TWI758579B - 附散熱座功率模組用基板及功率模組 - Google Patents

附散熱座功率模組用基板及功率模組 Download PDF

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TWI758579B
TWI758579B TW108102677A TW108102677A TWI758579B TW I758579 B TWI758579 B TW I758579B TW 108102677 A TW108102677 A TW 108102677A TW 108102677 A TW108102677 A TW 108102677A TW I758579 B TWI758579 B TW I758579B
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Taiwan
Prior art keywords
heat sink
layer
power module
substrate
bonding material
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TW108102677A
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English (en)
Chinese (zh)
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TW201933560A (zh
Inventor
大開智哉
大井宗太郎
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日商三菱綜合材料股份有限公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/121—Metallic interlayers based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/16—Silicon interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/402—Aluminium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
TW108102677A 2018-01-24 2019-01-24 附散熱座功率模組用基板及功率模組 TWI758579B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018009313A JP6601512B2 (ja) 2018-01-24 2018-01-24 ヒートシンク付きパワーモジュール用基板及びパワーモジュール
JP2018-009313 2018-01-24

Publications (2)

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TW201933560A TW201933560A (zh) 2019-08-16
TWI758579B true TWI758579B (zh) 2022-03-21

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Country Status (7)

Country Link
US (1) US11355415B2 (https=)
EP (1) EP3745453B1 (https=)
JP (1) JP6601512B2 (https=)
KR (1) KR102387210B1 (https=)
CN (1) CN111602238B (https=)
TW (1) TWI758579B (https=)
WO (1) WO2019146640A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021061341A (ja) * 2019-10-08 2021-04-15 昭和電工株式会社 半導体冷却装置
JP7487533B2 (ja) 2020-04-02 2024-05-21 富士電機株式会社 半導体モジュールおよび車両
JPWO2023032462A1 (https=) * 2021-09-02 2023-03-09
DE102021212232A1 (de) * 2021-10-29 2023-05-04 Zf Friedrichshafen Ag Leistungsmodul und verfahren zum montieren eines leistungsmoduls
DE102022207525A1 (de) 2022-07-22 2024-01-25 Vitesco Technologies Germany Gmbh Leistungsmodul und Verfahren zur Herstellung desselben, Stromrichter mit einem Leistungsmodul
TWI811136B (zh) * 2022-10-17 2023-08-01 創世電股份有限公司 半導體功率元件
TWI836729B (zh) * 2022-11-16 2024-03-21 財團法人工業技術研究院 陶瓷電路板結構及功率模組
WO2025027845A1 (ja) * 2023-08-03 2025-02-06 三菱電機株式会社 半導体装置および半導体装置の製造方法

Citations (4)

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JP2016027645A (ja) * 2014-07-04 2016-02-18 三菱マテリアル株式会社 放熱板付パワーモジュール用基板及びパワーモジュール
JP2016046356A (ja) * 2014-08-21 2016-04-04 三菱マテリアル株式会社 放熱板付パワーモジュール用基板及びパワーモジュール
US9723707B2 (en) * 2012-03-30 2017-08-01 Mitsubishi Materials Corporation Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate
US9807865B2 (en) * 2013-03-29 2017-10-31 Mitsubishi Materials Corporation Substrate for power modules, substrate with heat sink for power modules, and power module

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JP2003078086A (ja) 2001-09-04 2003-03-14 Kubota Corp 半導体素子モジュール基板の積層構造
CN105189109B (zh) * 2013-03-14 2017-04-05 三菱综合材料株式会社 接合体、功率模块用基板及自带散热器的功率模块用基板
KR102232098B1 (ko) * 2013-10-10 2021-03-24 미쓰비시 마테리알 가부시키가이샤 히트 싱크가 부착된 파워 모듈용 기판 및 그 제조 방법
JP6384112B2 (ja) 2014-04-25 2018-09-05 三菱マテリアル株式会社 パワーモジュール用基板及びヒートシンク付パワーモジュール用基板
CN106165090B (zh) 2014-04-25 2020-07-03 三菱综合材料株式会社 功率模块用基板单元及功率模块
CN106463477B (zh) * 2014-07-04 2019-03-12 三菱综合材料株式会社 功率模块用基板单元及功率模块
JP6435945B2 (ja) * 2015-03-23 2018-12-12 三菱マテリアル株式会社 ヒートシンク付きパワーモジュール用基板
JP6638284B2 (ja) * 2015-09-28 2020-01-29 三菱マテリアル株式会社 放熱板付パワーモジュール用基板及びパワーモジュール
JP6137267B2 (ja) 2015-10-08 2017-05-31 三菱マテリアル株式会社 ヒートシンク付きパワーモジュール用基板及びパワーモジュール
JP6647164B2 (ja) 2016-07-12 2020-02-14 鹿島建設株式会社 地盤改良工法及び地盤改良用プレキャスト地盤の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9723707B2 (en) * 2012-03-30 2017-08-01 Mitsubishi Materials Corporation Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate
US9807865B2 (en) * 2013-03-29 2017-10-31 Mitsubishi Materials Corporation Substrate for power modules, substrate with heat sink for power modules, and power module
JP2016027645A (ja) * 2014-07-04 2016-02-18 三菱マテリアル株式会社 放熱板付パワーモジュール用基板及びパワーモジュール
JP2016046356A (ja) * 2014-08-21 2016-04-04 三菱マテリアル株式会社 放熱板付パワーモジュール用基板及びパワーモジュール

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Publication number Publication date
KR102387210B1 (ko) 2022-04-14
CN111602238B (zh) 2023-11-10
CN111602238A (zh) 2020-08-28
JP2019129208A (ja) 2019-08-01
TW201933560A (zh) 2019-08-16
US11355415B2 (en) 2022-06-07
EP3745453A1 (en) 2020-12-02
US20210074607A1 (en) 2021-03-11
EP3745453B1 (en) 2022-09-21
WO2019146640A1 (ja) 2019-08-01
JP6601512B2 (ja) 2019-11-06
KR20200112845A (ko) 2020-10-05
EP3745453A4 (en) 2021-10-27

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