TWI759345B - 隱形切割用黏著板片及半導體裝置之製造方法 - Google Patents

隱形切割用黏著板片及半導體裝置之製造方法 Download PDF

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Publication number
TWI759345B
TWI759345B TW106136682A TW106136682A TWI759345B TW I759345 B TWI759345 B TW I759345B TW 106136682 A TW106136682 A TW 106136682A TW 106136682 A TW106136682 A TW 106136682A TW I759345 B TWI759345 B TW I759345B
Authority
TW
Taiwan
Prior art keywords
adhesive sheet
stealth dicing
acrylate
adhesive
less
Prior art date
Application number
TW106136682A
Other languages
English (en)
Chinese (zh)
Other versions
TW201817842A (zh
Inventor
山下茂之
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201817842A publication Critical patent/TW201817842A/zh
Application granted granted Critical
Publication of TWI759345B publication Critical patent/TWI759345B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
TW106136682A 2016-11-02 2017-10-25 隱形切割用黏著板片及半導體裝置之製造方法 TWI759345B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-215206 2016-11-02
JP2016215206 2016-11-02

Publications (2)

Publication Number Publication Date
TW201817842A TW201817842A (zh) 2018-05-16
TWI759345B true TWI759345B (zh) 2022-04-01

Family

ID=62075603

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106136682A TWI759345B (zh) 2016-11-02 2017-10-25 隱形切割用黏著板片及半導體裝置之製造方法

Country Status (5)

Country Link
JP (1) JP6980681B2 (ja)
KR (1) KR102382843B1 (ja)
CN (1) CN109997218B (ja)
TW (1) TWI759345B (ja)
WO (1) WO2018083987A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7254669B2 (ja) * 2019-09-20 2023-04-10 リンテック株式会社 ワーク加工用シートおよび半導体装置の製法方法
CN114867804A (zh) * 2020-03-30 2022-08-05 琳得科株式会社 粘着片
CN112635309B (zh) * 2020-12-07 2024-07-12 福建晶安光电有限公司 衬底加工方法及利用该方法加工的衬底

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201333145A (zh) * 2011-10-17 2013-08-16 Nitto Denko Corp 黏著帶用膜及黏著帶
TW201500514A (zh) * 2013-06-11 2015-01-01 Denki Kagaku Kogyo Kk 黏合片以及使用該黏合片之電子產品之製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH605065A5 (ja) 1976-05-06 1978-09-29 Fischer Ag Brugg Georg
JP4994895B2 (ja) 2007-03-09 2012-08-08 リンテック株式会社 粘着シート
JP5128575B2 (ja) * 2009-12-04 2013-01-23 リンテック株式会社 ステルスダイシング用粘着シート及び半導体装置の製造方法
JP5554118B2 (ja) * 2010-03-31 2014-07-23 古河電気工業株式会社 ウエハ加工用テープ
JP6328397B2 (ja) 2013-10-02 2018-05-23 リンテック株式会社 電子部品加工用粘着シートおよび半導体装置の製造方法
JP6306362B2 (ja) * 2014-02-13 2018-04-04 リンテック株式会社 伸長可能シートおよび積層チップの製造方法
CN105684131B (zh) * 2014-03-03 2018-09-25 古河电气工业株式会社 半导体加工用粘合带
JP5823591B1 (ja) * 2014-10-01 2015-11-25 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープおよび半導体ウエハの加工方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201333145A (zh) * 2011-10-17 2013-08-16 Nitto Denko Corp 黏著帶用膜及黏著帶
TW201500514A (zh) * 2013-06-11 2015-01-01 Denki Kagaku Kogyo Kk 黏合片以及使用該黏合片之電子產品之製造方法

Also Published As

Publication number Publication date
TW201817842A (zh) 2018-05-16
JP6980681B2 (ja) 2021-12-15
CN109997218B (zh) 2023-08-08
JPWO2018083987A1 (ja) 2019-09-19
KR20190076959A (ko) 2019-07-02
CN109997218A (zh) 2019-07-09
KR102382843B1 (ko) 2022-04-05
WO2018083987A1 (ja) 2018-05-11

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