TWI770478B - 基板處理裝置、半導體裝置之製造方法、記錄媒體及基板處理程式 - Google Patents

基板處理裝置、半導體裝置之製造方法、記錄媒體及基板處理程式 Download PDF

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Publication number
TWI770478B
TWI770478B TW109109105A TW109109105A TWI770478B TW I770478 B TWI770478 B TW I770478B TW 109109105 A TW109109105 A TW 109109105A TW 109109105 A TW109109105 A TW 109109105A TW I770478 B TWI770478 B TW I770478B
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TW
Taiwan
Prior art keywords
substrate
heating
chamber
processing
supporter
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TW109109105A
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English (en)
Chinese (zh)
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TW202041706A (zh
Inventor
松井智哉
立野秀人
平野誠
Original Assignee
日商國際電氣股份有限公司
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Publication of TW202041706A publication Critical patent/TW202041706A/zh
Application granted granted Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3312—Vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Photovoltaic Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW109109105A 2019-03-22 2020-03-19 基板處理裝置、半導體裝置之製造方法、記錄媒體及基板處理程式 TWI770478B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019-055549 2019-03-22
JP2019055549 2019-03-22
JP2020-030713 2020-02-26
JP2020030713A JP6995902B2 (ja) 2019-03-22 2020-02-26 基板処理装置及び半導体装置の製造方法並びに基板処理プログラム

Publications (2)

Publication Number Publication Date
TW202041706A TW202041706A (zh) 2020-11-16
TWI770478B true TWI770478B (zh) 2022-07-11

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TW109109105A TWI770478B (zh) 2019-03-22 2020-03-19 基板處理裝置、半導體裝置之製造方法、記錄媒體及基板處理程式

Country Status (3)

Country Link
JP (1) JP6995902B2 (https=)
CN (1) CN111725094B (https=)
TW (1) TWI770478B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115706037B (zh) * 2021-08-10 2025-12-12 北京北方华创微电子装备有限公司 半导体工艺设备及其晶圆对齐装置
WO2023047499A1 (ja) * 2021-09-22 2023-03-30 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法およびプログラム
CN117913005B (zh) * 2024-01-19 2025-05-02 浙江泓芯新材料股份有限公司 一种石英舟热处理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283509A (ja) * 1996-04-11 1997-10-31 Sony Corp ウエハ処理装置および処理方法
KR20160123564A (ko) * 2015-04-16 2016-10-26 주식회사 유진테크 기판 버퍼링 장치, 기판처리설비, 및 기판처리방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05218176A (ja) * 1992-02-07 1993-08-27 Tokyo Electron Tohoku Kk 熱処理方法及び被処理体の移載方法
JP2001250781A (ja) 2000-03-06 2001-09-14 Hitachi Kokusai Electric Inc 半導体製造装置
JP2003100736A (ja) 2001-09-26 2003-04-04 Hitachi Kokusai Electric Inc 基板処理装置
JP2013197232A (ja) * 2012-03-19 2013-09-30 Hitachi Kokusai Electric Inc 基板処理装置、基板処理方法、半導体装置の製造方法及び半導体装置の製造方法を実行させるためのプログラムを記録した記録媒体。
JP5792390B2 (ja) * 2012-07-30 2015-10-14 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及びプログラム
JP2014232816A (ja) * 2013-05-29 2014-12-11 株式会社日立国際電気 基板処理装置、半導体装置の製造方法および基板処理方法
CN107924825B (zh) * 2015-09-30 2021-12-24 株式会社国际电气 半导体器件的制造方法、衬底处理装置及记录介质
JP6568127B2 (ja) * 2017-03-02 2019-08-28 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、プログラム及び記録媒体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283509A (ja) * 1996-04-11 1997-10-31 Sony Corp ウエハ処理装置および処理方法
KR20160123564A (ko) * 2015-04-16 2016-10-26 주식회사 유진테크 기판 버퍼링 장치, 기판처리설비, 및 기판처리방법

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Publication number Publication date
JP2020161808A (ja) 2020-10-01
TW202041706A (zh) 2020-11-16
CN111725094A (zh) 2020-09-29
JP6995902B2 (ja) 2022-01-17
CN111725094B (zh) 2024-04-09

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