JPWO2023032462A1 - - Google Patents
Info
- Publication number
- JPWO2023032462A1 JPWO2023032462A1 JP2023545127A JP2023545127A JPWO2023032462A1 JP WO2023032462 A1 JPWO2023032462 A1 JP WO2023032462A1 JP 2023545127 A JP2023545127 A JP 2023545127A JP 2023545127 A JP2023545127 A JP 2023545127A JP WO2023032462 A1 JPWO2023032462 A1 JP WO2023032462A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/258—Metallic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/77—Auxiliary members characterised by their shape
- H10W40/778—Auxiliary members characterised by their shape in encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07336—Soldering or alloying
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/811—Multiple chips on leadframes
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021143182 | 2021-09-02 | ||
| PCT/JP2022/026677 WO2023032462A1 (ja) | 2021-09-02 | 2022-07-05 | 半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023032462A1 true JPWO2023032462A1 (https=) | 2023-03-09 |
| JPWO2023032462A5 JPWO2023032462A5 (https=) | 2024-05-24 |
Family
ID=85412092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023545127A Pending JPWO2023032462A1 (https=) | 2021-09-02 | 2022-07-05 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240203817A1 (https=) |
| JP (1) | JPWO2023032462A1 (https=) |
| CN (1) | CN117882187A (https=) |
| DE (1) | DE112022003837T5 (https=) |
| WO (1) | WO2023032462A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024241786A1 (ja) * | 2023-05-19 | 2024-11-28 | ローム株式会社 | 接合構造、半導体装置、および接合方法 |
| WO2025173483A1 (ja) * | 2024-02-14 | 2025-08-21 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| WO2025177769A1 (ja) * | 2024-02-19 | 2025-08-28 | ローム株式会社 | 半導体装置の製造方法、半導体装置および車両 |
| WO2026074979A1 (ja) * | 2024-10-01 | 2026-04-09 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| WO2026074948A1 (ja) * | 2024-10-01 | 2026-04-09 | ローム株式会社 | 半導体モジュール |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0786444A (ja) * | 1993-06-28 | 1995-03-31 | Sumitomo Electric Ind Ltd | 半導体用複合放熱基板の製造方法 |
| JP2016042529A (ja) * | 2014-08-18 | 2016-03-31 | 三菱マテリアル株式会社 | 接合体の製造方法、パワーモジュール用基板の製造方法、及び、ヒートシンク付パワーモジュール用基板の製造方法 |
| JP2016096263A (ja) * | 2014-11-14 | 2016-05-26 | 三菱電機株式会社 | パワー半導体装置およびその製造方法ならびに絶縁基板部 |
| WO2017130512A1 (ja) * | 2016-01-28 | 2017-08-03 | 三菱電機株式会社 | パワーモジュール |
| WO2019146640A1 (ja) * | 2018-01-24 | 2019-08-01 | 三菱マテリアル株式会社 | ヒートシンク付きパワーモジュール用基板及びパワーモジュール |
| JP2020072101A (ja) * | 2018-10-29 | 2020-05-07 | 京セラ株式会社 | パワーユニット、パワーユニットの製造方法、パワーユニットを有する電気装置及びヒートシンク |
| JP2021114537A (ja) * | 2020-01-17 | 2021-08-05 | パナソニックＩｐマネジメント株式会社 | 半導体装置 |
| WO2021199384A1 (ja) * | 2020-04-01 | 2021-10-07 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3355875B1 (en) | 2015-10-01 | 2021-09-29 | Gilead Sciences, Inc. | Combination of a btk inhibitor and a checkpoint inhibitor for treating cancers |
| JPWO2018207856A1 (ja) | 2017-05-10 | 2020-05-14 | ローム株式会社 | パワー半導体装置 |
-
2022
- 2022-07-05 JP JP2023545127A patent/JPWO2023032462A1/ja active Pending
- 2022-07-05 DE DE112022003837.3T patent/DE112022003837T5/de active Pending
- 2022-07-05 CN CN202280059171.4A patent/CN117882187A/zh active Pending
- 2022-07-05 WO PCT/JP2022/026677 patent/WO2023032462A1/ja not_active Ceased
-
2024
- 2024-02-29 US US18/591,744 patent/US20240203817A1/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0786444A (ja) * | 1993-06-28 | 1995-03-31 | Sumitomo Electric Ind Ltd | 半導体用複合放熱基板の製造方法 |
| JP2016042529A (ja) * | 2014-08-18 | 2016-03-31 | 三菱マテリアル株式会社 | 接合体の製造方法、パワーモジュール用基板の製造方法、及び、ヒートシンク付パワーモジュール用基板の製造方法 |
| JP2016096263A (ja) * | 2014-11-14 | 2016-05-26 | 三菱電機株式会社 | パワー半導体装置およびその製造方法ならびに絶縁基板部 |
| WO2017130512A1 (ja) * | 2016-01-28 | 2017-08-03 | 三菱電機株式会社 | パワーモジュール |
| WO2019146640A1 (ja) * | 2018-01-24 | 2019-08-01 | 三菱マテリアル株式会社 | ヒートシンク付きパワーモジュール用基板及びパワーモジュール |
| JP2020072101A (ja) * | 2018-10-29 | 2020-05-07 | 京セラ株式会社 | パワーユニット、パワーユニットの製造方法、パワーユニットを有する電気装置及びヒートシンク |
| JP2021114537A (ja) * | 2020-01-17 | 2021-08-05 | パナソニックＩｐマネジメント株式会社 | 半導体装置 |
| WO2021199384A1 (ja) * | 2020-04-01 | 2021-10-07 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20240203817A1 (en) | 2024-06-20 |
| WO2023032462A1 (ja) | 2023-03-09 |
| DE112022003837T5 (de) | 2024-05-23 |
| CN117882187A (zh) | 2024-04-12 |
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