TWI768001B - 帶電粒子束裝置以及試樣加工方法 - Google Patents
帶電粒子束裝置以及試樣加工方法 Download PDFInfo
- Publication number
- TWI768001B TWI768001B TW107107249A TW107107249A TWI768001B TW I768001 B TWI768001 B TW I768001B TW 107107249 A TW107107249 A TW 107107249A TW 107107249 A TW107107249 A TW 107107249A TW I768001 B TWI768001 B TW I768001B
- Authority
- TW
- Taiwan
- Prior art keywords
- sample
- charged particle
- particle beam
- processing
- sample piece
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
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- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Sampling And Sample Adjustment (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017060907A JP6974820B2 (ja) | 2017-03-27 | 2017-03-27 | 荷電粒子ビーム装置、試料加工方法 |
JP2017-060907 | 2017-03-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201835964A TW201835964A (zh) | 2018-10-01 |
TWI768001B true TWI768001B (zh) | 2022-06-21 |
Family
ID=63782290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107107249A TWI768001B (zh) | 2017-03-27 | 2018-03-05 | 帶電粒子束裝置以及試樣加工方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6974820B2 (ja) |
KR (1) | KR102590634B1 (ja) |
CN (1) | CN108666196B (ja) |
TW (1) | TWI768001B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102677678B1 (ko) * | 2017-09-25 | 2024-06-21 | 셀라 - 솔루션스 인에이블링 나노 어낼리시스 엘티디. | 깊이 제어 가능한 이온 밀링 |
JP7152757B2 (ja) * | 2018-10-18 | 2022-10-13 | 株式会社日立ハイテクサイエンス | 試料加工観察方法 |
JP7360871B2 (ja) * | 2019-09-24 | 2023-10-13 | 株式会社日立ハイテクサイエンス | 荷電粒子ビーム照射装置、及び制御方法 |
CN111366428B (zh) * | 2020-03-03 | 2023-06-09 | 上海华力集成电路制造有限公司 | Fib倒切制备tem样品的方法 |
EP4319111A4 (en) | 2021-07-08 | 2024-10-16 | Samsung Electronics Co Ltd | ELECTRONIC DEVICE COMPRISING A SUPPORT ELEMENT |
WO2023084773A1 (ja) * | 2021-11-15 | 2023-05-19 | 株式会社日立ハイテクサイエンス | 荷電粒子ビーム装置、及び荷電粒子ビーム装置の制御方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07318468A (ja) * | 1994-05-25 | 1995-12-08 | Hitachi Ltd | 電子顕微鏡観察用試料の作製方法 |
US20100288924A1 (en) * | 2007-08-08 | 2010-11-18 | Takashi Kaito | Composite focused ion beam device, process observation method using the same,and processing method |
EP2722661A2 (en) * | 2012-10-18 | 2014-04-23 | Carl Zeiss Microscopy GmbH | Particle beam system and method of processing a TEM-sample |
TW201614705A (en) * | 2014-08-29 | 2016-04-16 | Hitachi High Tech Science Corp | Charged particle beam apparatus |
US20160247662A1 (en) * | 2015-02-23 | 2016-08-25 | Hitachi High-Tech Science Corporation | Sample processing evaluation apparatus |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2992682B2 (ja) | 1996-11-26 | 1999-12-20 | セイコーインスツルメンツ株式会社 | 集積回路の断面観察方法 |
JP5039961B2 (ja) | 2007-04-24 | 2012-10-03 | エスアイアイ・ナノテクノロジー株式会社 | 三次元画像構築方法 |
JP5352335B2 (ja) * | 2009-04-28 | 2013-11-27 | 株式会社日立ハイテクノロジーズ | 複合荷電粒子線装置 |
CN102023108B (zh) * | 2009-09-23 | 2012-06-06 | 中芯国际集成电路制造(上海)有限公司 | 透射电子显微镜样品的制备方法 |
JP2011154920A (ja) * | 2010-01-28 | 2011-08-11 | Hitachi High-Technologies Corp | イオンミリング装置,試料加工方法,加工装置、および試料駆動機構 |
DE102010032894B4 (de) * | 2010-07-30 | 2013-08-22 | Carl Zeiss Microscopy Gmbh | Tem-Lamelle, Verfahren zu ihrer Herstellung und Vorrichtung zum Ausführen des Verfahrens |
JP2011203266A (ja) * | 2011-05-27 | 2011-10-13 | Sii Nanotechnology Inc | 薄片試料作製方法 |
US8859963B2 (en) * | 2011-06-03 | 2014-10-14 | Fei Company | Methods for preparing thin samples for TEM imaging |
JP6105204B2 (ja) * | 2012-02-10 | 2017-03-29 | 株式会社日立ハイテクサイエンス | Tem観察用試料作製方法 |
JP5887247B2 (ja) * | 2012-10-15 | 2016-03-16 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置および試料作製法 |
JP6101562B2 (ja) * | 2013-05-15 | 2017-03-22 | 株式会社日立ハイテクノロジーズ | 集束イオンビーム装置、集束イオンビーム装置を用いた試料加工方法、及び試料加工プログラム |
US9057670B2 (en) * | 2013-05-30 | 2015-06-16 | International Business Machines Corporation | Transmission electron microscope sample fabrication |
WO2015170397A1 (ja) * | 2014-05-09 | 2015-11-12 | 株式会社日立ハイテクノロジーズ | 試料加工方法、及び荷電粒子線装置 |
KR102358551B1 (ko) * | 2014-08-29 | 2022-02-04 | 가부시키가이샤 히다치 하이테크 사이언스 | 자동 시료편 제작 장치 |
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2017
- 2017-03-27 JP JP2017060907A patent/JP6974820B2/ja active Active
-
2018
- 2018-03-05 TW TW107107249A patent/TWI768001B/zh active
- 2018-03-22 CN CN201810239287.1A patent/CN108666196B/zh active Active
- 2018-03-26 KR KR1020180034692A patent/KR102590634B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07318468A (ja) * | 1994-05-25 | 1995-12-08 | Hitachi Ltd | 電子顕微鏡観察用試料の作製方法 |
US20100288924A1 (en) * | 2007-08-08 | 2010-11-18 | Takashi Kaito | Composite focused ion beam device, process observation method using the same,and processing method |
EP2722661A2 (en) * | 2012-10-18 | 2014-04-23 | Carl Zeiss Microscopy GmbH | Particle beam system and method of processing a TEM-sample |
TW201614705A (en) * | 2014-08-29 | 2016-04-16 | Hitachi High Tech Science Corp | Charged particle beam apparatus |
US20160247662A1 (en) * | 2015-02-23 | 2016-08-25 | Hitachi High-Tech Science Corporation | Sample processing evaluation apparatus |
Also Published As
Publication number | Publication date |
---|---|
CN108666196B (zh) | 2022-03-29 |
KR20180109734A (ko) | 2018-10-08 |
KR102590634B1 (ko) | 2023-10-17 |
JP2018163826A (ja) | 2018-10-18 |
TW201835964A (zh) | 2018-10-01 |
JP6974820B2 (ja) | 2021-12-01 |
CN108666196A (zh) | 2018-10-16 |
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