * 2017-11-20 2020-05-15 한국과학기술원 서브 챔버를 구비한 iCVD 시스템 및 방법
CN108380569A (zh) * 2018-03-02 2018-08-10 常州瑞择微电子科技有限公司 高浓度oh自由基发生装置
US10818512B2 (en) * 2019-01-28 2020-10-27 Tokyo Electron Limited Photo-assisted chemical vapor etch for selective removal of ruthenium
CN110797245B (zh) * 2019-10-28 2022-11-25 北京北方华创微电子装备有限公司 一种半导体加工设备
KR20230004523A (ko) * 2020-04-14 2023-01-06 라시크 아이엔씨. 수소 열화의 억제
KR102489838B1 (ko) * 2020-12-16 2023-01-17 동명대학교산학협력단 반도체 공정의 화학기계적 연마(CMP)를 위한 연마 입자 분산성 향상을 통한 시너지 효과 극대화와 SiC 및 GaN 기판 가공 방법 및 시스템
KR102520916B1 (ko) * 2020-12-16 2023-04-11 동명대학교산학협력단 반도체 공정의 화학기계적 연마(cmp)를 위한 히드록시 라디칼과 용존산소량 제어를 통한 고능률 하이브리드 연마 시스템
WO2024074929A1 (en) * 2022-10-03 2024-04-11 Rasirc, Inc. Hydrogen peroxide plasma etch of ashable hard mask

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TW200405456A (en) * 2002-07-24 2004-04-01 Toshiba Corp Method of forming pattern and substrate processing apparatus
TW200705676A (en) * 2005-07-30 2007-02-01 Samsung Electronics Co Ltd Method of making a display device, a display device made thereby and a thin film transistor substrate made thereby
TW200738329A (en) * 2005-11-18 2007-10-16 Mitsubishi Gas Chemical Co Method and apparatus for modifying substance
TW200909080A (en) * 2006-06-21 2009-03-01 Asahi Glass Co Ltd Apparatus and method for cleaning substrate
TW201028804A (en) * 2008-12-09 2010-08-01 Hitachi Int Electric Inc Substrate processing method
US20120285492A1 (en) * 2011-05-12 2012-11-15 Applied Materials, Inc. Methods of dry stripping boron-carbon films
US20140144463A1 (en) * 2012-11-27 2014-05-29 Tokyo Electron Limited Controlling cleaning of a layer on a substrate using nozzles
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US5269850A (en) * 1989-12-20 1993-12-14 Hughes Aircraft Company Method of removing organic flux using peroxide composition
TW200405456A (en) * 2002-07-24 2004-04-01 Toshiba Corp Method of forming pattern and substrate processing apparatus
TW200705676A (en) * 2005-07-30 2007-02-01 Samsung Electronics Co Ltd Method of making a display device, a display device made thereby and a thin film transistor substrate made thereby
TW200738329A (en) * 2005-11-18 2007-10-16 Mitsubishi Gas Chemical Co Method and apparatus for modifying substance
TW200909080A (en) * 2006-06-21 2009-03-01 Asahi Glass Co Ltd Apparatus and method for cleaning substrate
TW201028804A (en) * 2008-12-09 2010-08-01 Hitachi Int Electric Inc Substrate processing method
US20120285492A1 (en) * 2011-05-12 2012-11-15 Applied Materials, Inc. Methods of dry stripping boron-carbon films
TW201247312A (en) * 2011-05-12 2012-12-01 Applied Materials Inc Methods of dry stripping boron-carbon films
US20140144463A1 (en) * 2012-11-27 2014-05-29 Tokyo Electron Limited Controlling cleaning of a layer on a substrate using nozzles
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Also Published As

Publication number Publication date
CN107180774A (zh) 2017-09-19
KR20170105439A (ko) 2017-09-19
US10490399B2 (en) 2019-11-26
TW201801177A (zh) 2018-01-01
CN107180774B (zh) 2022-05-31
JP2017163143A (ja) 2017-09-14
KR102362672B1 (ko) 2022-02-11
JP6948808B2 (ja) 2021-10-13
US20170263436A1 (en) 2017-09-14

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