TWI768001B - 帶電粒子束裝置以及試樣加工方法 - Google Patents

帶電粒子束裝置以及試樣加工方法 Download PDF

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Publication number
TWI768001B
TWI768001B TW107107249A TW107107249A TWI768001B TW I768001 B TWI768001 B TW I768001B TW 107107249 A TW107107249 A TW 107107249A TW 107107249 A TW107107249 A TW 107107249A TW I768001 B TWI768001 B TW I768001B
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TW
Taiwan
Prior art keywords
sample
charged particle
particle beam
processing
sample piece
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TW107107249A
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English (en)
Chinese (zh)
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TW201835964A (zh
Inventor
酉川翔太
大西毅
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日商日立高新技術科學股份有限公司
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Publication of TW201835964A publication Critical patent/TW201835964A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q

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  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
TW107107249A 2017-03-27 2018-03-05 帶電粒子束裝置以及試樣加工方法 TWI768001B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017060907A JP6974820B2 (ja) 2017-03-27 2017-03-27 荷電粒子ビーム装置、試料加工方法
JP2017-060907 2017-03-27

Publications (2)

Publication Number Publication Date
TW201835964A TW201835964A (zh) 2018-10-01
TWI768001B true TWI768001B (zh) 2022-06-21

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Family Applications (1)

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TW107107249A TWI768001B (zh) 2017-03-27 2018-03-05 帶電粒子束裝置以及試樣加工方法

Country Status (4)

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JP (1) JP6974820B2 (ja)
KR (1) KR102590634B1 (ja)
CN (1) CN108666196B (ja)
TW (1) TWI768001B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190035587A (ko) * 2017-09-25 2019-04-03 셀라 - 솔루션스 인에이블링 나노 어낼리시스 엘티디. 깊이 제어 가능한 이온 밀링
JP7152757B2 (ja) * 2018-10-18 2022-10-13 株式会社日立ハイテクサイエンス 試料加工観察方法
JP7360871B2 (ja) * 2019-09-24 2023-10-13 株式会社日立ハイテクサイエンス 荷電粒子ビーム照射装置、及び制御方法
CN111366428B (zh) * 2020-03-03 2023-06-09 上海华力集成电路制造有限公司 Fib倒切制备tem样品的方法
WO2023084773A1 (ja) * 2021-11-15 2023-05-19 株式会社日立ハイテクサイエンス 荷電粒子ビーム装置、及び荷電粒子ビーム装置の制御方法

Citations (5)

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JPH07318468A (ja) * 1994-05-25 1995-12-08 Hitachi Ltd 電子顕微鏡観察用試料の作製方法
US20100288924A1 (en) * 2007-08-08 2010-11-18 Takashi Kaito Composite focused ion beam device, process observation method using the same,and processing method
EP2722661A2 (en) * 2012-10-18 2014-04-23 Carl Zeiss Microscopy GmbH Particle beam system and method of processing a TEM-sample
TW201614705A (en) * 2014-08-29 2016-04-16 Hitachi High Tech Science Corp Charged particle beam apparatus
US20160247662A1 (en) * 2015-02-23 2016-08-25 Hitachi High-Tech Science Corporation Sample processing evaluation apparatus

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JP2992682B2 (ja) 1996-11-26 1999-12-20 セイコーインスツルメンツ株式会社 集積回路の断面観察方法
JP5039961B2 (ja) 2007-04-24 2012-10-03 エスアイアイ・ナノテクノロジー株式会社 三次元画像構築方法
JP5352335B2 (ja) * 2009-04-28 2013-11-27 株式会社日立ハイテクノロジーズ 複合荷電粒子線装置
CN102023108B (zh) * 2009-09-23 2012-06-06 中芯国际集成电路制造(上海)有限公司 透射电子显微镜样品的制备方法
JP2011154920A (ja) * 2010-01-28 2011-08-11 Hitachi High-Technologies Corp イオンミリング装置，試料加工方法，加工装置、および試料駆動機構
DE102010032894B4 (de) * 2010-07-30 2013-08-22 Carl Zeiss Microscopy Gmbh Tem-Lamelle, Verfahren zu ihrer Herstellung und Vorrichtung zum Ausführen des Verfahrens
JP2011203266A (ja) * 2011-05-27 2011-10-13 Sii Nanotechnology Inc 薄片試料作製方法
US8859963B2 (en) * 2011-06-03 2014-10-14 Fei Company Methods for preparing thin samples for TEM imaging
JP6105204B2 (ja) * 2012-02-10 2017-03-29 株式会社日立ハイテクサイエンス Ｔｅｍ観察用試料作製方法
JP5887247B2 (ja) * 2012-10-15 2016-03-16 株式会社日立ハイテクノロジーズ 荷電粒子線装置および試料作製法
JP6101562B2 (ja) * 2013-05-15 2017-03-22 株式会社日立ハイテクノロジーズ 集束イオンビーム装置、集束イオンビーム装置を用いた試料加工方法、及び試料加工プログラム
US9057670B2 (en) * 2013-05-30 2015-06-16 International Business Machines Corporation Transmission electron microscope sample fabrication
CN106233420B (zh) * 2014-05-09 2018-10-16 株式会社日立高新技术 试样加工方法及带电粒子束装置
KR102358551B1 (ko) * 2014-08-29 2022-02-04 가부시키가이샤 히다치 하이테크 사이언스 자동 시료편 제작 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07318468A (ja) * 1994-05-25 1995-12-08 Hitachi Ltd 電子顕微鏡観察用試料の作製方法
US20100288924A1 (en) * 2007-08-08 2010-11-18 Takashi Kaito Composite focused ion beam device, process observation method using the same,and processing method
EP2722661A2 (en) * 2012-10-18 2014-04-23 Carl Zeiss Microscopy GmbH Particle beam system and method of processing a TEM-sample
TW201614705A (en) * 2014-08-29 2016-04-16 Hitachi High Tech Science Corp Charged particle beam apparatus
US20160247662A1 (en) * 2015-02-23 2016-08-25 Hitachi High-Tech Science Corporation Sample processing evaluation apparatus

Also Published As

Publication number Publication date
JP6974820B2 (ja) 2021-12-01
KR20180109734A (ko) 2018-10-08
TW201835964A (zh) 2018-10-01
CN108666196B (zh) 2022-03-29
KR102590634B1 (ko) 2023-10-17
JP2018163826A (ja) 2018-10-18
CN108666196A (zh) 2018-10-16

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